Motor controller structure and vehicle

Abstract

The application provides a motor controller structure and a vehicle, and relates to the technical field of motor control. The motor controller structure comprises: an electric control shell; an electric control drive board comprising an electric control mounting substrate and an electric drive connection port, the electric drive connection port being mounted on the electric control mounting substrate, and the electric control mounting substrate being mounted on the electric control shell; a bus capacitor mechanism, the bus capacitor mechanism being mounted on the electric control drive board; and a gallium nitride power module, the gallium nitride power module being mounted between the electric control mounting substrate and the electric control shell, and the gallium nitride power module being connected with the bus capacitor mechanism and the electric drive connection port respectively. The motor controller structure can achieve the technical effects of reducing the volume and improving the power density.

Description

Technical Field

[0001] This application relates to the field of motor control technology, and more specifically, to a motor controller structure and a vehicle. Background Technology

[0002] In existing technologies, the most widely used inverter circuit in motor controllers is the Si-based IGBT (Insulated-Gate Bipolar Transistor) inverter, which converts DC to AC. IGBT technology has been in mass production for a long time, has low cost per unit power, and possesses good thermal stability and reliability. However, due to the minority carrier storage effect of IGBTs, their switching speed is slow (turn-off time of hundreds of nanoseconds), and switching losses (turn-on / turn-off losses) increase sharply at high frequencies, leading to a decrease in the overall efficiency of the inverter. Moreover, the IGBT chip structure is complex, resulting in large size and low power density. Utility Model Content

[0003] The purpose of this application is to provide a motor controller structure and vehicle that can achieve the technical effects of reducing size and increasing power density.

[0004] In a first aspect, this application provides a motor controller structure, including: Electrical control housing; An electronic control drive board includes an electronic control mounting base plate and an electronic drive connection port, wherein the electronic drive connection port is mounted on the electronic control mounting base plate, and the electronic control mounting base plate is mounted on the electronic control housing; Bus capacitor mechanism, the bus capacitor mechanism is mounted on the electronic control drive board; A gallium nitride (GaN) power module is installed between the electronic control mounting substrate and the electronic control housing, and the GaN power module is connected to the bus capacitor mechanism and the electric drive connection port, respectively.

[0005] In the above implementation process, an electronic control drive board, bus capacitor mechanism, and gallium nitride (GaN) power module are installed in an electronic control housing. The GaN power module, as the core module of the inverter circuit, includes multiple GaN switch chips. The material properties of GaN solve the bottleneck of traditional silicon (Si) devices in high-frequency, high-voltage, and high-efficiency scenarios. Due to the high bandgap and high breakdown electric field of GaN, the same high voltage can be achieved with a thinner drift region, avoiding the increase in resistance caused by thicker layers. The chip size is smaller, and the electron mobility is 2-2.5 times that of silicon-based switch chips, which makes the GaN switch chips turn on faster and with less loss. Thus, this motor controller structure can achieve the technical effects of reducing size and increasing power density.

[0006] Furthermore, the gallium nitride power module includes a power mounting substrate, a plurality of gallium nitride switch chips, and a plurality of positive and negative input ports. The plurality of gallium nitride switch chips are mounted on the power mounting substrate, and the plurality of positive and negative input ports are arranged sequentially along the side of the power mounting substrate.

[0007] In the above implementation process, multiple positive and negative input ports are arranged sequentially along the side of the power mounting substrate to optimize the chip layout of the gallium nitride switch chip.

[0008] Furthermore, the bus capacitor mechanism includes a bus capacitor body and multiple positive and negative capacitor ports, the multiple positive and negative capacitor ports being matched with the multiple positive and negative input ports, and the bus capacitor body being connected to the multiple gallium nitride switching chips through the multiple positive and negative capacitor ports.

