A vehicle-mounted domain controller

Abstract

The utility model relates to a kind of vehicle-mounted field controllers, including liquid cooling bottom cover assembly, the upper cover of lid is set on the liquid cooling bottom cover assembly, and PCBA is installed between the liquid cooling bottom cover assembly and the upper cover, the liquid cooling bottom cover assembly includes liquid cooling bottom cover, the side of the liquid cooling bottom cover towards PCBA is provided with cavity, the edge of PCBA is isolated and fixed on the side wall of the cavity, heating element on the PCBA is contacted with the bottom of the cavity, the bottom of the cavity is provided with drainage structure for draining condensation. The vehicle-mounted field controller designed in the utility model can avoid condensation droplets falling on the surface of PCBA, reducing the risk of PCBA failure.

Description

Technical Field

[0001] This utility model relates to the field of vehicle technology, and in particular to an on-board domain controller. Background Technology

[0002] With the development of the automotive industry, new energy vehicles equipped with intelligent driving assistance functions are gradually gaining market favor. To achieve advanced intelligent driving assistance functions, vehicles rely on multiple sensors to provide environmental information about the vehicle's surroundings. Processing sensor information requires high computing power from the intelligent driving domain controller, which leads to high energy consumption and generates a significant amount of heat during operation. Therefore, heat dissipation for the core processing chip within the intelligent driving domain controller is essential. Currently, most types of domain controllers achieve liquid cooling by adding flow channels to the top cover. The main structure includes a liquid-cooled top cover, a PCBA, and a bottom cover. The PCBA contacts the liquid-cooled top cover via a heat-conducting medium, transferring heat generated by the heat-generating components on the PCBA to the liquid-cooled top cover for heat dissipation. However, due to the extremely high heat exchange efficiency between the coolant and the liquid-cooled top cover, the temperature of the liquid-cooled top cover closely follows the fluctuations in coolant temperature. When the coolant temperature is significantly lower than the internal ambient temperature of the domain controller, condensation may form on the surface of the liquid-cooled top cover. If this condensation drips onto the PCBA surface, it may cause a short circuit, ultimately leading to PCBA failure. Utility Model Content

[0003] To address the aforementioned problems, the purpose of this invention is to design an in-vehicle domain controller that can prevent condensation from dripping onto the PCBA surface and reduce the risk of PCBA failure.

[0004] The objective of this utility model is achieved through the following technical solution: Design an in-vehicle domain controller, including a liquid-cooled bottom cover assembly, an upper cover covering the liquid-cooled bottom cover assembly, and a PCBA installed between the liquid-cooled bottom cover assembly and the upper cover. The liquid-cooled bottom cover assembly includes a liquid-cooled bottom cover, and a cavity is provided on the side of the liquid-cooled bottom cover facing the PCBA. The edge of the PCBA is isolated and fixed to the side wall of the cavity. The heating element on the PCBA is in contact with the bottom of the cavity. The bottom of the cavity is provided with a drainage structure for draining condensation.

[0005] In this design, the liquid-cooled bottom cover is a fixed end. When the domain controller is installed on the vehicle, the PCBA is located above the liquid-cooled bottom cover. The domain controller's liquid cooling system is integrated on the liquid-cooled bottom cover, not on the top cover. Therefore, in humid environments, the temperature of the liquid-cooled bottom cover decreases with the coolant. When the temperature is below ambient temperature, condensation forms on the liquid-cooled bottom cover, not on the top cover. The condensation accumulates within the cavity of the liquid-cooled bottom cover and is drained through the drainage structure at the bottom of the cavity, preventing liquid residue from causing short-circuit failure of the PCBA. Furthermore, to reduce the heat exchange efficiency between the liquid-cooled bottom cover and the top cover via the PCBA, which could cause the top cover temperature to drop below ambient temperature, the edges of the PCBA are fixed to the side walls of the cavity. This reduces the contact between the PCBA edges and the cavity side walls, minimizing the heat transfer path between the liquid-cooled bottom cover and the top cover, thus preventing condensation from dripping onto the PCBA from the top cover.

