A new high-power ultra-thin power supply

Abstract

The utility model relates to power supply equipment technical field especially discloses a novel high -power ultrathin power, aims at solving the short board that traditional high -power power supply volume is big, heat dissipation efficiency is low, structural stability is poor, adaptive ultrathin equipment scene ability is insufficient. Through the shell and the shell buckle and form flat rectangular cavity, the upper shell inner wall heat dissipation boss is contacted with power component through heat conducting medium, and the upper shell outer wall heat dissipation rib and the shell heat dissipation hole, the shell inboard radiator form multi-path heat dissipation structure, with the fixed assembly is worn each component screw hole and realizes the close assembly, and the power component heat conduction, multi-path discharge whole structure stable high -efficient operation process is completed, and the stability of power supply is guaranteed when high -power output. The power supply has the advantages of ultrathin size, heat dissipation high efficiency, structural stability, and adapts to the demand of high -power power consumption scene of the strict restriction of power supply volume such as all -in -one, portable equipment.

Description

Technical Field

[0001] This utility model relates to the field of power supply equipment technology, and in particular to a novel high-power ultra-thin power supply. Background Technology

[0002] In the field of electronic devices, high-power power supplies are core power components for devices such as all-in-one PCs, portable workstations, and industrial control terminals. Their size, heat dissipation efficiency, and structural stability directly determine the integration, operational reliability, and lifespan of the terminal devices, while also being closely related to the portability and installation adaptability of the devices. If the power supply is too large, the terminal devices will not be able to meet the requirements of ultra-thin design, making it difficult to adapt to the current mainstream thin and light electronic device scenarios. If the heat dissipation efficiency is insufficient, the internal power components are prone to performance degradation due to high temperatures during high-power output, and may even cause shutdown failures, seriously affecting the operational stability of the equipment. If the structural stability is poor, internal components are prone to displacement and loosening under transportation or vibration environments, which can not only damage circuit connections but also create safety hazards due to component collisions. Therefore, high-power power supplies that combine ultra-thin size, efficient heat dissipation, and stable structure are one of the key fundamental components driving the development of electronic devices towards thinner, lighter, and more reliable designs.

[0003] Existing high-power power supplies suffer from the following prominent problems in practical applications: Their overall size is too large, especially in thickness, making them unsuitable for ultra-thin electronic devices with strict space constraints; the large amount of heat generated by internal power components during operation is easily dissipated by a single casing, leading to localized heat buildup and excessively high component temperatures, affecting power output stability and lifespan; furthermore, many internal components rely on single screws for fixing, which can easily loosen and shift under vibration, and the lack of precise positioning at some structural joints can cause component misalignment during assembly, affecting the overall structural stability and circuit safety of the power supply. To address these issues, additional heat dissipation accessories or reinforcement structures are required, further increasing the power supply's size, production costs, and assembly complexity, making it difficult to simultaneously meet the comprehensive requirements of ultra-thinness, high power, and high stability. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a novel high-power ultra-thin power supply, which solves the technical problems of traditional high-power power supplies being large in size, having low heat dissipation efficiency, poor structural stability, and being difficult to adapt to ultra-thin electronic device scenarios.

[0005] To achieve the above objectives, this utility model provides the following technical solution: A novel high-power ultra-thin power supply includes an upper shell and a lower shell, which are detachably fastened together by a fixing component to form a flat rectangular accommodating cavity. The inner wall of the upper shell has six evenly spaced trapezoidal slots, each fitted with a dedicated cover plate. The outer side of the upper shell has integrally formed heat dissipation fins, with a groove on the left side of the fins to optimize airflow. Threaded holes for assembly are pre-set at the four corners of the upper shell. Inside the accommodating cavity is a power component carrier assembly, which includes a diamond-shaped grid plate. A rectifier bridge, a high-frequency transformer, and a power MOSFET are movably mounted on the diamond-shaped grid plate, forming the core power supply component. The power component assembly includes a heat dissipation component above the diamond-shaped grid plate. The heat dissipation component includes a heat dissipation boss that is movably installed inside the trapezoidal slot. A heat-conducting medium for heat conduction is attached to the bottom of the heat dissipation boss. The side of the heat-conducting medium away from the heat dissipation boss is in contact with the top surface of the power component assembly. The lower shell has pre-set threaded holes at its four corners that correspond to the threaded holes of the upper shell. A heat sink corresponding to the position of the high-frequency transformer is fixedly installed on the inner side of the lower shell. A heat dissipation hole penetrating into the accommodating cavity is opened on the side wall of the lower shell. The fixing component includes a connector that passes through the threaded holes of the upper shell, lower shell and cover plate. The upper shell, lower shell and cover plate are tightly assembled by fastening the connector.

