A plate structure and an inverter

Abstract

The utility model discloses a kind of plate body structure and inverter, it is related to circuit board technical field.The plate body structure includes PCB and support plate.PCB has signal area and power area;Support plate and PCB are connected with each other, and its plate body surface is arranged with retaining wall, the free end of retaining wall is close to or abuts at PCB, to disturb the magnetic flux distribution path on PCB, signal area and power area are isolated;Wherein, support plate is made by extrusion process.The support plate in the plate body structure is made by extrusion process, compared with die casting and stamping process, it does not need to set draft angle, round corner and other demolding structure, to avoid the limitation of structure freedom degree to mould design, greatly improve the flexibility and customizable of support plate structure.Meanwhile, the support plate in the plate body structure is made by extrusion process, compared with die casting, it can save 70% mould processing cycle, compared with stamping, it saves 50% mould processing cycle, so it has the advantage of short processing cycle.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a board structure and inverter. Background Technology

[0002] In existing inverters, the support plate serves to fix the PCB board and electromagnetically shield the power module from noise.

[0003] like Figure 1 As shown, the mainstream support plate currently uses die casting, which results in high mold costs, long mold production cycles, and high costs and time required for mold repair when design changes are made later. The die-cast support plate is connected to the PCB using screws, resulting in a large horizontal no-feed area (typically...). (Above) The entire assembly occupies a large axial space for the screws. Taking a commonly used M3.5×12mm screw as an example, 16mm of axial space is required to accommodate the screw connection structure. For example... Figure 2 As shown, there is another type of stamped support plate, which has a shorter mold cycle than die casting, but it has the same shortcomings as die casting support plates: the wall thickness of the support plate body must be uniform, and the structure requires draft angles and rounded corners to ensure demolding and maintain mold life. Both of these structures result in wasted space. In addition, neither stamping nor die casting can produce complex undercut structures, i.e., structures without obstruction along the demolding direction.

[0004] For example Figure 3 and Figure 4 As shown, in related technologies, PCB boards are divided into power areas and signal areas. The power area is a source of signal noise and therefore needs to be isolated from the signal area. The support plate, as the mechanical component closest to the PCB board, typically requires a separating structure, such as a retaining wall. If die-casting is used, the top thickness of the retaining wall should generally not be less than 2mm; otherwise, the mold will be too thin, making demolding difficult. Furthermore, the draft angle and bottom rounded corners lead to wasted space. If stamping is used, a narrow and tall retaining wall cannot be made using only a stamping die. If additional metal sheets are riveted, the riveting process itself requires operating space, introducing constraints to the design of other functional structures. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a plate structure and inverter. The support plate in this plate structure is made by extrusion. Compared with die casting and stamping, it does not require draft angles, rounded corners, or other demolding structures, thus avoiding the limitation of mold design on structural freedom and greatly improving the flexibility and customizability of the support plate structure. At the same time, the extrusion molding process can realize structural designs with high straight walls and optimized thickness ratios (especially for retaining walls), effectively reducing space waste caused by draft angles and bottom rounded corners.

[0006] This utility model embodiment discloses a plate structure, including:

[0007] PCB board, which has signal area and power area;

[0008] A support plate is connected to the PCB board, and a baffle is arranged on its surface. The free end of the baffle is close to or abuts the PCB board to disturb the magnetic flux distribution path on the PCB board and isolate the signal area from the power area.

[0009] The support plate is manufactured using an extrusion process.

[0010] Furthermore, the thickness of the retaining wall is a, where a ≤ 1 mm.

[0011] Furthermore, the height of the retaining wall is d, where d ≥ 3 mm.

[0012] Furthermore, it also includes a bushing, through which the PCB board is connected to the support plate.

[0013] Furthermore, a pad is provided on one side surface of the PCB board, and the bushing and the pad are connected to each other by a soldering process.

[0014] Furthermore, the welding surface profile of the bushing is shaped to match the pad profile of the pad, and the outer diameter of the welding profile of the pad is smaller than the outer diameter of the welding surface profile of the bushing, so that the bushing and the PCB board can be aligned and positioned by the surface tension of the solder in the molten state.

[0015] Furthermore, the contour of the welding surface of the bushing and the contour of the solder pad are both circular.

[0016] Furthermore, the bushing and the support plate are connected to each other using a laser welding process.