[0006] Furthermore, the drainage structure includes a drainage ramp and a drainage hole disposed at the bottom of the cavity, the drainage hole being located at the lowest point of the drainage ramp.

[0007] In this design, a drainage slope is incorporated at the bottom of the cavity. Gravity allows condensation or accumulated water to naturally converge at the lowest point, preventing irregular liquid residue at the bottom. The drain hole is located at the lowest point of the slope, ensuring that all collected liquid is discharged through the hole, thus avoiding the risk of short circuits caused by localized water accumulation.

[0008] Furthermore, a heat dissipation boss is provided at the bottom of the cavity, and the heat-generating element on the PCBA is in contact with the heat dissipation boss. The drainage slope and drainage hole are located between the heat dissipation boss and the side wall of the cavity.

[0009] In this design, the heat dissipation boss contacts the heat-generating components on the PCBA, such as chips and power devices. This allows the heat generated by these components to be quickly conducted to the liquid-cooled bottom cover. The structure of the heat dissipation boss can be customized according to the heat source distribution of the PCBA, such as localized elevation or array-style bosses, ensuring precise contact with high-heat areas. Simultaneously, the heat dissipation boss is integrally molded with the bottom of the cavity, reducing intermediate heat transfer links and improving overall heat dissipation uniformity. Drainage slopes and drainage holes are located between the heat dissipation boss and the cavity sidewall, forming a drainage structure. The heat dissipation boss can be centrally positioned, with the drainage path located at the edge, utilizing the corner space of the cavity to create drainage channels without requiring additional internal volume in the controller.

[0010] Furthermore, the heat dissipation boss is covered with a thermally conductive medium, which is in contact with the heat-generating elements on the PCBA.

[0011] In this solution, the thermal conductive medium can be thermally conductive gel or thermally conductive pad, which can fill the microscopic gap between the heat dissipation protrusion and the heat-generating element, avoid the increase in thermal resistance caused by air retention, and significantly improve the heat conduction efficiency from the element to the liquid cooling bottom cover.

[0012] Furthermore, the sidewall of the cavity is provided with an isolation pad, and the edge of the PCBA is isolated from the top of the sidewall of the cavity through the isolation pad.

[0013] In this solution, the isolation gasket is made of a material with low thermal conductivity, such as polyetheretherketone (PEEK) or silicone rubber. The isolation gasket is placed between the side wall of the cavity and the edge of the PCBA, which reduces the contact between the edge of the PCBA and the side wall of the cavity, reduces the heat exchange efficiency between the liquid-cooled bottom cover and the top cover through the PCBA, and isolates the heat transfer path between the liquid-cooled bottom cover and the top cover as much as possible, so as to prevent the temperature of the top cover from falling below the ambient temperature and causing condensation to drip onto the PCBA.

[0014] Furthermore, the isolation pad is an annular isolation pad, and a threaded hole is provided on the top of the cavity sidewall. The isolation pad and the threaded hole are positioned correspondingly to achieve communication between the annular isolation pad and the threaded hole.

[0015] In this design, a countersunk hole can be provided around the threaded hole, and an annular isolation gasket can be embedded in the countersunk hole to achieve quick alignment between the isolation gasket and the threaded hole. In addition, it is necessary to ensure that the top of the isolation gasket is higher than the top of the cavity sidewall.

[0016] Furthermore, the top cover and the PCBA are respectively provided with a first through hole and a second through hole corresponding to the threaded hole. The top cover and the PCBA are connected to the threaded hole by threaded connectors passing through the first through hole, the second through hole, and the isolation gasket in sequence.

[0017] In this solution, the first through hole of the top cover, the second through hole of the PCBA, and the threaded hole of the liquid-cooled bottom cover are coaxially fitted. The layered fastening of the top cover, PCBA, isolation gasket, and liquid-cooled bottom cover is achieved by sequentially passing through threaded connectors, ensuring the relative positional accuracy of each component.

