Light emitting assembly and display device

Abstract

The application relates to a light-emitting assembly and a display device, comprising a chip support, a first light-emitting chip, a driving chip and a second light-emitting chip, the first light-emitting chip and the driving chip being arranged on a bearing surface of the chip support at intervals; the second light-emitting chip is arranged on the driving chip and emits light of a different color from the first light-emitting chip, the degree to which the light-emitting efficiency of the second light-emitting chip is affected by temperature is greater than the degree to which the light-emitting efficiency of the first light-emitting chip is affected by temperature; wherein the driving chip is connected with the first light-emitting chip and the second light-emitting chip respectively and used for driving the first light-emitting chip and the second light-emitting chip to emit light. The light-emitting assembly and the display device in the application can reduce display color deviation of the light-emitting assembly caused by the fact that the light-emitting efficiency of the second light-emitting chip is obviously affected by temperature, and improve display effect.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to light-emitting components and display devices. Background Technology

[0002] In the field of display technology, direct-view and backlit display technologies are two main display methods. Direct-view technology displays images by having each pixel emit light directly, while backlit technology uses a backlight to provide uniform light, and then the LCD panel or other components control the light transmittance to form an image. In backlit technology, the light-emitting chip, as a key backlight component, plays a crucial role.

[0003] However, because light-emitting chips consume a significant amount of power during operation, they generate considerable heat. Furthermore, the luminous efficiency of light-emitting chips is significantly affected by temperature, leading to a decrease in overall luminous efficiency. Utility Model Content

[0004] Therefore, it is necessary to provide a light-emitting component and display device that can improve the low luminous efficiency of light-emitting chips, addressing the aforementioned technical problems.

[0005] This application provides a light-emitting component, the light-emitting component comprising: Chip bracket; The first light-emitting chip and the driving chip are arranged at intervals on the support surface of the chip holder; The second light-emitting chip is disposed on the driving chip and in contact with the driving chip. It emits light of a different color than the first light-emitting chip. The luminous efficiency of the second light-emitting chip is affected by temperature to a greater extent than that of the first light-emitting chip. The driving chip is connected to the first light-emitting chip and the second light-emitting chip respectively, and is used to drive the first light-emitting chip and the second light-emitting chip to emit light. Beneficial effects

[0006] In related technologies, each light-emitting chip and driving chip in a light-emitting component is mounted on a chip carrier, or each light-emitting chip is mounted on a driving chip. On the one hand, the heat generated between the light-emitting chips will affect each other, with the second light-emitting chip being more affected by temperature, and its luminous efficiency being more significantly affected. On the other hand, mounting each light-emitting chip and driving chip on a chip carrier requires a larger chip carrier, and mounting each light-emitting chip on a driving chip requires a larger wafer, resulting in higher costs.

[0007] The light-emitting component provided in this embodiment includes a chip carrier, a first light-emitting chip, a driving chip, and a second light-emitting chip. The first light-emitting chip and the driving chip are arranged alternately on the support surface of the chip carrier. The second light-emitting chip is disposed on the driving chip and emits light of a different color than the first light-emitting chip. The luminous efficiency of the second light-emitting chip is more affected by temperature than that of the first light-emitting chip. The driving chip is connected to the first light-emitting chip and the second light-emitting chip respectively and is used to drive the first light-emitting chip and the second light-emitting chip to emit light.

[0008] On the one hand, the first light-emitting chip is mounted on the chip carrier, and the second light-emitting chip is mounted on the driver chip. This arrangement, with the first and second light-emitting chips on different substrates, reduces the impact of heat generated by the first chip on the second chip. On the other hand, the luminous efficiency of the second chip is more affected by temperature than that of the first chip. Therefore, by reducing the impact of heat generated by the first chip on the second chip, the color shift caused by the significant temperature-dependent luminous efficiency of the second chip in the light-emitting component can be reduced, thus improving the display effect.

[0009] On the other hand, the first light-emitting chip is set on the chip holder, and the second light-emitting chip is set on the driver chip. The chip holder only needs to support the first light-emitting chip and the driver chip, and the driver chip only needs to support the second light-emitting chip. The required size of the chip holder and the driver chip is small, which can reduce costs.

[0010] In one embodiment, the chip holder has a groove, the driving chip is disposed in the groove, and the first contact surface of the driving chip that contacts the second light-emitting chip and the second contact surface of the chip holder that contacts the first light-emitting chip are flush.

[0011] Beneficial effects: On the one hand, the chip holder has a groove, thus the chip holder adopts a sunken design. The groove provides a space for the driver chip. The driver chip is placed in the groove. The first contact surface of the driver chip and the second light-emitting chip are flush with the second contact surface of the chip holder and the first light-emitting chip. This ensures that the light-emitting surfaces of the second light-emitting chip and the first light-emitting chip are coplanar, so that the emission starting points of each light-emitting chip are as consistent as possible, the optical path difference of the light beam emitted by each light-emitting chip approaches zero, and different colors of light can radiate into space from the same starting point and mix synchronously during propagation, thereby improving the light mixing effect of the light-emitting component.

[0012] On the other hand, the first contact surface between the driver chip and the second light-emitting chip, and the second contact surface between the chip holder and the first light-emitting chip are flush, so that the light-emitting surfaces of the second light-emitting chip and the first light-emitting chip are coplanar, the light radiation center axis height of each display chip is consistent, and the radiation range of different colors of light almost overlaps, so that the light beam emitted by the light-emitting component can be received almost simultaneously, reducing the probability of light uniformity loss caused by radiation area misalignment and improving the display uniformity of the light-emitting component.

[0013] In one embodiment, there are two first light-emitting chips, and the two first light-emitting chips emit light of different colors; The chip support includes a main body and two protrusions. The protrusions protrude from the main body, and the portion of the main body between the two protrusions forms the groove. The two first light-emitting chips are respectively disposed on the two protrusions.

[0014] Beneficial effects: On the one hand, the number of first light-emitting chips is two, and the two first light-emitting chips emit light of different colors, increasing the possibility of color mixing between the two first light-emitting chips and the second light-emitting chip, thus providing more color display. On the other hand, the chip support includes a main body and two protrusions. The protrusions protrude from the main body, and the portion of the main body between the two protrusions forms a groove. The two protrusions provide support for the two first light-emitting chips respectively, and the groove provides a space for accommodating the second light-emitting chip. The second light-emitting chip is disposed in the groove, such that the first contact surface between the driving chip and the second light-emitting chip is flush with the second contact surface between the protrusion and the first light-emitting chip, thereby ensuring that the light-emitting surfaces of the second light-emitting chip and the first light-emitting chip are coplanar, improving the light emission effect of the light-emitting component.

[0015] In one embodiment, the surface layer of the chip holder near the first light-emitting chip and the driving chip is a metal layer, and the first light-emitting chip and the driving chip are respectively arranged on the metal layer.

[0016] Beneficial effects: The surface layer of the chip holder near the first light-emitting chip and the driver chip is a metal layer. The first light-emitting chip and the driver chip are arranged on the metal layer. The heat generated by the first light-emitting chip and the heat generated by the driver chip can be dissipated through the metal layer. The heat generated by the second light-emitting chip can also be transferred to the metal layer through the driver chip, and the metal layer further dissipates the heat, thus improving the heat dissipation performance of the light-emitting component.

[0017] In one embodiment, the driving chip is configured with a first power supply terminal and a second power supply terminal; the second light-emitting chip is configured with a first polarity electrode and a second polarity electrode, the polarities of the first polarity electrode and the second polarity electrode being opposite. The second light-emitting chip is integrated on the driver chip, and the first polar electrode of the second light-emitting chip is connected to the first power supply terminal of the driver chip, and the second polar electrode of the second light-emitting chip is connected to the driver unit on the driver chip. The chip holder is configured with a first power supply pin and a second power supply pin. The first power supply pin is connected to the first power supply terminal of the driver chip via a first lead, and the second power supply pin is connected to the second power supply terminal of the driver chip via a second lead.