[0017] Furthermore, the PCB board has through holes on its upper and lower sides, and the bushing has grooves that are adapted to the through holes so that the laser beam can act perpendicularly on the grooves to weld the bushing to the support plate.

[0018] Furthermore, the area where the bushing is welded to the support plate is defined as the welding area, and the remaining area of ​​the support plate is defined as the support area, wherein the thickness of the welding area is less than the thickness of the support area.

[0019] Furthermore, the support plate has a first plate and a second plate with different heights, the retaining wall is arranged in the first plate, and the bushing is welded in the second plate, wherein the distance between the first plate and the PCB board is greater than the distance between the second plate and the PCB board.

[0020] Furthermore, the bushing is a stamped bushing.

[0021] Furthermore, the bushing is made of steel.

[0022] Furthermore, the support plate is made of aluminum, steel, or injection-molded material doped with metal particles.

[0023] This utility model embodiment also discloses an inverter, including the plate structure as described above.

[0024] The plate structure and inverter provided by this utility model have the following beneficial effects, including but not limited to:

[0025] 1) The support plate in this plate structure is made by extrusion process. Compared with die casting and stamping processes, it does not require draft angle, rounded corners and other demolding structures, thus avoiding the restriction of structural freedom by mold design. It greatly improves the flexibility and customizability of the support plate structure. It can realize structures with different wall thicknesses. The wall thickness can be increased in places where strength is required, and the wall thickness can be reduced in places where space is compact. The wall thickness can be further reduced in places where laser welding is required to achieve rapid melting.

[0026] 2) The support plate in this plate structure adopts the extrusion molding process, which can realize the structural design of high straight wall and thin-thickness ratio. It is especially suitable for retaining walls, which can effectively reduce the space waste caused by the draft angle and bottom rounded corners of the retaining wall.

[0027] 3) The support plate in this plate structure is made by extrusion, which can save 70% of the mold processing cycle compared with die casting and 50% of the mold processing cycle compared with stamping;

[0028] 4) The connection methods between the bushing and the PCB board, and between the bushing and the support plate in this board structure, compared with the screw-fixed PCB board solution, reduce the horizontal PCB component no-layout area by about 55% and the laser irradiation direction space by about 60%. Attached Figure Description

[0029] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein:

[0030] Figure 1 A structural schematic diagram of the plate structure provided for related technologies;

[0031] Figure 2 A structural schematic diagram of a stamping support plate provided for related technologies;

[0032] Figure 3 A structural schematic diagram of a die-casting support plate provided for related technologies;

[0033] Figure 4 A schematic diagram of a support plate with riveted metal sheets provided for related technologies;

[0034] Figure 5 This is a schematic diagram of the plate structure provided in an embodiment of the present utility model;

[0035] Figure 6 An exploded view of the plate structure provided in this embodiment of the utility model;

[0036] Figure 7 A schematic diagram of the structure of the support plate provided in an embodiment of this utility model;

[0037] Figure 8 A schematic diagram of the connection between the PCB board and the bushing provided in an embodiment of this utility model;

[0038] Figure 9 A schematic diagram of the structure of the bushing provided in the embodiment of this utility model.

[0039] Figure 10 A cross-sectional view of the bushing connection provided in an embodiment of this utility model.

[0040] Icon: 100 - Plate structure;

[0041] 11-PCB board; 111-Signal area; 112-Power area; 113-Pad; 114-Through hole;

[0042] 12-Support plate; 121-Retaining wall; 122-First plate; 123-Second plate;

[0043] 13-Bushing; 131-Groove. Detailed Implementation

[0044] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0045] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0046] Please refer to Figures 5-10 This utility model embodiment provides a board structure 100, which includes a PCB board 11 and a support plate 12. The PCB board 11 has a signal region 111 and a power region 112; the support plate 12 is connected to the PCB board 11, and a baffle 121 is arranged on its surface. The free end of the baffle 121 is close to or abuts against the PCB board 11 to disturb the magnetic flux distribution path on the PCB board 11 and isolate the signal region 111 and the power region 112; wherein, the support plate 12 is made by extrusion process.

[0047] It should be noted that the free end of the barrier 121 refers to the end of the barrier 121 that is close to the PCB board 11. Depending on the EMC shielding requirements, it can directly contact the PCB board 11, or it can achieve EMC shielding by contacting the elastic elements on the PCB board, or it can simply be close without contact.

