Fin having honeycomb structure
Patent Information
- Application Number
- CN202522301945.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-30
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-10-30
AI Technical Summary
[0004]本实用新型的目的是解决以上缺陷,提供具有蜂窝结构的散热片,其在保证结构稳定与轻量化特性的同时,缩短热传导路径并增强气流扰动效果,解决了现有技术在结构强度与轻量化失衡、热源热量无法快速传导至散热体导致局部过热以及气流流动平缓散热效率不佳的技术问题
[0014]该实用新型通过蜂窝状散热体由若干连续排列的正六边形多孔单元构成且相邻单元共用立壁,实现散热片结构稳定且轻量化,具有在减少材料用量的同时提升抗压抗弯能力的好处;通过基板底部对应蜂窝状散热体孔洞设置导热凸台,实现热源热量向蜂窝状散热体的直接传递,具有缩短热传导路径、降低接触热阻的好处,解决热源热量无法快速传导至散热体导致局部过热的问题;通过蜂窝状散热体侧壁处一体成型的腰形扰流孔,实现气流在散热体内部的扰动,具有破坏层流、增强对流散热效率的好处,解决传统散热片气流流动平缓、散热效果不佳的问题。
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Figure CN224805315U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat sinks, specifically to heat sinks with a honeycomb structure. Background Technology
[0002] Heat sinks are key components in the field of electronic devices. They are mainly used to dissipate the heat generated by heat-generating components such as chips and modules, preventing the components from being affected by overheating and damaged. They are widely used in various electronic devices that require temperature control, and their structural design is directly related to heat dissipation efficiency and operational stability.
[0003] Existing heat sinks mostly use non-honeycomb independent fins or simple array structures, which have obvious limitations: First, it is difficult to balance structural strength and lightweight. Either the amount of material used is increased to improve strength, resulting in an overall heavier weight, or the weight reduction and simplification of the structure leads to a decrease in compressive and bending resistance, making it susceptible to deformation under external forces. Second, the heat exchange efficiency is insufficient. Some structures have unreasonable heat conduction path designs, making it difficult for heat to be quickly transferred to the heat dissipation body, or the airflow in the heat dissipation body tends to form a slow laminar flow, resulting in insufficient heat exchange with the heat dissipation structure, making it difficult to meet the requirements of efficient heat dissipation. Utility Model Content
[0004] The purpose of this invention is to address the above-mentioned deficiencies by providing a heat sink with a honeycomb structure. While ensuring structural stability and lightweight characteristics, it shortens the heat conduction path and enhances the airflow disturbance effect, thus solving the technical problems of existing technologies such as imbalance between structural strength and lightweight, inability of heat source to be quickly conducted to heat sink leading to local overheating, and slow airflow resulting in poor heat dissipation efficiency.
[0005] The objective of this utility model is achieved through the following means:
[0006] A heat sink with a honeycomb structure includes a substrate. A honeycomb heat sink is provided on the top of the substrate and is fixedly connected to the substrate. The honeycomb heat sink is composed of a number of continuously arranged regular hexagonal porous units. Each regular hexagonal porous unit is provided with a sidewall. The sidewall extends vertically outward from the top of the substrate to form a vertical wall. Adjacent regular hexagonal porous units share a vertical wall and are integrally connected. A heat-conducting protrusion is provided at the bottom of the substrate in the holes of the honeycomb heat sink and is connected to the substrate. A waist-shaped baffle hole is opened at the sidewall of the honeycomb heat sink and is integrally formed with the honeycomb heat sink.
[0007] By using hexagonal porous units sharing a common vertical wall, a lightweight design can be achieved while ensuring the overall structural stability of the heat sink, avoiding the problems of excessive weight or weak resistance to external damage caused by unreasonable structural design of traditional heat sinks. The heat-conducting protrusions set on the bottom of the substrate corresponding to the holes of the honeycomb heat sink can shorten the heat conduction path between the heat source and the honeycomb heat sink, improve heat transfer efficiency, and solve the problem that heat from the heat source cannot be quickly transferred to the heat sink. The waist-shaped turbulence holes integrally formed on the side wall of the honeycomb heat sink can effectively turbulent the airflow, break the laminar flow state to enhance the convective heat dissipation effect, and improve the problem of low heat dissipation efficiency caused by the slow airflow of traditional heat sinks.
[0008] Furthermore, a reinforcing rib is provided in the middle of the waist-shaped turbulence hole, and the reinforcing rib is integrally formed with the waist-shaped turbulence hole. The regular hexagonal porous unit is arranged in a honeycomb array along the length and width of the substrate, and the regular hexagonal porous units in two adjacent columns are staggered along the length of the substrate. The reinforcing rib is used to improve the strength of the sidewall of the regular hexagonal porous unit.