[0018] Beneficial effects: The second polar electrode of the second light-emitting chip is connected to the driving unit on the driving chip. The first power supply pin of the chip carrier is connected to the first power supply terminal of the driving chip through the first lead. The second light-emitting chip is integrated on the driving chip, and its first polar electrode is connected to the first power supply terminal of the driving chip. The second polar electrode of the second light-emitting chip is also connected to the driving unit on the driving chip, enabling the driving unit to output a driving signal to the second light-emitting chip through its second polar electrode, thus driving the second light-emitting chip to emit light. Therefore, when the driving chip receives an external power supply signal through its first power supply pin, this signal can be input to the first polar electrode of the second light-emitting chip, achieving synchronous power supply between the second light-emitting chip and the driving chip. This reduces the number of power supply pins in the chip carrier, eliminating the need for additional pins.

[0019] In one embodiment, the first light-emitting chip is configured with a first polar electrode and a second polar electrode, wherein the first polar electrode and the second polar electrode of the first light-emitting chip are respectively located on a first surface of the first light-emitting chip near the chip support. The light-emitting component includes a first power supply pad and a second power supply pad disposed on the chip carrier. The first power supply pad is in contact with the first polar electrode of the first light-emitting chip, and the second power supply pad is in contact with the second polar electrode of the first light-emitting chip. The chip holder is configured with a third power supply pin, which is connected to the second power supply pad via a third lead; the driver chip is configured with a driver terminal connected to the driver unit, which is connected to the first power supply pad via a fourth lead.

[0020] Beneficial effects: The first polar electrode and the second polar electrode of the first light-emitting chip are respectively disposed on the first surface of the first light-emitting chip near the chip carrier. The light-emitting component includes a first power supply pad and a second power supply pad disposed on the chip carrier. Therefore, the first polar electrode of the first light-emitting chip can directly contact and connect with the first power supply pad, and the second polar electrode of the first light-emitting chip can directly contact and connect with the second power supply pad, realizing flip-chip packaging of the first light-emitting chip and the chip carrier. This can improve the problem of thermal fatigue stress caused by the difference in thermal expansion coefficients of the "chip-lead-chip carrier" in traditional packaging. Simultaneously, since the first, second, third, and fourth leads do not need to bear the mechanical force of supporting the chip, but only need to achieve basic electrical connection, the requirements for the first, second, third, and fourth leads in terms of material purity, wire diameter accuracy, and temperature resistance can be reduced, thus reducing costs.

[0021] In some embodiments, the first light-emitting chip is configured with a first polar electrode and a second polar electrode, wherein the first polar electrode of the first light-emitting chip is disposed on a first surface of the first light-emitting chip close to the chip support, and the second polar electrode of the first light-emitting chip is disposed on a second surface of the first light-emitting chip away from the chip support. The chip support is provided with a third power supply pin, which is connected to the second polarity electrode of the first light-emitting chip via a fifth lead; the driving chip is provided with a driving end connected to the driving unit, which is connected to the first polarity electrode of the first light-emitting chip via a sixth lead.

[0022] Beneficial effects: The first polar electrode of the first light-emitting chip is located on the first surface of the first light-emitting chip close to the chip carrier, and the second polar electrode of the first light-emitting chip is located on the second surface of the first light-emitting chip away from the chip carrier. The first polar electrode of the first light-emitting chip is connected to the driving end of the driving chip through the sixth lead, and the second polar electrode of the first light-emitting chip is connected to the third power supply pin of the chip carrier through the fifth lead. This achieves a positive package of the first light-emitting chip and the chip carrier, and electrical connection is achieved through leads. There is no need to pre-process the chip carrier and the driving chip, nor is it necessary to add special electrode shapes, such as bumps. The architecture is simple and can reduce the manufacturing difficulty.

[0023] In some embodiments, the light-emitting component includes: A temperature detection unit is located in the driver chip and is used to detect the temperature of the first light-emitting chip.

[0024] Beneficial effects: On the one hand, the temperature detection unit is integrated into the driver chip, achieving an integrated design that eliminates the need for separate packaging of the temperature detection unit and the driver chip, reducing packaging costs. On the other hand, the first light-emitting chip and the driver chip are respectively mounted on the chip substrate, while the second light-emitting chip is mounted on the driver chip. The driver chip contains a temperature detection unit, which can more accurately detect the temperature of the second light-emitting chip, improving the accuracy of temperature detection and enabling the identification of how the luminous efficiency of the second light-emitting chip is affected by temperature.

[0025] In one embodiment, there are two first light-emitting chips, and the two first light-emitting chips emit light of different colors; One first light-emitting chip, one second light-emitting chip, and another first light-emitting chip are arranged at intervals along one direction; or, one first light-emitting chip, another first light-emitting chip, and another second light-emitting chip are arranged at intervals along the one direction.

[0026] Beneficial effects: Since there are two first-light-emitting chips, the two first-light-emitting chips emit light of different colors, and the light emitted by the two first-light-emitting chips is also different from that emitted by the second-light-emitting chip. Multiple colors can be displayed through light mixing, improving the color richness of the light-emitting component. The arrangement of the two first-light-emitting chips and the second-light-emitting chip can be either one first-light-emitting chip, one second-light-emitting chip, and another first-light-emitting chip arranged alternately in one direction, or another first-light-emitting chip, another first-light-emitting chip, and a second-light-emitting chip arranged alternately in one direction. Flexible packaging of multiple light-emitting chips can be achieved through different arrangement methods.

[0027] In one embodiment, the second light-emitting chip is a red light-emitting chip for emitting red light or a yellow light-emitting chip for emitting yellow light.

[0028] Beneficial Effects: Compared to light-emitting chips that emit other colors of light, red light-emitting chips (emitting red light) and yellow light-emitting chips (emitting yellow light) have smaller band gaps. As the temperature of these chips rises, the band gaps of their corresponding materials shrink due to lattice vibrations. Furthermore, the band gap shrinkage rate caused by temperature is significantly greater for the materials of red and yellow chips than for other light-emitting chips, potentially leading to color shift issues. Moreover, with the narrower band gap, defect energy levels (such as impurities and lattice vacancies) in the materials of red and yellow chips are more likely to fall into the band gap, becoming non-radiative recombination centers. Charge carriers are less likely to release photons through radiative transitions and instead release heat through defect energy levels, resulting in a greater decrease in luminous efficiency. In this embodiment, the second light-emitting chip is either a red light-emitting chip for emitting red light or a yellow light-emitting chip for emitting yellow light. The second light-emitting chip is disposed on the driver chip, while the first light-emitting chip and the driver chip are disposed on a chip support. Thus, the red or yellow light-emitting chip is disposed on a different substrate than the first light-emitting chip, which reduces the impact of heat generated by the first light-emitting chip on the red or yellow light-emitting chip. The luminous efficiency of the red or yellow light-emitting chip is more affected by temperature than that of the first light-emitting chip. The temperature detection unit is disposed in the driver chip, and the red or yellow light-emitting chip is disposed on the driver chip. The temperature detection unit can more accurately detect the temperature of the red or yellow light-emitting chip, improving the accuracy of temperature detection. This allows for the identification of the temperature-related effects on the red or yellow light-emitting chip, and enables the driver chip to accurately compensate for color accuracy loss caused by temperature increases in the red or yellow light-emitting chip, preventing color shifts in the light emitted by the light-emitting component and improving the display effect of the light-emitting component.

