LED support and LED package

Abstract

The application relates to an LED support and an LED package, the LED support comprising: a support body arranged on the upper surface of a ceramic substrate; the support body being provided with a reflecting cup; a first solder pad being arranged at the bottom of the reflecting cup; and a second solder pad being arranged on the side of the support body away from the reflecting cup; wherein the side of the support body is inwardly recessed to form a water blocking groove, and the water blocking groove is arranged around the second solder pad. The combination of the LED chip, the thermoelectric separation and the ceramic substrate forms an extremely efficient low-thermal-resistance heat dissipation path, the heat dissipation effect of the support is obviously improved, the overall air tightness of the support body is improved through the water blocking groove, the internal chip and the solder joint can be effectively prevented from being damp and oxidized, and therefore the reliability and the service life of the LED under long-time use in a harsh environment are ensured.

Description

Technical Field

[0001] This application relates to the field of LED technology, and in particular to an LED bracket and LED package. Background Technology

[0002] Currently, the thermoelectric separation and multi-color or multi-cup brackets on the market usually adopt a relatively traditional structural design, with conventional connections and layouts between components to achieve basic thermoelectric separation and multi-cup or multi-color load-bearing functions.

[0003] Currently available multi-pin brackets suffer from airtightness issues. Under prolonged use or harsh environments, internal components are prone to moisture absorption and oxidation, which can affect the performance and lifespan of LED chips. Furthermore, these existing bracket structures are inadequate in heat dissipation. As LED chip power increases, the generated heat is difficult to dissipate quickly and effectively, leading to overheating of the chips. This not only reduces luminous efficiency but may also accelerate chip aging and shorten their overall lifespan. Utility Model Content

[0004] This application provides an LED bracket that optimizes the current and heat paths through a thermoelectric separation pad layout, significantly improving the heat dissipation effect of the bracket, while also enhancing the overall airtightness of the bracket through a water-blocking groove.

[0005] Therefore, this application provides an LED bracket, comprising:

[0006] Ceramic substrate;

[0007] The support body is disposed on the upper surface of the ceramic substrate; the support body has a reflective cup;

[0008] The first pad is located at the bottom of the reflector cup;

[0009] The second pad is located on the side of the bracket body facing away from the reflector cup;

[0010] The support body has a water-blocking groove recessed inward on its side, and the water-blocking groove surrounds the second welding pad.

[0011] As a preferred embodiment, the support body includes a base on which the reflective cup is formed, the base having a first surface and a second surface facing away from each other;

[0012] The first pad protrudes from the first surface;

[0013] The water-blocking groove is recessed into the second surface, and is separated from other areas of the first surface by an isolation strip.

[0014] As a preferred embodiment, the base, the isolation strip, and the wall of the water-blocking trough are integrally formed.

[0015] As a preferred embodiment, there are multiple second pads, which are disposed on the second surface and arranged circumferentially around the first pad, and each second pad is provided with a water-blocking groove.

[0016] As a preferred embodiment, the number of the second pads is four, and the four second pads are arranged circumferentially around the first pad.

[0017] As a preferred embodiment, the first pad includes a pad body disposed on the first surface; and the pad body has a plurality of notches in the circumferential direction, and each notch corresponds to a second pad.

[0018] As a preferred embodiment, the system further includes a heat sink disposed on the first pad and located between adjacent water-retaining grooves, and thermally connected to the ceramic substrate.

[0019] This application also provides an LED package, including the above-mentioned LED bracket, LED chip and encapsulating adhesive layer, wherein the LED chip is disposed in the reflector cup of the LED bracket, and the encapsulating adhesive layer covers the LED chip and the opening end of the reflector cup.

[0020] The beneficial effects of this application are:

[0021] The LED bracket includes a ceramic substrate, a bracket body, a first pad, and a second pad. The bracket body is disposed on the upper surface of the ceramic substrate. The bracket body has a recessed reflective cup for supporting the LED chip. The first pad is disposed at the bottom of the reflective cup for electrically connecting with the first electrode of the LED chip. The second pad is disposed on the side of the bracket body opposite to the reflective cup for electrically connecting with the second electrode of the LED chip. A water-retaining groove is formed inwardly on the side of the bracket body, and the water-retaining groove surrounds the second pad.