[0009] Furthermore, an annular thermally conductive gap is formed between the thermally conductive protrusion and the regular hexagonal porous unit, and the annular thermally conductive gap is integrally formed with the substrate.
[0010] Furthermore, the interior of the annular thermally conductive gap is filled with a thermally conductive silicone layer, and the thermally conductive silicone layer is fixedly connected to the annular thermally conductive gap. The thickness of the thermally conductive silicone layer is the same as the depth of the annular thermally conductive gap, and the thermally conductive silicone layer is used for heat conduction.
[0011] Furthermore, the length direction of the waist-shaped baffle hole is the same as the height direction of the sidewall of the regular hexagonal porous unit, and the positions of the waist-shaped baffle holes on the sidewalls of adjacent regular hexagonal porous units are staggered, and the waist-shaped baffle holes are used for air circulation.
[0012] Furthermore, mounting holes are provided at all four corners of the substrate, and the mounting holes are integrally formed with the substrate. The mounting holes penetrate the substrate and are used for the passage of fasteners to fix the heat sink at the location where heat dissipation is required.
[0013] The beneficial effects of this utility model are:
[0014] This utility model utilizes a honeycomb heat sink composed of several continuously arranged regular hexagonal porous units, with adjacent units sharing a common vertical wall. This achieves a stable and lightweight heat sink structure, reducing material usage while improving compressive and bending resistance. Thermally conductive protrusions are provided on the bottom of the substrate corresponding to the holes in the honeycomb heat sink, enabling direct heat transfer from the heat source to the honeycomb heat sink. This shortens the heat conduction path and reduces contact thermal resistance, solving the problem of localized overheating caused by the inability to quickly conduct heat from the heat source to the heat sink. Furthermore, the integrally formed waist-shaped turbulence holes on the sidewalls of the honeycomb heat sink create airflow disturbance within the heat sink, disrupting laminar flow and enhancing convective heat dissipation efficiency, thus addressing the issues of slow airflow and poor heat dissipation in traditional heat sinks. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of the heat sink with a honeycomb structure according to this utility model;
[0016] Figure 2 This is a partial structural cross-sectional view of the heat sink with a honeycomb structure of this utility model;
[0017] Figure 3 This is a partial rear view of the heat sink with a honeycomb structure according to this utility model;
[0018] In the figure, 1 is the substrate; 2 is the honeycomb heat sink; 3 is the thermally conductive boss; 4 is the mounting hole; 5 is the waist-shaped baffle hole; 6 is the reinforcing rib; 7 is the annular thermally conductive gap; and 8 is the thermally conductive silicone layer. Detailed Implementation
[0019] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.
[0020] In this embodiment, refer to Figures 1-3 The honeycomb structure heat sink specifically implemented therein includes a substrate 1, a honeycomb heat sink 2 on the top of the substrate 1, and the honeycomb heat sink 2 is fixedly connected to the substrate 1. The honeycomb heat sink 2 is composed of several continuously arranged regular hexagonal porous units. Each regular hexagonal porous unit is provided with a side wall. The side wall extends vertically outward from the top of the substrate 1 to form a vertical wall. Adjacent regular hexagonal porous units share a vertical wall and form an integral connection. A heat-conducting protrusion 3 is provided in the holes of the honeycomb heat sink 2 at the bottom of the substrate 1, and the heat-conducting protrusion 3 is connected to the substrate 1. A waist-shaped baffle hole 5 is opened at the side wall of the honeycomb heat sink 2, and the waist-shaped baffle hole 5 is integrally formed with the honeycomb heat sink 2.
[0021] like Figure 2 and Figure 3As shown, a reinforcing rib 6 is provided in the middle part of the waist-shaped turbulence hole 5, and the reinforcing rib 6 is integrally formed with the waist-shaped turbulence hole 5. The regular hexagonal porous units are arranged in a honeycomb array along the length and width of the substrate 1, and the regular hexagonal porous units in two adjacent columns are staggered along the length of the substrate 1. The reinforcing rib 6 is used to improve the strength of the sidewall of the regular hexagonal porous unit.
[0022] like Figure 3 As shown, an annular thermally conductive gap 7 is provided between the thermally conductive protrusion 3 and the regular hexagonal porous unit, and the annular thermally conductive gap 7 is integrally formed with the substrate 1.
