A device for repairing broken grid and photovoltaic cell production line

Abstract

The application relates to a device for repairing broken grids and a photovoltaic cell production line. The device for repairing broken grids is used for repairing the broken grids on the substrate. The device for repairing broken grids comprises a detection mechanism, a first conveying mechanism and a transfer mechanism. The detection mechanism is used for detecting whether the substrate has a broken grid and obtaining the position, length and width of the broken grid. The first conveying mechanism conveys the substrate with the broken grid to a transfer station. The transfer mechanism is arranged above the substrate at the transfer station. The transfer mechanism comprises a transfer substrate and a laser transfer device arranged above or below the transfer substrate. One side of the transfer substrate is provided with paste. The paste on the transfer substrate is transferred to the position of the broken grid of the substrate by the laser transfer device. The device for repairing broken grids provided by the application can realize the detection, transfer and laser transfer device repairing of the substrate, and provides a high-efficiency, high-precision and high-reliability broken grid solution.

Description

Technical Field

[0001] This application relates to the field of solar photovoltaic cell manufacturing technology, and in particular to a device for repairing broken grids and a photovoltaic cell production line including the device. Background Technology

[0002] The photovoltaic industry is a crucial component of clean energy, and solar cells, as the core component of photovoltaic power generation, directly determine the power generation efficiency and performance of photovoltaic modules through their manufacturing quality. During the manufacturing process of solar cells, metal electrodes, or grid lines, used to collect and transmit current are typically printed onto a silicon substrate. The integrity of these grid lines is critical to the conductivity and output efficiency of the cell.

[0003] In the manufacturing process of photovoltaic cells, grid breakage is a common defect affecting cell efficiency. Laser transfer technology, as a precision repair method, has been applied to repair such defects. Currently, this technology generally uses a special carrier plate with microgrooves as the transfer medium. Metallic silver paste needs to be pre-filled into the grooves, and then transferred to the broken grid area of ​​the cell using laser energy. However, existing grooved carrier plates are mostly for single use or difficult to recycle, resulting in high production costs. Furthermore, alignment deviations occur during the laser transfer process, leading to a higher repair defect rate and poor process compatibility. Utility Model Content

[0004] Therefore, it is necessary to provide a device for repairing broken gates to address the above problems, thereby solving the issues of high cost, high defect rate, and low efficiency of existing broken gate repair devices.

[0005] On one hand, this application provides an apparatus for repairing broken gates, used to reprint broken gates at a substrate, the apparatus comprising:

[0006] The detection mechanism is used to detect whether the substrate has a broken grid and to obtain the position, length and width of the broken grid;

[0007] A first transport mechanism transports the substrate with the broken grid to the transfer station; and

[0008] A transfer mechanism is provided at the transfer station; the transfer mechanism includes a transfer substrate and a laser transfer device located above or below the transfer substrate; a paste is provided on one side of the transfer substrate so that the paste on the transfer substrate can be transferred to the location of the broken grid on the substrate by the laser transfer device.

[0009] In an optional embodiment, in the above-mentioned device for repairing broken grids, the transfer substrate is a glass substrate, the glass substrate includes a front side with one side being a flat surface and a back side with the other side being a light-transmitting surface, and the paste is printed on the front side of the glass substrate;

[0010] The transfer mechanism also includes a support mechanism located at the transfer station to support the glass substrate. During transfer, the support mechanism controls the back of the glass substrate to face the laser transfer device.

[0011] In an optional embodiment, in the above-mentioned device for repairing broken grids, the supporting mechanism is provided with a hollow structure to avoid the paste on the glass substrate, thereby enabling the paste on the front side of the glass substrate to be transferred to the broken grid position of the substrate under the action of the laser transfer device.

[0012] In an optional embodiment, in the above-mentioned device for repairing broken grids, the transfer substrate is a flexible substrate, the flexible substrate includes a front side with a groove on one side and a back side with a light-transmitting surface on the other side, and the groove is filled with paste.

[0013] The transfer mechanism also includes a winding and unwinding mechanism, which includes an unwinding roller and a winding roller. The flexible substrate is unwound by the unwinding roller and then wound up by the winding roller at the transfer station.