[0022] This application combines LED chips, thermoelectric separation, and a ceramic substrate to form an extremely efficient low thermal resistance heat dissipation path, which significantly improves the heat dissipation effect of the bracket. At the same time, the water-blocking groove can improve the overall airtightness of the bracket body, effectively preventing the internal chips and solder joints from getting damp and oxidized, thereby ensuring the reliability and lifespan of the LED for long-term use in harsh environments. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A top view of an LED bracket provided in this application;

[0025] Figure 2 for Figure 1 Cross-sectional view of AA in the middle;

[0026] Figure 3 for Figure 1 Backside structural diagram.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1. Support body; 11. Reflector cup; 12. Base; 2. First pad; 21. Notch; 3. Second pad; 4. Isolation strip; 5. Ceramic substrate; 6. Water barrier; 7. Heat sink. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.

[0031] like Figures 1 to 3As shown, an LED bracket provided in this application includes a ceramic substrate 5, a bracket body 1, a first pad 2, and a second pad 3. The bracket body 1 is disposed on the upper surface of the ceramic substrate 5. The bracket body 1 has a recessed reflective cup 11 for supporting an LED chip. The first pad 2 is disposed at the bottom of the reflective cup 11 for electrically connecting with the first electrode of the LED chip. The second pad 3 is disposed on the side of the ceramic bracket body 1 facing away from the reflective cup 11 for electrically connecting with the second electrode of the LED chip. A water-blocking groove 6 is formed inwardly recessed on the side of the bracket body 1, and the water-blocking groove 6 surrounds the second pad 3.

[0032] In this design, the ceramic substrate 5 serves as the bottom base, directly supporting the bracket body 1 and providing rigid support and structural stability, preventing deformation of the bracket body 1 from affecting the chip position. The reflector cup 11 of the bracket body 1 directly positions the LED chip, precisely fixing it in a preset position to prevent chip displacement. The first pad 2 is located at the bottom of the reflector cup 11, allowing the chip's first electrode to directly contact the first pad 2 after placement, achieving localized conductivity between the chip and the first pad 2. The second pad 3 is located on the side of the bracket facing away from the reflector cup 11, connecting the chip's second electrode to the second pad 3 on the back, ultimately forming a complete current loop. This design, distributing the two pads on both sides of the bracket body, achieves thermoelectric separation, and the heat generated by the chip can be directly transferred downwards through the first pad 2 to... The heat is conducted from the main body 1 to the ceramic substrate 5, and finally the ceramic substrate 5 dissipates the heat rapidly to the outside, significantly improving the heat dissipation effect of the bracket and ensuring the chip's luminous efficiency and lifespan. A water-blocking groove 6 surrounds the second pad 3, forming a physical barrier. When soldering the second pad 3, the molten solder is blocked by the water-blocking groove 6, preventing it from flowing to other areas of the main body 1 and avoiding solder contamination of the surface of the main body 1 or adjacent components. Simultaneously, when external moisture or contaminants attempt to penetrate inward along the interface between the main body 1 and the encapsulating adhesive, they are blocked by the water-blocking groove 6. Thus, the water-blocking groove 6 alters the penetration path, greatly extending the distance and time it takes for moisture to reach the core electrical areas (especially the second pad 3 and the chip). Furthermore, during overall molding or dispensing, the adhesive fills the water-blocking groove 6 and wraps around the sidewalls of the pads, forming an anchoring effect that greatly improves the sealing effect and significantly enhances its airtightness.

[0033] Thus, this application, through the combination of LED chip, thermoelectric separation and ceramic substrate 5, forms an extremely efficient low thermal resistance heat dissipation path, which significantly improves the heat dissipation effect of the bracket. At the same time, the water-blocking groove 6 can improve the overall airtightness of the bracket body 1, which can effectively prevent the internal chip and solder joint from getting damp and oxidized, thereby ensuring the reliability and lifespan of the LED for long-term use in harsh environments.

[0034] It is clear that the recessed inner wall of the reflector cup 11 is typically treated with high reflectivity, such as silver plating or aluminum plating. When the LED chip emits light, some of the light rays that diverge to the sides and downwards are reflected by the inner wall of the reflector cup 11. This reduces light loss inside the support, improves the light extraction efficiency of the chip, and avoids light waste. In addition, the included angle of the inner wall of the reflector cup 11 is set at 40°-50°, preferably 48.2°, ensuring that most of the light rays emitted from the side of the chip, after one reflection, can be emitted forward at a relatively concentrated angle, maximizing the light extraction efficiency and forming the desired light spot shape.

