Heat dissipation structure, machine cabin and robot

Abstract

The application discloses a heat dissipation structure, a machine compartment and a robot, and relates to the technical field of electronics. The heat dissipation structure is used for heat dissipation of a circuit board, and the circuit board comprises a heat conduction plate, a heat absorption piece and a heat radiator. The heat conduction plate comprises a first heat conduction part and a second heat conduction part connected with each other, and the first heat conduction part is located on one side of the circuit board. The heat absorption piece is connected with the first heat conduction part, and the heat absorption piece is arranged opposite to a heating element of the circuit board in the thickness direction of the circuit board. The heat radiator is thermally coupled with the second heat conduction part, so as to dissipate the heat of the heat conduction plate to the outside. The application absorbs the heat generated by the circuit board through the heat conduction plate, increases the heat dissipation area, and dissipates the heat of the element with large heat generation through the heat absorption piece, so that, on the basis of the overall heat dissipation of the circuit board, the element with high heat generation on the circuit board can be dissipated through the heat absorption piece, the heat dissipation efficiency of the circuit board is improved, the influence of the heat generated by the element of the circuit board during work on the circuit board is reduced, and the reliability and service life of the circuit board are improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and in particular to a heat dissipation structure, a chassis, and a robot. Background Technology

[0002] A robot is a mechatronic device that can automatically perform tasks such as handling, assembly, and inspection according to pre-set programs or artificial intelligence instructions. The robot's housing (also known as the core compartment or control compartment) is one of its most important components. This storage area serves as the robot's energy and control center, essentially its "brain and nerve center." The interior of the housing mainly houses circuit boards (e.g., control circuit boards, drive circuit boards), power modules, communication modules, and more.

[0003] The circuit board generates heat during operation, causing it to heat up, which reduces its reliability and lifespan. Utility Model Content

[0004] This application provides a heat dissipation structure, a housing, and a robot to at least solve the aforementioned technical problems.

[0005] To achieve the above objectives, according to a first aspect of this application, a heat dissipation structure is provided for heat dissipation of a circuit board. The heat dissipation structure includes a heat-conducting plate, a heat-absorbing component, and a heat sink. The heat-conducting plate includes a first heat-conducting part and a second heat-conducting part connected to each other. The first heat-conducting part and the second heat-conducting part extend in different directions. The first heat-conducting part is located on one side of the circuit board, and its extension direction is the same as that of the circuit board. The heat-absorbing component is connected to the first heat-conducting part and is disposed opposite to the heat-generating element of the circuit board in the thickness direction of the circuit board. The heat sink is thermally coupled to the second heat-conducting part to dissipate the heat of the heat-conducting plate to the outside.

[0006] Optionally, the heat sink includes a heat sink component, which is thermally coupled to the second heat-conducting part, and the heat sink component has a heat dissipation air duct.

[0007] Optionally, the heat sink extends along the extension direction of the second heat-conducting part to form a contact surface, and the heat sink is connected to the second heat-conducting part through the contact surface to form thermal coupling.

[0008] Optionally, the radiator also includes a cooling fan, which is located at one end of the cooling duct and the exhaust end of the cooling fan faces the cooling duct.

[0009] Optionally, the heat-absorbing element has an inner cavity in which a phase change material is disposed; And / or, the heat-absorbing element is strip-shaped.

[0010] Optionally, the circuit board and the heat-absorbing component are fixedly connected to the first heat-conducting part, and the heat sink is fixedly connected to the second heat-conducting part.

[0011] Optionally, a thermally conductive adhesive is provided between the heat-absorbing element and the first thermally conductive part; And / or, the heat-absorbing element is configured to be located on the side of the first heat-conducting part away from the circuit board, and thermally conductive adhesive is provided between the first heat-conducting part and the heating element.

