A packaging structure for improving yield of a vertical red light source and a vertical red light source

Abstract

The utility model discloses a kind of packaging structure and vertical red light source for improving the yield of vertical red light source, including ceramic substrate, vertical red light chip, gold wire, transparent silicone layer and white wall glue, ceramic substrate is equipped with first solder joint;Vertical red light chip is fixed on ceramic substrate, top surface is equipped with second solder joint;Gold wire is connected with first solder joint and second solder joint respectively, wherein, gold ball is formed at second solder joint;Transparent silicone layer covers the top surface of vertical red light chip, and the thickness is greater than the height of gold ball;White wall glue is arranged around vertical red light chip and transparent silicone layer, and the top surface of white wall glue is flush with the top surface of transparent silicone layer;Wherein, gold wire is buried in transparent silicone layer and white wall glue.This utility model avoids that gold wire is exposed and damaged, and prevents white wall glue from spilling and dyeing light emitting surface, while guaranteeing optical performance of light source, significantly improves product yield and long-term reliability.

Description

Technical Field

[0001] This utility model relates to the field of light source packaging technology, and in particular to a packaging structure and a vertical red light source for improving the yield of vertical red light sources. Background Technology

[0002] Vertical red light sources, as a common type of semiconductor light-emitting device, typically consist of a vertical red light chip, gold wires, white adhesive, and a ceramic substrate. In existing manufacturing processes, the vertical red light chip is first bonded to the ceramic substrate at high temperature using silver paste, connecting the chip's bottom positive electrode to the substrate. Then, gold wires are soldered between the chip's top negative electrode and the ceramic substrate using a wire bonding machine to complete the circuit connection. Next, white adhesive is applied around the chip using dispensing equipment, and after high-temperature curing, a protective encapsulation structure is formed. Finally, a dicing process yields the individual light source product.

[0003] Due to the structural characteristics of vertical red light chips, the positive electrode is located at the bottom of the chip, and the negative electrode is located at the top. Therefore, gold wires must be used to connect the top of the chip to the substrate to achieve circuit conduction. However, during the gold wire bonding process, a gold ball of a certain thickness forms at the negative electrode of the chip. The presence of this gold ball causes the overall height of the gold wire to exceed the chip surface. This height difference makes it difficult for the subsequent application of adhesive to completely cover the gold wire, resulting in some of the gold wire being exposed outside the package. The exposed gold wire is susceptible to displacement or breakage under external mechanical forces, thus affecting the reliability and yield of the light source. On the other hand, if the coating height of the adhesive is increased to completely cover the gold wire, the adhesive will overflow into the chip's light-emitting area, negatively impacting the light extraction efficiency and appearance quality. Utility Model Content

[0004] The technical problem to be solved by this utility model embodiment is: how to achieve reliable gold wire encapsulation while avoiding adverse effects of the encapsulating colloid on the optical performance of the chip.

[0005] To address the aforementioned problems, in a first aspect, this utility model proposes a packaging structure to improve the yield of vertical red light sources, comprising:

[0006] A ceramic substrate has a first solder joint.

[0007] A vertical red light chip is fixed on the ceramic substrate, and a second solder point is provided on the top surface;

[0008] Gold wires are connected to the first solder joint and the second solder joint respectively, wherein a gold ball is formed at the second solder joint;

[0009] A transparent silicone layer covers the top surface of the vertical red light chip, and its thickness is greater than the height of the gold ball;

[0010] White wall adhesive is disposed around the vertical red light chip and the transparent silicone layer, with the top surface of the white wall adhesive flush with the top surface of the transparent silicone layer; wherein, the gold wire is embedded in the transparent silicone layer and the white wall adhesive.

[0011] A further technical solution is that the height of the gold ball ranges from 30 to 50 μm.

[0012] A further technical solution is that the position of any point on the gold wire is lower than the position of the gold ball.

[0013] A further technical solution is that the side of the white wall adhesive contacts the side of the transparent silicone layer.

[0014] A further technical solution is that the second solder joint is located at the negative electrode of the vertical red light chip.

[0015] A further technical solution is that the vertical red light chip is fixed to the ceramic substrate by a silver paste layer.

[0016] Secondly, this utility model embodiment proposes a vertical red light source, including the packaging structure described in the first aspect for improving the yield of the vertical red light source.

