PCB product heating and cooling integrated device

Abstract

The application relates to a PCB product heating and cooling integrated device and belongs to the technical field of printed circuit board manufacturing, which comprises a drawer base, and two module bases are fixedly arranged in the drawer base. The application has the beneficial effect that by integrating the temperature adjusting assembly and the PCB placing structure in the same drawer base, the PCB product body completes the whole heating and cooling process on the synthetic stone protection plate of the mounting frame, and carrying between processes is not needed, which effectively avoids local stress unevenness caused by temperature sudden change in the carrying process, significantly reduces the occurrence rate of quality defects such as substrate deformation and circuit cracking, and simultaneously, the synthetic stone protection plate has excellent high-temperature resistance and heat insulation performance, can reduce temperature fluctuation of the PCB surface during heating, realizes accurate temperature control by cooperating with the thermocouple in the heat-conducting bottom plate, and further guarantees the processing precision of core processes such as solder reflow and substrate solidification.

Description

Technical Field

[0001] This application relates to the field of printed circuit board manufacturing technology, and in particular to an integrated heating and cooling device for PCB products. Background Technology

[0002] Printed circuit boards (PCBs), as the core carrier of electronic devices, achieve electrical connections between electronic components through wires and pads. Their manufacturing quality directly determines the stability and reliability of downstream products. In the PCB production process, heating and cooling are core processes that run through many key steps: heating operations are commonly used in solder reflow, substrate curing, and ink drying, requiring precise temperature control to ensure solder wettability, substrate material stability, and coating adhesion; cooling operations follow the heating process to quickly stabilize the molecular structure of the PCB, prevent substrate warping or component damage caused by thermal stress, and ensure smooth transitions to subsequent processes (such as testing and assembly).

[0003] Currently, the industry generally uses separate heating and cooling equipment to complete the above processes. Specifically, after the PCB is heated, it needs to be transported to the cooling equipment by hand or robotic arm for cooling. However, this separate operation mode has the following problems: during the transportation process, the PCB is exposed to the workshop environment, which is prone to uneven local stress due to sudden temperature changes, resulting in quality problems such as substrate deformation and circuit cracking. At the same time, the transportation process prolongs the production cycle and reduces the overall production efficiency. Utility Model Content

[0004] In view of the above-mentioned problems in the prior art, the main objective of this application is to provide an integrated heating and cooling device for PCB products.

[0005] The technical solution of this application is as follows: a PCB product heating and cooling integrated device includes a drawer-type base, two modular bases are fixedly installed inside the drawer-type base, and an installation frame is fixedly installed on the top of each modular base. A PCB fixing plate is provided on the top of the installation frame, an insulating plate is fixedly installed on the top of the PCB fixing plate, and a protective cover is fixedly installed on the top of the PCB fixing plate. A PCB product body is provided inside the installation frame, and a temperature regulating component for heating and cooling the PCB product body is provided on the top of the installation frame. Flipping components for flipping the protective cover are provided on both sides of the installation frame.

[0006] In a preferred embodiment, the temperature control component includes two heat-conducting base plates disposed inside the mounting frame. Heating rods are embedded equidistantly inside the heat-conducting base plates. A synthetic stone protective plate is fixedly installed on the top of the heat-conducting base plates. The PCB product body is placed on the top of the heat-conducting base plates. A thermocouple is fixedly installed inside the heat-conducting base plates. A controller is fixedly installed on one side of the module base.

[0007] By adopting the above technical solutions, the synthetic stone protective board has excellent high temperature resistance and heat insulation performance, which can reduce the temperature fluctuation of the PCB surface during heating, and achieve precise temperature control in conjunction with the thermocouple in the heat-conducting base plate.

[0008] In a preferred embodiment, the temperature control component further includes several cooling fans c fixedly installed on both sides of the protective cover, two fan fixing plates fixedly connected to the inner wall of the module base, two cooling fans b fixedly installed inside each fan fixing plate, and cooling fans a fixedly installed on the inner wall of the drawer-type base on both sides of the protective cover.

[0009] By adopting the above technical solution, the temperature control component and the PCB placement structure are integrated into the same drawer-type base. The PCB product body completes the entire heating and cooling process on the synthetic stone protective plate of the mounting frame, eliminating the need for handling between processes.

