Integrated liquid cooling heat dissipation device and system

Abstract

The utility model provides a kind of integrated liquid cooling heat dissipation device and system, the liquid cooling heat dissipation device includes single liquid cooling heat sink and single liquid pump integrated independent cooling unit formed;The liquid pump has liquid pump inlet and liquid pump outlet;The liquid cooling heat sink includes heat exchanger and the heat sink inlet pipeline and heat sink outlet pipeline communicated with it;The heat sink inlet pipeline, the liquid pump inlet, the liquid pump outlet and the heat sink outlet pipeline are connected in series and form liquid cooling cavity;The liquid pump and the liquid cooling heat sink are stacked in thickness direction and assembled as integrated structure, so that the liquid pump can directly compensate the flow resistance of the liquid cooling heat sink.The utility model is integrated by single liquid cooling heat sink and single liquid pump in structure, forms independent cooling unit with autonomous fluid driving capability, solves the technical problems, such as uneven flow distribution, response lag, low modularization and gas blockage prone to occur under two-phase working condition, in traditional centralized liquid cooling system.

Description

Technical Field

[0001] This utility model belongs to the field of liquid cooling heat dissipation technology, specifically relating to an integrated liquid cooling heat dissipation device and system. Background Technology

[0002] With the continuous increase in power density of electronic devices, traditional air-cooled and centralized liquid-cooled systems can no longer meet the demand for efficient heat dissipation. Existing liquid cooling technologies generally use a single main pump to drive the coolant through multiple liquid-cooled heat sinks. Due to differences in pipe layout, heat sink structure, and heat load, the flow resistance of each branch is uneven, resulting in unbalanced coolant distribution, which can easily cause local overheating and poor temperature uniformity. In addition, the system design is complex, and the replacement or expansion of heat sinks is limited by the head of the main pump, resulting in poor flexibility and maintainability.

[0003] Especially in two-phase liquid cooling systems, the bubbles generated by the vapor-liquid phase change significantly increase flow resistance, potentially leading to airlock or flow rate reduction, threatening stable system operation. Current technologies lack the ability to actively compensate for the flow resistance of individual heat sinks, making precise flow control and modular deployment difficult.

[0004] Therefore, there is an urgent need for an integrated liquid cooling solution that can decouple the heat sink from the system flow resistance, thereby improving heat dissipation uniformity, adaptability, and reliability. Utility Model Content

[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide an integrated liquid cooling heat dissipation device and system, which aims to solve the problems of reduced cooling efficiency, local overheating and insufficient system reliability caused by uneven flow resistance of multiple branches, lag in response to dynamic changes in heat load and low modularity in traditional centralized liquid cooling systems.

[0006] To achieve the above and other related objectives, this utility model proposes an integrated liquid cooling heat dissipation device, which includes an independent cooling unit formed by integrating a single liquid cooling heat sink and a single liquid pump.

[0007] The liquid pump has a liquid pump inlet and a liquid pump outlet;

[0008] The liquid-cooled heat sink includes a heat exchanger and a heat sink inlet pipe and a heat sink outlet pipe connected thereto.

[0009] The heat sink inlet pipe, the liquid pump inlet, the liquid pump outlet, and the heat sink outlet pipe are connected in series to form a liquid cooling cavity;

[0010] The liquid pump and the liquid-cooled heat sink are stacked and assembled into a single structure in the thickness direction, so that the liquid pump can directly compensate for the flow resistance of the liquid-cooled heat sink.

[0011] In one embodiment of the present invention, the motor and impeller of the liquid pump are located in the same plane, and the height difference between their centerlines does not exceed 90% of the thickness of the motor.

[0012] In one embodiment of the present invention, the pressure increase generated by the liquid pump during operation is not less than 50% of the flow resistance of the liquid-cooled heat sink under rated operating conditions.

[0013] In one embodiment of the present invention, the liquid-cooled heat sink further includes a liquid-cooled heat sink body, the heat sink inlet pipe and the heat sink outlet pipe are formed inside the liquid-cooled heat sink body, and the heat exchanger is arranged in the heat sink outlet pipe.

