A metal-based PCB plate provided with a groove on a side surface
Patent Information
- Application Number
- CN202522115172.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-30
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-09-30
AI Technical Summary
[0003]现有的埋嵌工艺为在PCB芯板上开比金属基大的通槽，将金属基放入槽内，采用PP将金属基与PCB黏合在一起，导致金属基于PCB接触面为四个侧面，二者相交表面积占比较小，导致PCB和金属基层的连接不够牢固，在PCB后制程及客户使用过程中存在金属基结合面断裂风险，导致散热失效，无法满足产品散热需求
[0015]根据上述方案的本实用新型，其有益效果在于，通过于芯板体开设通槽，于金属基的两侧间隔开设多个第一凹槽，当将金属基放入通槽内后，于通槽内填充粘合剂，粘合剂填满通槽和各第一凹槽，不仅实现了金属基的侧面与通槽的侧壁之间的粘接，通过各第一凹槽，还进一步增加金属基侧面与通槽侧壁之间的接触面积，从而使得金属基与芯板体之间连接更为牢固，提升了金属基与芯板体之间的连接强度。
Smart Images
Figure CN224805158U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB board processing technology, and in particular to a PCB board with a metal base having grooves on the side. Background Technology
[0002] With the development of the times, the use of electronic products has gradually increased, and the number of PCB boards used has also increased accordingly. Electronic components on PCB boards generate heat when they are working. In order to ensure the normal operation of electronic components, metal substrates are usually embedded in the PCB board, which can dissipate heat from the PCB board.
[0003] The existing embedding process involves creating a through-slot on the PCB core board that is larger than the metal base, placing the metal base inside the slot, and using PP to bond the metal base to the PCB. This results in the metal base having four sides in contact with the PCB, and the area of the intersecting surfaces being relatively small. Consequently, the connection between the PCB and the metal base is not strong enough, posing a risk of breakage at the metal base bonding surface during PCB manufacturing and customer use. This can lead to heat dissipation failure and fail to meet the product's heat dissipation requirements. Utility Model Content
[0004] In order to overcome the shortcomings of the existing technology, this utility model provides a PCB board with a metal base having grooves on the side.
[0005] The technical solution of this utility model is as follows: A PCB board with a metal base having grooves on its sides includes: a metal base and a core board body. A through groove is formed on the core board body. The metal base is disposed in the through groove. The metal base and the sidewall of the through groove are spaced apart. A plurality of first grooves are spaced apart on both sides of the metal base. Each first groove and the through groove are filled with adhesive.
[0006] Preferably, the through groove is located at the exact center of the core plate, and the metal base is disposed in the middle of the through groove.
[0007] Preferably, a plurality of second grooves are spaced apart at both ends of the metal base, and each of the second grooves and the through groove is filled with the adhesive.
[0008] Preferably, the first groove on one side of the metal base is aligned with the first groove on the other side of the metal base.
[0009] Preferably, the first groove on one side of the metal substrate is staggered from the first groove on the other side of the metal substrate.
[0010] Preferably, each of the second grooves at one end of the metal base is aligned with each of the second grooves on the other side of the metal base.
[0011] Preferably, the second grooves at one end of the metal base are staggered from each other with the second grooves on the other side of the metal base.
[0012] Preferably, the depth of both the first groove and the second groove is 20%-50% of the thickness of the metal base.
[0013] Preferably, the vertical distance from the top sidewall of each of the first grooves to the top surface of the metal base is equal to the vertical distance from the bottom sidewall of each of the first grooves to the bottom surface of the metal base.
[0014] Preferably, the vertical distance from the top sidewall of each of the second grooves to the top surface of the metal base is equal to the vertical distance from the bottom sidewall of each of the second grooves to the bottom surface of the metal base.
[0015] According to the above-described solution, the beneficial effect of this utility model is that by opening a through groove in the core board body and opening multiple first grooves at intervals on both sides of the metal base, when the metal base is placed in the through groove, the through groove is filled with adhesive. The adhesive fills the through groove and each first groove, which not only realizes the bonding between the side of the metal base and the side wall of the through groove, but also further increases the contact area between the side of the metal base and the side wall of the through groove through each first groove, thereby making the connection between the metal base and the core board body more firm and improving the connection strength between the metal base and the core board body. Attached Figure Description
[0016] Figure 1 A schematic diagram of a PCB board with a metal base having grooves on its sides; Figure 2 An exploded three-dimensional structural diagram of a PCB board with grooves on the side of a metal base. Figure 3 This is a schematic diagram of the cross-sectional structure of a metal substrate; Figure 4 A schematic diagram of a cross-sectional structure of a PCB board with a metal base having grooves on its sides; Figure 5 This is a schematic cross-sectional view of a PCB board with a metal base having grooves on its sides.