[0012] According to a second aspect of this application, a chassis is provided, the chassis including an outer shell, a first circuit board and the aforementioned heat dissipation structure; the outer shell has a mounting cavity; the first circuit board is disposed in the mounting cavity; a heat-conducting plate and a heat-absorbing component are disposed in the mounting cavity, a first heat-conducting part is disposed on the back side of the first circuit board, a second heat-conducting part contacts the inner wall of the outer shell, and a heat sink is disposed on the outside of the outer shell and contacts the portion of the outer shell near the second heat-conducting part.

[0013] Optionally, the nacelle also includes a second circuit board, with the first circuit board arranged along a first direction and the second circuit board arranged along a second direction, the first direction and the second direction being non-parallel to each other.

[0014] According to a third aspect of this application, a robot is provided that includes the aforementioned cabin.

[0015] In the heat dissipation structure of this application embodiment, the heat generated by the circuit board is absorbed by the heat-conducting plate to increase the heat dissipation area, and the heat-absorbing component is used to concentrate the heat dissipation of the components with high heat generation. Thus, on the basis of overall heat dissipation of the circuit board, the heat generated by the components with high heat generation on the circuit board is quickly absorbed to the heat-conducting plate by the heat-absorbing component, thereby improving the heat dissipation efficiency of the circuit board, reducing the impact of the heat generated by the components on the circuit board during operation, and improving the reliability and service life of the circuit board.

[0016] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0018] Figure 1 This is a schematic diagram of the heat dissipation structure provided in an exemplary embodiment of this application; Figure 2 This is a schematic diagram of the heat dissipation structure and its cooperation with the circuit board provided in an exemplary embodiment of this application; Figure 3This is a schematic diagram of another heat dissipation structure provided in an exemplary embodiment of this application cooperating with a circuit board; Figure 4 This is a schematic diagram of the internal structure of the heat absorber provided in an exemplary embodiment of this application; Figure 5 This is a side view of the heat-absorbing structure provided in an exemplary embodiment of this application; Figure 6 This is a side view of another heat-absorbing structure provided in an exemplary embodiment of this application; Figure 7 This is a schematic diagram of the structure of the cabin provided in an exemplary embodiment of this application; Figure 8 yes Figure 7 Sectional view of AA; Figure 9 This is a structural block diagram of the robot provided in an exemplary embodiment of this application.

[0019] Explanation of reference numerals in the attached figures: 100-Hanger; 10-Heat dissipation structure; 20 - Heat-conducting plate; 21 - First heat-conducting part; 22 - Second heat-conducting part; 23 - Groove; 24 - Through hole; 30 - Heat absorber; 31 - Inner cavity; 32 - Phase change material; 40 - Heat sink; 41 - Heat sink component; 411 - First plate; 412 - Second plate; 413 - Contact surface; 42 - Cooling fan; 51-Connecting piece; 52-Locking component; 53-Thermal conductive adhesive; 60 - Housing; 61 - First circuit board; 62 - Second circuit board; 63 - Mounting cavity; 64 - Circuit board; 200-Robot. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0021] Before introducing a heat dissipation structure, a housing, and a robot provided by the embodiments of this application, the relevant technologies of this application will be introduced first.

[0022] Robots have a wide range of applications in related technologies, including industry, agriculture, medicine, and services. Among them, quadruped robots (also known as bionic mechanical dogs or quadrupedal dogs) can flexibly climb stairs, cross ditches, and cope with unstructured environments such as gravel and muddy ground thanks to their bionic four-legged structure. They can enter areas that wheeled and tracked robots cannot reach, such as ruins, mountains, and jungles, thus increasing the demand for quadruped robots in various fields.

[0023] The chassis is one of the core components of a quadruped robot. It houses circuit boards, power modules, and communication modules. The circuit boards contain various electrical components that generate heat during operation, especially high-heat-generating components such as power semiconductor devices, core computing components, and sampling resistors. This heat causes the circuit board to heat up. Most components have strict maximum operating temperatures; for example, capacitors operate at 85℃-125℃, and chips at 100℃-150℃. If the ambient temperature exceeds these thresholds, performance degradation, parameter drift, and even thermal breakdown, capacitor bulging, and leakage can occur, leading to overall circuit board failure.