[0014] In one embodiment of the present invention, the top surface of the liquid-cooled heat sink body and the bottom surface of the liquid pump are respectively provided with mating surfaces for mutual installation, and the mating surfaces are provided with mating installation structures.

[0015] In one embodiment of the present invention, the mating installation structure includes a positioning structure for positioning the liquid pump and the liquid-cooled heat sink in a mating manner, and a sealing structure for sealing the liquid pump and the liquid-cooled heat sink in a mating manner.

[0016] In one embodiment of the present invention, a flow sensor or a flow resistance sensor is further included, wherein the flow sensor or the flow resistance sensor is disposed in the heat sink inlet pipe or the heat sink outlet pipe.

[0017] This utility model also proposes an integrated liquid cooling heat dissipation system, including a main power pump and at least one integrated liquid cooling heat dissipation device as described in any of the above embodiments, wherein the main power pump and the integrated liquid cooling heat dissipation device are connected through an external pipe.

[0018] In one embodiment of the present invention, a plurality of integrated liquid cooling heat dissipation devices are included, and the plurality of integrated liquid cooling heat dissipation devices are connected in parallel and / or in series.

[0019] In one embodiment of the present invention, a controller is further included, the controller being configured to control the rotational speed of the liquid pump based on detection data from a flow sensor or a flow resistance sensor in the integrated liquid cooling heat dissipation device.

[0020] This invention achieves significant technological progress and positive effects by structurally integrating a single liquid-cooled heat sink and a single liquid pump into an independent cooling unit with autonomous fluid drive capability. This fundamentally solves the technical problems of uneven flow distribution, slow response, low modularity, and susceptibility to air blockage under two-phase conditions in traditional centralized liquid cooling systems.

[0021] This invention integrates a liquid pump into each integrated liquid cooling heat dissipation device, which directly compensates for the flow resistance of its corresponding liquid cooling heat sink, making the unit a low-net-resistance or near-zero-resistance module in the system. Even in a multi-branch parallel system where the flow resistance of each heat sink varies significantly, it ensures stable and balanced coolant flow in each branch, effectively avoiding local overheating and significantly improving the overall thermal consistency and operational stability of the system.

[0022] In traditional systems, replacing or upgrading the heat sink requires recalibrating the main pump head. However, in this solution, each cooling unit has independent drive capability, and the flow resistance change of the heat sink is compensated by its built-in liquid pump. There is no need to adjust the system-level main pump parameters. The number of heat dissipation units can be flexibly increased or decreased, or different specifications of heat sinks can be replaced, which greatly improves the modularity, maintainability and expansion flexibility of the system.

[0023] Under two-phase cooling conditions, localized vaporization of the coolant can lead to a sharp increase in flow resistance. In this invention, the liquid pump is positioned close to the heat sink, enabling it to respond quickly to changes in local pressure drop, actively pressurize to maintain stable flow, effectively suppress flow attenuation or even interruption, significantly improve the system's anti-interference capability and operational reliability under high heat loads or transient conditions, and prevent the risk of thermal runaway caused by vapor lock.

[0024] In this invention, the liquid pump and heat sink are stacked and integrated in the thickness direction, allowing the pump to be positioned according to the heat source, the power source to be close to the heat-generating device, and the pressure transmission path to be short and the response speed to be fast. When the heat load changes abruptly, the built-in liquid pump can quickly adjust its speed to achieve rapid response and precise matching of cooling flow, significantly improving the dynamic heat dissipation performance of the system.

[0025] This invention integrates monitoring components such as flow sensors and pressure sensors, and combines them with a controller to dynamically adjust the pump speed, enabling an intelligent thermal management strategy of on-demand liquid supply: automatically increasing flow to enhance heat dissipation under high load, and reducing speed to save energy and reduce noise under low load. This closed-loop control mechanism not only improves the accuracy of thermal management but also optimizes system energy efficiency, making it suitable for energy- and noise-sensitive applications such as data centers and electric vehicles. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. It is obvious that the drawings described below are merely some embodiments of this application, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0027] Figure 1 This is a schematic diagram of the integrated liquid cooling heat dissipation device in one embodiment of the present invention.