[0018] Furthermore, the liquid-cooled bottom cover has a liquid-cooled flow channel inside, and the liquid-cooled bottom cover has an inlet port and an outlet port that communicate with the liquid-cooled flow channel. The liquid-cooled bottom cover assembly also includes a water nozzle that can be detachably installed on the inlet port and the outlet port.

[0019] The integrated flow channels inside the liquid-cooled base cover allow direct contact with the core heat-generating area of ​​the PCBA. Forced convection heat transfer via a liquid medium (such as a 50% ethylene glycol aqueous solution) significantly improves heat dissipation efficiency. The inlet and outlet ports feature detachable nozzles, and the fit between the nozzles and ports is sealed using a sealing ring (such as a high-temperature resistant silicone rubber O-ring). Combined with the micro-pressure design within the flow channels, this effectively prevents coolant leakage. Furthermore, the detachable nozzle structure allows for quick connection of piping during assembly and rapid replacement during subsequent maintenance, improving work efficiency.

[0020] Furthermore, the inlet port and outlet port are provided with slots, and the water nozzle is provided with a snap-fit ​​protrusion. During assembly, the snap-fit ​​protrusion snaps into the slot to connect the water nozzle to the inlet port or outlet port.

[0021] The mechanical interlocking design of the slot and the snap-fit ​​protrusion enables quick docking of the water nozzle and the liquid cooling port, which can be fixed without the need for tools, and can significantly reduce assembly time compared with traditional threaded connections.

[0022] Furthermore, the water nozzle is equipped with a control valve to control the opening and closing of the internal flow channel.

[0023] The control valve can control the flow path opening and closing as needed. For example, controlling the water nozzle flow path opening and closing separately allows for the maintenance of local water circuits (such as the liquid-cooled bottom cover cavity) without affecting the overall system, reducing downtime for maintenance.

[0024] Compared with the prior art, the beneficial effects of this utility model are: In this design, the liquid-cooled bottom cover is a fixed end. When the domain controller is installed on the vehicle, the PCBA is located above the liquid-cooled bottom cover. The domain controller's liquid cooling system is integrated on the liquid-cooled bottom cover, not on the top cover. Therefore, in humid environments, the temperature of the liquid-cooled bottom cover decreases with the coolant. When the temperature is below ambient temperature, condensation forms on the liquid-cooled bottom cover, not on the top cover. The condensation accumulates within the cavity of the liquid-cooled bottom cover and is drained through the drainage structure at the bottom of the cavity, preventing liquid residue from causing short-circuit failure of the PCBA. Furthermore, to reduce the heat exchange efficiency between the liquid-cooled bottom cover and the top cover via the PCBA, which could cause the top cover temperature to drop below ambient temperature, the edges of the PCBA are fixed to the side walls of the cavity. This reduces the contact between the PCBA edges and the cavity side walls, minimizing the heat transfer path between the liquid-cooled bottom cover and the top cover, thus preventing condensation from dripping onto the PCBA from the top cover. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the structure of an on-board domain controller according to an embodiment of the present invention.

[0026] Figure 2 This is an exploded view of an embodiment of the vehicle domain controller of this utility model.

[0027] Figure 3 This is a schematic diagram of the structure of a liquid-cooled bottom cover according to an embodiment of the present invention.

[0028] Figure 4 This is a schematic diagram of the structure of a water tap according to an embodiment of the present invention.

[0029] Figure 5 This is a cross-sectional view of a water tap according to an embodiment of the present invention.

[0030] Illustration: 1. Top cover; 11. First through hole; 2. Liquid-cooled bottom cover assembly; 21. Liquid-cooled bottom cover; 211. Cavity; 212. Drainage structure; 2121. Drainage slope; 2122. Drainage hole; 213. Heat dissipation boss; 2131. Heat transfer medium; 214. Isolation gasket; 215. Threaded hole; 216. Liquid inlet port; 217. Liquid outlet port; 218. Slot; 22. Water nozzle; 221. Snap-fit ​​protrusion; 222. Control valve; 2221. Ball valve sealing ring; 2222. Ball valve; 2223. Control rod; 23. Threaded connector; 3. PCBA; 31. Second through hole. Detailed Implementation

[0031] To facilitate understanding of this invention, a more comprehensive description will be provided below with reference to the accompanying drawings. The drawings illustrate preferred embodiments of the invention. However, this invention can be implemented in many different forms and is not limited to the embodiments described herein.

