An integrated circuit board with heat dissipation function

Abstract

The utility model discloses a kind of integrated circuit boards with heat dissipation function, including circuit board body, chip is installed on the circuit board body, the front of the circuit board body is provided with laminated heat dissipation module, the laminated heat dissipation module includes fin, part of the inner side of the fin is laminated with chip outer surface;Several directional heat dissipation channels are also opened in the circuit board body, the upper end of several directional heat dissipation channels corresponds the first heat dissipation fin of several fin inner surfaces, the outer surface of the fin is also provided with several second heat dissipation fins;Four rectangular array screw sleeves are embedded in the circuit board body, four corner positions of the lower side of the fin are formed with fixed column, screw hole is arranged in the fixed column, the hole of screw hole and screw sleeve is corresponding.The utility model realizes optimal heat dissipation performance in limited space, to significantly improve the long-term operation stability and service life of electronic equipment.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit board technology, and in particular to an integrated circuit board with heat dissipation function. Background Technology

[0002] With the rapid development of electronic information technology, the integration and processing speed of electronic components on integrated circuit boards, especially chips such as central processing units (CPUs), graphics processing units (GPUs), and application-specific integrated circuits (ASICs), are constantly increasing, leading to a sharp increase in the heat generated per unit area. Effective and timely heat dissipation has become a key technical challenge to ensure the stable operation of electronic equipment and improve product lifespan and reliability.

[0003] In existing heat dissipation solutions, a common approach is to mount a heatsink on top of the chip and use a fan for forced air cooling. However, this traditional method has several limitations. First, the contact interface between the heatsink and the chip has assembly tolerances and surface unevenness, which can easily generate contact thermal resistance and severely affect thermal conductivity. Although thermal grease and other materials are used for filling, the uniformity and thickness of the application are difficult to control precisely, and problems such as drying out or pumping out may occur after long-term use, leading to a decrease in heat dissipation performance. Second, traditional heat dissipation structures often only focus on the heat dissipation of the chip itself, while ignoring the heat generated by other components on the high-density mounted circuit board, as well as the "heat island" effect formed by heat accumulation within the board. This may cause the entire system to operate in a high-temperature environment, raising concerns about stability. Furthermore, traditional heatsink fixing methods are mostly rigid connections, making it difficult to precisely adjust the clamping force on the chip. Too little pressure results in poor contact, while too much pressure may damage the fragile chip core. In addition, the airflow generated by ordinary fans is often relatively dispersed, failing to concentrate and efficiently cover the entire surface of the heatsink and the key heat-generating areas on the circuit board, resulting in low heat dissipation efficiency and wasted energy. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. Therefore, one objective of this invention is to provide an integrated circuit board with heat dissipation function. This integrated circuit board directly attaches to the chip via a bonding heat dissipation module, achieving efficient heat conduction and concentrated heat dissipation. Furthermore, it utilizes directional heat dissipation channels and heat sink fins to achieve multi-directional heat dissipation, further improving heat dissipation efficiency. Simultaneously, an adjustable snap-fit ​​assembly allows for precise adjustment of the gap between the heat sink and the chip, ensuring stable thermal contact and adaptability.

[0005] Another objective of this invention is to propose an adjustable and stable heat sink fixing mechanism. Through the cooperation of the adjustable snap-fit ​​assembly and the fixing post, the heat sink can be quickly installed, pressure adjusted and reliably fixed, avoiding poor contact caused by vibration or thermal deformation.

[0006] Another objective of this invention is to propose an integrated forced air cooling heat dissipation system. By combining a cooling fan and an air guide shroud, airflow is enhanced and the system covers the surface of the heat sink and the outlet of the directional heat dissipation channel, achieving a comprehensive and efficient heat dissipation effect. This system is suitable for high-power or densely packed component applications.

[0007] An integrated circuit board with heat dissipation function according to this utility model includes: The circuit board body has a chip mounted on it. A heat dissipation module is provided on the front side of the circuit board body. The heat dissipation module includes a heat sink, and a portion of the inner side of the heat sink is attached to the outer surface of the chip. The circuit board body also has several directional heat dissipation channels. The upper ends of the several directional heat dissipation channels correspond to several first heat dissipation fins on the inner surface of the heat sink. Several second heat dissipation fins are also provided on the outer surface of the heat sink.