[0028] Label Explanation:

[0029] 100. Liquid pump; 200. Liquid-cooled heat sink; 110. Liquid pump inlet; 120. Liquid pump outlet; 101. Motor; 102. Impeller; Heat exchanger 210; 220. Heat sink inlet pipeline; 230. Heat sink outlet pipeline. Detailed Implementation

[0030] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0031] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. The drawings only show the components related to the present invention and are not drawn according to the actual number, shape and size of the components. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0032] In the following description, numerous details are explored to provide a more thorough explanation of embodiments of the present invention. However, it will be apparent to those skilled in the art that embodiments of the present invention may be practiced without these specific details. In other embodiments, well-known structures and devices are shown in block diagram form rather than in detail to avoid obscuring embodiments of the present invention.

[0033] With the rapid development of electronic devices towards higher power density, miniaturization, and integration, their heat generation has increased dramatically, making traditional air-cooling technology insufficient to meet the demands of efficient thermal management. Liquid cooling, due to its high heat transfer efficiency, low noise, and good temperature uniformity, has gradually become the mainstream heat dissipation solution in high-performance computing, data centers, electric vehicles, and power electronics. Existing liquid cooling systems typically employ a centralized pump-source architecture, where a main liquid pump provides circulation power to multiple liquid-cooled heat sinks (Cold Plates). The coolant flows sequentially or in parallel through the piping system through each heat sink, absorbs heat, is cooled by an external heat exchanger (such as a CDU), and then returns to the pump inlet to complete the cycle.

[0034] Understandably, this type of traditional liquid cooling system suffers from the following significant technical problems in practical applications: In a multi-heat sink parallel system, the varying lengths of the branch pipes, the number of bends, the internal flow channel structure of the heat sinks, and the heat load of the cooled components lead to significant differences in flow resistance among the branches, resulting in uneven coolant flow distribution. Some heat sinks experience reduced heat dissipation capacity due to insufficient flow, causing the corresponding components to overheat, affecting system stability and lifespan; the total system flow resistance is determined by the main pump head, and the flow resistance characteristics of each liquid-cooled heat sink directly affect the system flow distribution and pump selection. When a heat sink is replaced or upgraded (e.g., due to changes in flow resistance), it may cause an imbalance in the overall system flow, requiring a recalibration of pump performance and limiting the modular design and flexible deployment of heat sinks. In two-phase liquid cooling systems, the coolant vaporizes in high-temperature regions, generating bubbles to form a vapor-liquid two-phase flow, causing a sharp increase in local flow resistance. If the total system pressure drop exceeds the main pump head, it will cause flow attenuation or even interruption, resulting in local overheating or thermal runaway, seriously affecting system reliability. Furthermore, the main pump is usually located far from the heat source, and there is a delay in pressure transmission, making it difficult to respond quickly to sudden changes in local heat load, thus limiting dynamic heat dissipation performance.

[0035] To address the aforementioned problems, this invention proposes an integrated liquid cooling heat dissipation device, aiming to solve the technical defects of traditional centralized liquid cooling systems, such as uneven flow resistance across multiple branches, lag in response to dynamic changes in heat load, and low modularity, which lead to decreased cooling efficiency, localized overheating, and insufficient system reliability. The core of this integrated liquid cooling heat dissipation device lies in structurally integrating a single liquid cooling heat sink with a single liquid pump to form an independent, self-contained cooling unit. Each cooling unit possesses complete heat exchange and fluid drive functions, and can operate independently or be connected in parallel to a larger-scale liquid cooling system, significantly improving the system's thermal consistency, maintainability, and deployment flexibility.