[0029] Secondly, this application provides a display device, comprising: Display panel, used to display images; A backlight module is used to provide a light source for the display panel. The backlight module includes a plurality of light-emitting components, each of which includes: Chip bracket; Blue light-emitting chip; Green light-emitting chip; The driver chip, the blue light-emitting chip, the green light-emitting chip and the driver chip are arranged at intervals on the support surface of the chip holder; A red light-emitting chip is disposed on the driver chip and is in contact with the driver chip; A temperature detection unit is provided in the driver chip, and the temperature detection unit is used to detect the temperature of the red light-emitting chip.

[0030] Beneficial effects: In related technologies, each light-emitting chip and driving chip in the light-emitting component is mounted on a chip carrier, or each light-emitting chip is mounted on a driving chip. On the one hand, the heat generated between the light-emitting chips will affect each other, with red light-emitting chips being more affected by temperature, and the luminous efficiency of red light-emitting chips being more affected. On the other hand, if each light-emitting chip and driving chip is mounted on a chip carrier, the chip carrier needs to be larger, and if each light-emitting chip is mounted on a driving chip, the driving chip needs to use a larger wafer, resulting in higher costs.

[0031] The light-emitting component provided in this embodiment includes a chip carrier, a blue light-emitting chip, a green light-emitting chip, a driver chip, and a red light-emitting chip. The blue light-emitting chip, the green light-emitting chip, and the driver chip are arranged alternately on the support surface of the chip carrier. The luminous efficiency of the red light-emitting chip is affected by temperature more than that of the blue and green light-emitting chips. The driver chip is connected to the blue light-emitting chip, the green light-emitting chip, and the red light-emitting chip, respectively, and is used to drive the blue light-emitting chip, the green light-emitting chip, and the red light-emitting chip to emit light.

[0032] On one hand, the blue and green LEDs are mounted on the chip substrate, while the red LED is mounted on the driver chip. This placement of the blue, green, and red LEDs on different substrates reduces the impact of heat generated by the blue and green LEDs on the red LED. On the other hand, the luminous efficiency of the red LED is more significantly affected by temperature than that of the blue and green LEDs. Therefore, by reducing the heat generated by the blue and green LEDs, the color shift caused by the temperature-dependent luminous efficiency of the red LED can be minimized, thus improving the display effect.

[0033] On the other hand, the blue and green light-emitting chips are set on the chip holder, and the red light-emitting chip is set on the driver chip. The chip holder only needs to support the blue and green light-emitting chips and the driver chip, and the driver chip only needs to support the red light-emitting chip. The required size of the chip holder and the driver chip is small, which can reduce costs. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the drawings used in the description of the embodiments of this application or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of a light-emitting component in one embodiment of this application when applied to a light-emitting device; Figure 2 This is one of the structural schematic diagrams of the light-emitting component in one embodiment of this application; Figure 3 This is a graph showing the change in brightness of the red, blue, and green light-emitting chips as a function of temperature in one embodiment of this application. Figure 4 This is one of the schematic diagrams of the chip holder structure in one embodiment of this application; Figure 5 This is a second schematic diagram of the chip holder structure in one embodiment of this application; Figure 6 This is one of the structural schematic diagrams of the driver chip in one embodiment of this application; Figure 7 This is a second schematic diagram of the structure of the driver chip in one embodiment of this application; Figure 8 This is the third schematic diagram of the structure of the driver chip in one embodiment of this application; Figure 9 This is the fourth schematic diagram of the structure of the driver chip in one embodiment of this application; Figure 10 This is the fifth schematic diagram of the structure of the driver chip in one embodiment of this application; Figure 11 This is the sixth schematic diagram of the structure of the driver chip in one embodiment of this application; Figure 12 This is a second schematic diagram of the structure of the light-emitting component in one embodiment of this application; Figure 13 This is one of the top views of a light-emitting component in an embodiment of this application, when it includes two first light-emitting chips; Figure 14 This is a second top view of a light-emitting component in one embodiment of this application, when it includes two first light-emitting chips; Figure 15 This is one of the cross-sectional views of a light-emitting component in an embodiment of this application, when it includes two first light-emitting chips; Figure 16 This is a second cross-sectional view of a light-emitting component in one embodiment of this application, when it includes two first light-emitting chips.

[0036] Explanation of icon numbers: 110: Display panel; 120: Backlight module; 121: Light-emitting component; 1211: Chip bracket; 211: Main body; 2111: Groove; 2112: Protrusion; 2113: First power supply pin; 2114: Second power supply pin; 2115: First power supply pad; 2116: Second power supply pad; 2117: Third power supply pin; 2118: Third power supply pad; 2119: Fourth power supply pad; 2120: Fourth power supply pin; 2121: Fifth power supply pin; 2122: Data input pin; 2123: Data output pin; 1212: First light-emitting chip; 1213: Driver chip; 2131: First power supply terminal; 2132: Second power supply terminal; 2133: Driver terminal; 2134: Data input terminal; 2135: Data output terminal; 1214: Second light-emitting chip; 1215: Temperature detection unit. Detailed Implementation

[0037] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0038] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0039] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0040] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0041] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0042] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0043] In the field of display technology, backlighting and direct-viewing are two main display methods. The core of backlighting technology lies in providing uniform light through a backlight source, and then controlling the light transmittance through a panel to form an image. In a backlighting system, the light-emitting chip acts as the backlight source, needing to provide sufficient brightness to illuminate the entire display panel. Direct-viewing technology, on the other hand, displays images by having each pixel emit light directly. Each pixel contains multiple light-emitting diodes (LEDs), which can directly control the brightness and color of each pixel. Because each pixel emits light independently, direct-viewing technology can completely turn off the corresponding pixel when displaying black, thus achieving higher contrast and lower power consumption.

[0044] In backlit display systems, the light-emitting diodes (LEDs) need to provide sufficient brightness to illuminate the entire display panel. To achieve large-screen displays, the display area of ​​the panel is increased, thus increasing the number of light-emitting components, including the number of LEDs that need to be driven. The driver chip needs to drive multiple LEDs, therefore increasing its power. For example, an LCD monitor may require multiple high-power LEDs to provide sufficient backlight brightness. The power of these LEDs typically ranges from several hundred milliwatts to several watts, depending on the size and brightness requirements of the display. In contrast, the power of LEDs in direct-view technology is usually lower. Because each pixel emits light independently, the power requirement of each LED is relatively low. For example, in OLED displays, the power of each LED is typically only a few milliwatts. This is because direct-view technology does not require a large area of ​​uniform backlight like backlit displays; the power of each pixel only needs to meet its own display requirements. During operation, the LEDs convert some electrical energy into heat. The higher the power of the LED, the more heat it generates. Therefore, high-power LEDs in backlit displays generate more heat, leading to more severe heat generation issues.

[0045] The heat generated by an LED chip affects its luminous efficiency, which refers to its efficiency in converting electrical energy into light energy. Higher luminous efficiency means more electrical energy is converted into light energy and less into heat energy. The luminous efficiency of an LED chip is extremely sensitive to temperature. When the temperature rises, the carrier recombination efficiency inside the LED chip decreases, leading to a reduction in luminous efficiency.

[0046] Taking a red-emitting light-emitting chip as an example, such chips are made from specific semiconductor materials, such as aluminum indium gallium phosphide (AlInGaP) or certain quantum dot materials. The band structure and carrier recombination characteristics of these materials are highly sensitive to temperature changes. Therefore, their luminous efficiency may be more affected by temperature than that of other color-emitting chips. Specifically, increased temperature causes changes in the band structure of the semiconductor material, reducing carrier recombination efficiency. For example, high temperatures increase thermal excitation of carriers, causing more carriers to transition from bound states to free states, thus reducing the probability of radiative recombination and consequently decreasing luminous efficiency. For instance, at low temperatures, the chip may emit brighter and purer colored light; however, at high temperatures, its luminous intensity weakens and its spectrum shifts, resulting in a darker and less pure color. This color inconsistency affects the overall color balance and accuracy of the light-emitting component, leading to poor display performance.

