A pressing positioning structure suitable for super large size PCB product

Abstract

The utility model discloses a kind of pressing positioning structure suitable for super large size PCB product, including PCB pressing plate body, a plurality of interval and side-by-side arrangement PCB unit plate are arranged on the PCB pressing plate body, intermediate process edge is arranged between adjacent PCB unit plate, the left middle right area of each intermediate process edge is equipped with first rivet hole and second rivet hole, first rivet is inserted into along the front of PCB pressing plate body in each first rivet hole, second rivet is inserted into along the back of PCB pressing plate body in each second rivet hole. The utility model effectively solves the quality problem of expansion and contraction deformation and insufficient alignment accuracy of super large size PCB product in pressing process.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board (PCB) manufacturing technology, specifically to a pressing and positioning structure suitable for ultra-large PCB products. Background Technology

[0002] In the field of printed circuit board (PCB) manufacturing, when the production size of a product exceeds 1000mm, it is usually an extra-large PCB panel product. In the positioning and fixing stage before the lamination process, the industry generally adopts a combination of fusion and riveting to constrain and fix the product only around its perimeter.

[0003] Specifically, during the lamination process, the prepreg used in the product (as an interlayer insulation layer) undergoes a series of phase transitions: from an initial semi-cured state, it transforms into a liquid state under high temperature and pressure, and finally solidifies during cooling. One of the core functions of this phase transition process is to utilize the fluidity of the resin in the liquid stage to fill the residual copper areas on the surface of the core board, thereby achieving interlayer insulation and structural bonding.

[0004] However, for ultra-large products with dimensions >1000mm, the above-mentioned positioning method of fixing only the four sides has significant drawbacks: due to the large overall size of the product, the middle area lacks effective positioning constraints. During pressing, the flow of liquid resin in the prepreg will generate lateral thrust. At the same time, the difference in thermal expansion and contraction characteristics between the core board and the prepreg will cause internal stress. Under the combined effect of the two, it is very easy to cause irregular expansion and contraction deformation of each core board, resulting in the conductive patterns on each core board not being able to maintain precise alignment, resulting in layer misalignment. In severe cases, it can cause short circuits between layers, greatly reducing the product qualification rate and adversely affecting production quality. Utility Model Content

[0005] In order to overcome the problems of expansion and contraction deformation and insufficient alignment accuracy of ultra-large PCB products during the lamination process in the prior art, this utility model provides a lamination positioning structure suitable for ultra-large PCB products.

[0006] The technical solution of this utility model is as follows: A lamination and positioning structure suitable for ultra-large PCB products includes a PCB lamination board body. The PCB lamination board body is provided with a plurality of PCB unit boards arranged side by side at intervals. An intermediate process edge is provided between adjacent PCB unit boards. Each intermediate process edge has a first rivet hole and a second rivet hole in its left, middle and right regions. A first rivet hole is inserted into each of the first rivet holes along the front side of the PCB lamination board body, and a second rivet is inserted into each of the second rivet holes along the back side of the PCB lamination board body.

[0007] As a preferred embodiment of this utility model, the four sides of the PCB lamination board body are provided with edge processing edges.

[0008] As a preferred embodiment of this utility model, the PCB lamination board body is formed by laminating a top layer, a bottom layer, and a plurality of semi-cured sheets and core boards alternately stacked between the top layer and the bottom layer.

[0009] As a preferred embodiment of this utility model, the lengths of the first rivet and the second rivet are both less than the thickness of the PCB lamination board body.

[0010] As a preferred embodiment of this utility model, the first rivet and the second rivet have the same length.

[0011] As a preferred embodiment of this utility model, the first rivet hole and the second rivet hole are arranged side by side.