[0006] Preferred design: The upper shell adopts a flat structure design, with the heat dissipation fins integrally formed on the outer side and arranged parallel to the length of the upper shell. The groove on the left side of the heat dissipation fins is integrally formed with the heat dissipation fins, which can guide the airflow to flow orderly along the surface of the heat dissipation fins, reduce the dead corners of airflow stagnation, and improve the heat dissipation efficiency of the upper shell. The trapezoidal slots on the inner side wall of the upper shell are symmetrically and evenly distributed. The inner wall of the slots is smoothed to facilitate the flexible installation and position adjustment of the heat dissipation protrusions, while ensuring the fit and fit with the cover plate and avoiding structural loosening caused by assembly gaps.

[0007] Preferably, the diamond-shaped grid plate in the power component carrier assembly adopts a hollow structure, and its surface is pre-set with mounting positions adapted to the rectifier bridge, high-frequency transformer and power MOSFET. The inner wall of the mounting position is provided with an anti-slip buffer pad, which can provide stable positioning for the power component and prevent the component from shifting under vibration. The edge of the diamond-shaped grid plate is fitted to the inner wall of the accommodating cavity, providing stable support for the power component through its own structural characteristics, while not occupying extra space and ensuring the ultra-thin size of the power supply as a whole.

[0008] Preferably, the heat dissipation assembly consists of a heat dissipation boss, a thermally conductive medium, and a heat sink on the inner side of the lower shell. The heat dissipation boss is movably installed inside the trapezoidal slot and can be flexibly adjusted according to the installation position of the power components to ensure full contact with the thermally conductive medium. The thermally conductive medium is sandwiched between the heat dissipation boss and the power component assembly, and fills the tiny gaps at the contact surface through its own deformation, thereby improving the heat conduction efficiency. The heat sink is fixed on the inner side of the lower shell and faces the high-frequency transformer, which can specifically absorb the concentrated heat generated by the high-frequency transformer, forming a dual heat dissipation path from the heat dissipation boss to the thermally conductive medium and the heat sink.

[0009] Preferably, the heat dissipation holes on the side wall of the lower shell are evenly arranged along the length of the lower shell, and the axis of the heat dissipation holes is inclined at a preset angle to the bottom surface of the lower shell. This can ensure airflow while reducing the direct entry of external dust and impurities into the cavity. The threaded holes at the four corners of the lower shell are coaxially corresponding to the threaded holes of the upper shell. The inner wall of the threaded holes is provided with an anti-loosening thread structure. After the connecting parts are tightened, it can effectively prevent the screws from loosening due to vibration and improve the assembly stability of the upper and lower shells.

[0010] Preferably, the fixing component includes a connector and threaded holes pre-drilled in the upper shell, lower shell, and cover plate; the connector adopts a countersunk structure, and its head can be completely embedded in the countersunk hole on the surface of the cover plate, avoiding the protruding structure from affecting the overall flatness of the power supply; the threaded holes on the cover plate correspond precisely to the threaded holes in the upper shell and lower shell, and when the connector is sequentially passed through the threaded holes of the cover plate, upper shell, and lower shell and tightened, the cover plate and trapezoidal slot, and the upper shell and lower shell can be tightly fixed simultaneously, simplifying the assembly process.