[0010] In a preferred embodiment, the flipping assembly includes several hinges disposed on one side of the mounting frame. The PCB fixing plate is rotatably mounted on the top of the mounting frame via the hinges. Limiting components are rotatably connected to both sides of the mounting frame. Connecting components are rotatably connected to both ends of the bottom of the PCB fixing plate. The end of the limiting component away from the mounting frame is rotatably connected to the connecting component.

[0011] By adopting the above technical solution, and through the combined use of hinges, limiting components and connectors, the protective cover and PCB fixing board can be easily flipped open and closed, facilitating the quick loading and unloading of PCB products and the cleaning and maintenance of the device's interior.

[0012] In a preferred embodiment, the flipping assembly further includes clips b fixedly installed at both ends of the top of the module base, and clips a that cooperate with clips b are fixedly installed on both sides of the PCB fixing plate.

[0013] By adopting the above technical solution, the engaging structure of buckle a and buckle b ensures that the protective cover closes tightly during heating and cooling, thus guaranteeing operational stability.

[0014] In a preferred embodiment, a mounting bracket is fixedly installed on one side of the top of the insulating plate, and a heat dissipation plate is fixedly installed on the other side of the top of the insulating plate. Several stainless steel posts are inserted between the insulating plate and the protective cover.

[0015] By adopting the above technical solution and setting up the heat sink, concentrated heat can be quickly dispersed to a larger area, accelerating the diffusion of heat to the surrounding environment and shortening the cooling time of the PCB product body.

[0016] In a preferred embodiment, the inner wall of the module base is fixedly connected with eight support members, and the top of each support member is threaded with a bolt. Four bolts form a group, and the heat-conducting base plate is connected to the support members by a group of bolts.

[0017] By adopting the above technical solution and through the combination design of support components and bolts, the heat-conducting base plate can be flexibly disassembled and assembled.

[0018] Compared with the prior art, the advantages and positive effects of this application are as follows: 1. In this application, by integrating the temperature control component and the PCB placement structure into the same drawer-type base, the PCB product body completes the entire heating and cooling process on the synthetic stone protective plate of the mounting frame, eliminating the need for inter-process handling. This method effectively avoids uneven local stress caused by sudden temperature changes during handling, significantly reducing the incidence of quality defects such as substrate deformation and circuit cracking. At the same time, the synthetic stone protective plate has excellent high temperature resistance and thermal insulation properties, which can reduce temperature fluctuations on the PCB surface during heating. Combined with the thermocouple in the heat-conducting base plate, it achieves precise temperature control, further ensuring the processing accuracy of core processes such as solder reflow and substrate curing.

[0019] 2. In this application, the hinge, limiting member and connecting member are used in combination to easily realize the flipping and opening of the protective cover and PCB fixing board, which facilitates the quick loading and unloading of PCB products and the cleaning and maintenance of the inside of the device. Attached Figure Description

[0020] Figure 1 This application provides an overall perspective view of an integrated heating and cooling device for PCB products; Figure 2 This application provides a schematic diagram of a drawer-type base structure for an integrated heating and cooling device for PCB products; Figure 3 This application provides a schematic diagram of the rotating protective cover of an integrated heating and cooling device for PCB products. Figure 4 This application provides a schematic diagram of a PCB mounting plate for an integrated heating and cooling device for PCB products. Figure 5This application provides a schematic diagram of a flipping component for an integrated heating and cooling device for PCB products; Figure 6 This application provides a schematic diagram of a temperature control component for an integrated heating and cooling device for PCB products.