[0036] Please see Figure 1 As shown, in this embodiment, the liquid cooling heat dissipation device includes a liquid pump 100 and a liquid-cooled heat sink 200. The liquid pump 100 serves as a fluid-assisted power source and has a liquid pump inlet 110 and a liquid pump outlet 120. The liquid pump can be a high-efficiency, low-noise, long-life type such as a micro centrifugal pump, a magnetically driven pump, or a brushless DC pump. Its head and flow rate are designed to match the target heat load and the flow resistance characteristics of the heat sink, ensuring that it can actively compensate for the flow resistance inside the heat sink and the pipeline. The liquid-cooled heat sink 200 is used to directly contact the heat-generating device and absorb heat. It includes a heat exchanger 210, and a heat sink inlet pipe 220 and a heat sink outlet pipe 230 communicating with its internal flow channels. The heat exchanger 210 is usually made of a high thermal conductivity metal (such as copper or aluminum alloy) to enhance the convective heat transfer efficiency between the coolant and the wall.

[0037] In this embodiment, a closed liquid circulation path is formed by sequentially connecting the heat sink inlet pipe 220, the liquid pump inlet 110, the liquid pump outlet 120, and the heat sink outlet pipe 230. Coolant flows out of the heat sink outlet pipe and enters the liquid pump inlet. After being pressurized by the liquid pump, it is discharged from the liquid pump outlet and re-injected into the heat sink inlet pipe, completing one cycle. This liquid-cooled cavity constitutes a closed local circulation loop, allowing the liquid pump to directly and instantly compensate for the flow resistance of the liquid-cooled heat sink, avoiding flow attenuation caused by external system pressure drop fluctuations.

[0038] In this embodiment, the liquid pump 100 and the liquid-cooled heat sink 200 are stacked in the thickness direction and assembled into a compact, integrated structure through mechanical fastening, welding, or integral molding processes. For example, the liquid pump can be arranged on top or bottom of the liquid-cooled heat sink, and the two share part of the shell structure, reducing the length of connecting pipelines and lowering additional flow resistance. This stacked integrated design not only saves installation space but also enables the pump to be positioned with the heat source, shortening the pressure response path and improving the system's dynamic response capability to sudden changes in heat load.

[0039] In practical applications, multiple independent cooling units can be connected in parallel to the main liquid cooling pipeline system. Each unit can independently adjust its flow rate without interfering with others. When the heat load of a heat source increases, its corresponding integrated liquid cooling device can actively increase the coolant flow rate by increasing the pump speed to achieve on-demand cooling. In contrast, in traditional systems, such changes may lead to an increase in pressure drop across the entire branch, affecting the flow distribution of other branches.

[0040] Furthermore, this integrated design is particularly suitable for two-phase liquid cooling scenarios. In cases where localized vaporization of the coolant generates bubbles, traditional systems, due to the main pump being far from the heat source, struggle to overcome the rapid pressure rise caused by the vapor-liquid two-phase flow, easily leading to flow interruptions. In this embodiment, however, the liquid pump is positioned close to the heat sink, enabling rapid response to localized pressure drop changes, maintaining stable flow, and preventing thermal runaway.

[0041] Please see Figure 1 As shown, in this embodiment, the motor 101 and impeller 102 of the liquid pump 100 are located in the same plane, and the height difference between their centerlines does not exceed 90% of the motor thickness. This design aims to achieve a low-profile, highly integrated structure for the liquid pump to meet the compact stacking requirements of the overall device in the thickness direction.

[0042] In traditional liquid pump designs, the motor and impeller are often arranged vertically or obliquely, resulting in a large axial dimension of the pump body, making it difficult to match the thin structure of liquid-cooled heat sinks. In this embodiment, by placing the motor and impeller on nearly the same plane, the space occupied by the liquid pump in the stacking direction is significantly reduced. Specifically, the stator and rotor planes of the motor are substantially parallel or coplanar with the rotation plane of the impeller, resulting in a shorter power transmission path and a more compact structure. Furthermore, the height difference between the centerlines of the motor and impeller does not exceed 90% of the motor thickness to accommodate the compact stacking requirements of the overall device in the thickness direction.