[0047] In related technologies, there is a solution where the driver chip and multiple light-emitting chips are spaced apart on the same support surface of a chip holder. The support surface of the chip holder must simultaneously support both the driver chip and the multiple light-emitting chips. On the one hand, the driver chip occupies the light-emitting area on the support surface, reducing the effective light-emitting area ratio and weakening the display effect. On the other hand, the chip holder's size is relatively large due to the need to support both the driver chip and the multiple light-emitting chips, which is detrimental to the miniaturization design of the light-emitting components. Furthermore, it requires more chip holder material, which is not conducive to cost control.

[0048] In addition, another technical solution exists in which multiple light-emitting chips are mounted on a driver chip. The driver chip needs to support multiple light-emitting chips. On the one hand, the heat generated by the light emitted by the multiple light-emitting chips is transferred between them through the driver chip, causing the temperature of each chip to rise and affecting its luminous efficiency. On the other hand, because the driver chip needs to support multiple light-emitting chips, it requires a larger volume, resulting in a larger wafer and higher cost.

[0049] Therefore, in the field of backlight technology, how to reduce the impact of heat generation of the light-emitting chip on the luminous efficiency of the light-emitting chip is a technical problem that urgently needs to be solved.

[0050] The light-emitting component provided in this application can be applied to light-emitting components, which can be mobile terminals such as mobile phones, tablets, and televisions, or light-emitting components such as displays and monitors.

[0051] See Figure 1 , attached Figure 1 This illustration shows a schematic diagram of the structure of the light-emitting component 121 applied to a light-emitting device according to an embodiment of this application. Taking the light-emitting component 121 as a backlight module 120 applied to a real device as an example, the backlight module 120 may include multiple light-emitting components 121 to provide a light source for the display panel 110, enabling the display panel 110 to display corresponding images. The display panel 110 may be disposed on the light-emitting side of the backlight module 120.

[0052] Combined with appendix Figure 2 , attached Figure 2 This diagram illustrates one of the structural schematic diagrams of a light-emitting component 121 according to an embodiment of this application. The light-emitting component 121 in this embodiment may include a chip carrier 1211.

[0053] The chip bracket 1211 can be understood as a structural component used to support and fix the light-emitting chip and the driver chip 1213, and to connect the driver chip 1213 with external circuits, heat dissipation systems, etc.

[0054] The surface of the chip bracket 1211 used to support and fix the light-emitting chip and the driver chip 1213 can be called the support surface.

[0055] The light-emitting component 121 in this embodiment may include a first light-emitting chip 1212 and a driving chip 1213. The first light-emitting chip 1212 and the driving chip 1213 may be arranged at intervals on the support surface of the chip holder 1211.

[0056] The light-emitting component 121 in this embodiment may include a second light-emitting chip 1214. The second light-emitting chip 1214 may be disposed on the driving chip 1213 and in contact with the driving chip 1213. The second light-emitting chip 1214 and the first light-emitting chip 1212 emit light of different colors. The luminous efficiency of the second light-emitting chip 1214 is affected by temperature to a greater extent than that of the first light-emitting chip 1212.

[0057] The number of first light-emitting chips 1212 can be one or more. When there are multiple first light-emitting chips 1212, the colors of the light emitted by the multiple first light-emitting chips 1212 are different, and the colors of the light emitted by the multiple first light-emitting chips 1212 are also different from the colors of the light emitted by the second light-emitting chip 1214.

[0058] For example, when there is only one first light-emitting chip 1212, the first light-emitting chip 1212 can be a blue light-emitting chip for emitting blue light, and the second light-emitting chip 1214 can be a yellow light-emitting chip for emitting yellow light. Alternatively, the first light-emitting chip 1212 can be a cyan light-emitting chip for emitting cyan light, and the second light-emitting chip 1214 can be a red light-emitting chip for emitting red light. Alternatively, the first light-emitting chip 1212 can be a violet light-emitting chip for emitting violet light, and the second light-emitting chip 1214 can be a green light-emitting chip for emitting green light, and the process is not limited to these examples.

[0059] In another example, when there are multiple first light-emitting chips 1212, for instance, if there are two first light-emitting chips 1212, the two first light-emitting chips 1212 can be a blue light-emitting chip for emitting blue light and a green light-emitting chip for emitting green light, respectively, and the second light-emitting chip 1214 can be a red light-emitting chip for emitting red light. As another example, if there are three first light-emitting chips 1212, the three first light-emitting chips 1212 can be a white light-emitting chip for emitting white light, a blue light-emitting chip for emitting blue light, and a green light-emitting chip for emitting green light, respectively, and the second light-emitting chip 1214 can be a red light-emitting chip for emitting red light, and the method is not limited thereto.

[0060] The first light-emitting chip 1212 and the driving chip 1213 are arranged at intervals on the bearing surface of the chip holder 1211. This can be understood as the first light-emitting chip 1212 and the driving chip 1213 being arranged at intervals on the same bearing surface of the chip holder 1211, and both the first light-emitting chip 1212 and the driving chip 1213 being in contact with the bearing surface of the chip holder 1211.

[0061] The second light-emitting chip 1214 is disposed on the driver chip 1213. This can be understood as the second light-emitting chip 1214 being disposed on the surface of the driver chip 1213 opposite to the support surface of the chip support 1211, and in contact with the surface of the driver chip 1213 opposite to the support surface of the chip support 1211. For example, the second light-emitting chip 1214 being disposed on and in contact with the driver chip 1213 can be understood as the second light-emitting chip 1214 being integrated into the driver chip 1213. The driving unit in the driver chip 1213 cooperates with the second light-emitting chip 1214, enabling the driver chip 1213 to have both driving and light-emitting functions.

[0062] The luminous efficiency of the second light-emitting chip 1214 is more affected by temperature than that of the first light-emitting chip 1212. The bandgap and mobility of the core light-emitting material in the second chip 1214 are at least smaller than those in the first chip 1212. Therefore, the second chip 1214 is more sensitive to temperature. As the temperature increases, its carrier scattering becomes more severe, leading to more electrical energy being converted into heat energy rather than light energy. Simultaneously, the probability of carriers directly binding without releasing photons increases, resulting in a decrease in luminous efficiency. For example, see Appendix... Figure 3 , Figure 3 The diagram shows the brightness variations of red light-emitting chip R, blue light-emitting chip B, and green light-emitting chip G as a function of temperature. It is evident that the slope of the curve corresponding to red light-emitting chip R is significantly greater than that of the curves corresponding to blue light-emitting chip B and green light-emitting chip G. Therefore, in this embodiment, the second light-emitting chip 1214 can be red light-emitting chip R, and if there are multiple first light-emitting chips 1212, they can be blue light-emitting chip B and green light-emitting chip G, respectively. The rate at which the luminous efficiency of red light-emitting chip R decreases with increasing temperature is significantly greater than the rate at which the luminous efficiency of blue light-emitting chip B and green light-emitting chip G decreases with increasing temperature.

[0063] It is understood that in some embodiments, the fully encapsulated light-emitting component 121 may also include other encapsulation materials, such as sealants for sealing the driver chip 1213, the first light-emitting chip 1212, and the second light-emitting chip 1214. These sealants may cover the support surface of the chip holder 1211. The sealant may be a sealant that encapsulates the driver chip 1213, the first light-emitting chip 1212, and the second light-emitting chip 1214 to form a physical barrier, isolating them from moisture, dust, corrosive gases (such as sulfides and nitrogen oxides in the air), and mechanical shocks (such as collisions during assembly and vibrations during use) in the external environment. This protects the driver chip 1213, the first light-emitting chip 1212, and the second light-emitting chip 1214, ensuring the stable operation of the light-emitting component 121. Furthermore, in some embodiments, the sealant on the support surface of the chip holder 1211 may be raised, such as a raised hemisphere. The raised sealant can adjust the light emission angle of the light-emitting component 121 and control the light diffusion range; for example, a raised hemisphere can achieve a light-focusing effect.

