Battery protection board, battery and terminal device

Abstract

The application provides a battery protection plate, a battery and a terminal device. The battery protection plate comprises: a circuit board substrate; a power device arranged on the circuit board substrate; and a control module comprising a module substrate and a control device, wherein the module substrate is arranged on the circuit board substrate, the control device is arranged on the module substrate, the control device is electrically connected to the module substrate, the module substrate and the power device are electrically connected to the circuit board substrate, and the area of the module substrate is smaller than the area of the circuit board substrate. Thus, the battery protection plate, the battery and the terminal device provided by the application can reduce the number of copper layers of the circuit board substrate, thereby reducing the manufacturing, design, testing, management, research and development, procurement and other costs of battery protection plates with different shapes, structures and sizes.

Description

Technical Field

[0001] This application relates to the field of batteries, and more specifically, to a battery protection board, a battery, and a terminal device. Background Technology

[0002] The structure, size, and shape of battery protection boards vary considerably depending on the type of terminal device. However, battery protection boards with different structures, sizes, and shapes require separate design, testing, management, research and development, and procurement, resulting in high costs. Utility Model Content

[0003] In view of the above problems, this application provides a battery protection board, a battery, and a terminal device.

[0004] In a first aspect, this application provides a battery protection board, comprising: a circuit board substrate; a power device disposed on the circuit board substrate; and a control module, including a module substrate and a control device, wherein the module substrate is disposed on the circuit board substrate, the control device is disposed on the module substrate, the control device is electrically connected to the module substrate, the module substrate and the power device are electrically connected to the circuit board substrate, and the area of ​​the module substrate is smaller than the area of ​​the circuit board substrate.

[0005] In one possible implementation, the number of copper layers on the circuit board substrate is less than or equal to 6, and the number of copper layers on the module substrate is less than or equal to 6.

[0006] In one possible implementation, the circuit board substrate has 2 copper layers, and the module substrate has 4 or 6 copper layers.

[0007] In one possible implementation, the thickness of the circuit board substrate is 0.6~1mm and / or the thickness of the module substrate is 0.2~1mm.

[0008] In one possible implementation, the module substrate has a length of 6-20 mm and a width of 5-10 mm.

[0009] In one possible implementation, the battery protection board is configured to be electrically connected to an external battery cell and an external terminal device to form a main current loop, the power device is configured to be connected in series in the main current loop and carry the main load current in the main current loop, and the control device is configured to control the power device and / or receive voltage and / or current signals from the power device.

[0010] In one possible implementation, the power device includes at least one of a fuse, a protective switch, and a sampling device.

[0011] In one possible implementation, the power device is a fuse, a protective switch, a sampling device, or a protective switch, or a fuse, a protective switch, or a sampling device.

[0012] In one possible implementation, the control module further includes peripheral devices. The module substrate is electrically connected to the peripheral devices to form a peripheral circuit. The peripheral devices include at least one of capacitors, resistors, and diodes. The peripheral circuit consists of at least one of a filter circuit, a detection circuit, and an electrostatic discharge protection circuit.

[0013] In one possible implementation, the controller is a fuel gauge chip or a combination of a secondary protection chip and a fuel gauge chip.

[0014] In one possible implementation, the module substrate has at least one module pad electrically connected to a controller. The circuit board substrate has substrate pads electrically connected to power devices. The module pads are soldered to and electrically connected to the substrate pads.

[0015] In one possible implementation, the module pads are configured as a plurality of asymmetrically arranged in the width or length direction of the module substrate.

[0016] In one possible implementation, the control module is equipped with an identification code, which is configured to identify the control module.

[0017] In one possible implementation, the module substrate includes a first substrate layer, a first copper layer, and a first solder resist layer stacked sequentially along a first direction. The first solder resist layer is the top layer of the module substrate. The first copper layer has control device pads exposed on the first solder resist layer, and the control device is disposed on the control device pads. An identification code is disposed on the first solder resist layer. The first direction is the thickness direction of the battery protection board. And / or the control module also includes a package, which covers the first solder resist layer and the control device, and the identification code is disposed on the surface of the package.

[0018] In one possible implementation, the identification code is applied to the surface of the first solder mask layer and / or the package by at least one of inkjet printing, screen printing, or laser engraving.

[0019] In one possible implementation, the identification code is applied to the first solder mask layer by inkjet printing or screen printing. The first solder mask layer includes a first region and a second region. Along a first direction, the first region overlaps with the first copper layer, and the second region does not overlap with the first copper layer. The identification code is applied to the second region.

[0020] In one possible implementation, the identification code is applied to the first solder mask layer by inkjet printing or screen printing, the minimum distance between the identification code and the control device pad is greater than or equal to 0.5 mm, and / or along the first direction, the height of the identification code is less than or equal to the height of the control device.