[0017] Compared with the prior art, the technical effects achieved by the embodiments of this utility model include:

[0018] This invention proposes a packaging structure to improve the yield of a vertical red light source, comprising a ceramic substrate, a vertical red light chip, gold wires, a transparent silicone layer, and a white adhesive. The ceramic substrate has a first solder joint; the vertical red light chip is fixed on the ceramic substrate, and a second solder joint is provided on its top surface; the gold wires are connected to both the first and second solder joints, wherein a gold sphere is formed at the second solder joint; the transparent silicone layer covers the top surface of the vertical red light chip, and its thickness is greater than the height of the gold sphere; the white adhesive is disposed around the vertical red light chip and the transparent silicone layer, and the top surface of the white adhesive is flush with the top surface of the transparent silicone layer; wherein the gold wires are embedded within the transparent silicone layer and the white adhesive. This invention achieves complete embedding and reliable packaging of the gold wires by ensuring that the transparent silicone layer completely covers the gold spheres and gold wires, while simultaneously ensuring that the top surface of the white adhesive is precisely flush with the top surface of the transparent silicone layer. This avoids damage to exposed gold wires and prevents the white adhesive from overflowing onto the light-emitting surface, significantly improving product yield and long-term reliability while ensuring the optical performance of the light source. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0022] Figure 1 This is a schematic diagram of a packaging structure for improving the yield of a vertical red light source, as proposed in an embodiment of this utility model.

[0023] Figure 2 This is a schematic diagram of the encapsulation structure for improving the yield of vertical red light sources proposed in this embodiment of the present invention before the coating with white wall adhesive.

[0024] Figure Labels

[0025] The components include a ceramic substrate 10, a vertical red light chip 20, a gold wire 30, a transparent silicone layer 40, white wall adhesive 50, and a gold ball 60. Detailed Implementation

[0026] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Similar component reference numerals in the drawings represent similar components. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0027] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0028] It should also be understood that the terminology used in this specification of embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the present invention. As used in this specification of embodiments of the present invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0029] See Figures 1-2 This utility model embodiment proposes a packaging structure to improve the yield of vertical red light source, including a ceramic substrate 10, a vertical red light chip 20, a gold wire 30, a transparent silicone layer 40, and a white wall adhesive 50. The specific structure is described below:

[0030] A ceramic substrate 10 has a first solder joint; a vertical red light chip 20 is fixed on the ceramic substrate 10, and a second solder joint is provided on its top surface; gold wires 30 are connected to the first solder joint and the second solder joint respectively, wherein a gold ball 60 is formed at the second solder joint; a transparent silicone layer 40 covers the top surface of the vertical red light chip 20, and its thickness is greater than the height of the gold ball 60; a white wall adhesive 50 is arranged around the vertical red light chip 20 and the transparent silicone layer 40, and the top surface of the white wall adhesive 50 is flush with the top surface of the transparent silicone layer 40; wherein the gold wires 30 are embedded in the transparent silicone layer 40 and the white wall adhesive 50. The transparent silicone layer 40 is made of transparent silicone, which has the advantages of high light transmittance, high temperature resistance, high viscosity, and easy curing at low temperature.

[0031] In practice, by setting a transparent silicone layer 40 on the top surface of the vertical red light chip 20 with a thickness greater than the height of the gold ball 60 on its surface, the problem of exposed gold wires 30 caused by the protrusion of the gold ball 60 is directly solved. Since the transparent silicone layer 40 can completely wrap the gold ball 60 with a certain height and the gold wires 30 connected to it, the gold wires 30, which are originally easily damaged by external collisions or friction, are effectively mechanically protected, thereby significantly reducing the risk of open circuits or short circuits caused by them and improving the structural stability and long-term reliability of the light source.

[0032] Furthermore, by surrounding the chip and the transparent silicone layer 40 with the white adhesive 50, and ensuring its top surface is flush with the top surface of the transparent silicone layer 40, the adhesive contamination problem caused by attempting to completely cover the raised gold wire 30 in traditional packaging is cleverly avoided. The filling height of the white adhesive 50 is limited to the same level as the top surface of the transparent silicone layer 40. This means that the dispensing operation has a clear and safe reference plane, fundamentally preventing the white adhesive 50 from overflowing into the chip's light-emitting area due to excessive amount before curing. This design ensures that the chip's light-emitting surface is not obstructed, ensuring that the brightness and color quality of the light source meet expectations, while maintaining a clean and consistent product appearance.

[0033] Furthermore, completely embedding the gold wire 30 within a composite encapsulation formed by the transparent silicone layer 40 and the white wall adhesive 50 not only provides physical protection but also forms an effective environmental barrier. This structure prevents corrosive substances such as moisture and sulfide gases from directly contacting the surface of the gold wire 30, thereby inhibiting chemical corrosion and sulfidation of the gold wire 30 and extending the lifespan of the light source in harsh environments.

[0034] This invention achieves reliable physical protection for the gold wire 30, effective protection for the chip's light-emitting surface, and strict isolation from environmental corrosion through the synergistic design and precise coplanar structure of the transparent silicone layer 40 and the white wall adhesive 50. Ultimately, while ensuring the excellent optical performance of the light source, it significantly improves its production yield and overall reliability.

