Embedded anti-interference circuit board of fingerprint identification module

Abstract

The utility model discloses an embedded anti -interference circuit board of fingerprint identification module belongs to circuit board technical field, including substrate, fingerprint sensor module, processing component and anti -interference mechanism, processing component and fingerprint sensor module between electric connection, just sensor module and processing component all install the surface of substrate, the lower surface of substrate is provided with recess, the upper end of anti -interference mechanism is embedded in recess, through the substrate integration fingerprint sensor module and processing component, guarantee fingerprint signal efficient transmission, the recess of substrate is embedded in the upper end of anti -interference mechanism, can be targeted against equipment in voltage fluctuation, electromagnetic radiation etc.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, specifically to an embedded anti-interference circuit board for a fingerprint recognition module. Background Technology

[0002] With the rapid development of biometric technology, fingerprint recognition has been widely used in various smart terminal devices such as smartphones, tablets, smart door locks, and laptops due to its advantages such as uniqueness, stability, and convenience. Among the core components of the fingerprint recognition system, the embedded circuit board of the fingerprint recognition module undertakes the key functions of fingerprint signal acquisition, processing, transmission, and interaction with terminal devices. Its working stability and anti-interference ability directly determine the accuracy, response speed, and user experience of fingerprint recognition.

[0003] The internal environment of the equipment in which the circuit board is located is complex, with interference from voltage fluctuations in the power supply module and electromagnetic radiation interference from other electronic components (such as radio frequency modules and display driver circuits). At the same time, during long-term operation, the core components of the circuit board will continuously generate heat. If the heat cannot be dissipated in time, the local temperature of the substrate will rise. Excessive temperature will not only interfere with the operation of electronic components, thereby reducing working efficiency and lifespan, but also further aggravate the instability of signal transmission. Based on the above problems, an embedded anti-interference circuit board for fingerprint recognition module is proposed. Utility Model Content

[0004] The purpose of this utility model is to provide an embedded anti-interference circuit board for a fingerprint recognition module. By integrating a fingerprint sensor module and processing components on a substrate, it ensures efficient transmission of fingerprint signals. The anti-interference mechanism is embedded in a groove on the substrate, which can specifically resist interference such as voltage fluctuations and electromagnetic radiation within the device, avoid signal distortion, and improve recognition accuracy and response speed, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an embedded anti-interference circuit board for a fingerprint recognition module, comprising a substrate, a fingerprint sensor module, a processing component, and an anti-interference mechanism, wherein the processing component is electrically connected to the fingerprint sensor module;

[0006] Furthermore, the fingerprint sensor module and processing components are both mounted on the surface of the substrate, and a groove is formed on the lower surface of the substrate, with the upper end of the anti-interference mechanism embedded in the groove.

[0007] It also includes a reinforcement mechanism, which is provided in two sets, with the two sets of reinforcement mechanisms respectively located at both ends of the substrate and the anti-interference mechanism.

[0008] Preferably, the processing component includes a microprocessor, a power management module, and a signal processor. The microprocessor, power management module, and signal processor are all mounted on the upper surface of the substrate. The microprocessor is electrically connected to the fingerprint sensor module. The power management module is electrically connected to both the microprocessor and the fingerprint sensor module. The signal processor is electrically connected between the microprocessor and the fingerprint sensor module.

[0009] Preferably, the anti-interference mechanism includes a heat sink, the upper end of which is embedded in a groove, and thermally conductive adhesive is bonded to the connection between the heat sink and the groove. The lower end of the heat sink is connected to a flow guide plate, and the surface of the flow guide plate is arrayed with multiple heat dissipation holes.

[0010] Preferably, the anti-interference mechanism further includes an electromagnetic shielding adhesive, which is applied around the fingerprint sensor module and the processing component.

[0011] Preferably, the reinforcement mechanism includes a limiting plate, on which a slot is formed at a position corresponding to the base plate and the guide plate. The limiting plate is engaged with both ends of the base plate and the guide plate through the slot. Positioning holes are formed at symmetrical positions at both ends of the base plate and the guide plate. Fasteners are embedded at positions corresponding to the positioning holes on the limiting plate, and one end of the fastener is threaded into the positioning hole.

