A third order HDI board

Abstract

The utility model relates to HDI board technical field especially three -step HDI board, including mainboard body, is set up in the mainboard body and is opened and has the perforation and the corner mouth, is equipped with the mounting plate below the mainboard body, the side of mainboard body is equipped with the steady clamping plate, is opened and has the through hole and the steady clamping mouth in the steady clamping plate, is equipped with the long rod in the through hole, is provided with the local external thread and the rotation pressure handle on the long rod, is opened and has the buckle groove on the rotation pressure handle, is equipped with the anti -loose elastic ring on the rotation pressure handle, is equipped with the joint rib in the corner mouth, is provided with the limiting rod on the joint rib, is equipped with the heat conduction strip on the steady clamping plate, is opened and has the heat dissipation groove on the heat conduction strip. Avoid the situation that the outside wall surface between the preset three sub -boards of mainboard body appears the board warping gap because of the heat stress existing in the inside of mainboard body after the multiple compression technology operation, avoid the related electronic components of preset welding of mainboard body lower extreme to appear the extrusion situation with mounting plate, has improved the heat dissipation of mainboard body itself.

Description

Technical Field

[0001] This utility model relates to the field of HDI board technology, and in particular to a three-stage HDI board. Background Technology

[0002] HDI boards, or High Density Interconnect Printed Circuit Boards, come in many types. Among them, the three-stage HDI board is widely used in motherboards for high-end servers, routers, switches, as well as professional medical and military equipment.

[0003] The main manufacturing process of a Tier 3 HDI board is as follows: The first stage involves material preparation, which involves cutting the copper-clad laminate into production dimensions. Then, the core board is mechanically drilled to form holes required for future lamination positioning and buried vias. Next, these mechanically drilled holes are metallized to achieve electrical connection. Then, the inner layer circuit pattern on the film is transferred to the copper-clad laminate through exposure and development. Finally, the copper foil of the non-circuit parts is etched away to form the inner layer circuit. In the second stage, the first lamination, the prepared core board is stacked together with the insulating dielectric layer (such as prepreg) and the outer copper foil. Then, it is fed into the press and pressed into a whole under high temperature and high pressure. Next, the first laser drilling is performed. Using a UV laser or CO2 laser, first-order micro blind holes connecting the outermost layer (L1) and the second outermost layer (L2) are drilled on the laminated board. Finally, the first blind hole metallization is performed. Through chemical copper plating and electroplating, copper is deposited in the blind holes to achieve the electrical connection from L1 to L2. In the third stage, a second lamination is performed. A new dielectric layer and copper foil are stacked on the board after the first lamination, and a second lamination is performed. Then, a second laser drilling is performed to drill second-order micro blind vias from the new outer layer (still L1) to the third layer (L3). The hole position of this drilling must be precisely aligned with the blind via drilled in the first stage, because its goal is to drill on the pads of the first blind via to form a "stacked via" structure. Finally, the steps of descaling, activation, and electroplating are repeated to metallize the second-order blind vias and realize the connection from L1 to L3. In the fourth stage, the third lamination is performed, where the outermost dielectric layer and copper foil are stacked and lamination is performed for the third time. Then, the third laser drilling is performed to drill three-dimensional micro-blind vias from the outermost layer (L1) to the fourth layer (L4). Similarly, these vias need to be precisely aligned with the second blind vias to form the final stacked via structure. Finally, the third blind via is metallized to complete the copper plating of the three-dimensional blind vias, achieving a direct connection from L1 to L4. At this point, all internal interconnections of the motherboard are completed, and the outer protective layer, i.e., surface protection treatment, can be made later.

[0004] Currently, in existing three-stage HDI boards, when the mainboard is manufactured and needs to be installed on the mounting board, thermal stress will exist inside the mainboard itself due to the multiple pressing processes, which will cause the outer wall of the three sub-boards of the mainboard to warp and gap.