[0024] Furthermore, high temperatures can interfere with the electrical characteristics of circuits. The positive temperature coefficient of a conductor causes its resistance to increase with rising temperature, leading to increased signal transmission loss and voltage drop, which may cause data transmission errors and control signal delays.

[0025] Furthermore, since component lifespan decreases exponentially with increasing temperature, high temperatures also accelerate component aging. Even if components do not fail immediately, they significantly reduce the long-term reliability of circuit boards, housings, and robots, increasing the probability of failure.

[0026] In addition, the heat dissipation methods in related technologies have a basically uniform heat dissipation rate for all parts of the circuit board, resulting in poor heat dissipation for components with high heat generation on the circuit board.

[0027] Therefore, if a circuit board is exposed to high temperatures for a long time, it will lead to reduced operating efficiency, component aging, and other adverse effects, affecting the stability and lifespan of the circuit board.

[0028] Based on this, embodiments of this application provide a heat dissipation structure, a housing, and a robot, which can dissipate heat from the circuit board as a whole while concentrating heat dissipation from components with high heat generation, thereby effectively improving the heat dissipation efficiency of the circuit board and reducing the impact of heat generated by components during operation on the circuit board, thereby improving the reliability and service life of the circuit board.

[0029] The following combination Figures 1 to 9The present application provides a detailed description of a heat dissipation structure 10, a machine compartment 100, and a robot 200 provided in the embodiments of this application.

[0030] Please see Figures 1 to 3 , Figure 1 This is a schematic diagram of the heat dissipation structure 10 provided in an exemplary embodiment of this application. Figure 2 This is a schematic diagram of the heat dissipation structure 10 and the circuit board 64 provided in an exemplary embodiment of this application. Figure 3 This is a schematic diagram illustrating the interaction between another heat dissipation structure 10 provided in an exemplary embodiment of this application and a circuit board 64. In a first aspect, a heat dissipation structure 10 is provided, which includes a heat-conducting plate 20, a heat-absorbing element 30, and a heat sink 40. The heat-conducting plate 20 includes a first heat-conducting portion 21 and a second heat-conducting portion 22 connected to each other. The first heat-conducting portion 21 and the second heat-conducting portion 22 extend in different directions. The first heat-conducting portion 21 is located on one side of the circuit board 64, such as... Figure 2 or Figure 3 As shown, its extension direction is the same as that of the circuit board 64. The heat absorber 30 is connected to the first heat-conducting part 21. The heat absorber 30 is disposed opposite to the heat-generating element of the circuit board 64 in the thickness direction of the circuit board 64. The heat sink 40 is thermally coupled to the second heat-conducting part 22 to dissipate the heat of the heat-conducting plate 20 to the outside.

[0031] It can be understood that the different extending directions of the first heat-conducting part 21 and the second heat-conducting part 22 mean that the first heat-conducting part 21 and the second heat-conducting part 22 are arranged at an angle. For example, the first heat-conducting part 21 extends along the Z direction, and the second heat-conducting part 22 extends along the X direction, such as... Figure 1 As shown. Correspondingly, circuit board 64 extends along the Z direction.

[0032] The first heat-conducting part 21 is located on one side of the circuit board 64, and its extension direction is the same as that of the circuit board 64. This allows the heat generated by the circuit board 64 to be evenly conducted to the first heat-conducting part 21, increasing the heat dissipation area and reducing the overall temperature.

[0033] It can be understood that the heat sink 40 dissipates the heat of the second heat-conducting part 22 to the outside, which means that the heat sink 40 cools the second heat-conducting part 22, and cools the circuit board 64 through the heat-conducting plate 20.

