Circuit board heat dissipation structure

Abstract

The utility model discloses a circuit board heat dissipation structure, it includes circuit board body, and the circuit board body bottom and top all are connected with the heat conduction component, and the circuit board body bottom is connected with first protective cover, and the circuit board body top is connected with second protective cover, and the second protective cover top is provided with drive assembly, and the second protective cover top is provided with air cooling heat dissipation component, and the heat of heating element emission conduction reaches multiple heat conduction sheet, and the metal heat conduction block has increased the heat conduction efficiency to a certain extent, and the heat conduction sheet again conduction respectively reaches first protective cover and second protective cover, and through multiple radiating fins and air contact heat dissipation, and under the action of drive motor, the first pulley is driven to rotate, and under the action of transmission belt, the first pulley drives second pulley synchronous rotation, makes multiple fan blade produce accelerated airflow above circuit board body, and accelerated airflow accelerates and takes away heat from air outlet groove, and the heat dissipation silicone grease can further improve the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to a circuit board heat dissipation structure. Background Technology

[0002] As the main control device of electrical equipment, the circuit board houses numerous electronic components and has a large number of circuit connections. When the circuit board is in operation for a long time, it will inevitably generate a lot of heat. Heat dissipation of the circuit board is generally achieved by installing heat sinks on the circuit board and the electronic components mounted on it.

[0003] Most existing circuit board heat dissipation structures use heat sinks for heat dissipation, which is not very effective. In addition, adding heat sinks directly to the circuit board will occupy the circuit board space, affect the arrangement of heat-generating components, and reduce the usable area of ​​the circuit board to a certain extent. Utility Model Content

[0004] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0005] In view of the problems existing in the above and / or existing circuit board heat dissipation structures, this utility model is proposed.

[0006] Therefore, the purpose of this utility model is to provide a circuit board heat dissipation structure. In use, the circuit board body and multiple thermally conductive sheets are placed between the first protective cover and the second protective cover. By rotating the screws and locking nuts, the first and second protective covers clamp and fix the circuit board body and multiple thermally conductive sheets. The heat emitted by the heating element is conducted to the multiple thermally conductive sheets. The metal thermally conductive block increases the heat conduction efficiency to a certain extent. The thermally conductive sheets then conduct the heat to the first and second protective covers respectively. Heat is dissipated through multiple heat dissipation fins in contact with the air. At the same time, the first pulley is driven to rotate under the action of the drive motor. Under the action of the transmission belt, the first pulley drives the second pulley to rotate synchronously, so that multiple fan blades generate an accelerated airflow above the circuit board body. The accelerated airflow carries away the heat from the air outlet. Thermal grease can further improve the heat dissipation effect. This solves the problem that most existing circuit board heat dissipation structures use heat dissipation fins for heat dissipation, which has poor heat dissipation effect. In addition, adding heat dissipation fins directly to the circuit board will occupy the circuit board space, affect the arrangement of heating elements, and reduce the usable area of ​​the circuit board to a certain extent.

[0007] To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution:

[0008] A circuit board heat dissipation structure includes a circuit board body, with heat-conducting components connected to the bottom and top of the circuit board body. A first protective cover is connected to the bottom of the circuit board body, and a second protective cover is connected to the top of the circuit board body. A driving component is disposed on the top of the second protective cover, and a wind-cooling heat dissipation component is disposed on the top of the second protective cover. The wind-cooling heat dissipation component is connected to the driving component and cools the circuit board body.

[0009] As a preferred embodiment of the circuit board heat dissipation structure described in this utility model, a plurality of heat-generating elements are fixedly connected to the top of the circuit board body, and a plurality of metal heat-conducting blocks are provided at both the top and bottom of the circuit board body.

[0010] In a preferred embodiment of the heat dissipation structure of the circuit board described in this utility model, the heat-conducting component includes multiple heat-conducting sheets, and the top and bottom of the circuit board body are respectively attached to the multiple heat-conducting sheets.

[0011] In a preferred embodiment of the circuit board heat dissipation structure described in this utility model, thermal conductive film is coated with thermal grease on one side.

[0012] In a preferred embodiment of the circuit board heat dissipation structure described in this utility model, the top of the first protective cover and the bottom of the second protective cover are both provided with grooves, and the sides of the circuit board body and the thermal conductive film are located in the grooves. The first protective cover and the second protective cover clamp the circuit board body and the thermal conductive film.

[0013] As a preferred embodiment of the circuit board heat dissipation structure described in this utility model, multiple heat dissipation fins are fixedly connected to the bottom of the first protective cover and the top of the second protective cover, and the heat dissipation fins are made of aluminum metal.

[0014] In a preferred embodiment of the circuit board heat dissipation structure described in this utility model, the driving component includes a driving motor, a fixing frame is fixedly connected to the top of the second protective cover, and the bottom of the driving motor is fixedly connected to the top of the fixing frame.