[0035] In this embodiment, the support body 1 includes a base 12 on which the reflector cup 11 is formed. The base 12 has a first surface and a second surface that are opposite to each other. The first pad 2 protrudes from the first surface. The water-blocking groove 6 is recessed from the second surface and is separated from other areas of the first surface by an isolation strip 4.

[0036] The first pad 2 protrudes from the first surface of the base 12 and is in direct contact with the bottom electrode of the LED chip, forming a vertical heat conduction channel from chip to first pad 2 to base 12 to ceramic substrate 5. The water-blocking groove 6 is recessed on the second surface of the base 12 and is directly attached to the ceramic substrate 5. Since the thermal conductivity of the ceramic substrate 5 is much higher than that of traditional plastic brackets, the heat in the area of ​​the water-blocking groove 6 can be quickly diffused to the external heat dissipation structure through the ceramic substrate 5. The isolation strip 4 completely separates the water-blocking groove 6 from the first surface of the base 12 (the area that supports the reflector cup 11 and the first pad 2), forming an independent space around the second pad 3. Thus, when external water vapor penetrates to the surface of the bracket, it must bypass the height difference of the isolation strip 4 to contact the second pad 3, which significantly extends the penetration path, improves its sealing performance, and prevents water vapor from directly corroding the internal circuit.

[0037] In this embodiment, the base 12, the isolation strip 4, and the water-blocking groove 6 are integrally formed structures. Through integrated design, a complex and highly reliable sealing structure is achieved without increasing production steps, perfectly balancing performance, reliability, and cost.

[0038] In this embodiment, there are multiple second pads 3, which are disposed on the second surface and arranged circumferentially around the first pad 2, and each second pad 3 is surrounded by a water-blocking groove 6.

[0039] The multiple circumferentially arranged second pads 3 can provide power to the second electrodes of the chip from all sides, ensuring a more uniform current distribution inside the chip and avoiding hot spots caused by excessively high local current density, thereby improving luminous efficiency and chip reliability. Simultaneously, they form a multi-point contact heat dissipation interface with the ceramic substrate 5, allowing heat to not only be conducted downwards through the core area but also diffuse to a wider surrounding area through this heat dissipation ring, greatly improving overall heat dissipation uniformity and efficiency. Furthermore, each second pad 3 has an independent ring-shaped water-blocking groove 6. This independent water-blocking groove 6 allows for more precise control of the amount of solder around each pad, preventing solder from flowing and connecting between pads during reflow soldering, thus preventing short circuits. At the same time, the bottom of each water-blocking groove 6 forms an independent heat dissipation channel with the ceramic substrate 5, improving its heat dissipation efficiency. In addition, the multiple water-blocking grooves 6 form a distributed protection network, ensuring that even if one area is damaged by external force, the other water-blocking grooves 6 can still maintain overall sealing.

[0040] In this embodiment, there are four second pads 3, and the four second pads 3 are arranged circumferentially around the first pad 2. Preferably, the four second pads 3 are evenly distributed at 90-degree intervals with the first pad 2 as the center, forming an absolutely symmetrical structure. They form four equidistant heat dissipation contacts with the ceramic substrate 5, allowing the heat generated by the chip to be conducted in a radial path. The uniform heat dissipation distribution can balance the temperature stress of the ceramic substrate 5 and prevent substrate warping caused by local overheating.

[0041] In this embodiment, the first pad 2 includes a pad body disposed on the first surface; and the pad body has a plurality of notches 21 circumferentially arranged, and each notch 21 corresponds to a second pad 3, that is, four notches 21 are correspondingly opened on the first pad 2, and a second pad 3 is presented in each of the four notches 21, so as to ensure uniform stress release and overall structural balance through symmetry. The electrical connection path from the first pad 2 to the interior of the second pad 3 is located in the position corresponding to these notches 21, and the notches 21 provide physical space and alignment reference for these paths. The notches 21 weaken the constraint of the rigid metal ring on the ceramic-plastic bonding system, allowing the system to have a certain degree of flexibility during thermal expansion and contraction, protecting the most vulnerable ceramic substrate 5 and preventing it from breaking due to stress. In addition, the setting of the notches 21 increases the escape path of air bubbles between the first pad 2 and the chip electrode, so as to discharge air bubbles generated by the adhesive layer during packaging and prevent air bubbles from bursting and forming water ingress channels.

