Anti-loose solder printed circuit board

Abstract

The utility model relates to printed circuit board technical field, and disclose a kind of anti -welding printed circuit board, including circuit board main body, the four around of circuit board main body is fixed with buffer installation cover, the circuit board main body includes circuit board frame, the four around end of circuit board frame is equipped with mounting hole, the top surface of circuit board frame is equipped with multiple groups of welding groove, and the bottom end of welding groove is fixed with pin base, and the bottom end of pin base is connected with circuit layer.The utility model when being subjected to the shaking of overall circuit board frame, the rubber frame of electronic component four around engagement can provide local buffer and shock-absorbing effect, reduce the influence of overall circuit board concussion to component, while top sealing plate layer is carried out through corresponding size opening hole to the limiting of component, keep the reinforcement of electronic component, avoid bottom pin welding part to be affected and weld, and top sealing plate layer can cover welding groove top, avoid welding part to be affected, provide protection.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board technology, specifically to a printed circuit board that prevents desoldering. Background Technology

[0002] Printed circuit boards (PCBs) are a crucial component in the electronics industry. Almost every electronic device, from small items like watches and calculators to large systems like computers, communication devices, and military weapons, relies on PCBs for electrical interconnection with integrated circuits and other electronic components. A PCB consists of an insulating substrate, connecting wires, and pads for mounting and soldering electronic components. It serves the dual purpose of providing conductive lines and insulation, while also reducing overall size, lowering costs, and improving the quality and reliability of electronic devices. PCBs are typically mounted on machines using pre-drilled holes during manufacturing. Currently, electronic components on PCBs are typically connected using soldering wire.

[0003] Existing technology, such as the patent with publication number CN218735164U, discloses a printed circuit board with anti-desoldering capability, including a circuit board body, a diode, a detachable pin structure, a pin mating structure, and an electrical connection structure. The circuit board body has a through-hole mating groove that mates with the pin mating structure. The pin mating structure is detachably connected to the diode through the detachable pin structure. The electrical connection structure is fixedly installed on the inner diameter surface of the mating groove. The electrical connection structure and the pin mating structure are in contact and electrically connected. The detachable pin structure and the diode are electrically connected.

[0004] While the aforementioned existing technologies have significant beneficial effects, they still have shortcomings:

[0005] The aforementioned printed circuit board has a through-hole connection slot on the board. The board contact connector and pin holder are elastically mounted on the inner diameter surface of the connection slot. The pins can be passed through the connection slot and make contact with the contact connector to draw power. The pins are fixedly connected through the connection slot and the limiting bolt, avoiding soldering between the pins and the printed circuit board and preventing the pins from desoldering. However, the components such as diodes connected to the pins do not have a reinforcement structure. When the printed circuit board is vibrated, it cannot reduce the vibration amplitude of the circuit board, thus increasing the probability of circuit board damage. Therefore, a printed circuit board with anti-desoldering is proposed. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model provides an anti-desoldering printed circuit board. The rubber frame that holds the electronic components together provides localized buffering and shock absorption, reducing the impact of overall circuit board vibration on the components. At the same time, the top sealing layer uses corresponding sized openings to limit the components, preventing the bottom pin soldering parts from being affected by vibration.

[0007] To achieve the above objectives, this utility model provides the following technical solution: an anti-soldering printed circuit board, comprising a circuit board body, buffer mounting sleeves fixed around the circuit board body, a circuit board frame, mounting holes formed at the four peripheral ends of the circuit board frame, multiple sets of soldering grooves formed on the top surface of the circuit board frame, and pin seats fixed at the bottom of the soldering grooves, a circuit layer connected to the bottom of the pin seats, and a pin frame soldered to the top surface of the pin seats, an electronic component fixed to the top of the pin frame, and a rubber frame attached around the electronic component, a top sealing plate layer fixed to the outer wall of the rubber frame, and an adhesive layer attached to the bottom surface of the top sealing plate layer.

[0008] Preferably, the mounting holes are equidistantly spaced around the perimeter of the circuit board frame, and the inner walls of the mounting holes are fixedly connected to the buffer mounting sleeves.

[0009] Preferably, the circuit layer is evenly laid along the inside of the circuit board frame, and the circuit layer is soldered and fixed to multiple sets of pin sockets.