[0012] Preferably, a heat sink is mounted on the surface of the substrate, and thermally conductive adhesive is bonded to the lower surface of the heat sink where it adheres to the substrate.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This utility model provides an embedded anti-interference circuit board for a fingerprint recognition module. The fingerprint sensor module and processing components are integrated into the substrate to ensure efficient transmission of fingerprint signals. The upper end of the anti-interference mechanism is embedded in the groove of the substrate, which can specifically resist interference such as voltage fluctuations and electromagnetic radiation within the device, avoid signal distortion, and improve recognition accuracy and response speed. At the same time, two sets of reinforcement mechanisms fix the substrate and the anti-interference mechanism at both ends, enhancing the overall structural stability and preventing external forces from causing the components to loosen. In addition, the anti-interference mechanism is combined with a heat dissipation design to dissipate the heat of the core components in a timely manner, avoiding high temperature from affecting the efficiency and lifespan of the components, and further ensuring signal stability.

[0015] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained through the structures pointed out in the description and the accompanying drawings. Attached Figure Description

[0016] Figure 1This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is an exploded view of the overall structure of this utility model;

[0018] Figure 3 This is a bottom view of the substrate structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the substrate and processing components of this utility model.

[0020] The diagram is labeled as follows: 1. Substrate; 2. Fingerprint sensor module; 3. Processing component; 31. Microprocessor; 32. Power management module; 33. Signal processor; 4. Anti-interference mechanism; 41. Heat sink; 42. Thermal conductive adhesive one; 43. Guide plate; 44. Heat dissipation hole; 45. Electromagnetic shielding adhesive; 5. Groove; 6. Reinforcing mechanism; 61. Limiting plate; 62. Slot; 63. Positioning hole; 64. Fastener; 7. Heat sink; 8. Thermal conductive adhesive two. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] This utility model provides, for example Figures 1-4 An embedded anti-interference circuit board for a fingerprint recognition module is shown, including a substrate 1, a fingerprint sensor module 2, a processing component 3 and an anti-interference mechanism 4, wherein the processing component 3 is electrically connected to the fingerprint sensor module 2.

[0023] Furthermore, the fingerprint sensor module 2 and the processing component 3 are both mounted on the surface of the substrate 1. A groove 5 is provided on the lower surface of the substrate 1, and the upper end of the anti-interference mechanism 4 is embedded in the groove 5.

[0024] It also includes a reinforcement mechanism 6, which is provided in two sets. The two sets of reinforcement mechanisms 6 are respectively located at both ends of the substrate 1 and the anti-interference mechanism 4.

[0025] The substrate 1 serves as the supporting base, and the fingerprint sensor module 2 and processing component 3 are mounted on the surface and electrically connected to form the core link for fingerprint signal acquisition and processing. The upper end of the anti-interference mechanism 4 is embedded in the groove 5 on the lower surface of the substrate 1 to specifically block external interference. Two sets of reinforcement mechanisms 6 fix the substrate 1 and the two ends of the anti-interference mechanism 4 respectively to ensure the stability of the overall structure.

[0026] The modular integrated design improves signal transmission efficiency, the embedded connection between the anti-interference mechanism 4 and the substrate 1 enhances the interference effect, and the dual-group reinforcement mechanism 6 ensures the structural reliability of the device under vibration and impact environments, thereby improving the overall stability and durability of the fingerprint recognition system.

[0027] The processing component 3 includes a microprocessor 31, a power management module 32, and a signal processor 33. The microprocessor 31, the power management module 32, and the signal processor 33 are all mounted on the upper surface of the substrate 1. The microprocessor 31 is electrically connected to the fingerprint sensor module 2. The power management module 32 is electrically connected to both the microprocessor 31 and the fingerprint sensor module 2. The signal processor 33 is electrically connected between the microprocessor 31 and the fingerprint sensor module 2.

[0028] The microprocessor 31, as the core control unit, receives signals collected by the fingerprint sensor module 2; the signal processor 33 optimizes the original signal and then transmits it to the microprocessor 31; the power management module 32 provides stable power to the microprocessor 31 and the fingerprint sensor module 2, and the three work together to complete the collection, processing and control of fingerprint signals.