[0035] In some preferred embodiments, the height of the gold ball 60 ranges from 30 to 50 μm.

[0036] In practice, the height of the gold sphere 60 is limited to the range of 30-50 μm. The extremely thin gold sphere 60 directly reduces the overall bulge height of the gold wire 30 at the second solder joint, which allows the subsequent transparent silicone layer 40 to completely cover the entire gold wire 30 without needing to be too thick. A thinner transparent silicone layer 40 helps reduce light absorption and scattering, thereby better maintaining the brightness of the light source.

[0037] In some preferred embodiments, the position of any point of the gold wire 30 is lower than the position of the gold ball 60.

[0038] In specific implementation, the position of any point on the gold wire 30 is specified to be lower than the position of the gold ball 60. This feature clarifies the arc shape requirement of the gold wire 30, ensuring that the main body of the gold wire 30 can be tightly attached to the top surface of the vertical red light chip 20 without forming a tall arc between the chip and the first solder joint. This low-arc line rail design greatly reduces the overall thickness requirement of the encapsulating colloid. The transparent silicone layer 40 only needs to focus on covering the highest point of the gold ball 60, without increasing its thickness to cross a tall arc. This makes the encapsulation structure flatter, saving adhesive material and reducing the risk of internal stress caused by excessive colloid thickness, further ensuring the stability and reliability of the light source.

[0039] In some preferred embodiments, the side of the white wall adhesive 50 is in contact with the side of the transparent silicone layer 40.

[0040] In practice, the side of the white adhesive 50 is positioned to contact the side of the transparent silicone layer 40. This feature defines the horizontal connection between the two adhesives, forming a continuous and seamless side encapsulation barrier. This tight side contact prevents gaps or delamination between the two adhesives, effectively blocking external moisture and corrosive gases (such as sulfides) from penetrating the encapsulation structure from the sides, protecting the gold wires 30 and chip electrodes from corrosion. Simultaneously, this structure enhances the mechanical integrity of the entire encapsulation, allowing the white adhesive 50 and the transparent silicone layer 40 to work together as a whole to resist external stress, thus improving the long-term durability of the encapsulation structure.

[0041] In some preferred embodiments, the second solder joint is located at the negative electrode of the vertical red light chip 20.

[0042] In practice, the positive and negative electrodes of the vertical structure chip are located at the bottom and top, respectively, and the negative electrode at the top must be connected to the circuit of the substrate through the gold wire 30.

[0043] In some preferred embodiments, the vertical red light chip 20 is fixed to the ceramic substrate 10 by a silver paste layer.

[0044] In practice, the silver paste layer not only provides strong mechanical adhesion, firmly fixing the chip to the substrate, but its excellent conductivity also ensures a good circuit connection between the chip's bottom positive electrode and the substrate. Simultaneously, the silver paste can withstand the high-temperature curing process in subsequent packaging, guaranteeing the chip's positional stability and the reliability of its circuit connections during long-term use.

[0045] This utility model provides a vertical red light source, including a packaging structure as described in any of the above embodiments to improve the yield of the vertical red light source.

[0046] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0047] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0048] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0049] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0050] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0051] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0052] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Since these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

[0053] The above description describes specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A packaging structure for improving the yield of vertical red light sources, characterized in that, include: A ceramic substrate has a first solder joint. A vertical red light chip is fixed on the ceramic substrate, and a second solder point is provided on the top surface; Gold wires are connected to the first solder joint and the second solder joint respectively, wherein a gold ball is formed at the second solder joint; A transparent silicone layer covers the top surface of the vertical red light chip, and its thickness is greater than the height of the gold ball; White wall adhesive is disposed around the vertical red light chip and the transparent silicone layer, with the top surface of the white wall adhesive flush with the top surface of the transparent silicone layer; wherein, the gold wire is embedded in the transparent silicone layer and the white wall adhesive.

2. The packaging structure for improving the yield of vertical red light sources according to claim 1, characterized in that, The height of the gold sphere ranges from 30 to 50 μm.

3. The packaging structure for improving the yield of vertical red light sources according to claim 1, characterized in that, The position of any point on the gold wire is lower than the position of the gold ball.

4. The packaging structure for improving the yield of vertical red light sources according to claim 1, characterized in that, The side of the white wall adhesive is in contact with the side of the transparent silicone layer.

5. The packaging structure for improving the yield of vertical red light sources according to claim 1, characterized in that, The second solder joint is located at the negative electrode of the vertical red light chip.

6. The packaging structure for improving the yield of vertical red light sources according to claim 1, characterized in that, The vertical red light chip is fixed to the ceramic substrate by a silver paste layer.

7. A vertical red light source, characterized in that, Including the packaging structure for improving the yield of vertical red light sources as described in any one of claims 1-6.

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