[0008] In some examples of this utility model, the circuit board body is embedded with four screw sleeves arranged in a rectangular array, and fixing posts are formed at the four corners of the lower side of the heat sink. Screw holes are provided in the fixing posts, and the screw holes correspond to the holes of the screw sleeves.

[0009] In some examples of this utility model, adjustable snap-fit ​​assemblies are provided at the four corners of the heat sink, and the gap between the heat sink and the chip is adjusted by the adjustable snap-fit ​​assemblies; the adjustable snap-fit ​​assemblies include pressure plates, and four fixing posts are fixed on the circuit board body. The outer side of the pressure plate is sleeved on the corresponding fixing posts, and the inner end of the pressure plate is provided with a sleeve with internal threads. The adjusting post is screwed into the sleeve. The heat sink is provided with a groove, and the extension end of the adjusting post is adapted to the groove.

[0010] In some examples of this invention, an elastic thermal pad is adhered to the inner side of the heat sink.

[0011] In some examples of this utility model, the heat sink is a plate-like structure with a connecting platform formed on its inner side. The outer surface of the connecting platform is used to adapt and fit with the chip. A gap is formed between the lower side of the heat sink and the circuit board body, and the connecting platform is located in the gap.

[0012] In some examples of this utility model, the directional heat dissipation channel is a plurality of directional heat dissipation holes, which are vertically opened in the circuit board body and distributed around the component-dense area. The upper end of the directional heat dissipation hole corresponds to the first heat dissipation fin.

[0013] In some examples of this utility model, two oppositely arranged mounting posts are also fixed on the upper surface of the circuit board body. The mounting posts are used for detachably mounting a cooling fan, and the output end of the cooling fan corresponds to the upper and lower sides of the heat sink.

[0014] In some examples of this utility model, the edge of the cooling fan is fitted with an air guide shroud, which is a flat, trumpet-shaped structure with a small opening at one end and a large opening at the other end. The small opening is connected to the output end of the cooling fan, and the large opening covers the upper and lower surfaces of the heat sink and the outlet of the directional heat dissipation channel.

[0015] In some examples of this utility model, the press plate has a "Z" shaped structure, which forms a long arm end and a short arm end respectively. The long arm end is provided with a round hole adapted to the fixing post, and the sleeve is located on the short arm end.

[0016] In some examples of this utility model, several connection ports are also provided at the edge of the circuit board body.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.

[0018] The beneficial effects of this utility model are: This integrated circuit board achieves efficient and reliable thermal management by constructing a multi-path collaborative heat dissipation system. Its adhesive heat dissipation module is in direct and tight contact with the chip, and the dual pressure protection of the elastic thermal pad and adjustable snap-fit ​​assembly significantly optimizes the heat conduction efficiency. It can adapt to the thickness tolerance of different chips and ensure stable contact pressure, fundamentally reducing interface thermal resistance. The directional heat dissipation channel works in conjunction with the first heat dissipation fin to form an effective vertical airflow channel inside the circuit board, which not only enhances the heat dissipation of the chip area, but also solves the board-level heat dissipation problem under high-density component layout, effectively preventing local overheating. At the same time, the second heat dissipation fin outside the heat sink expands the heat dissipation area and works in conjunction with the flexibly configurable cooling fan and air guide shroud to greatly improve the overall heat dissipation capacity through forced convection. The detachable design of the fan facilitates maintenance and upgrades. This three-dimensional heat dissipation architecture enables the design to adapt to various working scenarios from low power consumption to high power consumption, achieving optimal heat dissipation performance in a limited space, thereby significantly improving the long-term operational stability and service life of electronic devices. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure according to Embodiment 1 of the present utility model; Figure 2 for Figure 1 The front view; Figure 3 for Figure 1 Side view; Figure 4 This is a schematic diagram of the tablet compression structure; Figure 5 This is a structural schematic diagram according to Embodiment 2 of the present utility model; Figure 6 This is a structural schematic diagram from another perspective of Embodiment 2; Figure 7 This is a front view of Example 2.