[0014] In an optional embodiment, the above-mentioned device for repairing broken grids further includes an adsorption component located at the transfer station; the adsorption component is located below the laser transfer device; when the flexible substrate passes below the adsorption component, it is adsorbed by the adsorption component, and the laser transfer device transfers the paste at the groove of the flexible substrate to the broken grid position of the substrate.

[0015] In an optional embodiment, in the above-described device for repairing broken grids, the adsorption component includes:

[0016] Support components, which form a hollow structure;

[0017] An adsorption element is disposed on the support member so that the flexible substrate is adsorbed by the adsorption element when it passes under the adsorption assembly.

[0018] In this process, the laser from the laser transfer device passes through the hollow structure and is directed toward the back of the flexible substrate that is being adsorbed.

[0019] In an optional embodiment, the above-mentioned device for repairing broken grids further includes a winding and unwinding mechanism that is positioned before the adsorption assembly along the movement direction of the flexible substrate, so that the flexible substrate is corrected by the correction mechanism before being adsorbed by the adsorption assembly.

[0020] In an optional embodiment, the above-mentioned device for repairing broken grids includes a first material changing and pressing platform and a second material changing and pressing platform. Both the first material changing and pressing platform and the second material changing and pressing platform include a support platform and a pressing member that reciprocates in a controlled manner relative to the support platform.

[0021] The first material changing clamping platform is located behind the unwinding roller, so that when the unwinding roller needs to change material, the clamping member is controlled to move to press the flexible substrate to the support platform, and after the unwinding roller has finished changing material, the clamping member is controlled to move to release the flexible substrate.

[0022] The second material changing clamping platform is located in front of the take-up roller, so that when the take-up roller needs to change material, the clamping member is controlled to move to press the flexible substrate to the support platform, and after the take-up roller has finished changing material, the clamping member is controlled to move to release the flexible substrate.

[0023] In an optional embodiment, the first transport mechanism in the above-described device for repairing broken grids further includes a correction component. The correction component corrects and positions the substrate according to the position, length, and width of the broken grid on the substrate and the position of the paste on the transfer substrate, thereby making the broken grid on the substrate correspond to the position of the paste on the transfer substrate.

[0024] In an optional embodiment, the above-mentioned device for repairing broken gates further includes:

[0025] A second transport mechanism is disposed on the side of the first transport mechanism; the second transport mechanism includes a first conveyor line and a second conveyor line, the first conveyor line being used to transport the substrate; the second conveyor line being used to transport the substrate without broken grids;

[0026] A first transfer assembly is movably disposed between the second transport mechanism and the first transport mechanism to transfer the substrate with a broken grid at the first transport line to the first transport mechanism.

[0027] In an optional embodiment, the above-described device for repairing broken gates further includes a second transport mechanism disposed on the side of the first transport mechanism; the second transport mechanism includes a first conveyor line and a second conveyor line, the first conveyor line being used to transport the substrate; the second conveyor line being used to transport the substrate without broken gates.

[0028] A third transport mechanism is disposed on the side of the second transport mechanism to transport the substrate with the broken grid; wherein the transport direction of the third transport mechanism is opposite to that of the first transport mechanism;

[0029] A first transfer assembly is movably disposed between the second transport mechanism and the third transport mechanism to transfer the substrate with a broken grid at the first transport line to the third transport mechanism.

[0030] A second transfer assembly is movably disposed between the third transport mechanism and the first transport mechanism to transfer the substrate with the broken grid at the third transport mechanism to the first transport mechanism.

[0031] In an optional embodiment, the above-described device for repairing broken gates further includes a buffer mechanism located upstream of the correction component to buffer the substrate with broken gates; the buffer mechanism includes:

[0032] At least one storage device, each of the storage devices having two opposing support plates on both sides in a direction perpendicular to the direction of movement of the substrate, the support plates having a plurality of locking teeth in the vertical direction, and supporting one of the substrates by the two corresponding locking teeth on both sides;

[0033] A lifting drive unit is connected to the support plate to drive the two support plates, which are disposed opposite to each other on the same substrate, to lift and lower simultaneously to store or release the substrate.

[0034] On the other hand, this application also provides a photovoltaic cell production line, including the device for repairing broken grids as described in any one of the claims.