[0048] It is worth noting that the support plate 12 in the plate structure 100 is manufactured using an extrusion process. Compared to die casting and stamping, it eliminates the need for draft angles, fillets, and other demolding structures, thus avoiding the limitations imposed by mold design on structural freedom and significantly improving the flexibility and customizability of the support plate 12 structure. Furthermore, the extrusion process reduces the mold processing cycle by 70% compared to die casting and by 50% compared to stamping. Therefore, it offers advantages such as a shorter processing cycle, which is beneficial for industrial manufacturing.

[0049] It is also worth noting that the support plate 12 in the plate structure 100 can easily realize structures with different wall thicknesses. The wall thickness can be increased in places where strength is required, and the wall thickness can be reduced in places where space is tight.

[0050] In some embodiments, the thickness of the retaining wall 121 is a, where a ≤ 1 mm.

[0051] It is worth noting that the thickness of the retaining wall 121 refers to the width of the retaining wall 121 in the horizontal plane. The thickness of the retaining wall 121 of the support plate 12, which is made by extrusion process, can be easily controlled to less than 1mm. This can effectively reduce the space waste caused by the draft angle and bottom rounded corner of the retaining wall 121, thereby improving the space utilization of the plate structure 100.

[0052] In some embodiments, the height of the retaining wall 121 is d, where d ≥ 3 mm.

[0053] It is worth noting that electromagnetic interference propagates spherically or fan-shaped in space. The barrier 121 structure can form a "screen"-like structure to block these paths. When the height of the barrier 121 increases, it is equivalent to increasing the blocking angle in the direction of noise propagation, thereby blocking or weakening the coupling path to a greater extent. Therefore, it is understandable that a height of 3mm or more for the barrier 121 can improve the isolation effect between the signal area 111 and the power area 112. In some special operating environments, the height of the barrier 121 can be further increased to 10mm or more to accommodate taller electrical components on the PCB board 11.

[0054] In some embodiments, a bushing 13 is also included, through which the PCB board 11 is connected to the support plate 12.

[0055] Optionally, a pad 113 is provided on one side surface of the PCB board 11, and the bushing 13 and the pad 113 are connected to each other by soldering.

[0056] It is worth noting that for PCB board 11 with electrical connection requirements, solder bushing 13 can achieve a smaller and more stable resistance value, solving the problem of significant fluctuation in contact resistance of screw connection under vibration or changes in ambient temperature.

[0057] It is also worth noting that the connection method between the bushing 13 and the PCB board 11 in the board structure 100, compared with the solution of fixing the PCB board 11 with screws, reduces the PCB device forbidden area by about 55% in the horizontal direction and reduces the space in the laser irradiation direction by about 60%.

[0058] In this embodiment, the contour of the soldering surface of the bushing 13 and the contour of the solder pad 113 are adapted to each other in shape, and the outer diameter of the soldering contour of the solder pad 113 is smaller than the outer diameter of the soldering surface contour of the bushing 13, so that the bushing 13 and the PCB board 11 can be aligned and positioned by the surface tension of the solder in the molten state.

[0059] It is worth noting that the bushing 13 and the PCB board 11 are positioned by utilizing the surface tension of molten solder. Compared with the positioning method of making a positioning structure on the bushing 13 and achieving hole-shaft mating with the PCB board 11, this simplifies the structure of the bushing 13, reduces the processing accuracy requirements of the bushing 13, and is conducive to industrial promotion and mass production.

[0060] Optionally, the contour of the welding surface of the bushing 13 and the contour of the pad 113 of the pad 113 are both circular.

[0061] Specifically, in its molten state, solder naturally tends to form symmetrical droplet shapes. The circular outline better matches the natural surface tension direction of the solder. This geometrically symmetrical arrangement allows the solder to have a stronger self-centering effect during cooling and solidification, thereby improving soldering positioning accuracy. At the same time, compared to irregularly shaped (such as rectangular, elliptical, or polygonal) pads 113, circular pads 113 are easier to control in terms of dimensional accuracy and machining alignment during PCB design and etching. The soldering surface of the bushing 13 is also easier to achieve a highly concentric circular surface through machining processes, reducing component manufacturing difficulty and cost.