[0021] Explanation of reference numerals in the attached figures: 1-Circuit board body; 2-Chip; 3-Heat sink; 31-Fixing post; 32-Connecting platform; 4-Directional heat dissipation channel; 5-First heat dissipation fin; 6-Second heat dissipation fin; 7-Screw sleeve; 8-Pressure plate; 81-Sleeve; 82-Long arm end; 83-Short arm end; 9-Fixing post; 10-Adjusting post; 11-Connecting port; 12-Mounting post; 13-Cooling fan; 14-Air guide cover. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0023] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0024] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] Example 1, see below for reference Figures 1-3 A heat dissipation integrated circuit board according to an embodiment of the present invention is described, comprising: The circuit board body 1 has a chip 2 mounted on it. A heat dissipation module is provided on the front side of the circuit board body 1. The heat dissipation module includes a heat sink 3. A portion of the inner side of the heat sink 3 is attached to the outer surface of the chip 2. The circuit board body 1 also has several directional heat dissipation channels 4. The upper ends of the several directional heat dissipation channels 4 correspond to several first heat dissipation fins 5 on the inner surface of the heat sink 3. Several second heat dissipation fins 6 are also provided on the outer surface of the heat sink 3.

[0027] Specifically, this structure constructs a complete heat dissipation path from the heat source to the environment. The heat sink 3, as the main heat sink, rapidly absorbs and conducts heat generated by the chip 2 through direct contact. The first heat sink fin 5 is located inside the heat sink 3, directly opposite and inserted above the directional heat dissipation channel 4. Its function is to accelerate airflow within the channel, forming a "chimney effect" to draw heat upwards from the bottom of the circuit board 1 and the component area. The second heat sink fin 6 significantly increases the contact area between the heat sink 3 and the external air, enhancing passive heat dissipation. This structure achieves a three-in-one heat dissipation system of "core heat conduction, in-board convection, and external diffusion." The cooperation between the first fin 5 and the directional channel 4 effectively solves the problem of localized overheating of the circuit board under high-density component layout, while the second heat sink fin 6 ensures basic heat dissipation capacity, resulting in high overall heat dissipation efficiency and a compact structure. The heat sink 3 can be made of aluminum alloy, copper, or high thermal conductivity materials such as diamond-aluminum composite materials. The first heat sink fin 5 and the second heat sink fin 6 can be integrally die-cast with the heat sink 3, or they can be bonded as independent components using brazing or thermally conductive adhesive. The cross-sectional shape of the directional heat dissipation channel 4 can be circular, square, or hexagonal.

[0028] Please continue reading Figures 1-3 As shown, according to one embodiment of the present invention, adjustable snap-fit ​​assemblies are provided at the four corners of the heat sink 3, and the gap between the heat sink 3 and the chip 2 is adjusted by the adjustable snap-fit ​​assemblies; the adjustable snap-fit ​​assemblies include pressure plates 8, and four fixing posts 9 are fixed on the circuit board body 1. The outer side of the pressure plate 8 is sleeved on the corresponding fixing post 9, and the inner end of the pressure plate 8 is provided with a sleeve 81 with internal threads. An adjusting post 10 is screwed into the sleeve 81. A groove is provided on the heat sink 3, and the extension end of the adjusting post 10 is adapted to the groove.

[0029] Specifically, this structure utilizes the lever principle. The pressure plate 8 uses the point where its outer side fits onto the fixing post 9 as the fulcrum. By turning the adjusting post 10, the length of its extension from the sleeve 81 is changed, thereby controlling the downward pressure of the short arm end of the pressure plate 8 on the groove of the heat sink 3, achieving fine adjustment of the clamping force between the heat sink 3 and the chip 2. This allows for precise control of the contact pressure of the heat sink 3 on the chip 2, perfectly adapting to chips with different height tolerances, and ensuring that the elastic thermal pad is in the optimal compression state, avoiding insufficient pressure leading to increased thermal resistance or excessive pressure damaging the chip. It provides extremely high assembly flexibility and reliability. This structure utilizes the lever principle. The pressure plate 8 uses the point where its outer side fits onto the fixing post 9 as the fulcrum. By turning the adjusting post 10, the length of its extension from the sleeve 81 is changed, thereby controlling the downward pressure of the short arm end of the pressure plate 8 on the groove of the heat sink 3, achieving fine adjustment of the clamping force between the heat sink 3 and the chip 2. The fixing post 9 can be a stud soldered onto the circuit board 1. The end of the adjusting column 10 can be designed as a ball head structure, which contacts the smooth surface on the heat sink 3 to compensate for angular deviations during installation. Alternatively, an eccentric wheel mechanism with ratchet teeth or springs can be used to replace the threaded adjusting column 10 to achieve stepless or stepped adjustment.

[0030] Please continue reading Figures 1-3 As shown, according to another embodiment of the present invention, an elastic thermal pad (not shown in the figure) is adhered to the inner side of the heat sink 3.