[0064] In this embodiment, on one hand, the first light-emitting chip 1212 is disposed on the chip support 1211, and the second light-emitting chip 1214 is disposed on the driver chip 1213. Thus, the first light-emitting chip 1212 and the second light-emitting chip 1214 are disposed on different substrates, which can reduce the impact of the heat generated by the first light-emitting chip 1212 on the second light-emitting chip 1214. On the other hand, the luminous efficiency of the second light-emitting chip 1214 is more affected by temperature than that of the first light-emitting chip 1212. Therefore, by reducing the impact of the heat generated by the first light-emitting chip 1212 on the second light-emitting chip 1214, the color shift caused by the significant temperature influence on the luminous efficiency of the second light-emitting chip 121 in the light-emitting component 121 can be reduced, thereby improving the display effect.

[0065] On the other hand, the first light-emitting chip 1212 is mounted on the chip holder 1211, and the second light-emitting chip 1214 is mounted on the driver chip 1213. The chip holder 1211 only needs to support the first light-emitting chip 1212 and the driver chip 1213, and the driver chip 1213 only needs to support the second light-emitting chip 1214. The required size of the chip holder 1211 and the driver chip 1213 is relatively small, which can reduce costs.

[0066] Combination Figure 4 As shown, Figure 4 The diagram shows one of the structural schematic diagrams of a chip holder 1211 in one embodiment of the present application. In some embodiments, the chip holder 1211 may be provided with a groove 2111.

[0067] In this embodiment, the driving chip 1213 can be disposed in the groove 2111. The first contact surface of the driving chip 1213 and the second light-emitting chip 1214 are flush with the second contact surface of the chip support 1211 and the first light-emitting chip 1212.

[0068] The first contact surface where the driver chip 1213 contacts the second light-emitting chip 1214, and the second contact surface where the chip support 1211 contacts the first light-emitting chip 1212, are flush. This can be achieved by setting the depth of the groove 2111. The depth of the groove 2111 can refer to the vertical distance between the bottom of the groove 2111 and the bearing surface of the chip support 1211. The difference between the depth of the groove 2111 and the thickness of the driver chip 1213 meets a preset condition, which can be understood as the difference between the depth of the groove 2111 and the thickness of the driver chip 1213 being within a preset error range, and the depth of the groove 2111 being approximately equal to the thickness of the driver chip 1213.

[0069] For example, the depth h of the groove 2111 and the thickness d of the driver chip 1213 are both 140um to 160um. For instance, the depth h of the groove 2111 and the thickness d of the driver chip 1213 can both be 150um.

[0070] In other embodiments, the depth h of the groove 2111 and the thickness d of the driving chip 1213 can be 140um, 145um, 148um, 155um, 158um, 160um, etc., respectively. The specific values ​​can be flexibly set according to actual needs or process limitations, and are not limited thereto.

[0071] In this embodiment, the chip holder 1211 is provided with a groove 2111, thereby adopting a recessed design. The groove 2111 provides a space for the driver chip 1213. The driver chip 1213 is disposed in the groove 2111. The first contact surface of the driver chip 1213 in contact with the second light-emitting chip 1214 and the second contact surface of the chip holder 1211 in contact with the first light-emitting chip 1212 are flush, which can ensure that the light-emitting surfaces of the second light-emitting chip 1214 and the first light-emitting chip 1212 are coplanar, so that the emission starting points of each light-emitting chip are as consistent as possible, the optical path difference of the light beam emitted by each light-emitting chip approaches zero, and different colors of light can radiate into space from the same starting point and mix synchronously during propagation, thereby improving the light mixing effect of the light-emitting component 121.

[0072] On the other hand, the first contact surface of the driver chip 1213 and the second light-emitting chip 1214, and the second contact surface of the chip bracket 1211 and the first light-emitting chip 1212 are flush, so that the light-emitting surfaces of the second light-emitting chip 1214 and the first light-emitting chip 1212 are coplanar, the light radiation center axis height of each display chip is consistent, and the radiation range of different colors of light almost overlaps, so that the light beam emitted by the light-emitting component 121 can be received almost simultaneously, reducing the probability of light uniformity loss caused by radiation area misalignment and improving the display uniformity of the light-emitting component 121.

[0073] Combined with appendix Figure 5 , attached Figure 5 The second schematic diagram of the chip holder 1211 in one embodiment of this application is shown. In some embodiments, there are two first light-emitting chips 1212, and the two first light-emitting chips 1212 emit light of different colors.

[0074] For example, one first light-emitting chip 1212 is a blue light-emitting chip for emitting blue light, and the other first light-emitting chip 1212 is a green light-emitting chip for emitting green light, but is not limited thereto.

[0075] The chip holder 1211 includes a main body 211 and two protrusions 2112. The protrusions 2112 protrude from the main body 211. The portion of the main body 211 located between the two protrusions 2112 forms a groove 2111. The two first light-emitting chips 1212 are respectively disposed on the two protrusions 2112.

[0076] In this embodiment, on the one hand, there are two first light-emitting chips 1212, and the two first light-emitting chips 1212 emit light of different colors, which increases the possibility of color mixing between the two first light-emitting chips 1212 and the second light-emitting chip 1214 of the light-emitting component 121, providing more color display. On the other hand, the chip support 1211 includes a main body 211 and two protrusions 2112. The protrusions 2112 protrude from the main body 211, and the portion of the main body 211 located between the two protrusions 2112 forms a groove 2111. The two protrusions 2112 provide support for the two first light-emitting chips 1212 respectively, and the groove 2111 provides a space for accommodating the second light-emitting chip 1214. The second light-emitting chip 1214 is disposed in the groove 2111, so that the first contact surface of the driving chip 1213 and the second light-emitting chip 1214 are flush with the second contact surface of the protrusion 2112 and the first light-emitting chip 1212, thereby ensuring that the light-emitting surfaces of the second light-emitting chip 1214 and the first light-emitting chip 1212 are coplanar, and improving the light-emitting effect of the light-emitting component 121.

[0077] In some embodiments, the surface layer of the chip holder 1211 near the first light-emitting chip 1212 and the driving chip 1213 is a metal layer, and the first light-emitting chip 1212 and the driving chip 1213 are respectively arranged on the metal layer.

[0078] In this embodiment, the surface layer of the chip holder 1211 near the first light-emitting chip 1212 and the driving chip 1213 is a metal layer. The first light-emitting chip 1212 and the driving chip 1213 are respectively arranged on the metal layer. The heat generated by the first light-emitting chip 1212 and the heat generated by the driving chip 1213 can be dissipated through the metal layer. The heat generated by the second light-emitting chip 1214 can also be transferred to the metal layer through the driving chip 1213. The metal layer further dissipates the heat, thereby improving the heat dissipation performance of the light-emitting component 121.

[0079] Combined with appendix Figure 6 , attached Figure 6 The diagram shows one of the structural schematic diagrams of the driver chip 1213 in one embodiment of this application. In some embodiments, the driver chip 1213 in this embodiment may be configured with a first power supply terminal 2131 and a second power supply terminal 2132; the second light-emitting chip 1214 is configured with a first polarity electrode and a second polarity electrode, the polarities of the first polarity electrode and the second polarity electrode being opposite.