[0021] Illustrations: 1. Drawer-type base; 2. Protective cover; 3. Cooling fan a; 4. Modular base; 5. Flip assembly; 51. Hinge; 52. Connector; 53. Limiting component; 54. Clip a; 55. Clip b; 6. Temperature control assembly; 61. Heat-conducting base plate; 62. Synthetic stone protective plate; 63. Heating rod; 64. Fan mounting plate; 65. Cooling fan b; 66. Cooling fan c; 67. Thermocouple; 7. Support component; 8. Bolt; 9. Mounting frame; 10. Mounting bracket; 11. Heat sink; 12. Stainless steel column; 13. Insulating plate; 14. PCB mounting plate. Detailed Implementation

[0022] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0023] Reference Figure 1-6 A PCB product heating and cooling integrated device includes a drawer-type base 1, with two modular bases 4 fixedly installed inside the drawer-type base 1. Each modular base 4 has a mounting frame 9 fixedly installed at its top. A PCB fixing plate 14 is provided at the top of the mounting frame 9. An insulating plate 13 is fixedly installed at the top of the PCB fixing plate 14. A protective cover 2 is fixedly installed at the top of the PCB fixing plate 14. A PCB product body is provided inside the mounting frame 9. A temperature regulating component 6 for heating and cooling the PCB product body is provided at the top of the mounting frame 9. Flipping components 5 for flipping the protective cover 2 are provided on both sides of the mounting frame 9.

[0024] Specifically, the temperature control component 6 includes two heat-conducting base plates 61 set inside the mounting frame 9. Heating rods 63 are equidistantly embedded inside the heat-conducting base plates 61. A synthetic stone protective plate 62 is fixedly installed on the top of the heat-conducting base plates 61. The PCB product body is placed on the top of the heat-conducting base plates 61. A thermocouple 67 is fixedly installed inside the heat-conducting base plates 61. A controller is fixedly installed on one side of the module base 4. By integrating the temperature control component 6 and the PCB placement structure into the same drawer-type base 1, the PCB product body completes the entire heating and cooling process on the synthetic stone protective plate 62 of the mounting frame 9, eliminating the need for inter-process handling. This method effectively avoids uneven local stress caused by sudden temperature changes during handling, significantly reducing the incidence of quality defects such as substrate deformation and circuit cracking. At the same time, the synthetic stone protective plate 62 has excellent high-temperature resistance and heat insulation properties, which can reduce the PCB during heating. The surface temperature fluctuations, combined with the thermocouple 67 inside the heat-conducting base plate 61, achieve precise temperature control, further ensuring the processing accuracy of core processes such as solder reflow and substrate curing. The temperature control component 6 also includes several cooling fans c66 fixedly installed on both sides of the protective cover 2. Two fan mounting plates 64 are fixedly connected to the inner wall of the module base 4, and two cooling fans b65 are fixedly installed inside each fan mounting plate 64. Cooling fans a3 are fixedly installed on both sides of the inner wall of the drawer-type base 1, located on both sides of the protective cover 2. The flip component 5 includes several hinges 51 set on one side of the mounting frame 9. The PCB mounting plate 14 is rotatably mounted on the top of the mounting frame 9 through the hinges 51. Limiting parts 53 are rotatably connected to both sides of the mounting frame 9. Connecting parts 52 are rotatably connected to both ends of the bottom of the PCB mounting plate 14. Through the cooperation of the hinges 51, limiting parts 53 and connecting parts 52, the protective cover 2 and the PCB mounting plate 14 can be easily flipped and opened, facilitating the PCB... For quick product loading and unloading and internal cleaning and maintenance of the device, the end of the limiting member 53 away from the mounting frame 9 is rotatably connected to the connector 52.

[0025] Specifically, the flipping assembly 5 also includes buckles b55 fixedly installed at both ends of the top of the module base 4. Buckles a54 that cooperate with buckles b55 are fixedly installed on both sides of the PCB fixing plate 14. Through the engagement structure of buckles a54 and buckles b55, the protective cover 2 can be tightly closed during heating and cooling, ensuring operational stability. A mounting bracket 10 is fixedly installed on one side of the top of the insulating plate 13, and a heat sink 11 is fixedly installed on the other side of the top of the insulating plate 13. Several stainless steel pillars 12 are inserted between the insulating plate 13 and the protective cover 2. Eight support members 7 are fixedly connected to the inner wall of the module base 4. Through the combination design of support members 7 and bolts 8, the heat-conducting base plate 61 can be flexibly disassembled and assembled, which facilitates maintenance by the staff. The top of each support member 7 is threaded with bolts 8. Four bolts 8 form a group, and the heat-conducting base plate 61 and the support members 7 are connected by a group of bolts 8.