[0031] Specifically, an elastic thermal pad fills the microscopically uneven gaps between the heat sink 3 and the chip 2 surface, replacing the low thermal conductivity air and establishing a highly efficient heat conduction bridge. The use of the elastic thermal pad significantly reduces the contact thermal resistance of the contact surface and improves the thermal conductivity. Its elasticity can absorb mechanical stress, compensate for assembly tolerances, and protect the surface of the chip 2. The elastic thermal pad can be a silicone rubber pad filled with ceramic particles such as boron nitride or alumina. Other alternative thermal interface materials include: thermally conductive silicone grease such as Shin-Etsu 7921, phase change thermal conductive films that undergo phase change at specific temperatures to fill gaps, or liquid metal materials used for extreme performance requirements.

[0032] Please continue reading Figures 1 to 3 As shown, according to another embodiment of the present invention, the heat sink 3 is a plate-shaped structure with a connecting platform 32 formed on its inner side. The outer surface of the connecting platform 32 is used to adapt and fit with the chip 2. A gap is formed between the lower side of the heat sink 3 and the circuit board body 1, and the connecting platform 32 is located in the gap.

[0033] Specifically, the connecting platform 32 is a raised platform on the heat sink 3 specifically designed for contact with the chip 2, ensuring that the installation pressure is concentrated on the chip. The main body of the heat sink 3 maintains a certain distance from the surface of the circuit board 1, forming an air circulation layer. The connecting platform 32 can be integrally formed with the heat sink 3, or it can be a separate insert made of a material with higher thermal conductivity, such as copper, embedded into the main body of the heat sink 3 through hot pressing or welding.

[0034] Please continue reading Figure 1 , Figure 5 and Figure 6 As shown, according to an optional embodiment of the present invention, the directional heat dissipation channel 4 is a plurality of directional heat dissipation holes, which are vertically opened inside the circuit board body 1. The directional heat dissipation holes are distributed around the component-dense area, and the upper end of the directional heat dissipation holes corresponds to the first heat dissipation fin 5.

[0035] Specifically, these vertically penetrating channels 1, under the suction of the cooling fan 13 or the natural upward movement of hot air, form a directional airflow from the bottom to the top of the circuit board. The first heat dissipation fins 5 are positioned directly above these channel outlets, greatly enhancing the heat dissipation surface area and turbulence effect at these locations. These vertically penetrating channels 1, under the suction of the cooling fan 13 or the natural upward movement of hot air, form a directional airflow from the bottom to the top of the circuit board. The first heat dissipation fins 5 are positioned directly above these channel outlets, greatly enhancing the heat dissipation surface area and turbulence effect at these locations. The directional heat dissipation channels 4 may not be through holes, but rather blind vias designed within the inner layer of the circuit board 1 and filled with a highly thermally conductive medium. Their layout can be non-uniformly and densely arranged in high-temperature areas based on thermal imaging analysis results.

[0036] Please continue reading Figures 1-7 As shown, according to a further embodiment of the present invention, two oppositely arranged mounting posts 12 are fixed on the upper surface of the circuit board body 1. The mounting posts 12 are used for detachably mounting a cooling fan 13. The output end of the cooling fan 13 corresponds to the upper and lower sides of the heat sink 3.

[0037] Specifically, the mounting post 12 serves as a base support, fixing the cooling fan 13 above the heatsink 3. When the fan operates, the generated high-speed airflow simultaneously covers the upper surface of the heatsink 3, the second and lower surfaces of the heatsink 6, and the area of ​​the first fin 5, providing forced convection cooling. The mounting post 12 serves as a base support, fixing the cooling fan 13 above the heatsink 3. When the fan operates, the generated high-speed airflow simultaneously covers the upper and lower surfaces of the heatsink 3, providing forced convection cooling. The connection method between the mounting post 12 and the cooling fan 13 can be: directly fastened to the plastic mounting post using self-tapping screws; using a clip-on connection with rubber anti-vibration pads; or using an independent metal bracket to fix the fan, which is then connected to the mounting post 12 with screws. The number and layout of the mounting posts 12 can be adjusted according to the fan size and air pressure distribution requirements.

[0038] Please continue reading Figures 1-7 As shown, in one optional embodiment of this utility model, the edge of the cooling fan 13 is fitted with an air guide shroud 14. The air guide shroud 14 is a flat, trumpet-shaped structure with a small opening at one end and a large opening at the other end. The small opening is connected to the output end of the cooling fan 13, and the large opening covers the upper and lower surfaces of the heat sink and the outlet of the directional heat dissipation channel 4.