[0062] In some embodiments, the bushing 13 and the support plate 12 are connected to each other by laser welding.

[0063] It is worth noting that the bushing 13 and the support plate 12 are connected by laser welding. This process can be carried out simultaneously with the surface mount soldering (tin soldering) of the bushing 13 and the PCB board 11, thereby reducing the production cycle.

[0064] Optionally, the PCB board 11 has through holes 114 on both the upper and lower sides, and the bushing 13 has a groove 131 that matches the through hole 114 so that the laser beam can act perpendicularly on the groove 131 to weld the bushing 13 to the support plate 12.

[0065] Specifically, the structural design of the bushing 13 allows welding to be achieved with only a single-axis laser welder, with low requirements for the degree of freedom of the welding equipment and low requirements for the tolerance of the weld point.

[0066] In some embodiments, the area of ​​the support plate 12 where the bushing 13 is welded is defined as the welding area (not shown in the figure), and the remaining area of ​​the support plate 12 is defined as the support area (not shown in the figure). The thickness of the welding area is less than the thickness of the support area. It can be understood that the welding area refers to the area of ​​the second plate 123 where the bushing 13 is welded.

[0067] It is worth noting that the extruded support plate 12 can achieve structures with different wall thicknesses: the wall thickness can be increased in places where strength is required, the wall thickness can be reduced in places where space is compact, and the wall thickness can be further reduced in places where laser welding is required to achieve rapid melting.

[0068] Please refer to this again. Figure 7 The support plate 12 has a first plate 122 and a second plate 123 with different heights. The retaining wall 121 is arranged in the first plate 122, and the bushing 13 is welded in the second plate 123. The distance between the first plate 122 and the PCB board 11 is greater than the distance between the second plate 123 and the PCB board 11.

[0069] It is worth noting that the smaller spacing between the second board 123 and the PCB board 11 allows for the use of a shorter bushing 13 structure, which is beneficial for laser focusing and improves welding accuracy and consistency, thereby enhancing the quality and reliability of laser welding. The larger spacing between the first board 122 and the PCB board 11 facilitates the placement of a taller baffle 121 structure in this area, achieving stronger isolation between the power area 112 and the signal area 111, effectively improving EMC (electromagnetic compatibility) performance and reducing the risk of electromagnetic interference. This structure features clear functional zoning, adaptable to various operating conditions. By setting board structures 100 of different heights, the support board 12 achieves regionalized distribution of connection and shielding functions, avoiding functional conflicts and facilitating modular design and manufacturing. Simultaneously, the design of different board heights makes the overall structure both compact and efficient, meeting the dual requirements of welding and EMC isolation without increasing the overall installation height, thus improving the overall integration.

[0070] In some embodiments, the bushing 13 may be a stamped bushing 13. It is understood that the stamped bushing 13 has the advantages of high processing efficiency, suitability for mass production, good finished product consistency, stable quality, high material utilization, and can reduce costs.

[0071] In some embodiments, the bushing 13 is made of steel. It is understood that, compared to other materials such as aluminum, copper, or plastic, the steel bushing 13 has the advantages of high mechanical strength, strong structural stability, good heat resistance, and suitability for welding processes.

[0072] In some embodiments, the support plate 12 may be made of aluminum, steel or injection-molded material doped with metal particles.

[0073] It is worth noting that the support plate 12 offers a high degree of material selection, adapting to diverse application scenarios. Different materials possess varying characteristics in terms of mechanical strength, thermal conductivity, weight, and processing methods, allowing for flexible selection based on factors such as the usage environment, electromagnetic compatibility requirements, and cost constraints, thereby enhancing the overall system's customization capabilities. Among these, aluminum offers the advantages of both lightweight and thermal conductivity, steel boasts high structural strength and rigidity, and injection molding materials doped with metal particles offer flexible molding options.

[0074] This utility model embodiment also discloses an inverter, including the plate structure 100 as described above, which has all its beneficial effects.

[0075] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

[0076] Throughout this description, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention may be practiced without one or more of these specific details or by other devices, systems, components, methods, parts, materials, components, etc. In other instances, well-known structures, materials, or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the present invention.