[0034] In this configuration, the heat-absorbing element 30 is positioned opposite the high-heat-generating element of the circuit board 64 along its thickness direction. This means that the heat-absorbing element 30 and the high-heat-generating element are arranged sequentially along a straight line parallel to the thickness direction of the circuit board 64. This arrangement brings the heat-absorbing element 30 close to the heat-generating element, allowing it to concentrate heat absorption from that element. The heat-generating element opposite the heat-absorbing element 30 can be at least the element with the highest heat generation on the circuit board, or at least a temperature-sensitive element or element with low temperature resistance, or at least the element with the highest maintenance cost. The specific heat-generating element(s) that the heat-absorbing element 30 is positioned opposite depends on the application and requirements of the circuit board.

[0035] Thermal coupling refers to a cooperative method in which heat is exchanged between two or more objects through heat transfer. Specifically, when the heat-conducting plate 20 absorbs heat from the circuit board 64, the absorbed heat is conducted to the heat sink 40 through direct or indirect contact. Specifically, the thermal coupling between the heat sink 40 and the second heat-conducting part 22 can be achieved by the heat sink 40 directly contacting the second heat-conducting part 22 to achieve heat transfer, thereby dissipating heat from the second heat-conducting part 22 and cooling the circuit board 64. Alternatively, the thermal coupling between the heat sink 40 and the second heat-conducting part 22 can also be achieved by the heat sink 40 transferring heat through an intermediate component located between itself and the second heat-conducting part 22. That is, at least a portion of the intermediate component is located between the heat sink 40 and the second heat-conducting part 22, absorbing heat from the second heat-conducting part 22 and transferring it to the heat sink 40, thereby cooling the circuit board 64.

[0036] It is understood that the heat-absorbing component 30 can be located on the side of the first heat-conducting part 21 away from the circuit board 64, such as... Figure 2 As shown. Figure 2 In the circuit, the first heat-conducting part 21 absorbs the heat generated when the circuit board 64 is working, while the heat-absorbing part 30 is positioned opposite the first heat-conducting part 21 and the components on the circuit board 64 that generate a lot of heat. Thus, the heat from the part opposite the first heat-conducting part 21 and the components that generate a lot of heat can be quickly absorbed by the heat-absorbing part 30, so that the part opposite the first heat-conducting part 21 and the components that generate a lot of heat can absorb more heat, thereby improving the heat dissipation efficiency of the heat dissipation structure 10.

[0037] It is understandable that the heat-absorbing component 30 can also be located on the side of the first heat-conducting part 21 facing the circuit board 64, such as... Figure 3 As shown. Figure 3In the circuit board 64, the heat-absorbing component 30 is arranged adjacent to the components that generate a lot of heat. The heat-absorbing component 30 can absorb the heat generated by the components. Through the connection between the heat-absorbing component 30 and the first heat-conducting part 21, the heat absorbed by the heat-absorbing component 30 is guided to the first heat-conducting part 21, so as to dissipate heat over a large area through the heat-absorbing plate. This quickly removes the heat generated by the components that generate a lot of heat, thereby improving the heat dissipation efficiency of the heat dissipation structure 10.

[0038] It is understood that the heat-conducting plate 20 can be disposed on the back side of the circuit board 64 or on the front side of the circuit board 64. The specific placement of the heat-conducting plate 20 is determined according to the installation and application scenarios of the circuit board 64.

[0039] It is understood that the heat-conducting plate 20 can be a metal plate, such as an aluminum plate, an aluminum alloy plate, a copper plate, or a copper alloy plate. The heat-conducting plate 20 can also be a graphite plate. For example, the heat-conducting plate 20 is an aluminum plate.

[0040] The heat absorber 30 can be made of metal or graphite; for example, the heat absorber 30 is made of copper.

[0041] The heat-absorbing component 30 can be fixed to the heat-conducting plate 20 by screws or other components, or it can be glued to the heat-conducting plate 20. Alternatively, the heat-absorbing component 30 can be integrally formed with the heat-conducting plate 20.