[0029] The well-defined processing component 3 architecture improves signal processing efficiency, the power management module 32 ensures power supply stability and reduces voltage fluctuations from interfering with the signal, and the intervention of the signal processor 33 reduces the noise of the original signal and improves the accuracy and response speed of fingerprint recognition.

[0030] The anti-interference mechanism 4 includes a heat sink 41, the upper end of which is embedded in a groove 5. Thermally conductive adhesive 42 is bonded to the connection between the heat sink 41 and the groove 5. A flow guide plate 43 is connected to the lower end of the heat sink 41. Multiple heat dissipation holes 44 are arrayed on the surface of the flow guide plate 43.

[0031] The heat sink 41 is tightly attached to the groove 5 of the substrate 1 by thermally conductive adhesive 42, which quickly absorbs the heat generated by the components on the substrate 1. The heat is conducted to the lower guide plate 43, which expands the heat dissipation area through the heat dissipation holes 44 arrayed on its surface, and accelerates the dissipation of heat to the external environment.

[0032] Thermal conductive adhesive 42 enhances heat conduction efficiency, and the combined design of heat sink 41 and flow guide plate 43 significantly improves heat dissipation performance, preventing components from degrading due to high temperature. The array of heat dissipation holes 44 optimizes airflow, further improving the heat dissipation rate and extending the service life of components.

[0033] The anti-interference mechanism 4 also includes electromagnetic shielding adhesive 45, which is applied around the fingerprint sensor module 2 and the processing component 3.

[0034] Electromagnetic shielding adhesive 45 is applied around the fingerprint sensor module 2 and the processing component 3 to form a surrounding shielding layer, which absorbs and blocks electromagnetic radiation generated by other electronic components inside the device, while reducing the leakage of the module's own electromagnetic signals to the outside.

[0035] Targeted blocking of electromagnetic interference prevents fingerprint signals from being distorted by electromagnetic radiation during acquisition and processing, improves the module's electromagnetic compatibility, and enables it to maintain stable operation in complex electronic environments.

[0036] The reinforcement mechanism 6 includes a limiting plate 61. A slot 62 is provided on the limiting plate 61 at a position corresponding to the base plate 1 and the guide plate 43. The limiting plate 61 is engaged with both ends of the base plate 1 and the guide plate 43 through the slot 62. Positioning holes 63 are provided symmetrically at both ends of the base plate 1 and the guide plate 43. Fasteners 64 are embedded on the limiting plate 61 at a position corresponding to the positioning holes 63. One end of the fastener 64 is threaded into the positioning hole 63.

[0037] The limiting plate 61 is engaged with the two ends of the base plate 1 and the guide plate 43 through the slot 62 to achieve initial positioning. The fastener 64 passes through the limiting plate 61, is embedded in the positioning hole 63 and is fixed by thread, so that the base plate 1, the anti-interference mechanism 4 and the limiting plate 61 are tightly connected as a whole, and the relative displacement of each component is restricted.

[0038] The double-fixed structure significantly improves the overall mechanical strength and effectively resists external impacts such as vibration and drops; the detachable threaded connection design facilitates later maintenance and component replacement, taking into account both stability and maintainability.

[0039] A heat sink 7 is mounted on the surface of the substrate 1, and thermally conductive adhesive 8 is bonded to the lower surface of the heat sink 7 where it is attached to the substrate 1.

[0040] The heat sink 7 is attached to the surface of the substrate 1 by thermally conductive adhesive 8. Utilizing its large surface area and excellent thermal conductivity, it quickly absorbs the redundant heat on the substrate 1 that has not been processed by the anti-interference mechanism 4 and dissipates it into the environment through air convection.

[0041] Thermally conductive adhesive 28 ensures tight heat dissipation contact and forms a dual heat dissipation system with the anti-interference mechanism 4, further enhancing the heat dissipation effect and providing precise heat dissipation for local high-temperature areas of the substrate 1, avoiding heat accumulation that could affect the stability of circuit parameters.

[0042] In practical use, the embedded anti-interference circuit board of the fingerprint recognition module integrates the core components through the substrate 1. After the fingerprint sensor module 2 collects fingerprint information, it is optimized and processed by the signal processor 33. The microprocessor 31 completes the recognition operation. The power management module 32 provides stable power supply throughout the process to ensure the efficient operation of the signal processing link.