[0080] The second light-emitting chip 1214 is integrated on the driver chip 1213, and the first polar electrode of the second light-emitting chip 1214 is connected to the first power supply terminal 2131 of the driver chip 1213. The second polar electrode of the second light-emitting chip 1214 is connected to the driving unit on the driver chip 1213. (See attached diagram) Figure 6 (Not shown).

[0081] The chip holder 1211 is configured with a first power supply pin 2113 and a second power supply pin 2114, the first power supply pin 2113 being connected to a first lead. l 1 is connected to the first power supply terminal 2131 of the driver chip 1213, and the second power supply pin 2114 is connected through the second lead. l 2 is connected to the second power supply terminal 2132 of the driver chip 1213.

[0082] The first power supply terminal 2131 and the second power supply terminal 2132 of the driver chip 1213 can be a positive power supply terminal and a negative power supply terminal, respectively. For example, the first power supply terminal 2131 can be a positive power supply terminal, and the second power supply terminal 2132 can be a negative power supply terminal. Alternatively, the first power supply terminal 2131 can be a negative power supply terminal, and the second power supply terminal 2132 can be a positive power supply terminal.

[0083] The first and second polarized electrodes of the second light-emitting chip 1214 can be positive and negative electrodes, respectively. For example, the first polarized electrode can be a positive electrode and the second polarized electrode can be a negative electrode. Alternatively, the first polarized electrode can be a negative electrode and the second polarized electrode can be a positive electrode.

[0084] For example, taking the first power supply terminal 2131 as the positive power supply terminal, the second power supply terminal 2132 as the negative power supply terminal, the first polar electrode as the positive electrode, and the second polar electrode as the negative electrode as an example, the positive electrode of the second light-emitting chip 1214 is connected to the positive power supply terminal, and the negative electrode of the second light-emitting chip 1214 is connected to the driving unit integrated in the driving chip 1213, so that the unit integrated in the driving chip 1213 can output a corresponding driving signal to the negative electrode of the second light-emitting chip 1214 to drive the second light-emitting chip 1214 to emit light.

[0085] The first power supply pin 2113 and the second power supply pin 2114 on the chip bracket 1211 can be a positive power supply pin and a negative power supply pin, respectively. For example, the first power supply pin 2113 can be a positive power supply pin and the second power supply pin 2114 can be a negative power supply pin; for another example, the first power supply pin 2113 can be a negative power supply pin and the second power supply pin 2114 can be a positive power supply pin.

[0086] For example, taking the first power supply pin 2113 as the positive power supply pin, the second power supply pin 2114 as the negative power supply pin, the first power supply terminal 2131 as the positive power supply terminal, and the second power supply terminal 2132 as the negative power supply terminal, the positive power supply pin can be connected via the first lead. l 1. Connect to the positive power supply terminal of the driver chip 1213; the negative power supply pin can be connected via the second lead. l 2. Connect to the negative power supply terminal of the driver chip 1213.

[0087] In this embodiment, the second polar electrode of the second light-emitting chip 1214 is connected to the driving unit on the driving chip 1213, and the first power supply pin 2113 of the chip bracket 1211 is connected to the first lead. lA first power supply pin 2131 is connected to the first power supply pin 2113 of the driver chip 1213. A second light-emitting chip 1214 is integrated on the driver chip 1213. The first polar electrode of the second light-emitting chip 1214 is connected to the first power supply pin 2131 of the driver chip 1213, and the second polar electrode of the second light-emitting chip 1214 is connected to the driving unit on the driver chip 1213. This allows the driving unit to output a driving signal to the second light-emitting chip 1214 through the second polar electrode, driving the second light-emitting chip 1214 to emit light. Therefore, when the driver chip 1213 receives an external power supply signal through the first power supply pin 2113, this power supply signal can be input to the first polar electrode of the second light-emitting chip 1214. The voltages required for the operation of the driver chip 1213 and the second light-emitting chip 1214 are similar, for example, both require 3.3V. Therefore, synchronous power supply to the second light-emitting chip 1214 and the driver chip 1213 can be achieved, reducing the number of power supply pins in the chip support 1211 and eliminating the need for additional pins.

[0088] Combined with appendix Figure 7 , attached Figure 7 The second schematic diagram of the structure of the driver chip 1213 in one embodiment of this application is shown. In some embodiments, the first light-emitting chip 1212 is configured with a first polar electrode and a second polar electrode. The first polar electrode and the second polar electrode of the first light-emitting chip 1212 are respectively located on the first surface of the first light-emitting chip 1212 near the chip support 1211.

[0089] The light-emitting component 121 includes a first power supply pad 2115 and a second power supply pad 2116 disposed on the chip holder 1211. The first power supply pad 2115 is in contact with the first polar electrode of the first light-emitting chip 1212, and the second power supply pad 2116 is in contact with the second polar electrode of the first light-emitting chip 1212.

[0090] The chip bracket 1211 is configured with a third power supply pin 2117, which is connected via a third lead. l 3 is connected to the second power supply pad 2116; the driver chip 1213 is configured with a driver terminal 2133 connected to the driver unit, and the driver terminal 2133 is connected to the fourth lead. l 4 is connected to the first power supply pad 2115.

[0091] The first polarity electrode and the second polarity electrode of the first light-emitting chip 1212 can be positive and negative electrodes, respectively. For example, the first polarity electrode can be a positive electrode and the second polarity electrode can be a negative electrode. Alternatively, the first polarity electrode can be a negative electrode and the second polarity electrode can be a positive electrode.

[0092] The first polar electrode and the second polar electrode of the first light-emitting chip 1212 are respectively located on the first surface of the first light-emitting chip 1212 near the chip support 1211. This can be understood as the first polar electrode and the second polar electrode of the first light-emitting chip 1212 both being disposed on the first surface of the first light-emitting chip 1212 opposite to the light-emitting surface. For example, the first polar electrode and the second polar electrode of the first light-emitting chip 1212 can be in the form of convex dots.

[0093] The first power supply pad 2115 and the second power supply pad 2116 disposed on the chip carrier 1211 can be a positive pad and a negative pad, respectively. For example, the first power supply pad 2115 can be a positive pad and the second power supply pad 2116 can be a negative pad. For another example, the first power supply pad 2115 can be a negative pad and the second power supply pad 2116 can be a positive pad.

[0094] The first power supply pad 2115 is connected to the first polar electrode of the first light-emitting chip 1212, and the second power supply pad 2116 is connected to the second polar electrode of the first light-emitting chip 1212, which can realize the flip-chip packaging of the first light-emitting chip 1212.

[0095] The chip bracket 1211 is configured with a third power supply pin 2117, which is connected via a third lead. l 3 is connected to the second power supply pad 2116; the driver chip 1213 is configured with a driver terminal 2133 connected to the driver unit, and the driver terminal 2133 is connected to the fourth lead. l 4. Connected to the first power supply pad 2115. The third power supply pin 2117 can be connected to an external power supply voltage to provide the operating voltage required for the first light-emitting chip 1212 to emit light. The driving terminal 2133 of the driver chip 1213 is connected to the fourth lead. l 4 is connected to the first power supply pad 2115, so that the drive signal output by the driver chip 1213 can pass through the driver terminal 2133 and the fourth lead in sequence. l 4 and the first power supply pad 2115 are transmitted to the first light-emitting chip 1212, thereby driving the first light-emitting chip 1212 to emit light.

[0096] For example, the number of first light-emitting chips 1212 is illustrated as two, see attached figure. Figure 8 , attached Figure 8The third schematic diagram shows the structure of the driver chip 1213 in one embodiment of this application. When there are two first light-emitting chips 1212, the light-emitting component 121 may include a third power supply pad 2118 and a fourth power supply pad 2119 disposed on the chip carrier 1211. The third power supply pad 2118 and the fourth power supply pad 2119 may be a positive pad and a negative pad, respectively. For example, the third power supply pad 2118 may be a positive pad and the fourth power supply pad 2119 may be a negative pad. In another example, the third power supply pad 2118 may be a negative pad and the fourth power supply pad 2119 may be a positive pad.