[0011] Compared with the prior art, the present invention has the following beneficial effects: The device achieves dual improvements in compatibility between ultra-thin size and high-power output, covering the power needs of ultra-thin devices. Through a flat snap-fit ​​structure from the upper shell to the lower shell and a trapezoidal slot for precise assembly, it overcomes the limitations of traditional high-power power supplies that are bulky and difficult to compress in thickness. The flat rectangular cavity enclosed by the upper and lower shells, combined with the diamond-shaped grid plate for compact support of power components, enables an orderly layout of core components within a limited space, significantly reducing the overall thickness of the power supply. It can be directly adapted to ultra-thin installation scenarios such as all-in-one machines and portable devices. The matching assembly of the trapezoidal slot and the special cover plate avoids the space occupied by additional reinforcement structures and ensures that the heat dissipation components and power components are precisely matched by limiting the heat dissipation protrusions through the slot, thus solving the problem that traditional power supplies cannot achieve both ultra-thinness and structural stability. Meanwhile, the multi-path heat dissipation structure works in synergy with power components to specifically absorb the heat generated by different components. The heat dissipation protrusions on the upper shell cover the rectifier bridge and power MOSFETs through a thermally conductive medium, while the heat sink on the lower shell precisely corresponds to the high-frequency transformer. Combined with the optimized airflow of the heat dissipation fins and holes, a triple path of top conductive heat dissipation, bottom directional heat dissipation, and external airflow-assisted heat dissipation is formed, which completely solves the problem of heat accumulation caused by the single heat dissipation of traditional power supplies. Even under high power output conditions, the component temperature can still be stably controlled within a safe range, and the power output stability and service life of the power supply are significantly improved. Attached Figure Description

[0012] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.

[0013] Figure 1This is an overall structural diagram of the present invention; Figure 2 This is a structural diagram of the lower shell of this utility model; Figure 3 This is a structural diagram of the rectifier bridge, high-frequency transformer, and power MOSFET of this utility model; Figure 4 This is a structural diagram of the heat dissipation boss of this utility model; Figure 5 This utility model Figure 3 Enlarged view of point A in the image; Figure 6 This utility model Figure 4 Enlarged view of point B in the image.

[0014] Legend: 1. Upper shell; 2. Heat dissipation fins; 3. Groove; 4. Threaded hole; 5. Lower shell; 6. Heat dissipation hole; 7. Heat sink; 8. Rectifier bridge; 9. High-frequency transformer; 10. Power MOSFET; 11. Diamond grid plate; 12. Thermal conductive silicone pad; 13. Heat dissipation boss; 14. Trapezoidal slot; 15. Cover plate; 16. Screw hole. Detailed Implementation

[0015] This application provides a novel high-power ultra-thin power supply, which effectively solves the problems of traditional high-power power supplies being large in size, having low heat dissipation efficiency, poor structural stability, and being difficult to adapt to ultra-thin electronic device scenarios.

[0016] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the overall concept of the embodiments of this application is as follows: To address the problems existing in the prior art, this utility model provides a novel high-power ultra-thin power supply, aiming to solve the shortcomings of traditional power supplies, such as easy heat accumulation due to single heat dissipation, difficulty in balancing ultra-thinness and structural stability, and insufficient adaptability to ultra-thin devices. By combining a flat shell snap-fit ​​structure with a multi-path heat dissipation collaborative design, the power supply's size adaptability, heat dissipation reliability, and structural stability in ultra-thin device scenarios are improved, meeting the dual requirements of all-in-one machines and portable devices for ultra-thin power supply size and high power output, while ensuring long-term safety and stability.

[0017] The structure and connection relationships of each part of this utility model are as follows: Upper shell 1: The outer side features an integrally formed parallel strip-shaped heat dissipation rib 2, with a groove 3 fixedly formed on the left side of the heat dissipation rib 2. The inner side wall is evenly provided with six trapezoidal slots 14, and threaded holes 4 are fixedly formed at the four corners. It has no redundant protrusions and is suitable for ultra-thin dimensions. Together with the lower shell 5, it forms a flat rectangular accommodating cavity to accommodate internal components. As the core heat dissipation carrier, the outer heat dissipation rib 2 increases the heat dissipation area, and the groove 3 optimizes airflow and accelerates heat dissipation. The inner trapezoidal slots 14 provide a positioning and installation base for the heat dissipation boss 13 and the cover plate 15.