[0012] As a preferred embodiment of this utility model, the length and width dimensions of the PCB lamination board body are both greater than 1000mm.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model provides a lamination and positioning structure suitable for ultra-large PCB products. By adding a forward and reverse interlocking rivet positioning structure to the middle process edge of the ultra-large PCB lamination board body, it counteracts the lateral thrust generated by the flow of liquid resin in the semi-cured sheet during lamination, as well as the internal stress caused by the difference in thermal expansion and contraction characteristics between the core board layer and the semi-cured sheet layer. This avoids irregular expansion and contraction of each core board layer, thereby ensuring that the conductive patterns of each core board layer of the ultra-large PCB lamination board (>1000mm) remain accurately aligned during lamination, reducing layer misalignment, lowering the risk of short circuits between layers, and thus significantly improving the product qualification rate and ensuring production quality. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of a pressing and positioning structure suitable for ultra-large PCB products in one embodiment of the present invention; Figure 2 for Figure 1 Sectional view of part A.

[0016] In the diagram, 1. PCB laminate body; 11. Top layer; 12. Bottom layer; 13. Prepreg layer; 14. Core board layer; 2. PCB unit board; 3. Edge process edge; 4. Middle process edge; 5. First rivet hole; 6. Second rivet hole; 7. First rivet; 8. Second rivet. Detailed Implementation

[0017] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It is also declared that the embodiments described below are only for explaining this utility model and are not intended to limit this utility model.

[0018] It should be noted that the terms "installation," "setting," "connection," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. Indications of orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used in the application's product, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implying a number of technical features. "A plurality" means two or more, unless otherwise explicitly defined.

[0019] Please see Figures 1 to 2This utility model provides a lamination and positioning structure suitable for ultra-large PCB products, including a PCB lamination board body 1. The PCB lamination board body 1 is formed by laminating a top layer 11, a bottom layer 12, and multiple semi-cured sheets 13 and core boards 14 alternately stacked between the top layer 11 and the bottom layer 12. The semi-cured sheets 13 serve as interlayer insulation and isolation, and simultaneously utilize their physical state transformation characteristics to achieve structural bonding. The core boards 14 carry conductive patterns and are the foundation for the PCB to realize circuit functions. The alternately stacked semi-cured sheets 13 and core boards 14 ensure that the PCB board has complex circuit wiring capabilities and good electrical properties. Multiple PCB unit boards 2 are arranged side-by-side at intervals on the PCB lamination board body 1. Edge process edges 3 are provided on all four sides of the PCB lamination board body 1, and intermediate process edges 4 are provided between adjacent PCB unit boards 2. The edge process edges 3 and intermediate process edges 4 cooperate with each other to constrain the PCB lamination board body 1 from different directions, enhancing the overall stability. Each of the middle process edges 4 has a first rivet hole 5 and a second rivet hole 6 in the left, middle and right areas. Each first rivet hole 5 has a first rivet 7 inserted along the front side of the PCB laminating board body 1, and each second rivet hole 6 has a second rivet 8 inserted along the back side of the PCB laminating board body 1.

[0020] The lamination process is as follows: First, insert the first rivet 7 into all the first rivet holes 5 from the front side of the PCB lamination board body 1 to complete the insertion operation of all the first rivet holes 5; then, rotate the PCB lamination board body 1 1800° and insert the second rivet 8 into all the second rivet holes 6 from the back side of the PCB lamination board body 1 to complete the insertion operation of all the second rivet holes 6; at this time, the first rivet 7 and the second rivet 8 interlock, realizing the internal positioning of the PCB lamination board body 1. The realization of internal positioning provides a stable foundation for subsequent lamination operations, so that each core board layer 14 can maintain precise alignment under high temperature and high pressure environment, and the semi-cured layer 13 can uniformly fill the residual copper area, achieving good interlayer insulation and structural bonding, meeting the production needs of ultra-large size PCB products; finally, the lamination operation is carried out according to the conventional process.