[0026] Working principle: First, by integrating the temperature control component 6 and the PCB placement structure into the same drawer-type base 1, the PCB product body completes the entire heating and cooling process on the synthetic stone protective plate 62 of the mounting frame 9, eliminating the need for inter-process handling. The thermocouple 67 detects the current temperature in real time and converts it into a corresponding thermoelectric potential signal. The heating rod 63, as the heating element, directly receives electrical signal commands from the controller. When a start signal is received, the heating rod 63 is energized and heats up, transferring heat to the PCB product through the heat-conducting base plate 61. The synthetic stone protective plate 62 possesses excellent high-temperature resistance and heat insulation properties, reducing temperature fluctuations on the PCB surface during heating. If the actual temperature reaches or exceeds the preset temperature of the thermocouple 67, the power is immediately cut off to stop heating, and the cooling fans b65 and c66 are activated, continuously dissipating internal heat for cooling. Subsequently, the engaging structure of the clips a54 and b55 ensures that the protective cover 2 remains tightly closed during heating and cooling, guaranteeing operational stability.

[0027] The above are merely preferred embodiments of this application and are not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A PCB product heating and cooling integrated device, comprising a drawer-type base (1), characterized in that: The drawer-type base (1) has two modular bases (4) fixedly installed inside. The top of each modular base (4) is fixedly installed with an installation frame (9). The top of the installation frame (9) is provided with a PCB fixing plate (14). The top of the PCB fixing plate (14) is fixedly installed with an insulating plate (13). The top of the PCB fixing plate (14) is fixedly installed with a protective cover (2). The PCB product body is provided inside the installation frame (9). The top of the installation frame (9) is provided with a temperature regulating component (6) for heating and cooling the PCB product body. The two sides of the installation frame (9) are provided with flipping components (5) for flipping the protective cover (2).

2. The integrated heating and cooling device for PCB products according to claim 1, characterized in that: The temperature control component (6) includes two heat-conducting base plates (61) set inside the mounting frame (9). Heating rods (63) are embedded in the heat-conducting base plates (61) at equal intervals. A synthetic stone protective plate (62) is fixedly installed on the top of the heat-conducting base plates (61). The PCB product body is placed on the top of the heat-conducting base plates (61). A thermocouple (67) is fixedly installed inside the heat-conducting base plates (61). A controller is fixedly installed on one side of the module base (4).

3. The integrated heating and cooling device for PCB products according to claim 2, characterized in that: The temperature control component (6) also includes several cooling fans c (66) fixedly installed on both sides of the protective cover (2). Two fan fixing plates (64) are fixedly connected to the inner wall of the module base (4). Two cooling fans b (65) are fixedly installed inside the fan fixing plates (64). Cooling fans a (3) are fixedly installed on the inner wall of the drawer-type base (1) and on both sides of the protective cover (2).

4. The integrated heating and cooling device for PCB products according to claim 1, characterized in that: The flipping assembly (5) includes several hinges (51) on one side of the mounting frame (9). The PCB fixing plate (14) is rotatably mounted on the top of the mounting frame (9) via the hinges (51). Limiting members (53) are rotatably connected to both sides of the mounting frame (9). Connecting members (52) are rotatably connected to both ends of the bottom of the PCB fixing plate (14). The end of the limiting member (53) away from the mounting frame (9) is rotatably connected to the connecting member (52).

5. The integrated heating and cooling device for PCB products according to claim 4, characterized in that: The flipping assembly (5) also includes buckles b (55) fixedly installed at both ends of the top of the module base (4), and buckles a (54) that cooperate with buckles b (55) are fixedly installed on both sides of the PCB fixing plate (14).

6. The integrated heating and cooling device for PCB products according to claim 1, characterized in that: An installation bracket (10) is fixedly installed on one side of the top of the insulating plate (13), and a heat sink plate (11) is fixedly installed on the other side of the top of the insulating plate (13). Several stainless steel columns (12) are inserted between the insulating plate (13) and the protective cover (2).

7. The integrated heating and cooling device for PCB products according to claim 2, characterized in that: The inner wall of the module base (4) is fixedly connected with eight support members (7), and the top of each support member (7) is threaded with a bolt (8). Four bolts (8) form a group, and the heat-conducting base plate (61) is connected to the support member (7) by a group of bolts (8).

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