[0042] It is understandable that when the heat absorber 30 and the heat conduction plate 20 are set separately, in order to avoid the existence of contact gaps that lead to low heat conduction efficiency, thermally conductive adhesive 53 can be set between the heat absorber 30 and the heat conduction plate 20 to fill the mating gap between the heat absorber 30 and the heat conduction plate 20, thereby improving the heat conduction efficiency.

[0043] For example, the heat absorber 30 can be metal, graphite, or a structure filled with a phase change material, or the heat absorber 30 can be a heat dissipation fin.

[0044] In this embodiment, the heat generated by the circuit board 64 is absorbed by the heat-conducting plate 20, increasing the heat dissipation area. The heat-absorbing component 30 concentrates the heat dissipation of components with high heat generation. Thus, on the basis of overall heat dissipation of the circuit board 64, the heat-absorbing component 30 quickly absorbs the heat generated by the components with high heat generation on the circuit board 64 to the heat-conducting plate, thereby improving the heat dissipation efficiency of the circuit board 64, reducing the impact of the heat generated by the components on the circuit board 64 during operation, and improving the reliability and service life of the circuit board 64.

[0045] Please see Figure 1In some embodiments, the heat sink 40 includes a heat sink 41. The heat sink 41 is thermally coupled to the second heat-conducting part 22. The heat sink 41 has a heat dissipation airflow channel. This allows the heat sink 40 to have a larger surface area, increasing the contact area between the heat sink 40 and the air, thereby improving the heat dissipation efficiency of the heat sink 40. This allows the heat sink 40 to quickly remove heat from the second heat-conducting part 22, improving the heat dissipation efficiency of the circuit board 64, and thus enhancing the reliability and lifespan of the circuit board 64.

[0046] For example, heat sink 41 is an aluminum finned heat sink.

[0047] Please see Figure 1 In some embodiments, the heat sink 41 extends along the extending direction of the second heat-conducting part 22 to form a contact surface 413. The heat sink 41 is connected to the second heat-conducting part 22 through the contact surface 413 to form thermal coupling. In this way, the heat-conducting surface between the heat sink 41 and the second heat-conducting part 22 can be larger, thereby improving the heat conduction efficiency between them. This allows the heat sink 40 to quickly remove the heat from the second heat-conducting part 22, improving the heat dissipation efficiency of the circuit board 64 and thus improving the reliability and service life of the circuit board 64.

[0048] It is understood that the connection between the contact surface 413 and the second heat-conducting part 22 can be a direct connection or a connection through other components. The connection can be achieved by using adhesive or similar materials to bond them together, or by allowing the opposing surfaces to contact or adhere to each other.

[0049] Please see Figure 1 In some embodiments, the heat sink 40 further includes a cooling fan 42. The cooling fan 42 is disposed at one end of the heat dissipation duct. The exhaust end of the cooling fan 42 faces the heat dissipation duct. In this way, the cooling fan 42 can remove heat from the surface of the heat sink 41, thereby quickly removing heat from the second heat-conducting part 22, improving the heat dissipation efficiency of the circuit board 64, and thus improving the reliability and service life of the circuit board 64.

[0050] Please see Figure 1 In some embodiments, the heat sink 41 includes a first plate 411 and a plurality of second plates 412. The first plate 411 is thermally coupled to the second heat-conducting part 22. The plurality of second plates 412 are located on the side of the first plate 411 opposite to the second heat-conducting part 22 and are connected to the first plate 411. The plurality of second plates 412 are arranged side by side to define a heat dissipation channel between adjacent second plates 412. In this way, the surface area of ​​the heat sink 41 can be increased, which is conducive to increasing the contact area between the heat sink 41 and the air, thereby improving the heat dissipation efficiency of the heat sink 41.

[0051] For example, the heat sink 41 is a single piece. Specifically, the heat sink 41 is formed by aluminum extrusion.