[0021] In one possible implementation, the module substrate includes a first solder resist layer, a first copper layer, and a first substrate layer stacked sequentially along a first direction. The first solder resist layer is the top layer of the module substrate. The first copper layer has control device pads exposed on the first solder resist layer, and the control devices are disposed on the control device pads. The first direction is the thickness direction of the battery protection board. The identification code is formed by etching the first copper layer, and the first solder resist layer covers the identification code.

[0022] In one possible implementation, the module substrate includes a first solder resist layer, a first copper layer, a first substrate layer, a second copper layer, and a second solder resist layer sequentially stacked along a first direction. The second solder resist layer is the bottom layer of the module substrate. Module pads are disposed on the second copper layer and exposed on the second solder resist layer. An identification code is disposed on the second solder resist layer by at least one of inkjet printing, screen printing, and laser engraving. The first direction is the thickness direction of the battery protection board. Along the first direction, the circuit board substrate has a viewing hole, the module substrate covers the viewing hole, and the identification code is exposed through the viewing hole.

[0023] In one possible implementation, the identification code includes characters or a QR code.

[0024] Secondly, this application provides a battery, including: a battery cell. The battery protection board provided in the first aspect is electrically connected to the battery cell.

[0025] Thirdly, this application provides a terminal device, including: a device body; and a battery provided in the second aspect, wherein the battery is disposed in the device body.

[0026] Therefore, the battery protection board, battery, and terminal device provided in this application, by setting up a control module, with the control device essentially disposed on a substrate equal to the sum of the number of copper layers on the module substrate and the number of copper layers on the circuit board substrate, can reduce the number of copper layers on the circuit board substrate while meeting the copper layer requirements of the control device. This reduces the manufacturing, design, testing, management, R&D, and procurement costs of battery protection boards of different shapes, structures, and sizes. Furthermore, since the control module is independently disposed on the circuit board substrate and is independent of the structure, quantity, shape, and size of the circuit board substrate and power devices, the versatility and compatibility of the circuit protection board can be improved, adapting to various types of cell architectures, battery structures, battery types, and terminal devices. This also reduces the manufacturing, design, testing, management, R&D, and procurement costs of battery protection boards of different shapes, structures, and sizes.

[0027] In addition, by setting an identification code on the control module, it is easy to trace and troubleshoot the control module during the manufacturing, R&D, testing, and management processes, and it is also easy to bind the control module to the corresponding circuit board substrate for development, testing, and management. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of a terminal device provided in an embodiment of this application.

[0029] Figure 2 This is a schematic diagram of a battery provided in one embodiment of this application.

[0030] Figure 3 This is a schematic diagram of a battery protection board provided in one embodiment of this application.

[0031] Figure 4 This is a schematic diagram of a battery protection board provided in an embodiment of this application along a first direction.

[0032] Figure 5 This is a schematic diagram of module pads and substrate pads provided in an embodiment of this application.

[0033] Figure 6 This is a schematic diagram showing the arrangement of module pads on a module substrate according to an embodiment of this application.

[0034] Figure 7 This is a schematic diagram illustrating one possible setting of the identification code provided in an embodiment of this application.

[0035] Figure 8 This is a schematic diagram illustrating one possible setting of the identification code provided in an embodiment of this application.

[0036] Figure 9 This is a schematic diagram illustrating one possible setting of the identification code provided in an embodiment of this application.

[0037] Figure 10 This is a schematic diagram illustrating one possible setting of the identification code provided in an embodiment of this application.

[0038] Figure 11 This is a schematic diagram illustrating one possible setting of the identification code provided in an embodiment of this application.

[0039] Figure 12 This is a schematic diagram illustrating one possible setting of the identification code provided in an embodiment of this application.

[0040] Explanation of main component symbols 10-Terminal equipment; 11-Equipment body; 12-Battery; 121-Battery cell; 122-Battery protection board; 1220-Peripheral components; 1221-Power devices; 1222-Controllers; 1223-Circuit board substrate; 1224-Control module; 1225-Module substrate; 1226-Module pads; 1227-Substrate pads; FUSE-Fuse pin; GND-Ground pin; VCC-Power supply pin; CFOUT-Charging control pin Pins; DFOUT - Discharge control pin; SRP - First communication pin; SRN - Second communication pin; 1228 - First solder mask layer; 1229 - First copper layer; 1230 - First substrate layer; 1231 - Controller pad; 1232 - Identifier code; 1233 - First area; 1234 - Second area; 1235 - Package; 1236 - Second substrate layer; 1237 - Second copper layer; 1238 - Second solder mask layer; 1239 - Through hole. Detailed Implementation

[0041] The technical solutions in the embodiments of this application will be clearly described below with reference to the accompanying drawings.

[0042] It is understood that the connection relationships described in this application refer to direct or indirect connections. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components. For example, A can be directly connected to C, and C can be directly connected to B, thus achieving a connection between A and B through C. It is also understood that the "A connects to B" described in this application can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0043] In the description of this application, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three cases: A exists alone, A and B exist simultaneously, and B exists alone.