[0017] In the figure, 10 is the core board body; 11 is the through groove; 12 is the core board; 13 is the copper base; 14 is the prepreg; 20 is the metal base; 21 is the first groove; 22 is the second groove; and 30 is the adhesive. Detailed Implementation
[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments: Example 1
[0019] like Figures 1-5 As shown, a PCB board with a metal substrate having grooves on its sides includes a metal substrate 20 and a core board body 10. The core board body 10 is composed of multiple core boards 12, copper substrates 13, and prepreg sheets 14. The top and bottom surfaces of each core board 12 are laminated with the copper substrate 13 to form a copper-clad laminate. The copper-clad laminates are bonded together with the prepreg sheets 14 to form a multi-layer structure core board body 10. The core board body 10 has a through slot 11, and the metal substrate 20 is disposed in the middle of the through slot 11. The four sides of the metal substrate 20 are evenly spaced from the corresponding hole walls of the through slot 11 to form equidistant gaps, which facilitates the installation of the metal substrate 20.
[0020] like Figure 2 , Figure 3 and Figure 5 As shown, multiple first grooves 21 are spaced apart on both sides of the metal base 20. The through groove 11 and all the first grooves 21 are filled with adhesive 30. It should be noted that the adhesive 30 is PP adhesive, i.e., polypropylene-specific plastic glue, and the prepreg 14 is PP glue. After the adhesive 30 cures, it firmly fixes the metal base 20 within the through groove 11. This structure not only facilitates the injection of adhesive 30 but also increases the bonding area and adhesion force between the metal base 20 and the core board 10 by utilizing the first grooves 21, significantly improving the bonding strength and heat dissipation performance, which is beneficial for subsequent processing.
[0021] In this embodiment, as Figure 2 As shown, the through slot 11 is opened at the very center of the core plate 10. This layout allows the metal base 20 in the through slot 11 to uniformly absorb the heat generated by the surrounding components. The metal base 20 is preferably made of copper, thereby significantly improving the overall heat dissipation efficiency.
[0022] In this embodiment, as Figures 2 to 4 As shown, multiple second grooves 22 are spaced apart at both ends of the metal base 20. This arrangement further increases the contact area between the side of the metal base 20 and the inner wall of the through groove 11. After filling the second grooves 22 and the through groove 11 with adhesive 30, the bonding strength between the metal base 20 and the core board 10 can be significantly enhanced, making the overall connection more robust and reliable.
[0023] In this embodiment, the first groove 21 on one side of the metal base 20 and the first groove 21 on the other side of the metal base 20 are staggered. By staggering them, the adhesive 30 can be distributed more evenly in the through groove 11, thereby enhancing the bonding strength between the two sides of the metal base 20 and the sidewall of the through groove 11.
[0024] In this embodiment, the second grooves 22 at one end of the metal base 20 are staggered from each other on the other side of the metal base 20. This staggering allows the adhesive 30 to be distributed more evenly within the through groove 11, thereby enhancing the bonding strength between the two ends of the metal base 20 and the sidewalls of the through groove 11.
[0025] In this embodiment, as Figure 2 , Figure 4 and Figure 5 As shown, the depths of the first groove 21 and the second groove 22 are 20%-50% of the thickness of the metal base 20. Preferably, the depths of the first groove 21 and the second groove 22 are 20% or 50% of the thickness of the metal base 20. With the above arrangement, not only can the adhesive 30 be retained in the first groove 21 and the second groove 22, thereby enhancing the mechanical bonding force between the metal base 20 and the sidewall of the through groove 11, but also, while ensuring effective bonding between the sidewall of the metal base 20 and the sidewall of the through groove 11, the additional contact area is significantly increased, thereby comprehensively improving the connection strength.