[0035] The device for repairing broken grids proposed in this application has at least the following beneficial effects:

[0036] The proposed device for repairing broken grids on a substrate includes a detection mechanism, a first transport mechanism, and a transfer mechanism. The detection mechanism detects whether the substrate has broken grids and determines the position, length, and width of the broken grid. The first transport mechanism transports the substrate with the broken grid to a transfer station. The transfer mechanism is positioned above the substrate at the transfer station. The transfer mechanism includes a transfer substrate and a laser transfer device located above or below the transfer substrate. A paste is applied to one side of the transfer substrate, which is then transferred to the broken grid location on the substrate by the laser transfer device. The proposed device automatically identifies and locates broken grid defects through the detection mechanism, automatically loads and unloads materials through the first transport mechanism, and performs repair transfer using the laser transfer device of the transfer mechanism. This device has high integration and automation, significantly improving the repair efficiency and accuracy of broken grids, reducing production costs and the defect rate caused by alignment deviations, and providing a reliable guarantee for high-quality substrate production. Attached Figure Description

[0037] Figure 1This is a schematic diagram of the overall structure of a gate repair device provided in one embodiment of this application.

[0038] Figure 2 A partial structural diagram of a gate-repairing device provided in one embodiment of this application. Figure 1 .

[0039] Figure 3 A partial structural diagram of a gate-repairing device provided in one embodiment of this application. Figure 2 .

[0040] Figure 4 A partially enlarged view of the buffer mechanism of a gate-repairing device provided in one embodiment of this application.

[0041] Figure 5 This is a schematic diagram of the winding and unwinding mechanism of a grid repair device according to one embodiment of this application.

[0042] Explanation of reference numerals in the attached figures

[0043] 10-Filling device; 11-Substrate; 100-Detection mechanism; 200-First transport mechanism; 210-Correcting component; 300-Transfer mechanism; 311-Glass substrate; 312-Flexible substrate; 320-Laser transfer device; 330-Bearing mechanism; 340-Unwinding and rewinding mechanism; 341-Unwinding roller; 342-Rewinding roller; 343-Correction mechanism; 344-First material changing and pressing platform; 345-Second material changing and pressing platform; 346-First support platform; 347-First pressing Components; 348-Second support platform; 349-Second clamping component; 350-Roller mechanism; 351-Tension roller mechanism; 352-Intermediate drive mechanism; 353-Adjusting roller mechanism; 400-Second transport mechanism; 410-First conveyor line; 420-Second conveyor line; 500-First transfer assembly; 600-Buffer mechanism; 610-Storage component; 611-Support plate; 612-Clamping teeth; 620-Lifting drive component; 700-Third transport mechanism; 800-Second transfer assembly. Detailed Implementation

[0044] To make the technical solution and beneficial effects of this application more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0045] The technical solution of the present invention will be described in more detail and in-depth below with reference to the accompanying drawings and through several specific embodiments. This section aims to provide sufficiently detailed technical information so that those skilled in the art can fully understand the principles, structure, and technical effects of the present invention. It should be noted that the following embodiments are merely typical representatives of the present invention and do not constitute a limitation on the scope of protection of the present invention. Any equivalent substitutions or improvements based on the core concept of the present invention should be considered to fall within the scope of protection of the present invention.

[0046] As a specific embodiment of this application, a grid repair device 10 is proposed for repairing broken grids at a substrate 11 (such as a solar cell). Figure 1 As shown, the device 10 for repairing broken grids may include a detection mechanism 100, a first transport mechanism 200, and a transfer mechanism 300. The detection mechanism 100 is used to detect whether there is a broken grid on the substrate 11 and calculate the geometric parameters of the broken grid, such as its position (e.g., X, Y coordinates), length, and width. The detection mechanism 100 typically includes a laser scanner, a high-resolution CCD camera, and an image processing unit. The detection mechanism 100 can integrate the functions of detecting whether the substrate 11 has a broken grid defect and detecting the size of the broken grid. In some embodiments, the function of the detection mechanism 100 can also be divided into several different modules, one part responsible for detecting whether the substrate 11 has a defect, and another part responsible for determining the length and width of the broken grid.

[0047] The first transport mechanism 200 is responsible for accurately transporting the substrate 11, which has been identified by the inspection mechanism 100 as having broken grids, from the inspection station to the subsequent transfer station. The first transport mechanism 200 includes a belt conveyor, roller conveyor, or linear guide platform, and is equipped with a servo motor to achieve precise transmission.