[0009] In the above implementation process, multiple positive and negative capacitor ports are matched and connected to the positive and negative terminals of the DC power supply. This allows the bus capacitor mechanism and gallium nitride switching chip to be connected to the DC power supply through the multiple positive and negative capacitor ports and the multiple positive and negative input ports, thus optimizing the connection structure.

[0010] Furthermore, the outer side of the electronic control housing is provided with multiple connection terminals, and the multiple positive and negative input ports are connected to the corresponding connection terminals.

[0011] In the above implementation process, when the bus capacitor mechanism is installed inside the electrical control housing, multiple positive and negative input ports are connected to the DC power supply through the connection terminals of the electrical control housing.

[0012] Furthermore, the electronic control drive board also includes a magnetic ring mechanism, which is mounted on the electronic control mounting base plate and is matched with the bus capacitor mechanism.

[0013] In the above implementation process, by setting the magnetic ring mechanism on the electronic control drive board, the high-frequency noise generated by the bus capacitor mechanism can be effectively absorbed and filtered out. It can also increase the impedance of the high-frequency oscillation path, effectively damping and suppressing ringing, making the drive waveform cleaner and steeper.

[0014] Furthermore, the bus capacitor mechanism also includes a temperature detection connection line, one end of which is disposed on the bus capacitor body, and the other end of which is connected to the electronic control drive board.

[0015] In the above implementation process, the temperature detection connection line is installed on the bus capacitor body. The temperature of the bus capacitor body can be detected through the temperature detection connection line, so as to avoid the bus capacitor body overheating and burning out various electronic components of the electronic control drive board.

[0016] Furthermore, the motor controller structure also includes an AC assembly, which is installed between the gallium nitride power module and the electronic control housing.

[0017] In the above implementation process, the AC assembly is equipped with electronic components such as AC output interface, current sensor and drive and protection circuit to ensure the normal operation of the motor controller structure.

[0018] Furthermore, the motor controller structure also includes an electrical control cover plate, which is matched with the electrical control housing, and the electrical control drive board, the bus capacitor mechanism and the gallium nitride power module are installed between the electrical control cover plate and the electrical control housing.

[0019] In the above implementation process, an internal space is formed between the electric control cover plate and the electric control housing, thereby installing the electric control drive board, bus capacitor mechanism and gallium nitride power module in the internal space between the electric control cover plate and the electric control housing, so that the motor controller mechanism is integrated into a whole structure, while ensuring the normal operation of the electric control drive board, bus capacitor mechanism and gallium nitride power module.

[0020] Furthermore, the motor controller structure also includes a module sealing ring, which is matched and configured to fit the gallium nitride power module.

[0021] In the above implementation process, the module sealing ring is matched with the gallium nitride power module to form a sealed structure, which can play a dustproof role and better ensure the normal operation of the electronic control drive board and related devices.

[0022] Secondly, this application provides a vehicle including the motor controller structure described in any one of the first aspects.

[0023] Other features and advantages disclosed in this application will be set forth in the following description, or some features and advantages may be inferred from the description or determined without doubt, or may be learned by practicing the above-described technology disclosed in this application.

[0024] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0025] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of a motor controller structure provided in an embodiment of this application; Figure 2 This is a schematic diagram of the structure of a gallium nitride power module provided in an embodiment of this application; Figure 3 This is a schematic diagram of the bus capacitor mechanism provided in an embodiment of this application.

[0027] Reference numerals: 100 for electrical control housing; 200 for electrical control drive board; 210 for electrical control mounting base plate; 300 for bus capacitor mechanism; 310 for bus capacitor body; 320 for positive and negative capacitor ports; 330 for temperature detection connection line; 400 for gallium nitride power module; 410 for power mounting base plate; 420 for gallium nitride switch chip; 430 for positive and negative input ports; 500 for AC assembly; 600 for electrical control cover plate. Detailed Implementation

[0028] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely represents selected embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0029] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0030] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0031] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or a point connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0032] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0033] Generally, the most widely used inverters in motor controllers are Si-based IGBT (Insulated-Gate Bipolar Transistor) inverters, which convert DC to AC. IGBT technology has been in mass production for a long time, has low cost per unit power, and possesses good thermal stability and reliability. However, due to the minority carrier storage effect of IGBTs, their switching speed is slow (turn-off time of hundreds of nanoseconds), and switching losses (turn-on / turn-off losses) increase sharply at high frequencies, leading to a decrease in the overall efficiency of the inverter. Moreover, the IGBT chip structure is complex, resulting in large size and low power density.