[0018] Lower shell 5: Adapted to the shape of upper shell 1, it is flat and rectangular. Threaded holes 4, corresponding to the threaded holes 4 on upper shell 1, are fixedly opened at the four corners. A heat sink 7 is fixedly installed on the inner side, and heat dissipation holes 6, extending through to the accommodating cavity, are fixedly opened on the side wall. Together with the upper shell 1, it achieves an ultra-thin overall power supply structure, providing physical protection for internal components. The inner heat sink 7 specifically absorbs heat from the high-frequency transformer 9, and the side wall heat dissipation holes 6 facilitate airflow exchange between the accommodating cavity and the outside, forming an auxiliary heat dissipation channel.

[0019] Cover plate 15: Its shape is adapted to the top contour of the trapezoidal slot 14 inside the upper shell 1.

[0020] Heat dissipation fin 2: integrally formed with the outer side of the upper shell 1, in the shape of parallel strips, with a groove 3 fixed on the left side; the length is the same as the length of the upper shell 1, with no redundant height, adapting to the ultra-thin overall size. It increases the contact area between the upper shell 1 and the air, accelerating the outward diffusion of heat conducted by the upper shell 1; the groove 3 guides the airflow to flow orderly along the surface of the heat dissipation fin 2, reducing airflow stagnation dead corners and improving heat dissipation efficiency.

[0021] Groove 3: Fixedly formed on the left side of heat dissipation rib 2, extending along the length of heat dissipation rib 2. The groove shape is adapted to airflow requirements and has no sharp edges. It is integrally formed with heat dissipation rib 2 and upper shell 1, and is only located on a specific side of heat dissipation rib 2. It optimizes the airflow path around heat dissipation rib 2, avoids the formation of dead zones between heat dissipation ribs 2, enhances the heat exchange efficiency between air and heat dissipation rib 2, and helps to improve the overall heat dissipation effect of upper shell 1.

[0022] Threaded holes 4: are fixedly opened at the four corners of the upper shell 1 and the four corners of the lower shell 5 respectively. The hole diameter is adapted to the countersunk screw, the hole wall is burr-free, and the depth is adapted to the length of the connecting parts.

[0023] Heat dissipation holes 6: Fixedly formed on the side wall of the lower shell 5, evenly distributed along the length of the lower shell 5, the holes penetrate the side wall of the lower shell 5, and the hole diameter is adapted to the airflow requirements, eliminating the risk of blockage. They are integrally formed with the lower shell 5, and the holes connect the housing cavity to the external space, avoiding internal components. This allows for air convection between the housing cavity and the outside, carrying away the heat generated by the power components inside the housing cavity with the airflow; simultaneously, in conjunction with the heat sink 7 inside the lower shell 5, it accelerates the dissipation of heat from the surface of the heat sink 7, forming an auxiliary heat dissipation path.

[0024] Heat sink 7: Fixedly installed inside the lower shell 5, it absorbs the concentrated heat generated by the high-frequency transformer 9 during operation, and transfers the heat to the lower shell 5 through its own conduction, and then dissipates it through the lower shell 5 and the heat dissipation hole 6, so as to avoid local heat accumulation in the high-frequency transformer 9 and ensure its working stability.

[0025] Rectifier bridge 8: It has a modular structure and is equipped with a mounting interface that matches the diamond grid plate 11. The pins are adapted to the PCB board soldering requirements. It is compact in size and does not occupy any extra space. It is movably mounted on the diamond grid plate 11, and the pins are soldered to the PCB board for fixation. The top surface is attached to the thermally conductive silicone pad 12.

[0026] High-frequency transformer 9: It has an installation structure that is compatible with the diamond grid plate 11, the bottom surface is compatible with the heat sink 7, and the top surface is in contact with the thermally conductive silicone pad 12.