[0048] The transfer mechanism 300, positioned above the transfer station, is the core component for performing the broken grid repair function. The transfer mechanism 300 may include a transfer substrate and a laser transfer device 320. The lower side of the transfer substrate is pre-printed with conductive paste, serving as a "donor" for repairing the broken grid. The laser transfer device 320, located above or below the transfer substrate, emits laser pulses of specific wavelength and energy. The laser beam irradiates the corresponding paste area on the transfer substrate according to a preset parameter path, causing the paste (such as silver paste) on the transfer substrate to melt or vaporize under the action of the laser, transferring it from the surface of the transfer substrate to the broken grid location on the substrate 11, thereby completing the repair of the broken grid.

[0049] The fault-repairing device 10 proposed in this application automates the entire process from defect detection, transfer, alignment to repair, achieving rapid repair speed. Employing laser transfer technology for non-contact processing avoids mechanical stress damage. The laser pulse energy, pulse width, and repetition frequency can be precisely controlled, thereby controlling the amount, shape, and speed of silver paste transfer. Combined with machine vision inspection, the fault-repairing device 10 can achieve micron-level repair, ensuring that the repaired grid line morphology is highly consistent with the original grid lines, guaranteeing the uniformity of substrate performance.

[0050] In one embodiment, such as Figure 2 As shown, the transfer substrate of the fault-fixing device 10 includes a highly flat glass substrate 311. The glass substrate 311 has a front side with one flat side and a back side with the other side being a light-transmitting side. The front side of the glass substrate 311 is pre-prepared with paste through methods such as coating and printing. In this embodiment, the paste is pre-printed on the glass substrate 311 by means of stencil printing. The transfer mechanism 300 of this embodiment also includes a supporting mechanism 330, which is located at the transfer station and below the laser transfer device 320. During transfer, the supporting mechanism 330 controls and fixes the back side of the glass substrate 311 to face the laser transfer device 320.

[0051] Furthermore, in this embodiment, the support mechanism 330 is provided with a hollow structure (such as a slot or through hole). The hollow structure is designed to avoid the paste area on the glass substrate 311, ensuring that after the laser emitted by the laser transfer device 320 irradiates the glass substrate 311, the paste on the front side of the glass substrate 311 can be transferred to the broken grid position of the substrate 11 without obstruction.

[0052] During operation, the first transport mechanism 200 transports the substrate 11 with broken grids, detected by the inspection mechanism 100, to the transfer station. The laser transfer device 320 emits laser pulses, the energy of which is absorbed by the paste on the lower surface of the glass substrate 311, causing the paste to detach from the glass substrate 311. Due to the hollow design of the supporting mechanism 330, the detached paste is deposited at the broken grid location on the substrate 11, forming good contact and completing the repair. The broken grid repair device 10 proposed in this application, due to the good flatness and stability of the glass substrate 311, combined with the image detection and recognition of the inspection mechanism 100 and the laser transfer device 320, can achieve precise positioning of the broken grid location and accurate transfer of repair material. At the same time, the device of this application uses the glass substrate 311 as the transfer substrate, and there is no need to cut grooves on the glass substrate in this embodiment, which can reduce the number of process steps. Since there are no grooves on the glass substrate 311, there is less residue after transfer, and it is easy to clean.

[0053] In other embodiments, such as Figure 3As shown, the transfer substrate of the fault repair device 10 is a flexible substrate 312 (such as a polyimide PI film or other polymer flexible film). The flexible substrate 312 includes a front side with a groove on one side and a back side with a light-transmitting surface on the other side. The side with the paste can be processed with grooves, and the paste (such as silver paste) is filled into the grooves, which helps to protect the grid lines and control the shape of the transfer material. The fault repair device 10 proposed in this application solves the problems of low efficiency, poor accuracy, high cost and weak adaptability of existing fault repair technologies by setting grooves on the flexible film, filling the paste, and then using laser scanning to transfer it to the fault area, which greatly improves production efficiency.

[0054] Furthermore, the transfer printing mechanism 300 also includes a take-up and unwinding mechanism 340 for taking up and unwinding the flexible substrate 312 to achieve continuous, large-scale automated production. The take-up and unwinding mechanism 340 includes an unwinding roller 341 and a take-up roller 342. The unwinding roller 341 is used to load and release the wound flexible substrate 312 material. The take-up roller 342 is used to collect the used portion of the flexible substrate 312 after the transfer printing function has been completed. After being unwound by the unwinding roller 341, the flexible substrate 312 is transferred at the transfer station and finally wound up by the take-up roller 342.