[0052] Please see Figure 2 In some embodiments, the first heat-conducting part 21 and the second heat-conducting part 22 are perpendicular to each other, and one end of the first heat-conducting part 21 is connected to one end of the second heat-conducting part 22. In this way, the heat absorption and heat dissipation of the heat-conducting plate 20 do not affect each other, thereby improving the heat dissipation efficiency of the heat dissipation structure 10.

[0053] In some embodiments, the heat-conducting plate 20 is a single piece. This increases the structural strength of the heat-conducting plate 20, thereby improving reliability.

[0054] Specifically, the heat-conducting plate 20 is bent to form a first plate 411 and a second plate 412 that are vertically connected.

[0055] Please see Figure 4 , Figure 4 This is a schematic diagram of the internal structure of the heat absorber 30 provided in an exemplary embodiment of this application. In some embodiments, the heat absorber 30 has an inner cavity 31, in which a phase change material 32 is disposed. In this way, the latent heat of phase change of the phase change material 32 can be used to absorb the heat conducted to the heat absorber 30, thereby improving the heat dissipation efficiency of the heat dissipation structure 10.

[0056] It can be understood that phase change material 32 refers to a material that can absorb or release a large amount of heat (i.e., "latent heat") when undergoing a phase change at a specific temperature (such as solid → liquid, liquid → gas, solid → solid), while maintaining a basically constant temperature. Its core characteristic is the storage and release of energy through a phase change process, thereby achieving temperature regulation. Furthermore, the latent heat of phase change material 32 during the phase change process (energy storage or release) is much greater than the sensible heat (i.e., the heat absorbed or released when the temperature changes) of conventional materials. Near the phase change point, the temperature of phase change material 32 changes little and is almost constant. Simultaneously, the phase change process of phase change material 32 is reversible, and it can maintain stable energy storage performance and chemical stability even after multiple phase change cycles.

[0057] For example, the phase change material 32 may be a paraffin (e.g., hexadecane, heptadecane, octadecane, eicosane or a mixture thereof), a fatty acid (e.g., stearic acid, palmitic acid, myristic acid), or polyethylene glycol.

[0058] In some embodiments, the heat-absorbing element 30 is strip-shaped. This can improve the concentrated heat absorption effect of the heat-absorbing element 30 on components that generate high heat on the circuit board 64, thereby improving the heat dissipation efficiency of the heat dissipation structure 10.

[0059] In some embodiments, the circuit board 64 and the heat absorber 30 are fixedly connected to the first heat-conducting part 21, and the heat sink 40 is fixedly connected to the second heat-conducting part 22. In this way, the circuit board 64 and the heat absorber 30 are connected to the first heat-conducting part 21 as a whole, forming a modular structure that is easy to disassemble and maintain.

[0060] For example, a nut is riveted to the first heat-conducting part 21, and the end of the screw shank passes through the body of the circuit board 64 and is threaded into the nut.

[0061] Please see Figure 1 and Figure 5 , Figure 5 This is a side view of the heat-absorbing structure provided in an exemplary embodiment of this application. In some embodiments, the heat dissipation structure 10 further includes a connecting piece 51 and a locking member 52. The two ends of the connecting piece 51 are connected to the first heat-conducting part 21 via the locking member 52 to define a through hole 24 between the connecting piece 51 and the first heat-conducting part 21. The heat-absorbing member 30 passes through the through hole 24. In this way, the heat-absorbing member 30 can be fixed to one side of the heat-conducting plate 20 in a circumferential manner, thereby improving the fixing stability of the heat-absorbing member 30.

[0062] Specifically, the locking element 52 is a screw, and the end of the screw shank passes through the connecting piece 51 and is threaded into the heat-conducting plate 20.

[0063] Alternatively, screws can be directly threaded to the heat-conducting plate 20, or internally threaded components can be riveted or welded onto the heat-conducting plate 20, with the screws threaded to the internally threaded components.