[0005] Therefore, we designed a three-stage HDI board to meet the needs of practical applications. Utility Model Content

[0006] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a three-stage HDI board.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: Design a three-stage HDI board, including a main board body, on which through holes and corner openings are formed. A mounting plate is provided below the main board body, and a screw groove is formed on the mounting plate. A stabilizing clamp is fitted on the side of the main board body, and the stabilizing clamp has a through hole and a stabilizing opening. A long rod is inserted through the through hole, and the long rod is provided with a partial external thread and a turning handle. The turning handle has a retaining groove and an anti-loosening spring ring. The corner opening is provided with a connecting rib, the connecting rib is provided with a limit rod, and the limit rod is provided with a damping pad; The stabilizing plate is provided with a heat-conducting strip, and the heat-conducting strip has heat dissipation grooves. A heat-conducting layer is provided inside the stabilizing opening.

[0008] In detail, the front view of the stabilizing plate is a U-shaped structure, and the through hole vertically penetrates the stabilizing plate.

[0009] In detail, there are four stabilizing plates, which are securely clamped to the four side walls of the main body through stabilizing openings.

[0010] In detail, the corner openings are symmetrically arranged in four places at the four corners of the main body, the connecting ribs are symmetrically arranged in two places and fixed to the outer wall of the limiting rod, and the damping pad is provided on the lower end surface of the limiting rod.

[0011] In detail, the long rod passes vertically through the through hole and the perforation, and the long rod is connected to the threaded groove through a partial external thread.

[0012] In detail, the heat-conducting strip is a rectangular strip structure and is firmly set along the outer wall of the stabilizing plate. The heat dissipation groove is a long strip opening groove and there are thirty-two of them arranged horizontally. The heat-conducting layer is evenly set along the inner wall of the stabilizing plate.

[0013] In detail, the buckle groove is a V-shaped inner groove, and there are twelve buckle grooves arranged in a circle. The anti-loosening spring ring is sleeved on the long rod and fixedly installed on the lower end face of the pressure handle.

[0014] The design scheme proposed in this utility model has the following beneficial effects in application: 1. This utility model provides a stabilizing clamping plate structure with stabilizing jaws on the four sides of the main board body, along with matching long rod structures. Matching through holes are then made in the stabilizing clamping plates. When the main board body is manufactured and needs to be installed on the mounting plate, the four stabilizing clamping plates can be used to stably clamp the four sides of the main board body, and then the long rods can be used to securely install it onto the mounting plate. This effectively avoids the situation where the outer wall of the three pre-set sub-boards of the main board body warps due to the thermal stress inside the main board body itself caused by multiple pressing processes.

[0015] 2. This utility model features a partial external thread structure on the long rod and a corner opening on the main body, with a connecting rib having a limiting rod on the corner opening. When the main body is threadedly locked to the mounting plate through the partial external thread on the long rod, the lower end face of the limiting rod will stably limit and abut against the mounting plate, achieving an effective distance between the lower end face of the main body and the mounting plate, thus preventing the pre-welded electronic components at the lower end of the main body from being directly squeezed against the mounting plate.

[0016] 3. This utility model improves the heat dissipation of the motherboard body by setting a heat-conducting strip with heat dissipation grooves on the stabilizing clamp and setting a heat-conducting layer structure in the stabilizing clamp opening. Attached Figure Description

[0017] Figure 1 This is an exploded three-dimensional schematic diagram of the overall structure of this utility model; Figure 2 This is a three-dimensional schematic diagram of the overall structure of this utility model in its installed state; Figure 3 For the present utility model Figure 1 A first-person perspective three-dimensional schematic diagram of a stabilizing plate with heat dissipation grooves; Figure 4 For the present utility model Figure 1 A three-dimensional schematic diagram of the main board body with a limiting rod; Figure 5 For the present utility model Figure 2 A three-dimensional schematic diagram of a long rod with an anti-loosening spring ring in the middle; Figure 6 For the present utility model Figure 3 A second-view perspective three-dimensional schematic diagram of a stable clamping plate with a heat-conducting layer.