[0043] The heat sink 41 in the groove 5 on the lower surface of the substrate 1 quickly absorbs the heat of the components through the thermally conductive adhesive 42, and dissipates it rapidly through the heat dissipation holes 44 of the guide plate 43. The heat sink 7 on the surface of the substrate 1, together with the thermally conductive adhesive 8, enhances heat dissipation in local high-temperature areas. The dual heat dissipation system avoids the influence of high temperature. At the same time, the electromagnetic shielding adhesive 45 around the fingerprint sensor module 2 and the processing component 3 forms a barrier to block external electromagnetic radiation and ensure stable signal transmission.

[0044] The limiting plates 61 of the two sets of reinforcement mechanisms 6 are connected to the base plate 1 and the two ends of the guide plate 43 by the slots 62, and then the fasteners 64 are connected to the positioning holes 63 by threads to form an integral fixation, which effectively resists external forces such as vibration and impact, prevents the components from loosening, and realizes the coordinated operation of fingerprint signal acquisition, processing, anti-interference, heat dissipation and structural reinforcement. It can maintain stable recognition performance in complex electronic environments and changing working conditions, and extend the service life of the equipment.

[0045] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An embedded anti-interference circuit board for a fingerprint recognition module, characterized in that: It includes a substrate (1), a fingerprint sensor module (2), a processing component (3) and an anti-interference mechanism (4), wherein the processing component (3) is electrically connected to the fingerprint sensor module (2); Furthermore, the fingerprint sensor module (2) and the processing component (3) are both mounted on the surface of the substrate (1), and a groove (5) is provided on the lower surface of the substrate (1), and the upper end of the anti-interference mechanism (4) is embedded in the groove (5); It also includes a reinforcement mechanism (6), which is provided in two sets, and the two sets of reinforcement mechanisms (6) are respectively provided at both ends of the substrate (1) and the anti-interference mechanism (4).

2. The embedded anti-interference circuit board for a fingerprint recognition module according to claim 1, characterized in that: The processing component (3) includes a microprocessor (31), a power management module (32), and a signal processor (33). The microprocessor (31), the power management module (32), and the signal processor (33) are all mounted on the upper surface of the substrate (1). The microprocessor (31) is electrically connected to the fingerprint sensor module (2). The power management module (32) is electrically connected to both the microprocessor (31) and the fingerprint sensor module (2). The signal processor (33) is electrically connected between the microprocessor (31) and the fingerprint sensor module (2).

3. The embedded anti-interference circuit board for a fingerprint recognition module according to claim 2, characterized in that: The anti-interference mechanism (4) includes a heat sink (41), the upper end of which is embedded in a groove (5), and a thermally conductive adhesive (42) is bonded at the connection between the heat sink (41) and the groove (5). A flow guide plate (43) is connected to the lower end of the heat sink (41), and multiple heat dissipation holes (44) are arrayed on the surface of the flow guide plate (43).

4. The embedded anti-interference circuit board for a fingerprint recognition module according to claim 3, characterized in that: The anti-interference mechanism (4) also includes an electromagnetic shielding adhesive (45) which is applied around the fingerprint sensor module (2) and the processing component (3).

5. The embedded anti-interference circuit board for a fingerprint recognition module according to claim 4, characterized in that: The reinforcement mechanism (6) includes a limiting plate (61). The limiting plate (61) has a slot (62) at a position corresponding to the base plate (1) and the guide plate (43). The limiting plate (61) is engaged with both ends of the base plate (1) and the guide plate (43) through the slot (62). Positioning holes (63) are symmetrically provided at both ends of the base plate (1) and the guide plate (43). Fasteners (64) are embedded in the limiting plate (61) at a position corresponding to the positioning holes (63). One end of the fastener (64) is threaded into the positioning hole (63).

6. The embedded anti-interference circuit board for a fingerprint recognition module according to claim 5, characterized in that: A heat sink (7) is mounted on the surface of the substrate (1), and thermally conductive adhesive (8) is bonded to the lower surface of the heat sink (7) where it is attached to the substrate (1).

Images