[0034] To address the aforementioned technical problems, this application provides a motor controller structure and a vehicle. The motor controller mounts an electronic control drive board, a bus capacitor mechanism, and a gallium nitride (GaN) power module within an electronic control housing. The GaN power module, serving as the core module of the inverter circuit, includes multiple GaN switching chips. The material properties of GaN overcome the bottlenecks of traditional silicon (Si) devices in high-frequency, high-voltage, and high-efficiency scenarios. Due to GaN's high bandgap and high breakdown electric field, the same high voltage can be achieved with a thinner drift region, avoiding increased resistance caused by thicker layers. This results in a smaller chip size, and GaN's electron mobility is 2-2.5 times that of silicon-based switching chips, leading to faster turn-on speeds and lower losses. Therefore, this motor controller structure achieves the technical effects of reducing size and increasing power density.

[0035] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of a motor controller structure provided in an embodiment of this application. Figure 2 This is a schematic diagram of the structure of a gallium nitride power module provided in an embodiment of this application. Figure 3This is a schematic diagram of the bus capacitor mechanism provided in an embodiment of this application; the motor controller structure includes: Electrical control housing 100; The electronic control drive board 200 includes an electronic control mounting base plate 210 and an electronic drive connection port. The electronic drive connection port is mounted on the electronic control mounting base plate 210, and the electronic control mounting base plate 210 is mounted on the electronic control housing 100. Bus capacitor mechanism 300, the bus capacitor mechanism 300 is mounted on the electric control drive board 200; Gallium nitride power module 400 is installed between the electronic control mounting base plate 210 and the electronic control housing 100. Gallium nitride power module 400 is connected to bus capacitor mechanism 300 and electric drive connection port 220 respectively.

[0036] For example, the electrical control housing 100 may be an insulating engineering plastic or composite material, such as ABS (Acrylonitrile Butadiene Styrene) plastic, polycarbonate, PBT (Polybutylene terephthalate) material, glass fiber reinforced plastic, etc., which are only examples and not limitations. The surface of the electronic control housing can be provided with multiple connection ports for connecting multiple signal / power ports of the electronic control drive board 200, bus capacitor mechanism 300, and gallium nitride power module 400, such as signal terminals and power terminals.

[0037] For example, the electronic control mounting substrate 210 in the electronic control drive board 200 is matched and installed with the electronic control housing 100, wherein the electronic control mounting substrate 210 is provided with an electric drive connection port, through which the power terminals and / or signal terminals of the gallium nitride power module are connected.

[0038] For example, the bus capacitor mechanism 300 is mounted on the electronic control drive board 200; by setting the bus capacitor mechanism 300, low impedance energy buffering can be provided, DC bus voltage can be stabilized, high frequency noise and ripple current can be absorbed, and interference from the power supply side can be filtered out. Generally, the low equivalent series inductance of the bus capacitor provides a low-impedance bypass path for these high-frequency switching currents and noise, allowing them to circulate locally without returning to the power supply or other parts of the system. In addition, the bus capacitor can filter out these lower-frequency interferences from the power supply side, ensuring a clean DC voltage is provided to the inverter bridge (GaN Power Module 400).