[0010] Preferably, the electronic components are fixed by welding to the pin holder via a pin bracket, and the electronic components are engaged with the top sealing plate layer by a rubber frame around their perimeter.

[0011] Preferably, the top sealing plate layer is bonded and fixed to the top surface of the circuit board frame by an adhesive layer, and the top sealing plate layer covers the top surface of the welding groove.

[0012] Preferably, the buffer mounting sleeve includes a pile body sleeve, and an outer rubber sleeve is fixed to the outer wall of the pile body sleeve, an inner rubber sleeve is fixed to the inner wall of the pile body sleeve, and friction rings are connected to the inner walls of the inner rubber sleeve.

[0013] Preferably, both the inner and outer rubber sleeves are made of rubber, and the friction rings are arranged at equal intervals around the inner wall of the inner rubber sleeve.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. When the overall circuit board frame shakes, the rubber frame around the electronic components can provide local buffering and shock absorption, reducing the impact of the overall circuit board vibration on the components. At the same time, the top sealing plate layer limits the components through corresponding sized openings, keeping the electronic components reinforced and preventing the bottom pin soldering parts from being affected and desoldered. In addition, the top sealing plate layer can cover the top of the soldering groove to prevent the soldering parts from being affected and provide protection.

[0016] 2. When this printed circuit board is subjected to vibration due to the environment of the housing it is installed in, the force will be reduced by the internal friction ring and the outer rubber sleeve of the outer wall, thereby achieving the purpose of buffering the connection position and improving the vibration protection of the circuit board body.

[0017] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures pointed out in the description, claims, and drawings. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural diagram of the main body of the circuit board of this utility model;

[0019] Figure 2 This is a partial cross-sectional view of the circuit board structure of this utility model;

[0020] Figure 3 This is a three-dimensional structural diagram of the buffer mounting sleeve of this utility model;

[0021] Figure 4 This is a schematic cross-sectional view of the buffer mounting sleeve of this utility model.

[0022] In the diagram: 1. Circuit board body; 101. Circuit board frame; 102. Mounting hole; 103. Soldering groove; 104. Pin socket; 105. Circuit layer; 106. Pin frame; 107. Electronic components; 108. Rubber frame; 109. Top sealing plate layer; 110. Adhesive layer; 2. Buffer mounting sleeve; 201. Stub sleeve; 202. Outer rubber sleeve; 203. Inner rubber sleeve; 204. Friction ring. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-4 This embodiment of an anti-soldering printed circuit board includes a circuit board body 1, with buffer mounting sleeves 2 fixed around the circuit board body 1. The circuit board body 1 includes a circuit board frame 101, with mounting holes 102 at the four peripheral ends of the circuit board frame 101. The top surface of the circuit board frame 101 has multiple sets of soldering grooves 103, and the bottom end of the soldering grooves 103 is fixed with a pin seat 104. The bottom end of the pin seat 104 is connected to a circuit layer 105, and the top surface of the pin seat 104 is soldered with a pin bracket 106. The top end of the pin bracket 106 is fixed with an electronic component 107, and a rubber frame 108 is attached around the electronic component 107. A top sealing plate layer 109 is fixed to the outer wall of the rubber frame 108, and an adhesive layer 110 is attached to the bottom surface of the top sealing plate layer 109.

[0025] like Figure 1-4 As shown, the printed circuit board in this invention is similar in structure to existing printed circuit boards, such as the anti-desoldering printed circuit board disclosed in CN218735164U. The main improvement of this invention is that the rubber frame 108 that engages around the electronic components 107 provides local buffering and shock absorption, reducing the impact of overall circuit board vibration on the components. Simultaneously, the top sealing layer 109 uses corresponding sized openings to limit the components, preventing the bottom pin soldering portion from being affected by vibration. In this invention, the circuit layer 105 and the electronic components 107 are existing technologies. When using this printed circuit board, the electronic components 107 requiring soldering can be placed in the corresponding soldering slots 103 on the circuit board frame 101. Then, the pin holders 106 at the bottom of the electronic components 107 are aligned with the pin seats 104 on the inner wall of the soldering slots 103. At this point, the worker can connect them by soldering to complete the connection of all corresponding electronic components 107. After placement, it is necessary to maintain the same level between the electronic components 107 and the circuit board frame 101. Then, apply an adhesive layer 110 to a local area on the top surface of the circuit board frame 101. Then, attach the top sealing plate layer 109, which is of the same size and molded to match the number of electronic components 107, to the top surface of the circuit board frame 101 to complete the bonding and fixing, thus completing the assembly. The connection between the pin base 104 and the circuit layer 105 ensures the normal use of the soldered circuit board. When the circuit board frame 101 shakes, the rubber frame 108 around the electronic components 107 can provide local buffering and shock absorption, reducing the impact of the overall circuit board vibration on the components. At the same time, the top sealing plate layer 109 limits the components through corresponding sized openings, reinforcing the electronic components 107 and preventing the bottom pin soldering parts from being affected and desoldered. The top sealing plate layer 109 can also cover the top of the soldering groove 103 to prevent the soldering parts from being affected and provide protection.