[0026] In this embodiment, as Figure 2 As shown, the vertical distance from the top sidewall of each of the second grooves 22 to the top surface of the metal base 20 is equal to the vertical distance from the bottom sidewall of each of the second grooves 22 to the bottom surface of the metal base 20. This arrangement helps maintain stress balance in the metal base 20 within the through groove 11, prevents the metal base 20 from becoming skewed due to the cooling and shrinkage of the adhesive 30, ensures that the adhesive 30 evenly coats both sides and ends of the metal base 20, and significantly improves the bonding reliability between the metal base 20 and the core board 10. Example 2
[0027] Unlike Example 1, as Figure 3 As shown, each of the second grooves 22 at one end of the metal base 20 is aligned with each of the second grooves 22 on the other side of the metal base 20. This arrangement helps the adhesive 30 to be evenly distributed and concentratedly filled in the through groove 11, thereby enhancing the bonding strength between the sidewall of the metal base 20 and the through groove 11. Example 3
[0028] Unlike Example 1, as Figure 3As shown, the first groove 21 on one side of the metal base 20 is aligned with the first groove 21 on the other side of the metal base 20. This arrangement helps the adhesive 30 to be evenly distributed and concentratedly filled within the through groove 11, thereby enhancing the bonding strength between the sidewall of the metal base 20 and the through groove 11. It should be noted that Embodiment 3 can be used in combination with Embodiment 2, or Embodiment 2 can be used in combination with Embodiment 1, replacing the offset arrangement of the second grooves 22 at one end of the metal base 20 with the second grooves 22 on the other side of the metal base 20 in Embodiment 1 with the technical solution in Embodiment 2. Alternatively, Embodiment 3 can be used in combination with Embodiment 1, that is, replacing the offset arrangement of the second grooves 22 at one end of the metal base 20 with the second grooves 22 on the other side of the metal base 20 with the technical solution in Embodiment 3.
[0029] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
[0030] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.
Claims
1. A PCB board with a metal base having grooves on its sides, characterized in that, include: The metal base (20) and the core board (10) are provided. A through groove (11) is provided on the core board (10). The metal base (20) is disposed in the through groove (11). The sidewalls of the metal base (20) and the through groove (11) are spaced apart. A plurality of first grooves (21) are provided on both sides of the metal base (20). Each first groove (21) and the through groove (11) are filled with adhesive (30).
2. A PCB board with a metal base having grooves on its sides according to claim 1, characterized in that, The through groove (11) is located at the center of the core plate (10), and the metal base (20) is located in the middle of the through groove (11).
3. A PCB board with a metal base having grooves on its sides according to claim 2, characterized in that, The metal base (20) has a plurality of second grooves (22) spaced apart at both ends, and each second groove (22) and the through groove (11) is filled with the adhesive (30).
4. A PCB board with a metal base having grooves on its sides according to claim 2, characterized in that, The first groove (21) on one side of the metal base (20) is aligned with the first groove (21) on the other side of the metal base (20).
5. A PCB board with a metal base having grooves on its sides according to claim 2, characterized in that, The first groove (21) on one side of the metal base (20) is staggered from the first groove (21) on the other side of the metal base (20).
6. A PCB board with a metal base having grooves on its side as described in claim 3, characterized in that, The second grooves (22) at one end of the metal base (20) are aligned with each other on the other side of the metal base (20).
7. A PCB board with a metal base having grooves on its side as described in claim 3, characterized in that, The second grooves (22) at one end of the metal base (20) are staggered from each other on the other side of the metal base (20).
8. A PCB board with a metal base having grooves on its side as described in claim 3, characterized in that, The depths of the first groove (21) and the second groove (22) are both 20%-50% of the thickness of the metal base (20).
9. A PCB board with a metal base having grooves on its side as described in claim 7, characterized in that, The vertical distance from the top sidewall of each of the first grooves (21) to the top surface of the metal base (20) is equal to the vertical distance from the bottom sidewall of each of the first grooves (21) to the bottom surface of the metal base (20).
10. A PCB board with a metal base having grooves on its sides according to claim 7, characterized in that, The vertical distance from the top sidewall of each of the second grooves (22) to the top surface of the metal base (20) is equal to the vertical distance from the bottom sidewall of each of the second grooves (22) to the bottom surface of the metal base (20).