[0039] For example, the gallium nitride power module 400 includes multiple gallium nitride power chips, and the inverter circuit composed of multiple gallium nitride power chips realizes the corresponding functions. The core of the gallium nitride power chip is to solve the bottleneck of traditional silicon (Si) devices in high frequency, high voltage and high efficiency scenarios by leveraging the material properties of gallium nitride. Gallium nitride has a high bandgap and a high breakdown electric field, which allows the same high voltage to be achieved with a thinner drift region, avoiding the increase in resistance caused by thick layers, realizing chip miniaturization, and making the turn-on speed of gallium nitride faster and the loss lower than that of silicon-based devices.

[0040] The motor controller provided in this application embodiment mounts an electronic control drive board 200, a bus capacitor mechanism 300, and a gallium nitride (GaN) power module 400 within an electronic control housing 100. The GaN power module 400, as the core module of the inverter circuit, includes multiple GaN switching chips. By leveraging the material properties of GaN, it overcomes the bottlenecks of traditional silicon (Si) devices in high-frequency, high-voltage, and high-efficiency scenarios. Due to GaN's high bandgap and high breakdown electric field, the same high voltage can be achieved with a thinner drift region, avoiding the increased resistance caused by thicker layers. This results in a smaller chip size, and the electron mobility is 2-2.5 times that of silicon-based switching chips, enabling faster turn-on speeds and lower losses for GaN switching chips. Thus, this motor controller structure achieves the technical effects of reducing size and increasing power density.

[0041] In some embodiments, the gallium nitride power module 400 includes a power mounting substrate 410, a plurality of gallium nitride switch chips 420 and a plurality of positive and negative input ports 430, wherein the plurality of gallium nitride switch chips 420 are mounted on the power mounting substrate 410 and the plurality of positive and negative input ports 430 are arranged sequentially along the side of the power mounting substrate 410.

[0042] For example, multiple positive and negative input ports 430 are arranged sequentially along the side of the power mounting substrate 410 to optimize the chip layout of the gallium nitride switch chip 420.

[0043] In some implementations, since the gallium nitride power chip 420 is a planar device, both the drain and source terminals of the gallium nitride power chip 420 need to be bonded. Therefore, in order to optimize the chip layout, the positive and negative terminals of the module input terminal are swapped with those of the standard packaged DC6I module.

[0044] For example, the standard packaged DC6i module refers to the standardized package form defined and promoted by Infineon Technologies for medium-to-high power IGBT modules, which specifies the module's external dimensions, pin (terminal) layout, mechanical structure, and mounting method. Among them, the DC6i package of the IGBT module is an industry-standard module shell optimized for medium-to-high power applications. Its core value lies in achieving high power density, high efficiency, and extremely high reliability through low inductance design, double-sided heat dissipation, and PressFIT bonding technology, making it one of the preferred power module packages in modern electric vehicles and high-end industrial drive fields.

[0045] In some embodiments, the bus capacitor mechanism 300 includes a bus capacitor body 310 and a plurality of positive and negative capacitor ports 320, the plurality of positive and negative capacitor ports 320 being matched with a plurality of positive and negative input ports 430, and the bus capacitor body 310 being connected to a plurality of gallium nitride switch chips 420 through the plurality of positive and negative capacitor ports 320.

[0046] For example, multiple positive and negative capacitor ports 320 are matched with multiple positive and negative input ports 430 and are connected to the positive and negative terminals of the DC power supply. This allows the bus capacitor mechanism 300 and the gallium nitride switch chip 420 to be connected to the DC power supply through the multiple positive and negative capacitor ports 320 and the multiple positive and negative input ports 430, thus optimizing the connection structure.

[0047] In some embodiments, the outer side of the electronic control housing 100 is provided with multiple connection terminals, and multiple positive and negative input ports 430 are connected to the corresponding connection terminals.

[0048] For example, when the bus capacitor mechanism 300 is installed inside the electrical control housing 100, multiple positive and negative input ports 430 are connected to a DC power supply through the connection terminals of the electrical control housing 100.