[0097] In this configuration, the first polarity electrode of one first light-emitting chip 1212 is connected to the first power supply pad 2115, and the second polarity electrode of the first light-emitting chip is connected to the second power supply pad 2116. The first polarity electrode of another first light-emitting chip 1212 is connected to the third power supply pad 2118, and the second polarity electrode of another first light-emitting chip 1212 is connected to the fourth power supply pad 2119.

[0098] The chip bracket 1211 can be configured with a third power supply pin 2117 and a fourth power supply pin 2120. The third power supply pin 2117 can be connected via a third lead. l 3 is connected to the second power supply pad 2116, and the fourth power supply pin 2120 can be connected via the seventh lead. l 7 is connected to the fourth power supply pad 2119.

[0099] The driver chip 1213 is configured with a driver terminal 2133 connected to the driver unit. The number of driver terminals 2133 can be the same as the number of first light-emitting chips 1212. If there are two first light-emitting chips 1212, there can be two driver terminals 2133. One driver terminal 2133 is connected via a fourth lead. l 4 is connected to the first power supply pad 2115, and the other drive end 2133 is connected through the eighth lead. l 8 is connected to the third power supply pad 2118.

[0100] In this embodiment, the first polar electrode and the second polar electrode of the first light-emitting chip 1212 are respectively disposed on the first surface of the first light-emitting chip 1212 near the chip carrier 1211. The light-emitting component 121 includes a first power supply pad 2115 and a second power supply pad 2116 disposed on the chip carrier 1211. Thus, the first polar electrode of the first light-emitting chip 1212 can directly contact and connect with the first power supply pad 2115, and the second polar electrode of the first light-emitting chip 1212 can directly contact and connect with the second power supply pad 2116, realizing flip-chip packaging of the first light-emitting chip 1212 and the chip carrier 1211. This can improve the problem of thermal fatigue stress caused by the difference in thermal expansion coefficients of the "chip-lead-chip carrier 1211" in traditional packaging. Simultaneously, due to the first lead... l 1. Second lead l 2. Third lead l 3 and the fourth lead l 4 (Seventh lead) l 7. Eighth lead l 8) It does not need to bear the mechanical force of supporting the chip, but only needs to realize the basic electrical connection, thus reducing the impact on the first lead. l 1. Second lead l 2. Third lead l 3 and the fourth lead l 4 (Seventh lead) l 7. Eighth lead l 8) Reduce costs by meeting requirements for material purity, wire diameter accuracy, and temperature resistance.

[0101] Combined with appendix Figure 9 , attached Figure 9 The fourth schematic diagram of the structure of the driver chip 1213 in one embodiment of this application is shown. In some embodiments, the first light-emitting chip 1212 is configured with a first polar electrode and a second polar electrode. The first polar electrode of the first light-emitting chip 1212 is disposed on the first surface of the first light-emitting chip 1212 close to the chip support 1211, and the second polar electrode of the first light-emitting chip 1212 is disposed on the second surface of the first light-emitting chip 1212 away from the chip support 1211.

[0102] The chip bracket 1211 is equipped with a third power supply pin 2117, which is connected to a fifth lead. l 5 is connected to the second polarity electrode of the first light-emitting chip 1212; the driving chip 1213 is configured with a driving terminal 2133 connected to the driving unit, and the driving terminal 2133 is connected to the sixth lead. l 6 is connected to the first polar electrode of the first light-emitting chip 1212.

[0103] The first polar electrode of the first light-emitting chip 1212 is disposed on the first surface of the first light-emitting chip 1212 near the chip support 1211, and the second polar electrode of the first light-emitting chip 1212 is disposed on the second surface of the first light-emitting chip 1212 away from the chip support 1211. It can be understood that the first surface is the surface opposite to the light-emitting surface of the first light-emitting chip 1212. The second surface can be understood as the light-emitting surface of the first light-emitting chip 1212.

[0104] The second polarity electrode of the first light-emitting chip 1212 is connected to the fifth lead. l 5 is connected to the third power supply pin 2117, and the first polarity electrode of the first light-emitting chip 1212 is connected to the sixth lead. l 6 is connected to the driving end 2133 of the driving unit connected to the driving chip 1213, realizing the proper packaging of the first light-emitting chip 1212.

[0105] For example, the number of first light-emitting chips 1212 is illustrated as two, see attached figure. Figure 10 , attached Figure 10 The fifth schematic diagram shows the structure of the driver chip 1213 in one embodiment of this application. When there are two first light-emitting chips 1212, the chip bracket 1211 can be configured with a third power supply pin 2117 and a fifth power supply pin 2121. The third power supply pin 2117 is connected to the fifth lead. l 5 is connected to the second polarity electrode of a first light-emitting chip 1212, and the fifth power supply pin 2121 is connected to the ninth lead. l 9 is connected to the second polarity electrode of another first light-emitting chip 1212.

[0106] The driver chip 1213 may be configured with two driver terminals 2133 connected to the driver unit integrated inside the driver chip 1213, one of which is connected via a sixth lead. l 6 is connected to the first polar electrode of a first light-emitting chip 1212, and the other driving terminal 2133 is connected through the tenth lead. l 10 is connected to the first polar electrode of another first light-emitting chip 1212.

[0107] In this embodiment, the first polar electrode of the first light-emitting chip 1212 is disposed on the first surface of the first light-emitting chip 1212 near the chip support 1211, and the second polar electrode of the first light-emitting chip 1212 is disposed on the second surface of the first light-emitting chip 1212 away from the chip support 1211. The first polar electrode of the first light-emitting chip 1212 is connected to the sixth lead. lThe first light-emitting chip 1212 is connected to the driving terminal 2133 of the driver chip 1213. The second polar electrode of the first light-emitting chip 1212 is connected to the third power supply pin 2117 of the chip carrier 1211 through the fifth pin, realizing the upright packaging of the first light-emitting chip 1212 and the chip carrier 1211. The electrical connection is realized through the lead wire. There is no need to pre-process the chip carrier 1211 and the driver chip 1213, nor is it necessary to add special electrode shapes, such as bumps. The architecture is simple and can reduce the manufacturing difficulty.

[0108] Combined with appendix Figure 11 , attached Figure 11 The sixth schematic diagram shows the structure of the driver chip 1213 in one embodiment of this application. The driver chip 1213 may be configured with a data input terminal 2134 and a data output terminal 2135 respectively connected to the driver unit integrated in the driver chip 1213.

[0109] Chip holder 1211 can be configured with an eleventh lead. l 11. The data input pin 2122 connected to the data input terminal 2134 and the twelfth lead l 12 is connected to the data output pin 2123 of the data output terminal 2135.

[0110] The data input pin 2122 can be connected to an external backlight controller, enabling the driving unit to receive backlight driving data output by the backlight controller and achieve backlight control. The data output pin 2123 can be connected to the corresponding data output pin 2123 of the multiple light-emitting components 121.

[0111] In the field of backlight display technology, accurate temperature monitoring of the light-emitting chip is crucial to ensure stable operation and improve display performance. Precise temperature monitoring provides an accurate basis for subsequent temperature compensation.