[0064] Please see Figure 5 In some embodiments, a thermally conductive adhesive 53 is provided between the heat-absorbing element 30 and the first thermally conductive part 21. In this way, the thermally conductive adhesive 53 can fill the mating gap between the heat-absorbing element 30 and the first thermally conductive part 21, thereby eliminating the air insulation layer, reducing contact thermal resistance, and improving heat transfer efficiency.

[0065] Please see Figure 2 In some embodiments, the heat-absorbing element 30 is configured to be located on the side of the first heat-conducting part 21 away from the circuit board 64, and thermally conductive adhesive 53 is provided between the first heat-conducting part 21 and the heat-generating element. This allows the first heat-conducting part 21 to be positioned closer to the circuit board 64, thereby improving the heat dissipation efficiency of the heat dissipation structure 10 for each component of the circuit board 64. Furthermore, the thermally conductive adhesive 53 can fill the gap between the heat-absorbing element 30 and the heat-conducting plate 20, thereby improving heat conduction efficiency.

[0066] Please see Figure 6 , Figure 6This is a side view of another heat-absorbing structure provided in an exemplary embodiment of this application. In some embodiments, the heat-absorbing member 30 is configured to be located on the side of the first heat-conducting part 21 facing the circuit board 64, and a groove 23 is provided on the side of the first heat-conducting part 21 facing the circuit board 64, with the heat-absorbing member 30 disposed within the groove 23. In this way, the heat-absorbing member 30 can be positioned facing the circuit board 64, and the distance between the remaining part of the first heat-conducting part 21 and the circuit board 64 can be reduced, thereby improving the heat dissipation efficiency of the heat dissipation structure 10.

[0067] Please see Figure 7 and Figure 8 , Figure 7 This is a schematic diagram of the structure of the cabin 100 provided in an exemplary embodiment of this application. Figure 8 yes Figure 7 A cross-sectional view of AA. In a second aspect, embodiments of this application provide a chassis 100. The chassis 100 includes a housing 60, a first circuit board 61, and the aforementioned heat dissipation structure 10. The housing 60 has a mounting cavity 63. The first circuit board 61 is disposed in the mounting cavity 63. A heat-conducting plate 20 and a heat-absorbing member 30 are disposed in the mounting cavity 63. A first heat-conducting portion 21 is disposed on the back side of the first circuit board 61. A second heat-conducting portion 22 contacts the inner wall of the housing 60. A heat sink 40 is disposed on the outside of the housing 60 and contacts the portion of the housing 60 near the second heat-conducting portion 22.

[0068] The first circuit board 61 is connected to the heat-conducting plate 20 by screws.

[0069] Specifically, the first circuit board 61 is fixed inside the housing 60 by the heat-conducting plate 20. Thus, the first circuit board 61 and the heat-conducting plate 20 can be assembled as a single unit before the first circuit board 61 is installed in the mounting cavity 63. This allows the heat-conducting plate 20 to protect the first circuit board 61 throughout the assembly process, improving assembly reliability and maintainability.

[0070] It is understood that the nacelle 100 includes the aforementioned heat dissipation structure 10, and the nacelle 100 has all the beneficial effects of the aforementioned heat dissipation structure 10, which will not be repeated here.

[0071] Please see Figure 8 In some embodiments, the cabin 100 further includes a second circuit board 62. The first circuit board 61 is arranged along a first direction. The second circuit board 62 is arranged along a second direction. The first direction and the second direction are not parallel to each other. In this way, multiple circuit boards 64 can be arranged within the cabin 100, and compared with the scheme of arranging multiple circuit boards 64 side by side, this embodiment can improve the compactness of the internal component arrangement of the cabin 100 through the above arrangement, so as to reduce the overall volume of the cabin 100.

[0072] It is understandable that the first circuit board 61 and the second circuit board 62 are set at an angle.

[0073] For example, the first direction is perpendicular to the second direction. Correspondingly, the substrate of the first circuit board 61 is perpendicular to the substrate of the second circuit board 62.