[0032] like Figure 1 and Figure 2 As shown, this embodiment provides an in-vehicle domain controller, including a liquid-cooled bottom cover assembly 2, an upper cover 1 covering the liquid-cooled bottom cover assembly, and a PCBA 3 installed between the liquid-cooled bottom cover assembly 2 and the upper cover 1. The liquid-cooled bottom cover assembly 2 includes a liquid-cooled bottom cover 21, and a cavity 211 is provided on the side of the liquid-cooled bottom cover 21 facing the PCBA. The edge of the PCBA 3 is isolated and fixed to the side wall of the cavity 211. The heating element on the PCBA 3 is in contact with the bottom of the cavity 211. The bottom of the cavity 211 is provided with a drainage structure 212 for draining condensation.

[0033] It should be noted that in this embodiment, the liquid-cooled bottom cover 21 is a fixed end with mounting feet on its periphery. When the domain controller is installed on the vehicle, the mounting feet are locked in the vehicle's installation position using threaded connectors. Furthermore, during installation, the vehicle-mounted domain controller is installed horizontally or at an angle, with the liquid-cooled bottom cover 21 at the bottom and the PCBA3 above it. The domain controller's liquid cooling system is integrated on the liquid-cooled bottom cover 21, not on the top cover 1. The liquid-cooled bottom cover 21 is made of a high thermal conductivity material, such as aluminum alloy, and is formed by welding or integral die casting. The top cover 1 is made of a different material than the liquid-cooled bottom cover 21, using a low thermal conductivity material, such as resin or lead. Additionally, the top cover 1 and the liquid-cooled bottom cover 21 are not in direct contact. After the PCBA3 is stacked on the liquid-cooled bottom cover 21, the top cover 1 is pressed onto the PCBA3, leaving a certain gap between the inner side wall of the top cover 1 and the outer wall of the liquid-cooled bottom cover 21.

[0034] like Figure 2 and Figure 3As shown, the bottom of the cavity 211 is provided with a heat dissipation protrusion 213. The heat-generating components on the PCBA3 are in contact with the heat dissipation protrusion 213. The heat dissipation protrusion 213 is in contact with the heat-generating components on the PCBA3, such as chips and power devices. The heat generated by the heat-generating components can be quickly conducted to the liquid-cooled bottom cover 21 through the heat dissipation protrusion 213. The structure of the heat dissipation protrusion 213 can be customized according to the heat source distribution of the PCBA3, such as local heightening or array protrusions, to ensure precise fit with high heat generation areas. At the same time, the heat dissipation protrusion 213 is integrally formed with the bottom of the cavity 211, reducing intermediate heat transfer links and improving the overall heat dissipation uniformity.

[0035] Additionally, the heat dissipation protrusion 213 can be covered with a thermally conductive medium 2131, which contacts the heat-generating element on the PCBA3. The thermally conductive medium 2131 can be made of thermally conductive gel or thermally conductive pad, which can fill the microscopic gap between the heat dissipation protrusion 213 and the heat-generating element, avoiding the increase in thermal resistance caused by air retention, and significantly improving the heat conduction efficiency from the heat-generating element to the liquid-cooled bottom cover 21.