[0027] Power MOSFET 10: It has a mounting position that is compatible with the diamond grid plate 11, and the top surface is flat and compatible with the thermally conductive silicone pad 12.

[0028] Diamond-shaped grid plate 11: Flat in shape, with a pre-designed mounting structure on its surface to accommodate the rectifier bridge 8, high-frequency transformer 9, and power MOSFET 10. It is thin and lightweight, with dimensions adapted to the internal space of the housing. Located within the housing enclosed by the upper shell 1 and lower shell 5, its bottom contacts the inner support structure of the lower shell 5, while the top mounts the rectifier bridge 8, high-frequency transformer 9, and power MOSFET 10. The top surface contacts the thermally conductive silicone pad 12. It provides precise support and positioning for the core power component group, enabling a compact and orderly arrangement of components within the ultra-thin housing, preventing component displacement. Simultaneously, it separates the components from the lower shell 5, preventing direct contact between components and the housing, thus ensuring circuit safety.

[0029] Thermally conductive silicone pad 12: Its dimensions are adapted to the bottom surface of the heat dissipation boss 13, the top surface of the rectifier bridge 8, the top surface of the high-frequency transformer 9, and the top surface of the power MOSFET 10. It is sandwiched between the bottom of the heat dissipation boss 13 and the top surfaces of the rectifier bridge 8, high-frequency transformer 9, and power MOSFET 10, completely covering the contact surfaces without any noticeable gaps. It uses its own deformation to fill the tiny gaps between the heat dissipation boss 13 and the contact surfaces of the power components, eliminating contact thermal resistance, improving the heat conduction efficiency from the power components to the heat dissipation boss 13, and ensuring the continuity of the top heat dissipation path.

[0030] Heat dissipation protrusion 13: The bottom surface is flat and adapted to the thermal conductive silicone pad 12, and the top is provided with a connection structure adapted to the trapezoidal slot 14 inside the upper shell 1; the number matches the number of core power components. It specifically covers the top surface of the rectifier bridge 8, power MOSFET 10 and high-frequency transformer 9, so as to efficiently transfer the heat generated by these components to the upper shell 1, and then dissipate it through the heat dissipation fins 2 on the outside of the upper shell 1, forming the main heat dissipation path at the top of the power supply.

[0031] Trapezoidal slots 14: Six in total, evenly distributed on the inner wall of the upper shell 1. The slots are trapezoidal in shape with flat walls. Their dimensions are adapted to the top connection structure of the heat dissipation boss 13 and the edge of the cover plate 15. The depth is adapted to the cavity space with no redundant dimensions. They provide a positioning and installation base for the heat dissipation boss 13, ensuring that the heat dissipation boss 13 can accurately correspond to the power components; at the same time, they provide installation support for the cover plate 15.

[0032] Screw hole 16: Fixedly opened on cover plate 15, the hole diameter is adapted to countersunk screws, the hole wall is smooth, and the depth is adapted to the needs of connecting parts.

[0033] Working principle: This invention achieves ultra-thin installation and stable, efficient operation of a high-power power supply through a combination of ultra-thin shell packaging and multi-path heat dissipation with coordinated temperature control. The specific process is as follows: When the power supply is running, the heat generated by the rectifier bridge 8 and the power MOSFET 10 is transferred to the heat dissipation boss 13 through the top thermal conductive silicone pad 12. The heat dissipation boss 13 conducts the heat to the upper shell 1. The heat dissipation fins 2 on the outside of the upper shell 1 increase the heat dissipation area. Together with the groove 3 on the left side of the heat dissipation fins 2, they guide the airflow and accelerate the diffusion of heat into the air, forming the main heat dissipation path at the top. When the high-frequency transformer 9 is working, part of the concentrated heat is incorporated into the top heat dissipation path through the top thermal conductive silicone pad 12, and the other part is transferred to the lower shell 5 through the bottom heat sink 7. The heat dissipation holes 6 on the side wall of the lower shell 5 realize the airflow exchange between the cavity and the outside, and carry the heat out with the convective air, forming the bottom auxiliary heat dissipation path. At the same time, the air in the cavity forms a circulating airflow under the action of the heat dissipation holes 6 and the heat dissipation fins 2, which further carries away the residual heat inside, fills the heat dissipation blind area, and forms a coordinated temperature control with the top and bottom heat dissipation paths. If it is necessary to adjust the heat dissipation center of gravity to adapt to different installation scenarios, the installation position of the heat dissipation boss 13 in the trapezoidal slot 14 can be adjusted to optimize the correspondence with the power components; to achieve efficient temperature control during high-power power supply operation, ensure power output stability, and adapt to the long-term use needs of ultra-thin electronic devices.