[0043] In this embodiment, the pressure boost generated by the liquid pump 100 during operation is no less than 50% of the flow resistance of the liquid-cooled heat sink 200 under rated operating conditions, ensuring that the integrated liquid cooling heat dissipation device has autonomous fluid compensation capability. In actual operation, the internal flow channels of the liquid-cooled heat sink 200 generate certain flow resistance due to factors such as microchannels, bends, and cross-sectional changes. The coolant must overcome this resistance to achieve effective circulation. If the pressure boost provided by the liquid pump is insufficient, the system still needs to rely on an external main pump to provide additional pressure head, and cannot truly achieve independent operation. Therefore, this embodiment requires that the pressure output capability of the liquid pump matches the flow resistance of the integrated liquid-cooled heat sink. For example, when the pressure drop of the liquid-cooled heat sink at the rated flow rate is 80 kPa, the liquid pump should be able to provide a pressure boost of no less than 40 kPa. Preferably, the pressure boost value of the liquid pump reaches more than 100% of the flow resistance of the heat sink, which can completely compensate for its internal resistance, enabling the liquid-cooled heat sink to achieve low flow resistance, or even zero flow resistance, modularization, independent of the performance of the external pump, and allowing for non-destructive replacement and optimization.

[0044] This design allows each independent cooling unit to maintain stable coolant flow within its liquid cooling chamber without the need for an external pump source, significantly reducing reliance on the system-level main pump. Even if the flow resistance of a heat sink changes in a multi-unit parallel system, its corresponding integrated liquid pump can actively adjust its output pressure to maintain stable flow, avoiding impact on other branches and thus improving the system's thermal consistency and modular flexibility. Furthermore, in two-phase liquid cooling conditions, coolant vaporization can cause a sharp increase in local flow resistance. Liquid pumps with sufficient pressure compensation capabilities can effectively suppress flow rate decay, prevent circulation interruptions due to sudden pressure drops, and improve system reliability under extreme conditions.

[0045] In this embodiment, the liquid-cooled heat sink also includes a liquid-cooled heat sink body. The heat sink inlet pipe 220 and the heat sink outlet pipe 230 are directly formed inside the liquid-cooled heat sink body. This design not only improves structural strength and sealing reliability but also reduces the use of external connectors, lowering the risk of leakage and assembly complexity. Furthermore, the heat exchanger 210 is arranged in the heat sink outlet pipe 230. That is, after the coolant flows through the internal channels of the liquid-cooled heat sink body, it first passes through the heat exchange area and then exits from the outlet. This arrangement allows the coolant to remain in the heat exchanger for a longer time and the flow field distribution to be more uniform, which is beneficial for improving convective heat transfer efficiency. At the same time, concentrating the heat exchange function in the outlet section avoids local hot spots caused by unstable flow in the inlet section, improving the consistency of the temperature field.

[0046] The top surface of the liquid-cooled heat sink and the bottom surface of the liquid pump 100 are respectively provided with mating surfaces for mutual installation. These mating surfaces are the key interface for the mechanical connection and functional integration of the two components. By setting matching mounting structures on the mating surfaces, the liquid pump can be quickly and accurately assembled with the liquid-cooled heat sink, making it suitable for automated production lines and improving manufacturing efficiency. Simultaneously, this design supports modular replacement and maintenance; when the liquid pump fails, it can be disassembled and replaced individually without replacing the entire heat dissipation device, reducing operation and maintenance costs.

[0047] In this embodiment, the mating surface is provided with two parts: a positioning structure and a sealing structure. The positioning structure is used to achieve precise positioning between the liquid pump and the liquid-cooled heat sink, preventing assembly misalignment. Methods such as pin-hole alignment, guide boss-groove alignment, and snap-fit ​​alignment can be used to ensure accurate alignment of the liquid pump inlet 110 and the heat sink outlet pipe 230, and the liquid pump outlet 120 and the heat sink inlet pipe 220 at the flow channel connection, avoiding increased flow resistance or seal failure due to misalignment. The sealing structure is used to ensure the sealing performance of the liquid-cooled cavity and prevent coolant leakage. O-rings, gaskets, laser welding, or adhesive sealing processes can be used to form a reliable static seal between the mating surfaces. Through the synergistic effect of the positioning and sealing structures, the integrated liquid-cooled heat dissipation device maintains structural stability, leak-free operation, and low flow resistance during long-term operation, meeting the requirements of high-reliability application scenarios.