[0039] Specifically, the air guide shroud 14 acts as an airflow distributor. Its small opening tightly connects to the fan outlet, collecting all the exhaust air. Its large opening acts like a "lid," evenly guiding the airflow to the entire area requiring heat dissipation, including the upper surface of the heat sink 3, the gap space below it, and the outlet of the directional heat dissipation channel 4. The air guide shroud 14 can be connected to the cooling fan 13 via clips, screws, or Velcro. The shape of the air guide shroud 14 can be optimized according to the shape of the heat dissipation area; for example, it can be designed as a rectangular flared opening, with guide fins on its sidewalls to further optimize airflow distribution.

[0040] Please continue reading Figure 4 As shown, in some examples of this utility model, the pressing plate 8 has an overall "Z" shaped structure, which forms a long arm end 82 and a short arm end 83 respectively. The long arm end 82 is provided with a round hole that matches the fixing post 9, and the sleeve 81 is located on the short arm end 83.

[0041] Specifically, the "Z"-shaped structure is essentially a lever. The long arm end 82 is fitted onto the fixed column 9 as a fulcrum. When the adjusting column 10 is screwed into the sleeve 81 of the short arm end 83 and a downward force is applied, according to the lever principle, the short arm end will generate an amplified, vertically downward pressure on the heat sink 3. The shape of the pressure plate 8 is not limited to "Z" shape; it can also be "L" shape, or the sleeve 81 can be directly made on a vertical column, with a horizontal pressure rod pressing down on the heat sink 3.

[0042] Please continue reading Figures 1-7 As shown, in some examples of this utility model, the edge of the circuit board body 1 is also provided with several connection ports.

[0043] Connection port 11 is the physical interface for power transmission and signal exchange between the circuit board and the external environment. Specific types of connection port 11 include, but are not limited to: PCIe slot, USB Type-C interface, HDMI interface, RJ45 network interface, spring terminal block or soldered header.

[0044] Example 2 differs from Example 1 in that: Please continue reading Figures 5-7 As shown, the circuit board body 1 is embedded with four screw sleeves 7 arranged in a rectangular array. Fixing posts 31 are formed at the four corners of the lower side of the heat sink 3. Screw holes are provided in the fixing posts 31, and the screw holes correspond to the holes of the screw sleeves 7.

[0045] It should be noted that this solution uses screws to pass through the fixing posts 31 of the heat sink 3 and screw into the threaded sleeves 7 pre-embedded in the circuit board 1, forming a four-point rigid fastening. This connection can firmly and evenly press the heat sink 3 onto the chip 2. The threaded sleeves 7 can be press-fit brass threaded sleeves, ultrasonically embedded plastic threaded sleeves, or directly tapped into the metallized holes of the circuit board 1. This solution uses screws to pass through the fixing posts 31 of the heat sink 3 and screw into the threaded sleeves 7 pre-embedded in the circuit board 1, forming a four-point rigid fastening. This connection can firmly and evenly press the heat sink 3 onto the chip 2. The fixing method is not limited to screws; quick-release fixing can also be achieved using plastic clips with a reverse-clamp structure, or permanent fixing can be achieved using rivets.