[0044] In the description of this application, the words "first," "second," etc., are used only to distinguish different objects and do not limit the quantity or order of execution, nor do they imply that they must be different. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0045] Please see Figure 1 , Figure 1 This is a schematic diagram of a terminal device 10 provided in an embodiment of this application.

[0046] The terminal device 10 includes a device body 11 and a battery 12. The battery 12 is located in the device body 11. The battery 12 provides power to the device body 11.

[0047] In some embodiments, the terminal device 10 can be an electronic device powered by the battery 12, such as a mobile phone, tablet computer, watch, desktop computer, laptop computer, industrial control computer, smart home device, sensor, television, game console, virtual reality (VR) device, augmented reality (AR) device, router, camera, printer, robot, drone, etc.

[0048] Please see Figure 2 , Figure 2 This is a schematic diagram of a battery 12 provided in one embodiment of this application.

[0049] The battery 12 includes a cell 121 and a battery protection board 122. The battery protection board 122 is configured to be electrically connected to the cell 121 and the device body 11 of the terminal device 10 to form a main current loop. The main current loop is the charging and discharging loop of the cell 121. When the cell 121 is charging or discharging, the charging and discharging current of the cell 121 flows through the main current loop. That is, the main current loop is the necessary loop for the cell 121 to charge and discharge. For example, the circuit between the positive terminal of the cell 121, the battery protection board 122, and the terminal device 10 constitutes the main current loop.

[0050] In addition, the battery protection board 122 is configured to manage the charging and discharging of the battery cell 121. This charging and discharging management may include starting or stopping the charging and discharging of the battery cell 121, adjusting the charging and discharging current of the battery cell 121, adjusting the charging and discharging voltage of the battery cell 121, providing over-temperature, over-current, and over-voltage protection for the battery cell 121, collecting the electrical parameters of the battery cell 121 and calculating its state of charge (SOC) and state of health (SOH), recording and outputting the number of charge and discharge cycles of the battery cell 121, fault logs, etc., to external testing equipment or terminal equipment 10.

[0051] The battery protection board 122 includes a power device 1221. The power device 1221 is configured to be connected in series in the main current loop and carries the main load current in the main current loop. The power device 1221 can be a device with a large heat dissipation power, and the main load current can be the charging and discharging current of the battery cell 121.

[0052] In some embodiments, the power device 1221 includes at least one of a fuse, a protective switch, and a sampling device. For example, the power device 1221 may be a protective switch, a fuse and a protective switch, or a protective switch and a sampling device. The fuse may be a one-time fuse, a resettable fuse, an electronic fuse, etc. The protective switch may be a charging switch, a discharging switch, etc. The sampling device may be a precision resistor, a current sensor, a voltage sensor, a temperature sensor, a thermistor, etc.

[0053] The battery protection board 122 also includes a control device 1222. The control device 1222 is configured to control the power device 1221 and / or receive voltage and / or current signals from the power device 1221. For example, when the power device 1221 is a fuse and / or a protective switch, the control device 1222 correspondingly controls whether the fuse blows and / or the protective switch is turned on or off. The control device 1222 can also correspondingly receive, acquire, and detect the current flowing through the fuse, the voltage across the fuse, and / or the current flowing through the protective switch, and the voltage across the protective switch. Furthermore, the control device 1222 can also correspondingly receive, acquire, and detect other parameters of the power device 1221, such as temperature and power. The control device 1222 can also correspondingly receive, acquire, and detect parameters such as current, voltage, temperature, and power of the battery cell 121. Thus, the controller 1222 can collect parameters such as the voltage of each cell 121, the current in the main current circuit, and the temperature of the battery 12, and then adjust the charging and discharging strategy of the cell 121 and control the triggering of overcurrent, overcharge and other protections for the cell 121.

[0054] In some embodiments, the controller 1222 is a fuel gauge chip or a combination of a secondary protection chip and a fuel gauge chip. The fuel gauge chip (Fuel Gauge IC) can be a chip that monitors, calculates, and reports electrical parameters such as SOC and SOH of the battery cell 121 in real time, dynamically adjusts the charging and discharging parameters of the battery cell 121, and controls the on / off state of the protection switch. The secondary protection chip can be a redundant safety protection chip, which works in conjunction with the fuel gauge chip to form a dual protection mechanism, protecting the battery cell 121 even after the fuel gauge chip fails. For example, the secondary protection chip is configured to control whether a fuse blows, thereby protecting the battery cell 121.

[0055] Please see Figure 3 , Figure 3 This is a schematic diagram of a battery protection board 122 provided in an embodiment of this application.