[0074] Please see Figure 9 , Figure 9 This is a structural block diagram of a robot 200 provided in an exemplary embodiment of this application. According to a third aspect of this application, a robot 200 is provided, which includes the aforementioned cabin 100.

[0075] The robot 200 can be a quadruped robot 200, a wheeled robot 200, or a tracked robot 200, etc., and this application does not make any specific limitation in this regard.

[0076] It is understood that the robot 200 includes the heat dissipation structure 10 described above, and the robot 200 has all the beneficial effects of the heat dissipation structure 10 described above, which will not be repeated here.

[0077] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0078] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0079] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0080] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A heat dissipation structure (10) for heat dissipation of a circuit board, characterized in that, The heat dissipation structure (10) includes: The heat-conducting plate (20) includes a first heat-conducting part (21) and a second heat-conducting part (22) connected to each other. The first heat-conducting part (21) and the second heat-conducting part (22) have different extension directions. The first heat-conducting part (21) is located on one side of the circuit board and its extension direction is the same as that of the circuit board. The heating element of the circuit board is thermally coupled to the first heat-conducting part (21). A heat-absorbing element (30) is connected to the first heat-conducting part (21), and the heat-absorbing element (30) is disposed opposite to the heating element of the circuit board in the thickness direction of the circuit board; and The heat sink (40) is thermally coupled to the second heat-conducting part (22) to dissipate the heat of the heat-conducting plate (20) to the outside.

2. The heat dissipation structure (10) according to claim 1, characterized in that, The radiator (40) includes a heat sink (41), which is thermally coupled to the second heat-conducting part (22), and the heat sink (41) has a heat dissipation duct.

3. The heat dissipation structure (10) according to claim 2, characterized in that, The heat sink (41) extends along the extension direction of the second heat-conducting part (22) to form a contact surface (413). The heat sink (41) is connected to the second heat-conducting part (22) through the contact surface (413) to form a thermal coupling.

4. The heat dissipation structure (10) according to claim 2, characterized in that, The radiator (40) also includes a cooling fan (42), which is located at one end of the cooling duct and the air outlet of the cooling fan (42) faces the cooling duct.

5. The heat dissipation structure (10) according to any one of claims 1 to 4, characterized in that, The heat absorber (30) has an inner cavity (31) in which a phase change material (32) is disposed; And / or, the heat-absorbing element (30) is strip-shaped.

6. The heat dissipation structure (10) according to any one of claims 1 to 4, characterized in that, The circuit board and the heat absorber (30) are fixedly connected to the first heat-conducting part (21), and the heat sink (40) is fixedly connected to the second heat-conducting part (22).

7. The heat dissipation structure (10) according to any one of claims 1 to 4, characterized in that, A thermally conductive adhesive (53) is provided between the heat-absorbing element (30) and the first heat-conducting part (21); And / or, the heat-absorbing element (30) is configured to be located on the side of the first heat-conducting part (21) away from the circuit board (64), and thermally conductive adhesive (53) is provided between the first heat-conducting part (21) and the heating element.

8. A cabin (100), characterized in that, include: The outer casing (60) has a mounting cavity (63); A first circuit board (61) is disposed in the mounting cavity (63); as well as In the heat dissipation structure (10) as described in any one of claims 1 to 7, the heat-conducting plate (20) and the heat-absorbing element (30) are disposed in the mounting cavity (63), the first heat-conducting part (21) is disposed on the back side of the first circuit board (61), the second heat-conducting part (22) is in contact with the inner wall of the outer shell (60), and the heat sink (40) is disposed outside the outer shell (60) and in contact with the part of the outer shell (60) near the second heat-conducting part (22).

9. The cabin (100) according to claim 8, characterized in that, The nacelle (100) further includes a second circuit board (62), the first circuit board (61) is arranged along a first direction, and the second circuit board (62) is arranged along a second direction, wherein the first direction and the second direction are not parallel to each other.

10. A robot (200), characterized in that, Includes the cabin (100) as described in claim 9.

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