[0018] In the diagram: 1 Main body; 11 Through hole; 2 Corner opening; 21 Connecting rib; 22 Limiting rod; 23 Damping pad; 3 Long rod; 31 Partial external thread; 4 Turning handle; 41 Clip groove; 42 Anti-loosening spring ring; 5 Stabilizing plate; 51 Through hole; 6 Stabilizing clamp; 61 Heat-conducting layer; 7 Heat-conducting strip; 71 Heat dissipation groove; 8 Mounting plate; 81 Thread groove. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0020] Reference Figures 1-6 A three-stage HDI board includes a main board body 1, which has a through hole 11 and a corner opening 2. A mounting plate 8 is provided below the main board body 1, which has a screw groove 81. A stabilizing plate 5 is sleeved on the side of the main board body 1. The stabilizing plate 5 has a through hole 51 and a stabilizing opening 6. A long rod 3 is inserted through the through hole 51. The long rod 3 has a partial external thread 31 and a turning handle 4. The turning handle 4 has a buckle groove 41 and an anti-loosening spring ring 42. A connecting rib 21 is provided inside the corner opening 2, a limit rod 22 is provided on the connecting rib 21, and a damping pad 23 is provided on the limit rod 22. The stabilizing plate 5 is provided with a heat-conducting strip 7, and a heat dissipation groove 71 is provided on the heat-conducting strip 7. A heat-conducting layer 61 is provided inside the stabilizing opening 6. The mainboard body 1 described in this patent is a three-stage HDI board, which has been described in the background technology of this patent and is prior art.

[0021] It should be further noted that the front view of the stabilizing plate 5 is a U-shaped structure, and the through hole 51 vertically penetrates the stabilizing plate 5. The main body 1 and the stabilizing plate 5 are stably connected by the long rod 3 and the anti-loosening spring ring 42.

[0022] It should be further noted that there are four stabilizing plates 5. The stabilizing plates 5 are firmly clamped to the four side walls of the main body 1 through the stabilizing clamping holes 6, so as to avoid the situation where the outer wall of the three pre-set sub-plates of the main body 1 (the three sub-plates are their manufacturing process, which has been described in the background art and is the prior art) is warped due to the thermal stress inside the main body 1 itself after multiple pressing processes.

[0023] It should be further noted that four corner openings 2 are symmetrically arranged and opened at the four corners of the main body 1, and two connecting ribs 21 are symmetrically arranged and fixed to the outer wall of the limiting rod 22. Both the connecting ribs 21 and the limiting rod 22 are made of hard resin plastic, which is durable and has high strength, and can be bonded and fixed by epoxy resin glue.

[0024] The damping pad 23 is located on the lower end face of the limiting rod 22. The damping pad 23 is made of vulcanized rubber with a certain elasticity. Its body has damping and anti-slip properties to avoid damaging the mounting plate 8.

[0025] It should be further explained that the long rod 3 passes vertically through the through hole 51 and the through hole 11. The long rod 3 is threadedly connected to the screw groove 81 through the local external thread 31, which realizes a stable threaded installation connection between the main body 1 and the mounting plate 8.

[0026] It should be further explained that the heat-conducting strip 7 is a rectangular strip structure and is firmly set along the outer wall of the stabilizing plate 5. The heat-conducting strip 7 and the stabilizing plate 5 are made of engineering plastic with PPS polyphenylene sulfide as the matrix. PPS is resistant to chemical corrosion and high temperature flame retardant. Boron nitride powder (a hexagonal layered material composed of boron and nitrogen atoms with excellent thermal conductivity and high insulation) is used as a filler and is evenly dispersed in the PPS plastic matrix. The mixture is then mixed and manufactured into granules by a granulator. Later, it will be molded into the structure of the stabilizing plate 5 by a mold.

[0027] The heat dissipation slot 71 is a long strip-shaped open slot with thirty-two slots arranged horizontally, which further increases the effective heat dissipation area.

[0028] The thermally conductive layer 61 is uniformly arranged along the inner wall of the clamping opening 6. The thermally conductive layer 61 is a hard silicon nitride coating with excellent thermal conductivity and hardness. It is firmly bonded to the inner wall of the clamping opening 6 with epoxy resin adhesive with high thermal conductivity.

[0029] It should be further explained that the buckle groove 41 is a V-shaped inner groove, and there are twelve buckle grooves arranged in a circle. Fingers can directly hook into and rotate the long rod 3, which is very convenient.

[0030] The anti-loosening spring ring 42 is sleeved on the long rod 3 and fixedly installed on the lower end face of the turning handle 4. The anti-loosening spring ring 42 is made of polyurethane rubber, which has excellent high elasticity, wear resistance and durability. After the long rod 3 is threadedly locked into the screw groove 81, refer to Figure 2 At this time, the anti-loosening spring ring 42 will be squeezed by the stabilizing clamp 5 and the turning handle 4. After being squeezed, the anti-loosening spring ring 42 will generate a vertical rebound force. When this vertical rebound force acts on the local external thread 31, it improves the thread anti-loosening effect between the local external thread 31 and the thread groove 81.