[0056] The battery protection board 122 includes a circuit board substrate 1223, a power device 1221, and a control module 1224. The circuit board substrate 1223 can be a printed circuit board (PCB), a flexible printed circuit board (FPC), a rigid-flex PCB, a ceramic substrate, a glass substrate, a biodegradable substrate, etc.

[0057] The power device 1221 is disposed on the circuit board substrate 1223. The power device 1221 can be disposed on the circuit board substrate 1223 by means of soldering, fixing with fasteners, bonding, etc.

[0058] The control module 1224 includes a module substrate 1225 and a controller 1222. The module substrate 1225 can be a circuit board of the same type as the circuit board substrate 1223, or it can be a circuit board of a different type than the circuit board substrate 1223.

[0059] Module substrate 1225 is disposed on circuit board substrate 1223. Control device 1222 is disposed on module substrate 1225. Control device 1222 is electrically connected to module substrate 1225, and module substrate 1225 and power device 1221 are electrically connected to circuit board substrate 1223. Module substrate 1225 can be disposed on circuit board substrate 1223 by means of soldering, fastening with fasteners, bonding, etc. For example, as... Figure 5 As shown, module pads 1226 can be provided on the module substrate 1225. Substrate pads 1227 can be provided on the circuit board substrate 1223. The module pads 1226 and the substrate pads 1227 are soldered and electrically connected accordingly. Similarly, the controller 1222 can be mounted on the module substrate 1225 by soldering, fixing with fasteners, or bonding. Thus, the controller 1222 is electrically connected to the power device 1221 through the module substrate 1225 and the circuit board substrate 1223, thereby enabling the controller 1222 to control the power device 1221 and / or receive voltage and / or current signals from the power device 1221.

[0060] In some embodiments, the module pads 1226 and / or the substrate pads 1227 can be square. Square module pads 1226 and / or substrate pads 1227 can increase the soldering area and enhance soldering reliability. The module pads 1226 and / or substrate pads 1227 can be circular. Circular module pads 1226 and / or substrate pads 1227 can enhance the stability of the soldering process and reduce the problem of short circuits between solder balls and pads during soldering. The module pads 1226 and / or substrate pads 1227 can be elliptical. Elliptical module pads 1226 and / or substrate pads 1227 can combine the advantages of square and circular shapes, increasing the soldering area while also improving the stability of the soldering process.

[0061] In some embodiments, the control module 1224 further includes peripheral devices 1220, which are disposed on the module substrate 1225. The module substrate 1225 and the peripheral devices 1220 are electrically connected to form a peripheral circuit. The peripheral devices 1220 include at least one of capacitors, resistors, and diodes, and the peripheral circuit consists of at least one of filter circuits, detection circuits, and electrostatic discharge protection circuits.

[0062] In some embodiments, such as Figures 7 to 11 As shown, the control module 1224 is also equipped with an identification code 1232. The identification code 1232 is configured to identify the control module 1224. Thus, by setting the identification code 1232 on the control module 1224, it is convenient to trace and troubleshoot the control module 1224 during the manufacturing, R&D, testing, debugging, and management processes, and to facilitate the binding development, testing, and management of the control module 1224 with the corresponding circuit board substrate 1223.

[0063] In some embodiments, the identification code 1232 includes characters or a QR code. The QR code may include DM codes and QR codes, and its size may be greater than or equal to 1mm × 1mm, thereby representing a large amount of information from the identification code 1232.

[0064] Please see Figure 4 , Figure 4 This is a schematic diagram of a battery protection board 122 provided in an embodiment of this application along a first direction X.

[0065] Wherein, the first direction X is the thickness direction of the battery protection board 122. Taking the circuit board substrate 1223 and the module substrate 1225 as both being PCBs, the number of copper layers of the circuit board substrate 1223 can be less than or equal to 6 layers, and the number of copper layers of the module substrate 1225 can be less than or equal to 6 layers.

[0066] In some embodiments, the circuit board substrate 1223 has 2 copper layers, and the module substrate 1225 may have 4 or 6 copper layers.

[0067] In some embodiments, the thickness of the circuit board substrate 1223 is 0.6~1mm and / or the thickness of the module substrate 1225 is 0.2~1mm.

[0068] In some embodiments, the area of ​​the module substrate 1225 is smaller than the area of ​​the circuit board substrate 1223.

[0069] In some embodiments, the module substrate 1225 has a length of 6-20 mm and a width of 5-10 mm.