[0049] In some embodiments, the electronic control drive board 200 further includes a magnetic ring mechanism 110, which is mounted on the electronic control mounting base plate 210 and is matched with the bus capacitor mechanism 300.

[0050] For example, by setting the magnetic ring mechanism 110 on the electronic control drive board 200, the high-frequency noise generated by the bus capacitor mechanism 300 can be effectively absorbed and filtered out. It can also increase the impedance of the high-frequency oscillation path, effectively damping and suppressing ringing, making the drive waveform cleaner and steeper.

[0051] In some embodiments, the bus capacitor mechanism 300 further includes a temperature detection connection line 330, one end of which is disposed on the bus capacitor body 310, and the other end of which is connected to the electronic control drive board 200.

[0052] For example, by installing the temperature detection connection 330 on the bus capacitor body 310, the temperature of the bus capacitor body 310 can be detected through the temperature detection connection 330, so as to prevent the bus capacitor body 310 from overheating and burning out various electronic components of the electronic control drive board 200.

[0053] In some embodiments, the motor controller structure also includes an AC assembly 500, which is mounted between the gallium nitride power module 400 and the control housing 100.

[0054] For example, the AC assembly 500 is equipped with electronic components such as an AC output interface, a current sensor, and drive and protection circuits to ensure the normal operation of the motor controller structure; wherein: AC output interface: used for power transmission and connection, efficiently and reliably delivering the generated three-phase AC power to the drive motor, including AC copper busbars, three-phase terminals / connectors, etc. Current sensor: Used for real-time current monitoring, accurately detecting the three-phase AC current flowing to the motor, providing key feedback signals for the control algorithm, and realizing precise torque control; Drive and protection circuits: the "commander" and "bodyguard" of the gallium nitride power module: amplify the weak current control signals of the microcontroller to drive the power devices in the gallium nitride power module and provide fast protection against overcurrent, short circuit and other hazards.

[0055] In some embodiments, the motor controller structure further includes an electrical control cover plate 600, which is matched with the electrical control housing 100, and the electrical control drive board 200, the bus capacitor mechanism 300 and the gallium nitride power module 400 are installed between the electrical control cover plate 600 and the electrical control housing 100.

[0056] For example, an internal space is formed between the electronic control cover plate 600 and the electronic control housing 100, thereby installing the electronic control drive board 200, the bus capacitor mechanism 300 and the gallium nitride power module 400 in the internal space between the electronic control cover plate 600 and the electronic control housing 100, so that the motor controller mechanism forms an integral structure, while ensuring the normal operation of the electronic control drive board 200, the bus capacitor mechanism 300 and the gallium nitride power module 400.

[0057] In some embodiments, the motor controller structure also includes a module seal ring that is matched with the gallium nitride power module 400.

[0058] For example, by matching the module sealing ring with the gallium nitride power module 400 to form a sealed structure, the gallium nitride power module 400 can achieve a dustproof effect and better ensure the normal operation of the electronic control drive board 200 and related devices.

[0059] Exemplary, embodiments of this application provide a vehicle, including Figures 1 to 3 The motor controller structure is shown.

[0060] In some implementation scenarios, the motor controller structure provided in this application is a motor controller with a gallium nitride (GaN) power module as the inverter bridge. The core is to solve the bottleneck of traditional silicon (Si) devices in high-frequency, high-voltage, and high-efficiency scenarios by leveraging the material properties of gallium nitride. Among them, gallium nitride has a high bandgap and a high breakdown electric field, which allows the same high voltage to be achieved with a thinner drift region, avoiding the increase in resistance caused by thicker layers and enabling chip miniaturization. Its electron mobility is 2-2.5 times that of Si, which makes GaN turn-on faster and with lower losses. Optionally, since gallium nitride power chips are planar devices, both the drain and source of gallium nitride power chips need to be bonded with bonding wires. Therefore, in order to optimize the chip layout, the positive and negative terminals of the input terminals of the gallium nitride power module are swapped with those of the standard packaged DC6I module. To adapt to the gallium nitride module, the positive and negative terminals of the capacitors are swapped.