[0055] In some embodiments, the winding and unwinding mechanism 340 of the fault repair device 10 further includes an adsorption component (not shown) located at the transfer station. The adsorption component is located below the laser transfer device 320. When the flexible substrate 312 passes below the adsorption component, it is adsorbed by the adsorption component, and the laser transfer device 320 transfers the paste in the groove on the flexible substrate 312 to the fault position on the substrate 11. When the flexible substrate 312 moves to the transfer station, the adsorption component operates, adsorbing and fixing the flexible substrate 312 flatly in a certain position by means of vacuum adsorption or the like, avoiding deformation caused by flexibility, and creating stable working conditions for laser transfer. The adsorption component may include a support member with a hollow structure and an adsorption component (such as a vacuum chuck or vacuum chamber) connected and disposed below the support member. When the flexible substrate 312 passes below the adsorption component, the laser emitted by the laser transfer device 320 can irradiate the back side of the flexible substrate 312 adsorbed by the adsorption component through the hollow structure.

[0056] In some embodiments, the unwinding and rewinding mechanism 340 of the grid repair device 10 further includes a correction mechanism 343. The correction mechanism 343 is along the movement direction of the flexible substrate 312 and is disposed before the adsorption assembly. The function of the correction mechanism 343 is to detect and correct the positional deviation of the flexible substrate 312 in the width direction in real time before the flexible substrate 312 enters the transfer station, so as to ensure that the flexible substrate 312 does not shift during the unwinding and rewinding process. The flexible substrate 312 is corrected by the correction mechanism 343 and then adsorbed by the adsorption assembly.

[0057] In some embodiments, the unwinding and rewinding mechanism 340 of the grid repair device 10 may further include a first material changing clamping platform 344 (located downstream of the unwinding roller 341) and a second material changing clamping platform 345 (located upstream of the take-up roller 342). Both the first material changing clamping platform 344 and the second material changing clamping platform 345 include a support platform and a clamping member. The clamping member can reciprocate and lift relative to the support platform under the drive of a cylinder, electric cylinder, or other driving components. In this embodiment, as... Figure 3 As shown, each material changing and clamping platform can be equipped with two clamping components to provide a more uniform clamping force during material changing and prevent the flexible substrate 312 from deforming.

[0058] In this embodiment, as Figure 5 As shown, the first material changing and pressing platform 344 may include a first support platform 346 and a first pressing member 347. When the flexible substrate 312 on the unwinding roll 341 is depleted and needs to be changed, the first pressing member 347 moves downward, pressing the flexible substrate 312 onto the first support platform 346. At this time, the operator can safely perform material changing operations on the unwinding roll 341, and the head of the new roll and the tail of the old roll can be connected with high-temperature tape on the tape-connecting platform next to the platform. After the material changing on the unwinding roll 341 is completed, the first pressing member 347 moves upward to release the flexible substrate 312. The second material changing and pressing platform 345 may include a second support platform 348 and a second pressing member 349. When the flexible substrate 312 on the take-up roll 342 is wound up and needs to be changed, the second pressing member 349 moves downward, pressing the flexible substrate 312 onto the second support platform 348. After the material changing on the take-up roll 342 is completed, the second pressing member 349 moves upward to release the flexible substrate 312. The first material changing and pressing platform 344 and the second material changing and pressing platform 345 work together to achieve "non-stop material changing," ensuring a continuous supply of the flexible substrate 312, which serves as the supplier for repairing broken grids. When the unwinding and rewinding mechanism 340 is operating, the flexible substrate 312 is released from the unwinding roller 341 and sequentially passes through the roller guide mechanism 350, the tension roller mechanism 351, the web guiding mechanism 343, and the intermediate drive mechanism 350 before finally entering the transfer station. The roller guide mechanism 350 is located between the unwinding roller 341 and the tension roller mechanism 351 to guide the flexible substrate 312. The tension roller mechanism 351 may include multiple parallel tension rollers to apply and maintain tension on the flexible substrate 312. The web guiding mechanism 343 may include a position sensor and an electric web guiding roller to monitor and calibrate the position of the flexible substrate 312 in real time. The intermediate drive mechanism 352 is located after the tension roller mechanism 351 and before the transfer station to guide the positioned flexible substrate 312 to the transfer station.