[0046] Working principle of this utility model: When chip 2 is working, it generates heat, which is first transferred to the heat sink 3 that is in close contact with it through direct contact. To ensure maximum heat transfer, heat sink 3 is precisely connected to chip 2 through the connecting platform 32 on its inner side, and an elastic thermally conductive pad is filled between the two to eliminate air gaps and significantly reduce contact thermal resistance. Heat sink 3 is fixed in two ways: first, it is rigidly connected to the screw sleeve 7 in the circuit board 1 by screws using the fixing posts 31 at the four corners, providing a stable basic clamping force; second, it is precisely fine-tuned by adjusting the pressure through the adjustable buckle assembly. The user can apply controllable downward pressure to heat sink 3 by rotating the adjusting post 10 to push the "Z" shaped pressure plate 8 in a lever manner. This is especially suitable for ensuring optimized contact of chips with different tolerances. After heat is efficiently transferred to the heat sink 3, its dissipation process involves three coordinated paths. Path 1: The first heat dissipation fins 5 on the inner surface of the heat sink 3 face the directional heat dissipation channels 4 on the circuit board 1. These vertical channels are distributed around the dense component area. When the cooling fan 13 is working, or due to the natural rise of hot air, cool air is drawn into the directional heat dissipation channels 4 from the bottom of the circuit board 1, flows through the area heated by the first heat dissipation fins 5, and then becomes hot air and is discharged upwards. This process not only directly cools the first heat dissipation fins 5, but more importantly, it effectively removes the accumulated heat inside the circuit board body 1 and the component area, achieving board-level heat dissipation. Path 2: The second heat dissipation fins 6 on the outer surface of the heat sink 3 greatly... The increased contact area with air; the cooling fan 13 mounted on the mounting column 12 generates a strong airflow, which is constrained and guided by the air guide shroud 14; the horn-shaped structure of the air guide shroud 14 covers the entire area, including the second heat dissipation fin array 6, the lower surface area of ​​the heat sink 3, and the outlet of the directional heat dissipation channel 4, all under the effective forced airflow, greatly enhancing the convective heat transfer efficiency and quickly carrying away the heat on the fins; Path 3: the gap between the heat sink 3 body and the surface of the circuit board 1 also provides space for airflow, helping to carry away the heat of other components on the circuit board.

[0047] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0048] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. An integrated circuit board with heat dissipation function, characterized in that, include: The circuit board body has a chip mounted on it. A heat dissipation module is provided on the front side of the circuit board body. The heat dissipation module includes a heat sink, and a portion of the inner side of the heat sink is attached to the outer surface of the chip. The circuit board body also has several directional heat dissipation channels. The upper ends of the several directional heat dissipation channels correspond to several first heat dissipation fins on the inner surface of the heat sink. Several second heat dissipation fins are also provided on the outer surface of the heat sink.

2. The integrated circuit board with heat dissipation function according to claim 1, characterized in that: The circuit board body is embedded with four screw sleeves arranged in a rectangular array. The four corners of the lower side of the heat sink are formed with fixing posts. The fixing posts are provided with screw holes, which correspond to the holes of the screw sleeves.

3. An integrated circuit board with heat dissipation function according to claim 1, characterized in that: Adjustable latching assemblies are provided at the four corners of the heat sink, and the gap between the heat sink and the chip can be adjusted by the adjustable latching assemblies. The adjustable latching assemblies include pressure plates, and four fixing posts are fixed on the circuit board body. The outer side of the pressure plate is sleeved on the corresponding fixing posts, and the inner end of the pressure plate is provided with a sleeve with internal threads. The adjusting post is screwed into the sleeve. The heat sink is provided with a groove, and the extension end of the adjusting post is adapted to the groove.

4. An integrated circuit board with heat dissipation function according to claim 3, characterized in that: An elastic thermal pad is bonded to the inner side of the heat sink.

5. An integrated circuit board with heat dissipation function according to claim 2 or 3, characterized in that: The heat sink is a plate-shaped structure with a connecting platform formed on its inner side. The outer surface of the connecting platform is used to adapt and fit with the chip. A gap is formed between the lower side of the heat sink and the circuit board body, and the connecting platform is located in the gap.

6. An integrated circuit board with heat dissipation function according to claim 1, characterized in that: The directional heat dissipation channel is a plurality of directional heat dissipation holes, which are vertically opened in the circuit board body and distributed around the component-dense area. The upper end of the directional heat dissipation hole corresponds to the first heat dissipation fin.

7. An integrated circuit board with heat dissipation function according to claim 1, characterized in that: The upper surface of the circuit board body is also fixed with two oppositely arranged mounting posts. The mounting posts are used to detachably install a cooling fan. The output end of the cooling fan corresponds to the upper and lower sides of the heat sink.

8. An integrated circuit board with heat dissipation function according to claim 7, characterized in that: The cooling fan is fitted with an air guide shroud at its edge. The air guide shroud is a flat, trumpet-shaped structure with a small opening at one end and a large opening at the other. The small opening connects to the output end of the cooling fan, and the large opening covers the upper and lower surfaces of the heat sink and the outlet of the directional heat dissipation channel.

9. An integrated circuit board with heat dissipation function according to claim 3, characterized in that: The tablet has a "Z" shaped structure, which forms a long arm end and a short arm end. The long arm end has a round hole that matches the fixing post, and the sleeve is located on the short arm end.

10. An integrated circuit board with heat dissipation function according to claim 1, characterized in that: Several connection ports are also provided at the edge of the circuit board body.

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