[0061] The motor controller structure provided in this application embodiment realizes an inverter based on gallium nitride, and has at least the following beneficial effects: Gallium nitride power modules have fast switching speeds and low on-resistance; low switching losses (turn-on / turn-off losses) and high motor controller efficiency. Using gallium nitride chips, which have higher thermal conductivity than IGBTs, and combined with silver sintering technology, the overall system's heat dissipation and conductivity are improved. The chip is small in size, and through optimization of chip layout and bonding process, the current carrying capacity of the module is improved, the volume is reduced, and the power density of the electrode controller is increased.

[0062] In some implementation scenarios, the motor controller structure provided in this application embodiment can also be applied to photovoltaic power generation, energy storage, and other power scenarios involving DC to AC conversion.

[0063] It should be understood that the phrases "in this embodiment," "in this application embodiment," or "as an optional implementation" throughout the specification mean that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this application. Therefore, the phrases "in this embodiment," "in this application embodiment," or "as an optional implementation" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Those skilled in the art should also understand that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to this application.

[0064] In the various embodiments of this application, it should be understood that the sequence number of each process does not necessarily imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0065] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims.

Claims

1. A motor controller structure, characterized in that, include: Electrical control housing; An electronic control drive board includes an electronic control mounting base plate and an electronic drive connection port, wherein the electronic drive connection port is mounted on the electronic control mounting base plate, and the electronic control mounting base plate is mounted on the electronic control housing; Bus capacitor mechanism, the bus capacitor mechanism is mounted on the electronic control drive board; A gallium nitride (GaN) power module is installed between the electronic control mounting substrate and the electronic control housing, and the GaN power module is connected to the bus capacitor mechanism and the electric drive connection port, respectively.

2. The motor controller structure according to claim 1, characterized in that, The gallium nitride power module includes a power mounting substrate, multiple gallium nitride switch chips, and multiple positive and negative input ports. The multiple gallium nitride switch chips are mounted on the power mounting substrate, and the multiple positive and negative input ports are arranged sequentially along the side of the power mounting substrate.

3. The motor controller structure according to claim 2, characterized in that, The bus capacitor mechanism includes a bus capacitor body and multiple positive and negative capacitor ports. The multiple positive and negative capacitor ports are matched with multiple positive and negative input ports. The bus capacitor body is connected to the multiple gallium nitride switch chips through the multiple positive and negative capacitor ports.

4. The motor controller structure according to claim 2 or 3, characterized in that, Multiple connection terminals are provided on the outside of the electrical control housing, and the multiple positive and negative input ports are connected to the corresponding connection terminals.

5. The motor controller structure according to claim 1, characterized in that, The electronic control drive board also includes a magnetic ring mechanism, which is mounted on the electronic control mounting base plate and is matched with the bus capacitor mechanism.

6. The motor controller structure according to claim 1, characterized in that, The bus capacitor mechanism also includes a temperature detection connection line, one end of which is disposed in the bus capacitor mechanism and the other end of which is connected to the electronic control drive board.

7. The motor controller structure according to claim 1, characterized in that, The motor controller structure also includes an AC assembly, which is installed between the gallium nitride power module and the electronic control housing.

8. The motor controller structure according to claim 1, characterized in that, The motor controller structure also includes an electrical control cover plate, which is matched with the electrical control housing, and the electrical control drive board, the bus capacitor mechanism and the gallium nitride power module are installed between the electrical control cover plate and the electrical control housing.

9. The motor controller structure according to claim 1, characterized in that, The motor controller structure also includes a module sealing ring, which is matched and configured to match the gallium nitride power module.

10. A vehicle, characterized in that, The motor controller structure includes any one of claims 1 to 9.

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