[0059] At the transfer station, the adsorption assembly is activated. The adsorption components (such as vacuum suction cups) of the adsorption assembly firmly adsorb the flexible substrate 312 onto the adsorption components by drawing a vacuum, keeping the flexible substrate 312 flat and stable. The laser emitted by the laser transfer device 320 passes through the hollow structure of the support component and irradiates the paste on the flexible substrate 312, causing the functional material to be transferred to the substrate 11, completing the transfer of the substrate. After the transfer is completed, the flexible substrate 312 is adjusted in posture by the adjusting roller mechanism 353 and finally conveyed to the take-up roller 342 for winding.

[0060] The fault repair device 10 proposed in this application provides two donor options: a rigid substrate (glass substrate 311) and a flexible substrate 312, which can be selected according to actual needs. After the repair is completed, the repaired substrate can be inspected again using a CCD camera to ensure that the repair quality meets the requirements.

[0061] In some embodiments, the first transport mechanism 200 of the repair grid device 10 further includes a correction component 210. The correction component 210 adjusts the horizontal position (X, Y direction) of the substrate 11 to be repaired at the transfer station by means of a drive device (such as a motor + lead screw) based on the position, length, and width of the broken grid on the substrate 11 and the parameters (e.g., position, size, etc.) of the paste on the transfer substrate, thereby correcting and positioning the substrate 11 to ensure that the position of the broken grid on the substrate 11 is aligned in space with the position of the grid line to be transferred on the transfer substrate.

[0062] In some embodiments, the gate-repairing device 10 further includes a second transport mechanism 400 and a first transfer assembly 500. The second transport mechanism 400 is disposed beside the first transport mechanism 200 and includes a first conveyor line 410 and a second conveyor line 420. The first conveyor line 410 is used to transport all substrates 11, and the second conveyor line 420 is used to transport substrates 11 without gate breaks. The first transfer assembly 500 is movably disposed between the second transport mechanism 400 and the first transport mechanism 200, and includes a robotic arm, a cross slide, a linear guide, etc., to transfer substrates 11 with gate breaks at the first conveyor line 410 to the first transport mechanism 200.

[0063] In some embodiments, such as Figure 1As shown, the broken grid repair device 10 also includes a second transport mechanism 400, a third transport mechanism 700, a first transfer assembly 500, and a second transfer assembly 800. The second transport mechanism 400 is located beside the first transport mechanism 200. The second transport mechanism 400 includes a first conveyor line 410 and a second conveyor line 420. The first conveyor line 410 transports all substrates 11 (including those with broken grids and those without), while the second conveyor line 420 transports substrates 11 without broken grids, i.e., the qualified substrate transport line. The third transport mechanism 700 is located beside the second transport mechanism 400 to transport substrates 11 with broken grids, i.e., the broken grid substrate transport line. The third transport mechanism 700 has the opposite transport direction to the first transport mechanism 200, which saves space, makes full use of space, and avoids excessively long transport lines. The first transfer assembly 500 is movably disposed between the second transport mechanism 400 and the third transport mechanism 700 to transfer substrates 11 with broken grids from the second conveyor line 410 to the third transport mechanism 700. The second transfer component 800 is movably disposed between the third transport mechanism 700 and the first transport mechanism 200 to transfer the substrate 11 with broken grids at the third transport mechanism 700 to the first transport mechanism 200. The first transport mechanism 200, the second transport mechanism 400, and the third transport mechanism 700 may include belt conveyors, roller conveyors, chain conveyors, etc. Through the design of the above-mentioned multiple transport mechanisms and transfer components, the physical separation of the substrate with broken grids from the qualified substrate is achieved, making the logistics transportation clearer and preventing interference between them.

[0064] In some embodiments, the fault repair device 10 further includes a buffer mechanism 600, which is located upstream of the correction component 210 to buffer the substrate 11 with faulty grids. This buffer mechanism is used to temporarily store the faulty grid substrate 11 when it cannot be processed in time due to the busy transfer station, thereby controlling the production rhythm.