[0070] Because the controller 1222 requires high-precision signal processing—for example, it needs to monitor parameters such as voltage, current, and temperature of the battery cell 121 in real time with high accuracy—a stable reference ground plane may be necessary on the circuit board supporting the controller 1222 to reduce power supply noise and ground bounce interference, thereby improving the monitoring accuracy of the controller 1222. Furthermore, it may be necessary to implement layered routing for different types of signals, such as high-frequency signals, analog signals, and digital signals, on the circuit board to reduce crosstalk between different signal types. Additionally, due to the large number of pins and the small spacing between them, it may be necessary to increase the number of layers and vias on the circuit board to achieve high-density interconnection routing between the pins. Moreover, since the controller 1222 also has communication capabilities, it is necessary to control the characteristic impedance of its communication pins. This may necessitate increasing the number of layers on the circuit board to adjust the impedance linewidth and dielectric layer thickness of each layer, thereby precisely controlling the characteristic impedance of the communication pins of the controller 1222. Meanwhile, considering electromagnetic interference, it may be necessary to install a shielding layer in the circuit board to improve signal isolation and reduce signal and electromagnetic interference.

[0071] In summary, the circuit board carrying the control device 1222 requires a larger number of layers. Conversely, the circuit board carrying the power device 1221 can have fewer layers.

[0072] However, in the prior art, since both the controller 1222 and the power device 1221 are disposed on the circuit board substrate 1223, the number of copper layers on the circuit board substrate 1223 must preferentially meet the needs of the controller 1222; otherwise, the controller 1222 cannot function properly. This application addresses this by setting a control module 1224. In this case, the controller 1222 is essentially disposed on a substrate whose copper layer count is the sum of the copper layers on the module substrate 1225 and the circuit board substrate 1223. This satisfies the copper layer requirement of the controller 1222 while reducing the copper layer count on the circuit board substrate 1223, thereby reducing costs. It also reduces the thickness and weight of the circuit board substrate 1223. Furthermore, the control module 1224 can serve as a universal standard component, applicable to battery protection boards 122 in different products, thus reducing the manufacturing, design, testing, R&D, and repair costs of the battery protection board 122, and shortening the R&D cycle. Furthermore, when the area of ​​the module substrate 1225 is smaller than the area of ​​the circuit board substrate 1223, the manufacturing cost of the battery protection board 122 can be reduced more significantly.

[0073] Please see Figure 5 , Figure 5 This is a schematic diagram of module pad 1226 and substrate pad 1227 provided in an embodiment of this application.

[0074] The module substrate 1225 has at least one module pad 1226. The module pad 1226 is electrically connected to the controller 1222. The circuit board substrate 1223 has a substrate pad 1227, which is electrically connected to the power device 1221. The module pad 1226 and the substrate pad 1227 are correspondingly soldered and electrically connected. Along the first direction X, the controller 1222, the module substrate 1225, the module pad 1226, the substrate pad 1227, and the circuit board substrate 1223 are stacked sequentially. Thus, the controller 1222 is electrically connected to the power device 1221 through the module pad 1226 and the substrate pad 1227, thereby controlling the power device 1221 and / or receiving voltage and / or current signals from the power device 1221.

[0075] In one possible implementation, the module pads 1226 are configured as multiple, such as Figure 6 As shown, the number of module pads 1226 can be set according to the number of pins and ports of the controller 1222. The pins of the controller 1222 may include a fuse pin (FUSE), a ground pin (GND), a power supply pin (VCC), a charging control pin (CFOUT), a discharging control pin (DFOUT), a first communication pin (SRP), a second communication pin (SRN), etc. For each pin of the controller 1222, a corresponding module pad 1226 can be provided and electrically connected to the corresponding pin of the controller 1222.

[0076] Please see Figure 6 Multiple module pads 1226 are asymmetrically arranged in the width or length direction of the module substrate 1225. For example, taking the length centerline of the module substrate 1225 as a reference, the number, shape, or size of the module pads 1226 on one side of the length centerline is different from that on the other side, and / or the positions of the module pads 1226 on one side of the length centerline are asymmetrically arranged about the length centerline. Similarly, taking the width centerline of the module substrate 1225 as a reference, the number, shape, or size of the module pads 1226 on one side of the width centerline is different from that on the other side, and / or the positions of the module pads 1226 on one side of the width centerline are asymmetrically arranged about the width centerline. This reduces the heat concentration of the module substrate 1225 and optimizes and balances its heat dissipation. Furthermore, it disperses the mechanical stress of the module substrate 1225, improving its mechanical strength. Simultaneously, it prevents mis-soldering and reverse soldering during the soldering of the module substrate 1225 to the circuit board substrate 1223, thus acting as a foolproof method.

[0077] Please see Figure 7 , Figure 7 This is a schematic diagram illustrating one possible configuration of the identifier 1232 provided in an embodiment of this application.

[0078] The module substrate 1225 includes a first solder resist layer 1228, a first copper layer 1229, and a first substrate layer 1230 sequentially stacked along a first direction X. The first solder resist layer 1228 is the top layer of the module substrate 1225. The first copper layer 1229 is the first copper layer of the module substrate 1225, i.e., the top copper layer. The first copper layer 1229 is provided with controller pads 1231. The controller pads 1231 are exposed on the first solder resist layer 1228, and controllers 1222 are disposed on the controller pads 1231. An identification code 1232 is disposed on the first solder resist layer 1228.