[0036] like Figure 3 As shown, the drainage structure 212 includes a drainage slope 2121 and a drainage hole 2122 located at the bottom of the cavity 211. The drainage hole 2122 is located at the lowest point of the drainage slope 2121, and the drainage slope 2121 and drainage hole 2122 are located between the heat dissipation boss 213 and the side wall of the cavity 211. The drainage slope 2121 and drainage hole 2122, located between the heat dissipation boss 213 and the side wall of the cavity 211, form a dredging drainage structure 212. The heat dissipation boss 213 can be centrally located, and the drainage path is located at the edge, utilizing the corner space of the cavity 211 to set up the drainage channel without occupying additional internal volume of the controller. The drainage slope 2121 at the bottom of the cavity 211 uses gravity to allow condensation or accumulated water to naturally collect at the lowest point, avoiding irregular liquid residue at the bottom. The drainage hole 2122 is located at the lowest point of the slope, ensuring that all collected liquid is discharged through the channel, avoiding the risk of short circuit caused by local water accumulation. The number of drainage holes 2122 is set according to actual needs. In this embodiment, four drainage holes 2122 are provided, respectively located at the four corners of the cavity 211. The corresponding drainage slope 2121 can be inclined from the middle of the bottom of the cavity 211 outwards. In other possible embodiments, the number of drainage holes 2122 may also be one, with one drainage hole 2122 located in the middle of the cavity 211, and the corresponding drainage slope 2121 can be inclined from the periphery of the cavity towards the middle.

[0037] like Figure 2As shown, the sidewall of the cavity 211 is provided with an isolation gasket 214, and the edge of the PCBA3 is isolated from the top of the sidewall of the cavity 211 by the isolation gasket 214. The isolation gasket 214 is made of a low thermal conductivity material, such as polyetheretherketone or silicone rubber. The isolation gasket 214 is placed between the sidewall of the cavity 211 and the edge of the PCBA3, reducing the contact between the edge of the PCBA3 and the sidewall of the cavity 211, reducing the heat exchange efficiency between the liquid-cooled bottom cover 21 and the top cover 1 through the PCBA3, so as to isolate the heat transfer path between the liquid-cooled bottom cover 21 and the top cover 1 as much as possible, and preventing the temperature of the top cover 1 from falling below the ambient temperature, so that condensation will form on the top cover 1 and drip onto the PCBA3.

[0038] The isolation gasket 214 is an annular isolation gasket. A threaded hole 215 is provided at the top of the sidewall of the cavity 211. The isolation gasket 214 and the threaded hole 215 are positioned correspondingly to achieve communication between the annular isolation gasket 214 and the threaded hole 215. A countersunk hole can be provided around the threaded hole 215, and the annular isolation gasket 214 can be embedded in the countersunk hole to achieve quick alignment between the isolation gasket 214 and the threaded hole 215. Additionally, it must be ensured that the top of the isolation gasket 214 is higher than the top of the sidewall of the cavity 211. Of course, in other possible embodiments, other methods can also be used to achieve the alignment of the annular isolation gasket 214 and the threaded hole 215. The upper cover 1 and PCBA3 are respectively provided with a first through hole 11 and a second through hole 31 corresponding to the threaded hole 215. The upper cover 1 and PCBA3 are connected by a threaded connector 23 that passes through the first through hole 11, the second through hole 31, the isolation gasket 214, and the threaded hole 215 in sequence.

[0039] It should be noted that multiple threaded holes 215 are provided on the sidewall of the cavity 211, and correspondingly multiple first through holes 11, second through holes 31, and isolation gaskets 214 are also provided. The first through hole 11 of the upper cover 1 and the second through hole 31 of the PCBA3 form a coaxial fit with the threaded hole 215 of the liquid-cooled bottom cover 21. The threaded connector 23 passes through sequentially to achieve a layered fastening of the upper cover 1-PCBA3-isolation gasket 214-liquid-cooled bottom cover 21, ensuring the relative positional accuracy of each component. In addition, the threaded connector 23 is also made of a low thermal conductivity material, such as stainless steel or tin-plated carbon steel, to isolate the heat transfer path between the liquid-cooled bottom cover 21 and the upper cover 1 as much as possible.