[0065] The cache mechanism 600 includes at least one storage component 610 and a lift-down drive component 620. For example... Figure 4 As shown, each storage unit 610 has two opposing support plates 611 on both sides in a direction perpendicular to the movement direction of the substrate 11. Each support plate 611 has multiple locking teeth 612 in the vertical direction, supporting the same substrate 11 through the corresponding locking teeth 612 on both sides. A lifting drive unit 620 is connected to the support plates 611 to simultaneously lift and lower the two opposing support plates 611 on the same substrate 11, storing or releasing the substrate 11. When buffering is required, the substrate 11 is conveyed between the support plates 611, and the lifting drive unit 620 drives the support plates 611 to rise, causing the locking teeth 612 at a specific height to hold the edge of the substrate 11 for storage. During release, the support plates 611 descend, placing the substrate 11 back onto the conveyor line.

[0066] The cache mechanism 600 of this application is located before the correction component 210. It uses a support plate 611 with multi-level teeth 612 to support the substrate 11, and controls the lifting and lowering of the support plate 611 through the lifting drive component 620, thereby realizing the storage and release of the substrate 11 with high space utilization.

[0067] The overall structure of the gate repair device 10 proposed in this application adopts a modular design, including a transmission mechanism, a detection mechanism, a transfer mechanism, and an intelligent control system. The modules work collaboratively through the intelligent control system to ensure the high efficiency and stability of the equipment operation.

[0068] On the other hand, this application also provides a photovoltaic cell production line, including a grid repair device 10. The grid repair device 10 may include a detection mechanism 100, a first transport mechanism 200, and a transfer mechanism 300, which work together to achieve efficient and accurate automatic repair of photovoltaic cells with grid defects.

[0069] The inspection unit 100, located at a corresponding station on the solar cell production line, is capable of image acquisition and intelligent analysis of passing solar cells, accurately identifying the location and related parameters of broken grids. The first transport unit 200 is responsible for smoothly conveying defective solar cells to the transfer station and can return them to the main production line after repair. The transfer unit 300, based on the inspection results, uses laser transfer technology to fill and repair the grid lines.

[0070] The photovoltaic cell production line proposed in this application can promptly repair cells with grid breakage defects, greatly improving the product yield of the photovoltaic cell production line.

[0071] The above embodiments are merely typical application examples of this application. Those skilled in the art can adjust the laser type, transfer material, mechanical structure dimensions, etc., according to actual production needs. These changes and improvements based on the core concept of this invention all fall within the protection scope claimed by this invention.

[0072] In this application, the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "height," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this application.

[0073] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" may explicitly include at least one of those features. In this application, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0074] In this application, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0075] In this application, unless otherwise expressly defined, the terms "above," "on top of," "over," "above," "below," "below," "below," or "below" for "first feature over second feature" can refer to the first and second features being in direct contact, or to the first and second features being in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" for "first feature over second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature over second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0076] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. An apparatus for repairing broken grids, used to reprint broken grids on a substrate, characterized in that, The device for repairing broken grids includes: The detection mechanism is used to detect whether the substrate has a broken grid and to obtain the position, length and width of the broken grid; A first transport mechanism transports the substrate with the broken grid to the transfer station; and A transfer mechanism is provided at the transfer station; the transfer mechanism includes a transfer substrate and a laser transfer device located above or below the transfer substrate; a paste is provided on one side of the transfer substrate so that the paste on the transfer substrate can be transferred to the location of the broken grid on the substrate by the laser transfer device.

2. The apparatus for repairing broken grids according to claim 1, characterized in that, The transfer substrate is a glass substrate, which includes a front side with one flat side and a back side with the other side being a light-transmitting side. The paste is printed on the front side of the glass substrate. The transfer mechanism also includes a support mechanism located at the transfer station to support the glass substrate. During transfer, the support mechanism controls the back of the glass substrate to face the laser transfer device.

3. The apparatus for repairing broken grids according to claim 2, characterized in that, The support mechanism is provided with a hollow structure to avoid the paste on the glass substrate, so that the paste on the front side of the glass substrate can be transferred to the broken grid position of the substrate under the action of the laser transfer device.

4. The apparatus for repairing broken grids according to claim 1, characterized in that, The transfer substrate is a flexible substrate, which includes a front side with a groove on one side and a back side with a light-transmitting surface on the other side, and the groove contains a paste. The transfer mechanism also includes a winding and unwinding mechanism, which includes an unwinding roller and a winding roller. The flexible substrate is unwound by the unwinding roller and then wound up by the winding roller at the transfer station.