[0026] like Figure 3-4 As shown, the buffer mounting sleeve 2 includes a stake sleeve 201, and an outer rubber sleeve 202 is fixed to the outer wall of the stake sleeve 201. An inner rubber sleeve 203 is fixed to the inner wall of the stake sleeve 201, and friction rings 204 are connected to the inner walls of the inner rubber sleeve 203. When the circuit board is assembled with the housing of the device, the buffer mounting sleeve 2 around the circuit board frame 101 needs to be aligned with the limiting stakes of the device housing and inserted. After the limiting stakes enter the inner rubber sleeve 203, as multiple sets of friction rings 204 are continuously inserted, the friction is maintained through the friction rings 204 to keep the installation stable. When the device is affected by the housing and vibrates, the force is reduced by the internal friction rings 204 and the outer rubber sleeve 202, thereby achieving the purpose of buffering the connection position and improving the vibration protection of the circuit board body.

[0027] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A solder resisting printed circuit board, comprising a circuit board body (1), characterized in that, The circuit board body (1) is fixed with buffer mounting sleeves (2) around its perimeter. The circuit board body (1) includes a circuit board frame (101). Mounting holes (102) are opened at the four perimeters of the circuit board frame (101). Multiple sets of soldering grooves (103) are opened on the top surface of the circuit board frame (101). A pin seat (104) is fixed at the bottom of the soldering groove (103). A circuit layer (105) is connected to the bottom of the pin seat (104). A pin frame (106) is soldered on the top surface of the pin seat (104). An electronic component (107) is fixed at the top of the pin frame (106). A rubber frame (108) is attached around the electronic component (107). A top sealing plate layer (109) is fixed on the outer wall of the rubber frame (108). An adhesive layer (110) is attached to the bottom surface of the top sealing plate layer (109).

2. The anti-desoldering printed circuit board according to claim 1, characterized in that, The mounting holes (102) are equidistantly opened around the circuit board frame (101), and the inner walls of the mounting holes (102) are fixedly connected to the buffer mounting sleeve (2).

3. The anti-desoldering printed circuit board according to claim 1, characterized in that, The circuit layer (105) is evenly laid along the inside of the circuit board frame (101), and the circuit layer (105) is welded and fixed to multiple sets of pin sockets (104).

4. The anti-desoldering printed circuit board according to claim 1, characterized in that, The electronic component (107) is welded and fixed to the pin base (104) via the pin frame (106), and the electronic component (107) is engaged with the top sealing plate layer (109) by the rubber frame (108) around its perimeter.

5. A printed circuit board for preventing desoldering according to claim 1, characterized in that, The top sealing plate layer (109) is bonded and fixed to the top surface of the circuit board frame (101) by an adhesive layer (110), and the top sealing plate layer (109) and the top surface of the welding groove (103) are covered.

6. The anti-desoldering printed circuit board according to claim 1, characterized in that, The buffer mounting sleeve (2) includes a pile body sleeve (201), and an outer rubber sleeve (202) is fixed to the outer wall of the pile body sleeve (201). An inner rubber sleeve (203) is fixed to the inner wall of the pile body sleeve (201), and a friction ring (204) is connected to the inner walls of the inner rubber sleeve (203).

7. A printed circuit board for preventing desoldering according to claim 6, characterized in that, Both the inner rubber sleeve (203) and the outer rubber sleeve (202) are made of rubber, and the friction rings (204) are arranged at equal intervals around the inner wall of the inner rubber sleeve (203).

Images