[0042] In this embodiment, a heat sink 7 is also included. Preferably, the heat sink 7 can be a heat sink fin or a copper sheet. The heat sink 7 is disposed between the adjacent water-blocking grooves 6, that is, placed in the cross-shaped or grid-like gaps formed by the four independent water-blocking grooves 6, avoiding local heat accumulation and ensuring a more uniform temperature field throughout the entire support body 1. It is also thermally connected to the ceramic substrate 5. Preferably, the heat sink 7 is tightly bonded to the back of the ceramic substrate 5 by welding, sintering, or high thermal conductivity silver paste, etc., to ensure extremely low thermal resistance, so that the heat from the first pad 2 can flow to the ceramic substrate 5 without obstruction through the heat sink 7, further improving the long-term reliability of the LED chip and the entire packaging structure.

[0043] This application also provides an LED package, including the above-mentioned LED bracket, LED chip and encapsulating adhesive layer, wherein the LED chip is disposed in the reflector cup 11 of the LED bracket, and the encapsulating adhesive layer covers the LED chip and the opening end of the reflector cup 11.

[0044] The first pad 2 and the ceramic substrate 5 directly support the chip, and the heat generated by the chip is directly conducted downwards to the first pad 2, where it is quickly absorbed and dissipated by the ceramic substrate 5 below. The chip is precisely placed in the optical focal area of ​​the reflector cup 11, and the side light emitted by the chip is efficiently reflected by the inner wall of the reflector cup 11 to maximize the light output efficiency. The other electrode of the chip is connected to multiple second pads 3 through an internal passage to ensure current balance and avoid local overheating. At the same time, the heat is quickly dissipated from the core area through the heat sink 7 distributed between the water-blocking grooves 6, forming a three-dimensional heat dissipation. The encapsulation adhesive layer is usually high-transmittance silicone or epoxy resin, which is the last step in completing the encapsulation. The water-blocking grooves 6 and the isolation strip 4 work together with the encapsulation adhesive layer to form a strong sealing barrier to resist the invasion of external moisture and contaminants. The notch 21 of the first pad 2 absorbs the stress generated by the thermal expansion and contraction of different materials, preventing the substrate from cracking.

[0045] It is known that when the liquid encapsulating adhesive is filled into the reflective cup 11 and covers the opening, it will completely flow into and fill each water-blocking groove 6; after curing, the adhesive, together with the water-blocking groove 6, the isolation strip 4 and the sidewall of the pad wrapped by it, forms a sealed cavity, thus completely blocking the path of moisture and contaminants to penetrate along the edge of the pad and solving the problem of the airtightness of the bracket.

[0046] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0048] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0049] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0050] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Since these modifications and variations fall within the scope of the claims and their equivalents, this application also intends to include these modifications and variations.

[0051] The above description describes specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An LED bracket, characterized in that, include: Ceramic substrate; The main support body is disposed on the upper surface of the ceramic substrate; The main body of the bracket has a reflective cup; The first pad is located at the bottom of the reflector cup; The second pad is located on the side of the bracket body facing away from the reflector cup; The support body has a water-blocking groove recessed inward on its side, and the water-blocking groove surrounds the second welding pad.

2. The LED bracket according to claim 1, characterized in that, The support body includes a base on which the reflective cup is formed, the base having a first surface and a second surface facing away from each other; The first pad protrudes from the first surface; The water-blocking groove is recessed into the second surface, and is separated from other areas of the first surface by an isolation strip.

3. The LED bracket according to claim 2, characterized in that, The base, the isolation strip, and the wall of the water-blocking trough are integrally formed.

4. The LED bracket according to claim 3, characterized in that, The number of second pads is multiple, and the multiple second pads are disposed on the second surface and arranged circumferentially around the first pad, and each second pad is provided with a water-blocking groove around it.

5. The LED bracket according to claim 4, characterized in that, The number of the second pads is four, and the four second pads are arranged circumferentially around the first pad.

6. The LED bracket according to claim 5, characterized in that, The first pad includes a pad body disposed on the first surface; and the pad body has a plurality of notches in the circumferential direction, and each notch corresponds to a second pad.

7. The LED bracket according to claim 2, characterized in that, It also includes a heat sink, which is disposed on the first pad and located between adjacent water-retaining grooves, and is thermally connected to the ceramic substrate.

8. An LED package, characterized in that, The device includes an LED bracket, an LED chip, and an encapsulating adhesive layer as described in any one of claims 1-7, wherein the LED chip is disposed within the reflector cup of the LED bracket, and the encapsulating adhesive layer covers the LED chip and the open end of the reflector cup.

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