[0015] In a preferred embodiment of the circuit board heat dissipation structure described in this utility model, the power output end of the drive motor is fixedly connected to a first pulley through the fixing frame, and the top of the second protective cover is provided with multiple through slots, in which a fixing plate is fixedly connected laterally.

[0016] In a preferred embodiment of the circuit board heat dissipation structure described in this utility model, a second pulley is movably connected to the top of the fixed plate, a transmission belt is provided between the second pulley and the first pulley, fan blades are fixedly connected to the bottom of both the first pulley and the second pulley through the fixed plate, and multiple air outlet slots are provided on both sides of the second protective cover.

[0017] As a preferred embodiment of the circuit board heat dissipation structure described in this utility model, the first protective cover is provided with through holes at all four corners, and the second protective cover is movably connected with screws at all four corners. One end of each screw passes through the outer side of the first protective cover and is threaded to a locking nut.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows: the circuit board body and multiple thermally conductive sheets are placed between the first protective cover and the second protective cover. By rotating the screws and locking nuts, the first and second protective covers clamp and fix the circuit board body and multiple thermally conductive sheets. The heat emitted by the heating element is conducted to the multiple thermally conductive sheets. The metal thermally conductive block increases the heat conduction efficiency to a certain extent. The thermally conductive sheets then conduct the heat to the first and second protective covers respectively. Heat is dissipated through multiple heat dissipation fins in contact with the air. At the same time, the first pulley is driven to rotate under the action of the drive motor. Under the action of the transmission belt, the first pulley drives the second pulley to rotate synchronously, so that multiple fan blades generate an accelerated airflow above the circuit board body. The accelerated airflow carries away the heat from the air outlet. The thermal grease can further improve the heat dissipation effect. This solves the problem that most existing circuit board heat dissipation structures use heat dissipation fins for heat dissipation, which has poor heat dissipation effect. In addition, adding heat dissipation fins directly to the circuit board will occupy the circuit board space, affect the arrangement of heating elements, and reduce the usable area of ​​the circuit board to a certain extent. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0020] Figure 1 This is a schematic diagram of the overall structure of a circuit board heat dissipation structure according to the present invention.

[0021] Figure 2 This is an exploded view of the overall structure of a circuit board heat dissipation structure according to the present invention.

[0022] Figure 3 This is a schematic diagram of the circuit board body structure of a circuit board heat dissipation structure according to the present invention.

[0023] Figure 4 This is a schematic diagram of the thermal conductive film structure of a circuit board heat dissipation structure according to the present invention.

[0024] Figure 5 This is a schematic diagram of the first protective cover structure of a circuit board heat dissipation structure according to the present invention.

[0025] Figure 6 This is a schematic diagram of the second protective cover structure of a circuit board heat dissipation structure according to the present invention. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Example

[0028] Please see Figure 1-6 This utility model provides a circuit board heat dissipation structure, including a circuit board body 1. The bottom and top of the circuit board body 1 are connected to heat conduction components. The bottom of the circuit board body 1 is connected to a first protective cover 2, and the top of the circuit board body 1 is connected to a second protective cover 3. A driving component is provided on the top of the second protective cover 3, and a wind-cooling heat dissipation component is provided on the top of the second protective cover 3. The wind-cooling heat dissipation component is connected to the driving component and cools down the circuit board body 1.

[0029] Multiple heating elements 11 are fixedly connected to the top of the circuit board body 1, and multiple metal heat-conducting blocks 12 are provided at the top and bottom of the circuit board body 1.

[0030] The thermal conductive assembly includes multiple thermal conductive sheets 4, with the top and bottom of the circuit board body 1 respectively bonded to the multiple thermal conductive sheets 4.

[0031] Thermal grease 13 is applied to one side of the thermal conductive film 4.

[0032] The top of the first protective cover 2 and the bottom of the second protective cover 3 are both provided with grooves 14. The sides of the circuit board body 1 and the thermal conductive film 4 are located in the grooves 14. The first protective cover 2 and the second protective cover 3 clamp the circuit board body 1 and the thermal conductive film 4.

[0033] Multiple heat dissipation fins 19 are fixedly connected to the bottom of the first protective cover 2 and the top of the second protective cover 3. The heat dissipation fins 19 are made of aluminum metal.

[0034] The drive assembly includes a drive motor 7, a mounting bracket 6 is fixedly connected to the top of the second protective cover 3, and the bottom of the drive motor 7 is fixedly connected to the top of the mounting bracket 6.

[0035] The power output end of the drive motor 7 is fixedly connected to the first pulley 8 through the fixed frame 6. The top of the second protective cover 3 is provided with multiple through slots 16, and a fixed plate 17 is fixedly connected horizontally in the through slots 16.