[0079] In some embodiments, the first copper layer 1229 can be replaced with other layered structures with conductive properties, such as a silver layer, an aluminum layer, a graphite layer, or a metal alloy layer.

[0080] In some embodiments, the identification code 1232 can be disposed on the surface of the first solder mask layer 1228 by at least one of inkjet printing, screen printing, and laser engraving. For example, as Figure 8As shown, the identification code 1232 is applied to the first solder mask layer 1228 by inkjet printing or screen printing. The first solder mask layer 1228 includes a first region 1233 and a second region 1234. Along the first direction X, the first region 1233 overlaps with the first copper layer 1229, while the second region 1234 does not overlap with the first copper layer 1229. That is, the first region 1233 is the projection area of ​​the first copper layer 1229 onto the first solder mask layer 1228 in the opposite direction of the first direction X, and there is no intersection or overlap between the first region 1233 and the second region 1234. The identification code 1232 is applied to the second region 1234. Thus, since the second region 1234 does not overlap with the first copper layer 1229, the height of the second region 1234 of the first solder resist layer 1228 is less than the height of the first region 1233 in the first direction X. This reduces the ink height used when inkjet printing or screen printing the identification code 1232, thereby reducing the risk of poor solder paste printing or adhesion caused by the high ink height of the identification code 1232 during subsequent surface treatment or surface mounting processes on the battery protection board 122. This improves the soldering stability of the battery protection board 122.

[0081] The first copper layer 1229 can be a structural layer containing copper, in which case the first region 1233 corresponds to the region of the first copper layer 1229. The second region 1234 corresponds to the region where the first copper layer 1229 is not present. Alternatively, the first copper layer 1229 can be a structural layer comprising both copper-containing and copper-free regions, in which case the first region 1233 corresponds to the copper-containing region of the first copper layer 1229, and the second region 1234 corresponds to the copper-free region of the first copper layer 1229. The second region 1234 can be an electrical isolation region, etc.

[0082] In some embodiments, the minimum distance between the identification code 1232 and the controller pad 1231 is greater than or equal to 0.5 mm. This reduces the risk of the stencil being lifted by the identification code 1232 due to the small gap between the identification code 1232 and the controller pad 1231 during subsequent surface treatment or surface mount processes of the battery protection board 122, which could lead to poor solder paste printing or adhesion, and improves the soldering stability of the battery protection board 122.

[0083] In some embodiments, along the first direction X, the height of the identification code 1232 is lower than or equal to the height of the control device 1222. This reduces the risk of poor solder paste printing or adhesion caused by the high ink height of the identification code 1232 during subsequent surface treatment or surface mounting processes on the battery protection board 122, which could result in the stencil being lifted by the identification code 1232. This improves the soldering stability of the battery protection board 122.

[0084] In some embodiments, the identification code 1232 can be laser-engraved onto the surface of the first solder mask layer 1228. In this way, laser engraving can significantly reduce the height of the identification code 1232 without affecting the subsequent soldering of the battery protection board 122.

[0085] Please see Figure 9 , Figure 9 This is a schematic diagram illustrating one possible configuration of the identifier 1232 provided in an embodiment of this application.

[0086] The battery protection board 122 provided in this embodiment and Figure 7 The difference in the embodiment is that, in this embodiment, the identification code 1232 is formed by etching a first copper layer 1229, and a first solder mask layer 1228 covers the identification code 1232. Specifically, the pattern of the identification code 1232 can be set in the etching pattern of the first copper layer 1229. Thus, after the pattern of the first copper layer 1229 is exposed and developed, the identification code 1232 is etched together with the pattern of the first copper layer 1229. In addition, the first solder mask layer 1228 covering the identification code 1232 can protect the identification code 1232, thereby reducing the risk of the identification code 1232 being worn, corroded, oxidized, or contaminated. Furthermore, no additional process is required to manufacture the identification code 1232, reducing the setting cost of the identification code 1232.

[0087] Please see Figure 10 , Figure 10 This is a schematic diagram illustrating one possible configuration of the identifier 1232 provided in an embodiment of this application.

[0088] The battery protection board 122 provided in this embodiment and Figure 7 The difference in the embodiment is that, in this embodiment, the control module 1224 further includes a package 1235, which covers the first solder mask layer 1228 and the controller 1222, and an identification code 1232 is disposed on the surface of the package 1235. The identification code 1232 is disposed on the surface of the package 1235 by at least one of inkjet printing, screen printing, or laser engraving.