[0031] Working method: When the main board 1 is completed and needs to be installed on the mounting plate 8, the four stabilizing plates 5 are first placed on the four sides of the main board 1 through the stabilizing holes 6. Then, the long rod 3 is vertically passed through the through hole 51 and the through hole 11. Next, the fingers are inserted into the locking groove 41 and rotated clockwise, which drives the long rod 3 to rotate clockwise. The local external thread 31 is then threaded and locked with the matching thread groove 81, which effectively and stably clamps the four sides of the main board 1. This avoids the situation where the outer wall of the three pre-set sub-plates of the main board 1 (the three sub-plates are their manufacturing process, which has been described in the background art and is existing technology) warps due to the thermal stress inside the main board 1 itself after multiple pressing processes.

[0032] Furthermore, when the motherboard body 1 is threaded and locked to the screw groove 81 on the mounting plate 8 via the partial external thread 31 on the long rod 3, the damping pads 23 on the lower end face of the four limiting rods 22 will stably limit and hold against the upper end face of the mounting plate 8, thereby achieving an effective distance between the lower end face of the motherboard body 1 and the mounting plate 8, and preventing the relevant electronic components pre-welded to the lower end of the motherboard body 1 from being directly squeezed against the mounting plate 8.

[0033] In addition, when the stabilizing plate 5 is clamped on the motherboard body 1, the motherboard body 1 will generate heat when it is powered on. Some of the heat will be quickly transferred to the outside through the heat conduction layer 61 and the heat conduction strip 7, and finally dissipated to the outside through each heat sink 71, which further improves the heat dissipation of the motherboard body 1 itself.

[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A three-stage HDI board, comprising a main board body (1), characterized in that: The main body (1) has a through hole (11) and a corner opening (2). The main body (1) has a mounting plate (8) at its bottom. The mounting plate (8) has a screw groove (81). The main body (1) has a stabilizing plate (5) on its side. The stabilizing plate (5) has a through hole (51) and a stabilizing opening (6). A long rod (3) is inserted through the through hole (51). The long rod (3) has a partial external thread (31) and a turning handle (4). The turning handle (4) has a buckle groove (41) and an anti-loosening spring ring (42). The corner opening (2) is provided with a connecting rib (21), a limit rod (22) is provided on the connecting rib (21), and a damping pad (23) is provided on the limit rod (22). The stabilizing plate (5) is provided with a heat-conducting strip (7), and the heat-conducting strip (7) is provided with a heat dissipation groove (71). The stabilizing opening (6) is provided with a heat-conducting layer (61).

2. A three-stage HDI board according to claim 1, characterized in that: The front view of the stabilizing plate (5) is a U-shaped structure, and the through hole (51) vertically penetrates the stabilizing plate (5).

3. A third-order HDI board according to claim 1, characterized in that: The number of the stabilizing plates (5) is four, and the stabilizing plates (5) are firmly clamped to the four side walls of the main body (1) through the stabilizing openings (6).

4. A three-stage HDI board according to claim 1, characterized in that: The corner openings (2) are symmetrically arranged in four places and opened at the four corners of the main body (1). The connecting ribs (21) are symmetrically arranged in two places and fixedly installed on the outer wall of the limiting rod (22). The damping pad (23) is located on the lower end surface of the limiting rod (22).

5. A three-stage HDI board according to claim 1, characterized in that: The long rod (3) passes vertically through the through hole (51) and the through hole (11), and the long rod (3) is threadedly connected to the threaded groove (81) through the local external thread (31).

6. A three-stage HDI board according to claim 1, characterized in that: The heat-conducting strip (7) is a rectangular strip structure and is securely set along the outer wall of the stabilizing plate (5). The heat dissipation groove (71) is a long strip opening groove and there are thirty-two of them arranged horizontally. The heat-conducting layer (61) is evenly set along the inner wall of the stabilizing opening (6).

7. A three-stage HDI board according to claim 1, characterized in that: The buckle groove (41) is a V-shaped inner groove, and there are twelve buckle grooves arranged in a circle. The anti-loosening spring ring (42) is sleeved on the long rod (3) and fixedly installed on the lower end face of the rotating handle (4).

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