[0036] The top of the fixed plate 17 is movably connected to the second pulley 9, and a transmission belt 10 is provided between the second pulley 9 and the first pulley 8. The bottom of both the first pulley 8 and the second pulley 9 are fixedly connected to the fan blades 5 through the fixed plate 17. Multiple air outlet slots 18 are provided on both sides of the second protective cover 3.

[0037] The first protective cover 2 has through holes 15 at each of its four corners, and the second protective cover 3 has screws 20 movably connected at each of its four corners. One end of the screw 20 passes through the outer side of the first protective cover 2 and is threaded to a locking nut 21.

[0038] Specifically, the circuit board body 1 and multiple thermally conductive sheets 4 are placed between the first protective cover 2 and the second protective cover 3. The screw 20 and locking nut 21 are rotated to clamp and fix the circuit board body 1 and the multiple thermally conductive sheets 4 under the first and second protective covers 2 and 3. The heat emitted by the heating element 11 is conducted to the multiple thermally conductive sheets 4. The metal heat-conducting block 12 increases the heat conduction efficiency to a certain extent. The thermally conductive sheets 4 then conduct the heat to the first and second protective covers 2 and 3 respectively, and dissipate heat through contact with the air via multiple heat dissipation fins 19. Simultaneously, the drive motor... Under the action of 7, the first pulley 8 is driven to rotate. Under the action of the transmission belt 10, the first pulley 8 drives the second pulley 9 to rotate synchronously, so that multiple fan blades 5 generate accelerated airflow above the circuit board body 1. The accelerated airflow accelerates and carries away heat from the air outlet 18. The thermal grease 13 can further improve the heat dissipation effect. This solves the problem that most existing circuit board heat dissipation structures use heat dissipation fins for heat dissipation, which has poor heat dissipation effect. In addition, directly adding heat dissipation fins to the circuit board will occupy the circuit board space, affect the arrangement of heat-generating components, and reduce the usable area of ​​the circuit board to a certain extent.

[0039] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A heat dissipation structure for a circuit board, characterized in that, The circuit board body (1) is provided with heat conduction components at both the bottom and top of the circuit board body (1). A first protective cover (2) is connected to the bottom of the circuit board body (1), and a second protective cover (3) is connected to the top of the circuit board body (1). A driving component is provided on the top of the second protective cover (3), and a wind-cooling heat dissipation component is provided on the top of the second protective cover (3). The wind-cooling heat dissipation component is connected to the driving component and cools down the circuit board body (1).

2. The circuit board heat dissipation structure according to claim 1, characterized in that, The circuit board body (1) has multiple heating elements (11) fixedly connected to the top, and multiple metal heat-conducting blocks (12) are provided at the top and bottom of the circuit board body (1).

3. The circuit board heat dissipation structure according to claim 2, characterized in that, The thermal conductive assembly includes multiple thermal conductive films (4), and the top and bottom of the circuit board body (1) are respectively attached to the multiple thermal conductive films (4).

4. The circuit board heat dissipation structure according to claim 3, characterized in that, The thermal conductive film (4) has a heat-dissipating grease (13) applied to one side.

5. A circuit board heat dissipation structure according to claim 4, characterized in that, The top of the first protective cover (2) and the bottom of the second protective cover (3) are both provided with grooves (14). The sides of the circuit board body (1) and the thermal conductive film (4) are located in the grooves (14). The first protective cover (2) and the second protective cover (3) clamp the circuit board body (1) and the thermal conductive film (4).

6. A circuit board heat dissipation structure according to claim 5, characterized in that, Multiple heat dissipation fins (19) are fixedly connected to the bottom of the first protective cover (2) and the top of the second protective cover (3), and the heat dissipation fins (19) are made of aluminum metal.

7. A circuit board heat dissipation structure according to claim 6, characterized in that, The drive assembly includes a drive motor (7), a fixing frame (6) is fixedly connected to the top of the second protective cover (3), and the bottom of the drive motor (7) is fixedly connected to the top of the fixing frame (6).

8. A circuit board heat dissipation structure according to claim 7, characterized in that, The power output end of the drive motor (7) is fixedly connected to the first pulley (8) through the fixed frame (6), and the top of the second protective cover (3) is provided with multiple through slots (16), and a fixed plate (17) is fixedly connected horizontally in the through slots (16).

9. A circuit board heat dissipation structure according to claim 8, characterized in that, The top of the fixed plate (17) is movably connected to a second pulley (9), and a transmission belt (10) is provided between the second pulley (9) and the first pulley (8). The bottom of the first pulley (8) and the second pulley (9) are both fixedly connected to fan blades (5) through the fixed plate (17). Multiple air outlet slots (18) are provided on both sides of the second protective cover (3).

10. A circuit board heat dissipation structure according to claim 9, characterized in that, The first protective cover (2) has through holes (15) at each of its four corners, and the second protective cover (3) has screws (20) movably connected at each of its four corners. One end of the screw (20) passes through the outer side of the first protective cover (2) and is threaded to a locking nut (21).

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