5. The apparatus for repairing broken grids according to claim 4, characterized in that, The winding and unwinding mechanism further includes an adsorption component located at the transfer station; the adsorption component is located below the laser transfer device; when the flexible substrate passes below the adsorption component, it is adsorbed by the adsorption component, and the laser transfer device transfers the paste at the groove of the flexible substrate to the broken grid position of the substrate.

6. The apparatus for repairing broken grids according to claim 5, characterized in that, The adsorption component includes: Support components, which form a hollow structure; An adsorption element is disposed on the support member so that the flexible substrate is adsorbed by the adsorption element when it passes under the adsorption assembly. In this process, the laser from the laser transfer device passes through the hollow structure and is directed toward the back of the flexible substrate that is being adsorbed.

7. The apparatus for repairing broken grids according to claim 5, characterized in that, The winding and unwinding mechanism further includes a correction mechanism, which is positioned before the adsorption assembly along the movement direction of the flexible substrate, so that the flexible substrate is corrected by the correction mechanism before being adsorbed by the adsorption assembly.

8. The apparatus for repairing broken grids according to claim 5, characterized in that, The winding and unwinding mechanism further includes a first material changing and pressing platform and a second material changing and pressing platform. Both the first material changing and pressing platform and the second material changing and pressing platform include a support platform and a pressing member that reciprocates in a controlled manner relative to the support platform. The first material changing clamping platform is located behind the unwinding roller, so that when the unwinding roller needs to change material, the clamping member is controlled to move to press the flexible substrate to the support platform, and after the unwinding roller has finished changing material, the clamping member is controlled to move to release the flexible substrate. The second material changing clamping platform is located in front of the take-up roller, so that when the take-up roller needs to change material, the clamping member is controlled to move to press the flexible substrate to the support platform, and after the take-up roller has finished changing material, the clamping member is controlled to move to release the flexible substrate.

9. The apparatus for repairing broken grids according to any one of claims 1-8, characterized in that, The first transport mechanism further includes a correction component, which corrects and positions the substrate according to the position, length, and width of the broken grid on the substrate and the position of the paste on the transfer substrate, thereby making the broken grid on the substrate correspond to the position of the paste on the transfer substrate.

10. The apparatus for repairing broken grids according to any one of claims 1-8, characterized in that, Also includes: A second transport mechanism is disposed on the side of the first transport mechanism; the second transport mechanism includes a first conveyor line and a second conveyor line, the first conveyor line being used to transport the substrate, and the second conveyor line being used to transport the substrate without broken grids; A first transfer assembly is movably disposed between the second transport mechanism and the first transport mechanism to transfer the substrate with a broken grid at the first transport line to the first transport mechanism.

11. The apparatus for repairing broken grids according to any one of claims 1-8, characterized in that, It also includes a second transport mechanism disposed on the side of the first transport mechanism; the second transport mechanism includes a first conveyor line and a second conveyor line, the first conveyor line being used to transport the substrate, and the second conveyor line being used to transport the substrate without broken grids; A third transport mechanism is disposed on the side of the second transport mechanism to transport the substrate with the broken grid; wherein the transport direction of the third transport mechanism is opposite to that of the first transport mechanism; A first transfer assembly is movably disposed between the second transport mechanism and the third transport mechanism to transfer the substrate with a broken grid at the first transport line to the third transport mechanism. A second transfer assembly is movably disposed between the third transport mechanism and the first transport mechanism to transfer the substrate with the broken grid at the third transport mechanism to the first transport mechanism.

12. The apparatus for repairing broken grids according to claim 9, characterized in that, It also includes a caching mechanism located upstream of the correction component to cache the substrate with broken gates; the caching mechanism includes: At least one storage device, each of the storage devices having two opposing support plates on both sides in a direction perpendicular to the direction of movement of the substrate, the support plates having multiple locking teeth in the vertical direction, and supporting one of the substrates through the two corresponding locking teeth on both sides; A lifting drive unit is connected to the support plate to drive the two support plates, which are disposed opposite to each other on the same substrate, to lift and lower simultaneously to store or release the substrate.

13. A photovoltaic cell production line, characterized in that, The device for repairing broken grids as described in any one of claims 1-9.

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