[0077] Throughout this specification, references to "an embodiment," "an embodiment," or "a specific embodiment" mean that a particular feature, structure, or characteristic described in connection with an embodiment is included in at least one embodiment of the present invention, but not necessarily in all embodiments. Therefore, the various representations of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. Furthermore, a particular feature, structure, or characteristic of any specific embodiment of the present invention can be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments of the present invention shown herein may be based on the teachings herein and will be considered part of the spirit and scope of the present invention.

[0078] It should also be understood that one or more of the elements shown in the figures may be implemented in a more separate or more integrated manner, or may even be removed because they are inoperable in certain circumstances or provided because they may be useful for a particular application.

[0079] Furthermore, unless otherwise expressly stated, any arrows in the accompanying drawings should be considered illustrative only and not limiting. Additionally, unless otherwise stated, the term "or" as used herein is generally intended to mean "and / or". Where a term is anticipated to provide a separation or combination capability that is unclear, a combination of components or steps will also be considered as indicated.

[0080] As used herein and throughout the claims below, unless otherwise specified, “a” and “the” include the plural references. Similarly, as used herein and throughout the claims below, unless otherwise specified, “in” means “in” and “on”.

[0081] The above description of the embodiments shown in this utility model (including the content in the abstract of the specification) is not intended to be an exhaustive enumeration or to limit the utility model to the precise forms disclosed herein. Although specific embodiments and examples of the utility model have been described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the utility model, as will be recognized and understood by those skilled in the art. As indicated, these modifications can be made to the utility model in accordance with the above description of the embodiments of the utility model, and such modifications will be within the spirit and scope of the utility model.

[0082] This document has generally described the systems and methods in detail to aid in understanding the present invention. Furthermore, various specific details have been set forth to provide a general understanding of embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention can be practiced without one or more specific details, or using other devices, systems, accessories, methods, components, materials, parts, etc. In other instances, well-known structures, materials, and / or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the present invention.

Claims

1. A plate structure, characterized in that, include: PCB board, which has signal area and power area; A support plate is connected to the PCB board, and a baffle is arranged on its surface. The free end of the baffle is close to or abuts the PCB board to disturb the magnetic flux distribution path on the PCB board and isolate the signal area from the power area. The support plate is manufactured using an extrusion process.

2. The plate structure according to claim 1, characterized in that, The thickness of the retaining wall is ,in, .

3. The plate structure according to claim 1, characterized in that, The height of the retaining wall is ,in, .

4. The plate structure according to claim 1, characterized in that, It also includes bushings, through which the PCB board is connected to the support plate.

5. The plate structure according to claim 4, characterized in that, The PCB board has a pad on one side surface, and the bushing and the pad are connected to each other by soldering.

6. The plate structure according to claim 5, characterized in that, The contour of the welding surface of the bushing is adapted to the contour of the pad in shape, and the outer diameter of the welding contour of the pad is smaller than the outer diameter of the welding surface contour of the bushing, so that the bushing and the PCB board can be aligned and positioned by the surface tension of the solder in the molten state.

7. The plate structure according to claim 6, characterized in that, The contour of the welding surface of the bushing and the contour of the solder pad are both circular.

8. The plate structure according to claim 4, characterized in that, The bushing and the support plate are connected to each other using a laser welding process.

9. The plate structure according to claim 8, characterized in that, The PCB board has through holes on both the top and bottom sides, and the bushing has grooves that are adapted to the through holes so that the laser beam can act perpendicularly on the grooves to weld the bushing to the support plate.

10. The plate structure according to claim 8, characterized in that, The area where the bushing is welded to the support plate is defined as the welding area, and the remaining area of ​​the support plate is defined as the support area. The thickness of the welding area is less than the thickness of the support area.

11. The plate structure according to claim 8, characterized in that, The support plate has a first plate and a second plate with different heights. The retaining wall is arranged in the first plate, and the bushing is welded in the second plate. The distance between the first plate and the PCB board is greater than the distance between the second plate and the PCB board.

12. The plate structure according to claim 4, characterized in that, The bushing is a stamped bushing.

13. The plate structure according to claim 4, characterized in that, The bushing is made of steel.

14. The plate structure according to claim 1, characterized in that, The support plate is made of aluminum, steel, or injection-molded material doped with metal particles.

15. An inverter, characterized in that, Includes the plate structure as described in any one of claims 1-14.

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