[0034] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A novel high-power ultra-thin power supply, characterized in that, Includes an upper shell (1), a lower shell (5), a cover plate (15), a heat dissipation assembly, a power component support assembly, and a fixing assembly; The upper shell (1) and the lower shell (5) are fixedly connected by screws. The inner side wall of the upper shell (1) is provided with six trapezoidal slots (14), and the cover plate (15) is adapted to be installed on the top of the trapezoidal slots (14). The heat dissipation assembly includes a heat dissipation boss (13) that is movably installed inside the trapezoidal slot (14), a thermally conductive silicone pad (12) provided on the heat dissipation boss (13), a heat dissipation rib (2) fixed to the outside of the upper shell (1), and a heat sink (7) fixed to the lower shell (5). The power component carrier assembly includes a diamond grid plate (11) disposed on a thermally conductive silicone pad (12), on which a rectifier bridge (8), a high-frequency transformer (9) and a power MOSFET (10) are movably mounted respectively.

2. The novel high-power ultra-thin power supply as described in claim 1, characterized in that: The fixing components include threaded holes (4) at the four corners of the upper shell (1), threaded holes (4) at the four corners of the lower shell (5), and screw holes (16) on the cover plate (15). The upper shell (1) is fixed to the lower shell (5) and the cover plate (15) by means of the threaded holes (4) of the connector.

3. A novel high-power ultra-thin power supply as described in claim 2, characterized in that: The heat dissipation fins (2) on the outer side of the upper shell (1) have a groove (3) on the left side. The groove (3) extends along the length of the heat dissipation fins (2) to optimize the airflow around the heat dissipation fins (2) and help improve the heat dissipation efficiency of the upper shell (1).

4. A novel high-power ultra-thin power supply as described in claim 3, characterized in that: Trapezoidal slots (14) are evenly distributed on the inner sidewall of the upper shell (1). The shape of the cover plate (15) is adapted to the top contour formed by the six trapezoidal slots (14). The cover plate (15) only cooperates with the trapezoidal slots (14) and achieves stable coverage through trapezoidal structure limiting.

5. A novel high-power ultra-thin power supply as described in claim 4, characterized in that: The number of heat dissipation protrusions (13) matches the number of core heat-generating components of the power element. The installation position of the heat dissipation protrusions (13) in the trapezoidal slot (14) can be adjusted to ensure precise contact with the thermal conductive silicone pad (12), thereby covering the heat-generating areas of the rectifier bridge (8), high-frequency transformer (9) and power MOSFET (10).

6. A novel high-power ultra-thin power supply as described in claim 5, characterized in that: The lower shell (5) has a heat dissipation hole (6) which penetrates the side wall of the lower shell (5) and communicates with the accommodating cavity. The installation position of the radiator (7) corresponds to that of the high-frequency transformer (9).

7. A novel high-power ultra-thin power supply as described in claim 6, characterized in that: The diamond grid plate (11) is fixedly connected to the thermally conductive silicone pad (12). The surface of the diamond grid plate (11) is provided with mounting positions for the rectifier bridge (8), high-frequency transformer (9) and power MOSFET (10). Each power component is positioned through the mounting positions to avoid displacement during operation.

8. A novel high-power ultra-thin power supply as described in claim 7, characterized in that: The threaded holes (4) of the fixing components are located in positions corresponding to those of the upper shell (1) and the lower shell (5).

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