[0048] Of course, in some other embodiments, the housing of the liquid pump 100 can be integrally formed with the liquid-cooled heat sink body, and the motor 101 and impeller 102 are installed in the housing.

[0049] In this embodiment, the liquid cooling heat dissipation device further includes a flow sensor and / or a flow resistance sensor 600, installed in the heat sink inlet pipe 220 or the heat sink outlet pipe 230, for real-time monitoring of the coolant flow status or system flow resistance changes. By acquiring flow data in real time, the control system can dynamically adjust the pump speed to achieve on-demand liquid supply: when a decrease in flow is detected (e.g., due to scaling, bubbles, or increased flow resistance caused by increased heat load), the pump speed is automatically increased to maintain cooling capacity; when the heat load decreases, the pump speed is reduced to save energy and reduce noise. Furthermore, pressure sensors are installed in the heat sink inlet pipe 220 and the heat sink outlet pipe 230 respectively. Combined with the pressure difference between the inlet and outlet, the actual flow resistance of the liquid-cooled heat sink can be calculated to assess whether blockage, vaporization, or deposition has occurred inside the heat exchanger, achieving fault warning and health management. For example, in a two-phase cooling system, if the flow resistance suddenly increases, it can be determined that local boiling has intensified, and the system can activate a power reduction or enhanced heat dissipation strategy to prevent thermal runaway. This sensor-integrated design enhances the intelligence level of the integrated liquid cooling heat dissipation device, enabling it to have self-sensing and self-adjusting capabilities, making it suitable for scenarios with extremely high requirements for thermal management accuracy and system reliability, such as data centers and electric vehicles.

[0050] In summary, this invention, by structurally integrating the liquid pump and the liquid cooling heat sink to form an independent cooling unit with autonomous fluid drive capability, fundamentally solves the problems of uneven flow distribution, lag response, and modular limitation in multi-branch liquid cooling systems. It significantly improves the reliability, flexibility, and thermal management accuracy of the heat dissipation system, providing an innovative solution for the efficient cooling of high-power electronic devices.

[0051] This invention also proposes an integrated liquid cooling system, which includes a main power pump and at least one integrated liquid cooling device as described in the above embodiment. The main power pump and each integrated liquid cooling device are connected through external pipes to form a complete liquid cooling circulation loop.

[0052] In this system, the main power pump primarily provides the system-level circulation power, driving the coolant to flow between multiple heat dissipation units and delivering it to the external heat exchanger for overall cooling. Meanwhile, the liquid pumps within each integrated liquid cooling unit focus on compensating for the local flow resistance of the liquid cooling heat sink they are connected to, achieving coordinated driving. This architecture breaks through the high dependence of traditional centralized liquid cooling systems on the main pump's head. Even if a branch experiences a significant increase in flow resistance due to complex flow channels, high heat load, or localized vaporization, its corresponding integrated liquid pump can still actively pressurize to maintain a stable flow rate in that branch. This results in more balanced overall system thermal management and significantly improved temperature consistency across all heat-generating components.

[0053] The system comprises multiple integrated liquid-cooled heat dissipation devices, which can be connected in parallel, series, or a hybrid series-parallel topology. In parallel connection mode, the liquid-cooled chambers of each integrated liquid-cooled heat dissipation device are connected to a shared inlet and outlet manifold. This structure is suitable for parallel cooling of multiple independent heat sources, with each unit operating independently and allowing for independent adjustment of cooling intensity, facilitating refined thermal management. In series connection mode, coolant flows sequentially through multiple integrated liquid-cooled heat dissipation devices, forming a cascaded cooling loop. Regardless of the connection method, each integrated liquid-cooled heat dissipation device can actively adjust its own flow rate using its built-in liquid pump, effectively mitigating uneven flow distribution caused by differences in branch resistance and improving the overall system energy efficiency and reliability. Furthermore, because each integrated liquid-cooled heat dissipation device has independent fluid drive capability, the system's sensitivity to piping layout is reduced, allowing for more flexible equipment deployment and modular expansion.