[0023] like Figure 3 As shown, the interior of the annular thermally conductive gap 7 is filled with a thermally conductive silicone layer 8, and the thermally conductive silicone layer 8 is fixedly connected to the annular thermally conductive gap 7. The thickness of the thermally conductive silicone layer 8 is the same as the depth of the annular thermally conductive gap 7, and the thermally conductive silicone layer 8 is used for heat conduction.
[0024] like Figure 2 and Figure 3 As shown, the length direction of the waist-shaped baffle 5 is the same as the height direction of the side wall of the regular hexagonal porous unit. The positions of the waist-shaped baffle 5 on the side wall of adjacent regular hexagonal porous units are staggered. The waist-shaped baffle 5 is used for air circulation.
[0025] like Figure 1 , Figure 2 and Figure 3 As shown, mounting holes 4 are provided at all four corners of the substrate 1, and the mounting holes 4 are integrally formed with the substrate 1. The mounting holes 4 penetrate the substrate 1 and are used for the passage of the fastener to fix the heat sink at the position where heat dissipation is required.
[0026] The working principle of the honeycomb structure heat sink in this embodiment is as follows: When the heat sink is working, the fixing component is first inserted through the mounting holes 4 at the four corners of the substrate 1 to fix the heat sink as a whole at the corresponding position of the heat source, ensuring that the heat-conducting protrusion 3 on the lower surface of the substrate 1 is in close contact with the heat source; the heat generated by the heat source is first transferred to the heat-conducting protrusion 3. Because there is an annular heat-conducting gap 7 between the heat-conducting protrusion 3 and the regular hexagonal porous unit, and the heat-conducting silicone layer 8 filled in the gap can effectively reduce the contact thermal resistance, the heat is quickly conducted through the heat-conducting protrusion 3 and the heat-conducting silicone layer 8. The heat is drawn to the substrate 1 and then diffused to the vertical wall of the honeycomb heat sink 2, which is fixedly connected to the substrate 1. At the same time, waist-shaped turbulence holes 5 are provided on the vertical wall of the honeycomb heat sink 2. Air can flow through the waist-shaped turbulence holes 5 between the regular hexagonal porous units. The reinforcing ribs 6 in the middle of the waist-shaped turbulence holes 5 can help to break the laminar flow, enhance the air turbulence, and accelerate the heat dissipation through convection. In addition, the regular hexagonal porous units are arranged in a honeycomb array along the length and width of the substrate 1 and the adjacent columns are staggered, which further expands the heat dissipation area and finally achieves efficient heat dissipation.
[0027] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.
Claims
1. A heat sink with a honeycomb structure, comprising a substrate, wherein a honeycomb heat sink is disposed on the top of the substrate, and the honeycomb heat sink is fixedly connected to the substrate, characterized in that: The honeycomb heat sink is composed of several continuously arranged regular hexagonal porous units. Each regular hexagonal porous unit is provided with a sidewall. The sidewall extends vertically outward from the top of the substrate to form a vertical wall. Adjacent regular hexagonal porous units share a vertical wall. The bottom of the substrate is provided with a heat-conducting protrusion in the hole of the honeycomb heat sink, and the heat-conducting protrusion is connected to the substrate. The sidewall of the honeycomb heat sink is provided with a waist-shaped baffle hole, and the waist-shaped baffle hole is integrally formed with the honeycomb heat sink.
2. The heat sink with a honeycomb structure according to claim 1, characterized in that: The inner middle part of the waist-shaped turbulence hole is provided with a reinforcing rib, and the reinforcing rib is integrally formed with the waist-shaped turbulence hole. The regular hexagonal porous unit is arranged in a honeycomb array along the length and width of the substrate, and the regular hexagonal porous units in two adjacent columns are staggered along the length of the substrate.
3. The heat sink with a honeycomb structure according to claim 1, characterized in that: An annular thermally conductive gap is formed between the thermally conductive protrusion and the regular hexagonal porous unit, and the annular thermally conductive gap is integrally formed with the substrate.
4. The heat sink with a honeycomb structure according to claim 3, characterized in that: The annular thermally conductive gap is filled with a thermally conductive silicone layer, and the thermally conductive silicone layer is fixedly connected to the annular thermally conductive gap. The thickness of the thermally conductive silicone layer is the same as the depth of the annular thermally conductive gap.
5. The heat sink with a honeycomb structure according to claim 1, characterized in that: The length direction of the waist-shaped turbulence hole is the same as the height direction of the side wall of the regular hexagonal porous unit, and the positions of the waist-shaped turbulence holes on the side walls of adjacent regular hexagonal porous units are staggered.
6. The heat sink with a honeycomb structure according to claim 1, characterized in that: Mounting holes are provided at all four corners of the substrate, and the mounting holes are integrally formed with the substrate.