[0040] like Figure 2As shown, the liquid-cooled bottom cover 21 has a liquid-cooled flow channel inside. The side of the liquid-cooled bottom cover 21 has an inlet port 216 and an outlet port 217 connecting the liquid-cooled flow channel. The liquid-cooled bottom cover assembly 2 also includes a water nozzle 22 detachably mounted on the inlet port 216 and the outlet port 217. The integrated flow channel inside the liquid-cooled bottom cover 21 can directly contact the heat-generating core area of ​​the PCBA3, significantly improving heat dissipation efficiency through forced convection heat transfer using a liquid medium (such as a 50% ethylene glycol aqueous solution). The inlet port 216 and the outlet port 217 adopt a detachable water nozzle structure. The fit between the water nozzle 22 and the port can be sealed using a sealing ring (such as a high-temperature resistant silicone rubber O-ring). Combined with the micro-pressure design within the flow channel, this effectively prevents coolant leakage. Furthermore, the detachable water nozzle structure allows for quick connection of the piping during assembly and rapid replacement during later maintenance, improving work efficiency.

[0041] like Figure 3 and Figure 4 As shown, the inlet port 216 and outlet port 217 are provided with slots 218, and the nozzle 22 is provided with a snap-fit ​​protrusion 221. During assembly, the snap-fit ​​protrusion 221 snaps into the slot 218 to connect the nozzle 22 with the inlet port 216 or the outlet port 217. Specifically, the slot 218 is an annular slot surrounding the inlet port 216 and the outlet port 217, and the snap-fit ​​protrusion 221 is a U-shaped elastic clamp. The side of the nozzle 22 is provided with a mounting groove for installing the elastic clamp, wherein the mounting groove is through the inner wall. When the nozzle 22 is inserted into the inlet port 216 and the outlet port 217, the mounting groove corresponds to the slot 218, and the part of the mounting groove that is through the inner wall is connected to the slot 218. At this time, the elastic clamp is snapped into the mounting groove to achieve a limiting connection between the two. The elastic clamp is snapped into the mounting groove so that the nozzle 22 cannot be pulled out of the port. In other possible embodiments, the snap-fit ​​protrusion 221 can also adopt other structures, such as elastic ball bearings. The ball bearings are arranged in a ring around the position of the nozzle 22 corresponding to the slot 218. When the nozzle 22 is inserted into the inlet port 216 and the outlet port 217, parts of the ring-arranged ball bearings are engaged in the slot 218, which can achieve a limiting connection between the two, making it impossible for the nozzle 22 to be pulled out of the port. The mechanical interlocking design of the slot 218 and the snap-fit ​​protrusion 221 can realize the quick docking of the nozzle 22 and the liquid cooling port, which can be fixed without the need for tools, and can significantly reduce assembly time compared with traditional threaded connections.

[0042] like Figure 5As shown, the water nozzle 22 is equipped with a control valve 222 for controlling the opening and closing of the internal flow channel. Specifically, the control valve 222 includes a ball valve sealing ring 2221 disposed on the stepped surface of the internal flow channel of the water nozzle 22, a ball valve 2222 abutting against the ball valve sealing ring 2221, and a control rod 2223 for controlling the rotation of the ball valve 2222. The control rod 2223 passes through the water nozzle body and is connected to the ball valve 2222. The ball valve 2222 has a connecting end and a blocking end. By rotating the control rod 2223, the ball valve 2222 can be rotated so that the connecting end of the ball valve 2222 abuts against the ball valve sealing ring 2221, or the blocking end of the ball valve 2222 abuts against the ball valve sealing ring 2221. When the connecting end of the ball valve 2222 abuts against the ball valve sealing ring 2221, the water nozzle 22 is in the open state, and coolant can flow into the liquid-cooled bottom cover 21. When the sealing end of ball valve 2222 abuts against ball valve sealing ring 2221, water nozzle 22 is in the closed state, and coolant cannot flow into liquid-cooled bottom cover 21. Control valve 222 can control the flow path opening and closing as needed. For example, controlling the opening and closing of the water nozzle flow path separately allows for maintenance of local water circuits (such as the liquid-cooled bottom cover cavity) without affecting the overall system, reducing downtime for maintenance.