[0054] The system includes a controller configured to dynamically adjust the speed of the liquid pump based on detection data from flow sensors or flow resistance sensors in the integrated liquid cooling heat dissipation device. Specifically, the controller receives real-time flow or differential pressure signals from each heat dissipation unit, combines them with a preset temperature threshold or heat load model, and generates control commands using PID, fuzzy control, or adaptive algorithms to adjust the speed of the liquid pump motor.

[0055] For example, when the flow sensor of a certain heat dissipation unit detects a flow rate drop of more than 10%, the controller determines that the flow resistance of that branch has increased, possibly due to local boiling or deposition. It then increases the speed of the liquid pump in that unit by 15% to 30% to restore the designed flow rate. When the heat load decreases and the temperature stabilizes, the controller reduces the pump speed to save energy and reduce noise. This intelligent control strategy not only enhances the system's dynamic response capability but also enables on-demand cooling and energy-saving operation, making it particularly suitable for high-performance computing or electric vehicle operating conditions with drastic load fluctuations.

[0056] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An integrated liquid cooling heat dissipation device, characterized in that, The liquid cooling heat dissipation device includes an independent cooling unit formed by integrating a single liquid cooling heat sink and a single liquid pump. The liquid pump has a liquid pump inlet and a liquid pump outlet; The liquid-cooled heat sink includes a heat exchanger and a heat sink inlet pipe and a heat sink outlet pipe connected thereto. The heat sink inlet pipe, the liquid pump inlet, the liquid pump outlet, and the heat sink outlet pipe are connected in series to form a liquid cooling cavity; The liquid pump and the liquid-cooled heat sink are stacked and assembled into a single structure in the thickness direction, so that the liquid pump can directly compensate for the flow resistance of the liquid-cooled heat sink.

2. The integrated liquid cooling heat dissipation device according to claim 1, characterized in that, The motor and impeller of the liquid pump are located in the same plane, and the height difference between their centerlines does not exceed 90% of the motor thickness.

3. The integrated liquid cooling heat dissipation device according to claim 1, characterized in that, The pressure increase generated by the pump during operation shall not be less than 50% of the flow resistance of the liquid-cooled heat sink under rated operating conditions.

4. The integrated liquid cooling heat dissipation device according to claim 1, characterized in that, The liquid-cooled heat sink also includes a liquid-cooled heat sink body, the heat sink inlet pipe and the heat sink outlet pipe are formed inside the liquid-cooled heat sink body, and the heat exchanger is arranged in the heat sink outlet pipe.

5. The integrated liquid cooling heat dissipation device according to claim 4, characterized in that, The top surface of the liquid-cooled heat sink and the bottom surface of the liquid pump are respectively provided with mating surfaces for mutual installation, and the mating surfaces are provided with mating installation structures.

6. The integrated liquid cooling heat dissipation device according to claim 5, characterized in that, The mounting structure includes a positioning structure for positioning the liquid pump and the liquid-cooled heat sink, and a sealing structure for sealing the liquid pump and the liquid-cooled heat sink.

7. The integrated liquid cooling heat dissipation device according to claim 1, characterized in that, It also includes a flow sensor or a flow resistance sensor, which is disposed in the heat sink inlet pipe or the heat sink outlet pipe.

8. An integrated liquid cooling heat dissipation system, characterized in that, It includes a power pump and at least one integrated liquid cooling device as described in any one of claims 1 to 7, wherein the power pump and the integrated liquid cooling device are connected by an external pipe.

9. The integrated liquid cooling system according to claim 8, characterized in that, It includes multiple integrated liquid cooling heat dissipation devices, which are connected in parallel and / or in series.

10. The integrated liquid cooling system according to claim 8, characterized in that, It also includes a controller configured to control the rotational speed of the liquid pump based on detection data from a flow sensor or a flow resistance sensor in the integrated liquid cooling system.

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