[0089] In some embodiments, the package 1235 is a protective layer formed by encapsulating thermosetting or thermoplastic plastic around the control module 1224 through processes such as injection molding or compression molding. This can reduce the impact of environmental factors such as chemical corrosion, mechanical impact, dust, and moisture on the control module 1224, thereby improving the stability and reliability of the control module 1224. Simultaneously, when the control module 1224 is soldered onto the circuit board substrate 1223, the package 1235 can reduce abnormalities such as relative movement and deformation between the control device 1222 and the module substrate 1225 after the solder melts between them, thus improving the soldering stability of the control device 1222 during the secondary reflow of the control module 1224.

[0090] In some embodiments, the thermal conductivity of the package 1235 is 1~3 W / (m·K). Thus, the package 1235 can enhance the thermal conductivity of the control module 1224 and reduce the thermal failure rate of the control module 1224.

[0091] Please see Figure 11 , Figure 11 This is a schematic diagram illustrating one possible configuration of the identifier 1232 provided in an embodiment of this application.

[0092] The battery protection board 122 provided in this embodiment and Figure 7 The difference in the embodiment is that, in this embodiment, in addition to the first solder resist layer 1228, the first copper layer 1229, and the first substrate layer 1230, the module substrate 1225 also includes a second substrate layer 1236, a second copper layer 1237, and a second solder resist layer 1238 sequentially stacked along the first direction X, with the second solder resist layer 1238 being the bottom layer of the module substrate 1225. A substrate pad 1227 is provided on the circuit board substrate 1223. Module pads 1226 are disposed on the second copper layer 1237 and exposed on the second solder resist layer 1238. An identification code 1232 is disposed on the second solder resist layer 1238 by at least one of inkjet printing, screen printing, and laser engraving. The module pads 1226 are soldered to and electrically connected to the substrate pads 1227.

[0093] Along the first direction X, the circuit board substrate 1223 has a viewing hole 1239, the module substrate 1225 covers the viewing hole 1239, and the identification code 1232 is exposed through the viewing hole 1239. That is, when viewed in the opposite direction of the first direction X, a portion of the module substrate 1225 can be seen through the viewing hole 1239, and the identification code 1232 disposed on the second solder mask layer 1238 can be observed. In this way, the identification code 1232 does not occupy the area on the side of the module substrate 1225 where the control device 1222 is located, thereby improving the area utilization rate of the module substrate 1225.

[0094] Please see Figure 12 , Figure 12 This is a schematic diagram illustrating one possible configuration of the identification code 1232 provided in an embodiment of this application. The battery protection board 122 provided in this embodiment and... Figure 11The difference in the embodiment is that, in this embodiment, the identification code 1232 is formed by etching the second copper layer 1237, and the second solder mask layer 1238 covers the identification code 1232. Specifically, the pattern of the identification code 1232 can be set in the etching pattern of the second copper layer 1237. Thus, after the pattern of the second copper layer 1237 is exposed and developed, the identification code 1232 is etched together with the pattern of the second copper layer 1237. In addition, the second solder mask layer 1238 covering the identification code 1232 can protect the identification code 1232, thereby reducing the risk of the identification code 1232 being worn, corroded, oxidized, or contaminated. Furthermore, no additional process is required to manufacture the identification code 1232, reducing the setting cost of the identification code 1232.

[0095] Therefore, the battery protection board 122, battery 12, and terminal device 10 provided in this application, by setting a control module 1224, where the control device 1222 is essentially disposed on a substrate equal to the sum of the number of copper layers on the module substrate 1225 and the circuit board substrate 1223, can meet the copper layer requirements of the control device 1222 while reducing the number of copper layers on the circuit board substrate 1223, thereby reducing costs. It can also reduce the thickness and weight of the circuit board substrate 1223. Furthermore, the control module 1224 can serve as a universal standard component, applicable to battery protection boards 122 in different products, thereby reducing the costs of manufacturing, design, testing, R&D, and rework of the battery protection board 122, and shortening the R&D cycle. In addition, when the area of ​​the module substrate 1225 is smaller than the area of ​​the circuit board substrate 1223, the manufacturing cost of the battery protection board 122 can be reduced even more significantly.

[0096] Those skilled in the art should recognize that the above embodiments are only used to illustrate this application and are not intended to limit this application. Any appropriate changes and variations made to the above embodiments within the essential spirit and scope of this application fall within the scope of protection claimed in this application.

Claims

1. A battery protection board, characterized in that, include: Circuit board substrate; Power devices are disposed on the circuit board substrate; A control module includes a module substrate and a controller. The module substrate is disposed on the circuit board substrate, and the controller is disposed on the module substrate and electrically connected to the module substrate. The module substrate and the power device are electrically connected to the circuit board substrate, and the area of ​​the module substrate is smaller than the area of ​​the circuit board substrate.

2. The battery protection board as described in claim 1, characterized in that, The circuit board substrate has 6 or fewer copper layers, and the module substrate has 6 or fewer copper layers.

3. The battery protection board as described in claim 2, characterized in that, The circuit board substrate has 2 copper layers, and the module substrate has 4 or 6 copper layers.