[0021] In this embodiment, by adding a forward and reverse interlocking rivet positioning structure to the middle process edge 4 of the ultra-large PCB laminate body, the lateral thrust generated by the flow of liquid resin in the semi-cured layer 13 during the pressing process is offset, as well as the internal stress caused by the difference in thermal expansion and contraction characteristics between the core layer 14 and the semi-cured layer 13. This avoids irregular expansion and contraction of each core layer 14, thereby ensuring that the conductive patterns of each core layer 14 of the ultra-large PCB laminate (>1000mm) remain accurately aligned during the pressing process, reducing layer misalignment, lowering the risk of short circuits between layers, and thus significantly improving the product qualification rate and ensuring production quality.

[0022] In a preferred embodiment, the first rivet 7 and the second rivet 8 are of the same length and both are less than the thickness of the PCB laminate body 1. For example, if the thickness of the PCB laminate body 1 is 6.0 mm, the height of the first rivet 7 and the second rivet 8 is less than 6.0 mm. Designing the first rivet 7 and the second rivet 8 to be of the same length ensures a more balanced riveting force and connection state on both sides when forming the interlocking structure. This balanced interlocking can more reliably resist the lateral thrust generated by the flow of liquid resin in the prepreg layer 13 and the internal stress caused by the difference in thermal expansion and contraction between the core layer 14 and the prepreg layer 13. This effectively prevents relative movement of the core layers 14 due to uneven stress, thereby better maintaining the precise alignment of the conductive patterns on each core layer 14 and reducing the probability of layer misalignment. The design ensures that the lengths of the first rivet 7 and the second rivet 8 are both less than the thickness of the PCB laminating board body 1. This guarantees that during the lamination process, the first rivet 7 and the second rivet 8 will not protrude from the surface of the PCB laminating board body 1, thus avoiding interference with the lamination equipment and ensuring the normal operation of the lamination process and the stability of product quality. If the lengths of the first rivet 7 and the second rivet 8 are too long, they may come into contact with the pressure plate or other components of the lamination equipment during lamination, resulting in uneven lamination pressure. This would affect the filling effect of the prepreg layer 13 on the residual copper area, thereby reducing the interlayer insulation performance and structural bonding strength.

[0023] In a preferred embodiment, the first rivet hole 5 and the second rivet hole 6 are arranged side by side, making the distribution of rivets on the middle process edge 4 more uniform. During the pressing process, the uniformly distributed rivets can apply constraint forces to the PCB press board body 1 from multiple directions, making the positioning constraint on the middle area more balanced.

[0024] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0025] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A pressing and positioning structure suitable for ultra-large PCB products, characterized in that, The PCB lamination board includes a PCB lamination board body, on which multiple PCB unit boards are arranged side by side at intervals. A middle process edge is provided between adjacent PCB unit boards. Each middle process edge has a first rivet hole and a second rivet hole in its left, middle and right regions. A first rivet hole is inserted into each of the first rivet holes along the front side of the PCB lamination board body, and a second rivet is inserted into each of the second rivet holes along the back side of the PCB lamination board body.

2. The lamination and positioning structure for ultra-large PCB products according to claim 1, characterized in that, The PCB lamination board body has edge processing edges on all four sides.

3. The lamination and positioning structure for ultra-large PCB products according to claim 1, characterized in that, The PCB laminate body is formed by laminating a top layer, a bottom layer, and multiple semi-cured sheets and core layers alternately stacked between the top layer and the bottom layer.

4. The lamination and positioning structure for ultra-large PCB products according to claim 1, characterized in that, The lengths of both the first rivet and the second rivet are less than the thickness of the PCB laminate body.

5. The lamination and positioning structure for ultra-large PCB products according to claim 1, characterized in that, The first rivet and the second rivet are of the same length.

6. The lamination and positioning structure for ultra-large PCB products according to claim 1, characterized in that, The first rivet hole and the second rivet hole are arranged side by side.

7. The lamination and positioning structure for ultra-large PCB products according to claim 1, characterized in that, The length and width of the PCB lamination board body are both greater than 1000mm.

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