[0043] In this embodiment, the liquid-cooled bottom cover 21 is a fixed end. When the domain controller is installed on the vehicle, the PCBA is located above the liquid-cooled bottom cover. The liquid cooling system of the domain controller is integrated on the liquid-cooled bottom cover 21, rather than on the upper cover 1. Therefore, in a humid environment, the temperature of the liquid-cooled bottom cover 21 decreases with the coolant. When it is below the ambient temperature, condensation forms on the liquid-cooled bottom cover 21, rather than on the upper cover 1. The condensation accumulates in the cavity 211 of the liquid-cooled bottom cover 21 and is discharged through the drainage structure 212 at the bottom of the cavity 211, preventing liquid residue from causing short-circuit failure of the PCBA3. In addition, in order to reduce the heat exchange efficiency between the liquid-cooled bottom cover 21 and the upper cover 1 through the PCBA3, resulting in the temperature of the upper cover 1 being lower than the ambient temperature, the edge of the PCBA3 is fixedly isolated to the side wall of the cavity 211. That is, by reducing the contact between the edge of the PCBA3 and the side wall of the cavity 211, the heat transfer path between the liquid-cooled bottom cover 21 and the upper cover 1 is isolated as much as possible, thereby preventing condensation from the upper cover 1 dripping onto the PCBA3.

[0044] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0045] Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, the inclusion of "first," "second," etc., in a feature may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0046] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A vehicle-mounted domain controller, characterized in that, The device includes a liquid-cooled bottom cover assembly, an upper cover disposed on the liquid-cooled bottom cover assembly, and a PCBA installed between the liquid-cooled bottom cover assembly and the upper cover. The liquid-cooled bottom cover assembly includes a liquid-cooled bottom cover, and the liquid-cooled bottom cover has a cavity on one side facing the PCBA. The edge of the PCBA is fixed to the side wall of the cavity. The heating element on the PCBA is in contact with the bottom of the cavity. The bottom of the cavity has a drainage structure for draining condensation.

2. The vehicle-mounted domain controller according to claim 1, characterized in that, The drainage structure includes a drainage ramp and a drainage hole disposed at the bottom of the cavity, wherein the drainage hole is located at the lowest point of the drainage ramp.

3. The vehicle-mounted domain controller according to claim 2, characterized in that, The bottom of the cavity is provided with a heat dissipation boss, and the heat-generating element on the PCBA is in contact with the heat dissipation boss. The drainage slope and drainage hole are located between the heat dissipation boss and the side wall of the cavity.

4. The vehicle domain controller according to claim 3, characterized in that, The heat dissipation boss is covered with a thermally conductive medium, which is in contact with the heat-generating element on the PCBA.

5. The vehicle-mounted domain controller according to claim 1, characterized in that, The cavity has an isolation pad on its sidewall, and the edge of the PCBA is isolated from the top of the cavity sidewall by the isolation pad.

6. The vehicle domain controller according to claim 5, characterized in that, The isolation pad is an annular isolation pad, and a threaded hole is provided on the top of the cavity sidewall. The isolation pad is positioned corresponding to the threaded hole so that the annular isolation pad is connected to the threaded hole.

7. The vehicle domain controller according to claim 6, characterized in that, The top cover and the PCBA are respectively provided with a first through hole and a second through hole corresponding to the threaded hole. The top cover and the PCBA are connected to the threaded hole by threaded connectors passing through the first through hole, the second through hole, and the isolation gasket in sequence.

8. The vehicle domain controller according to claim 1, characterized in that, The liquid-cooled bottom cover has a liquid-cooled flow channel inside, and the liquid-cooled bottom cover has an inlet port and an outlet port that communicate with the liquid-cooled flow channel. The liquid-cooled bottom cover assembly also includes a water nozzle that can be detachably installed on the inlet port and the outlet port.

9. The vehicle domain controller according to claim 8, characterized in that, The inlet and outlet ports are provided with slots, and the nozzle is provided with a snap-fit ​​protrusion. During assembly, the snap-fit ​​protrusion snaps into the slot to connect the nozzle to the inlet or outlet port.

10. The vehicle domain controller according to claim 8, characterized in that, The water nozzle is equipped with a control valve to control the opening and closing of the internal flow channel.

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