4. The battery protection board as described in any one of claims 1 to 3, characterized in that, The thickness of the circuit board substrate is 0.6~1mm and / or the thickness of the module substrate is 0.2~1mm.

5. The battery protection board as described in claim 4, characterized in that, The module substrate has a length of 6-20mm and a width of 5-10mm.

6. The battery protection board as described in claim 1, characterized in that, The battery protection board is configured to be electrically connected to an external battery cell and an external terminal device to form a main current loop. The power device is configured to be connected in series in the main current loop and carry the main load current in the main current loop. The control device is configured to control the power device and / or receive the voltage and / or current signals of the power device.

7. The battery protection board as described in claim 6, characterized in that, The power device includes at least one of a fuse, a protective switch, and a sampling device.

8. The battery protection board as described in claim 7, characterized in that, The power device is a fuse, a protective switch, a sampling device, or... The power device is a protective switch, or The power device is a fuse, a protective switch, or... The power devices are protection switches and sampling devices.

9. The battery protection board as described in claim 6, characterized in that, The control module also includes peripheral devices. The module substrate is electrically connected to the peripheral devices to form a peripheral circuit. The peripheral devices include at least one of capacitors, resistors, and diodes. The peripheral circuit is composed of at least one of a filter circuit, a detection circuit, and an electrostatic discharge protection circuit.

10. The battery protection board as described in claim 6, characterized in that, The controller is a fuel gauge chip or a combination of a secondary protection chip and a fuel gauge chip.

11. The battery protection board as described in claim 1, characterized in that, The module substrate is provided with at least one module pad, and the module pad is electrically connected to the controller. The circuit board substrate is provided with substrate pads, and the substrate pads are electrically connected to the power device; The module pads are welded to and electrically connected to the substrate pads.

12. The battery protection board as described in claim 11, characterized in that, The module pads are configured in multiple ways, and the multiple module pads are arranged asymmetrically in the width or length direction of the module substrate.

13. The battery protection board as described in claim 11 or 12, characterized in that, The control module is equipped with an identification code, which is configured to identify the control module.

14. The battery protection board as described in claim 13, characterized in that, The module substrate includes a first solder resist layer, a first copper layer, and a first substrate layer stacked sequentially along a first direction. The first solder resist layer is the top layer of the module substrate. The first copper layer has control device pads exposed on the first solder resist layer, and the control device is disposed on the control device pads. The identification code is disposed on the first solder resist layer. The first direction is the thickness direction of the battery protection board, and / or The control module further includes a package that covers the first solder mask layer and the control device, and the identification code is affixed to the surface of the package.

15. The battery protection board as described in claim 14, characterized in that, The identification code is applied to the surface of the first solder mask layer and / or the package by at least one of inkjet printing, screen printing, or laser engraving.

16. The battery protection board as described in claim 14 or 15, characterized in that, The identification code is applied to the first solder mask layer by inkjet printing or screen printing. The first solder mask layer includes a first region and a second region. Along the first direction, the first region overlaps with the first copper layer, and the second region does not overlap with the first copper layer. The identification code is applied to the second region.

17. The battery protection board as described in claim 15, characterized in that, The identification code is affixed to the first solder mask layer by inkjet printing or screen printing. The minimum distance between the identification code and the pad of the controller is greater than or equal to 0.5 mm, and / or Along the first direction, the height of the identification code is lower than or equal to the height of the controller.

18. The battery protection board as described in claim 13, characterized in that, The module substrate includes a first solder resist layer, a first copper layer and a first substrate layer stacked sequentially along a first direction. The first solder resist layer is the top layer of the module substrate. The first copper layer is provided with control device pads. The control device pads are exposed on the first solder resist layer and the control device is disposed on the control device pads. The first direction is the thickness direction of the battery protection board. The identification code is formed by etching the first copper layer, and the first solder mask layer covers the identification code.

19. The battery protection board as described in claim 13, characterized in that, The module substrate includes a first solder resist layer, a first copper layer, a first substrate layer, a second copper layer, and a second solder resist layer stacked sequentially along a first direction. The second solder resist layer is the bottom layer of the module substrate. The module pads are disposed on the second copper layer and exposed on the second solder resist layer. The identification code is disposed on the second solder resist layer by at least one of inkjet printing, screen printing, and laser engraving. The first direction is the thickness direction of the battery protection board. Along the first direction, the circuit board substrate is provided with a viewing hole, the module substrate covers the viewing hole, and the identification code is exposed in the viewing hole.

20. The battery protection board as described in claim 13, characterized in that, The identification code includes characters or a QR code.

21. A battery, characterized in that, include: Battery cell; The battery protection board as described in any one of claims 1 to 20, wherein the battery protection board is electrically connected to the battery cell.

22. A terminal device, characterized in that, include: Equipment body; The battery as claimed in claim 21, wherein the battery is disposed in the device body.

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