[0112] In one feasible implementation, a temperature detection unit 1215 can be set in the driver chip 1213 to detect the temperature of the light-emitting chip. However, since the light-emitting chip is not directly disposed on the surface of the driver chip 1213, but is connected to the driver chip 1213 through a certain distance or connection method, both the driver chip 1213 and the light-emitting chip are disposed on the surface of the chip carrier 1211. Although this layout simplifies the circuit design to a certain extent, due to the physical distance between the temperature detection unit 1215 and the light-emitting chip, the detected temperature data often cannot accurately reflect the actual operating temperature of the light-emitting chip, reducing the accuracy of temperature detection. For example, when the light-emitting chip generates heat, the heat needs to go through a certain conduction path to reach the temperature detection unit 1215 on the driver chip 1213. During this process, some heat may be lost due to the thermal resistance of the conduction medium, resulting in the detected temperature value being lower than the actual temperature of the light-emitting chip. In addition, if the connection between the light-emitting chip and the driver chip 1213 is unstable or there is poor contact, it will further aggravate the detection error. Such inaccurate temperature detection results may mislead the system's thermal management strategy for the light-emitting chip.

[0113] In another feasible implementation, the driver chip 1213 includes a temperature detection unit 1215, but all the light-emitting chips are disposed on the surface of the driver chip 1213. The temperature detection unit 1215 is closer to the light-emitting chips, which improves the inaccuracy of the temperature detection unit 1215 in the previous solution and increases the sensitivity of temperature detection to some extent. However, because all the light-emitting chips are concentrated on the driver chip 1213, the heat on the driver chip 1213 is concentrated, and the ambient temperature of the temperature detection unit 1215 is inherently high. This makes the temperature detection unit 1215 susceptible to interference from the surrounding ambient temperature when detecting the temperature of the light-emitting chips, unable to accurately distinguish the superposition effect of the heat generated by the light-emitting chips themselves and the heat from the surrounding environment, and unable to accurately detect the temperature of a single light-emitting chip. For example, when multiple light-emitting chips work simultaneously, the heat they generate superimposes, causing the temperature on the driver chip 1213 to rise sharply. The temperature value detected by the temperature detection unit 1215 may be higher than the actual operating temperature of the light-emitting chips. The heat from the multiple light-emitting chips is transferred through the driver chip 1213, interfering with the temperature of a single light-emitting chip. Such excessively high detection values ​​may cause the system to over-control the heat dissipation of the light-emitting chip, which not only wastes energy but may also affect the normal operation of the light-emitting chip.

[0114] Combined with appendix Figure 12 , attached Figure 12 This is a second schematic diagram of the structure of the light-emitting component 121 according to one embodiment of the present application. In some embodiments, the light-emitting component 121 in this embodiment may include a temperature detection unit 1215.

[0115] In this embodiment, the temperature detection unit 1215 can be located in the driver chip 1213 and is used to detect the temperature of the first light-emitting chip 1212.

[0116] The temperature detection unit 1215 can be located in the driver chip 1213. The temperature detection unit 1215 is integrated into the driver chip 1213, which can reduce the space occupied by the temperature detection unit 1215 and reduce the size of the light-emitting component 121.

[0117] In some embodiments, the driver chip 1213 may be integrated with a driver unit for providing drive signals to the first light-emitting chip 1212 and the second light-emitting chip 1214, and the driver unit is integrated with the temperature detection unit 1215.

[0118] It is understood that in some embodiments, the temperature detection unit 1215 may also be located on the driver chip 1213, and is not limited thereto.

[0119] Before the temperature detection unit 1215 detects the temperature of the second light-emitting chip 1214, the temperature detection unit 1215 can be calibrated to compensate for the characteristic changes of the temperature detection unit 1215, ensure that the deviation of each temperature point is within the allowable range, and improve the temperature measurement accuracy of the temperature detection unit 1215.

[0120] The temperature of the second light-emitting chip 1214 detected by the temperature detection unit 1215 can be used to assist in temperature compensation. For example, the temperature detection unit 1215 can be connected to a driving unit integrated in the driving chip 1213, and output the temperature of the second light-emitting chip 1214 to the driving unit, so that the driving unit outputs a corresponding driving signal based on the backlight driving data output by the backlight controller and the temperature of the second light-emitting chip 1214. Alternatively, the temperature detection unit 1215 can be connected to a backlight controller external to the light-emitting component 121, and output the temperature of the second light-emitting chip 1214 to the backlight controller, so that the backlight controller outputs corresponding backlight driving data based on the user's or system's display requirements and the temperature of the second light-emitting chip 1214. The driving unit integrated in the driving chip 1213 is connected to the backlight controller, and the driving unit integrated in the driving chip 1213 outputs a corresponding driving signal based on the backlight driving data to drive each light-emitting chip to emit light.

[0121] In this embodiment, on the one hand, the temperature detection unit 1215 is integrated into the driver chip 1213, achieving an integrated design. This eliminates the need for separate packaging of the temperature detection unit 1215 and the driver chip 1213, reducing packaging costs. On the other hand, the first light-emitting chip 1212 and the driver chip 1213 are respectively disposed on the chip support 1211, and the second light-emitting chip 1214 is disposed on the driver chip 1213. The driver chip 1213 contains the temperature detection unit 1215, which can more accurately detect the temperature of the second light-emitting chip 1214, improving the accuracy of temperature detection and enabling the identification of the effect of temperature on the luminous efficiency of the second light-emitting chip 1214.

[0122] Combined with appendix Figure 13 ~Appendix Figure 16 , attached Figure 13 This is one of the top views of the light-emitting component 121 in one embodiment of this application, which includes two first light-emitting chips 1212. Figure 14 This is a second top view of the light-emitting component 121 in one embodiment of this application, which includes two first light-emitting chips 1212. Figure 15 This is one of the cross-sectional views of the light-emitting component 121 in one embodiment of this application, which includes two first light-emitting chips 1212. Figure 16 This is a second cross-sectional view of the light-emitting component 121 in one embodiment of this application, which includes two first light-emitting chips 1212. In some embodiments, the number of first light-emitting chips 1212 is two, and the two first light-emitting chips 1212 emit light of different colors.

[0123] A first light-emitting chip 1212, a second light-emitting chip 1214, and another first light-emitting chip 1212 are arranged at intervals along one direction; or, a first light-emitting chip 1212, another first light-emitting chip 1212, and a second light-emitting chip 1214 are arranged at intervals along one direction.

[0124] When there are two first light-emitting chips 1212, the colors of the light emitted by the two first light-emitting chips 1212 are different, and the colors of the light emitted by the two first light-emitting chips 1212 and the second light-emitting chip 1214 are also different. For example, one first light-emitting chip 1212 can be a blue light-emitting chip for emitting blue light, the other first light-emitting chip 1212 can be a green light-emitting chip for emitting green light, and the second light-emitting chip 1214 can be a red light-emitting chip for emitting red light, but it is not limited to these.

[0125] like Figure 13 As shown, the driving chip 1213 can be disposed between the two first light-emitting chips 1212, such that one first light-emitting chip 1212, the second light-emitting chip 1214, and the other first light-emitting chip 1212 are arranged at intervals along one direction.

[0126] like Figure 14 As shown, the driving chip 1213 can be adjacent to one of the two first light-emitting chips 1212, such that one first light-emitting chip 1212, the other first light-emitting chip 1212, and the second light-emitting chip 1214 are arranged at intervals along one direction.

[0127] In some embodiments, such as Figure 15 As shown, the groove 2111 of the chip holder 1211 can be disposed in the middle of the two first light-emitting chips 1212, such that one first light-emitting chip 1212, the second light-emitting chip 1214, and the other first light-emitting chip 1212 are arranged at intervals in one direction, and the first contact surface of the driving chip 1213 in contact with the second light-emitting chip 1214 and the second contact surface of the chip holder 1211 in contact with the two first light-emitting chips 1212 are flush.

[0128] In another embodiment, as shown in the appendix Figure 16 As shown, the groove 2111 of the chip holder 1211 can also be adjacent to one of the two first light-emitting chips 1212, such that one first light-emitting chip 1212, the other first light-emitting chip 1212, and the second light-emitting chip 1214 are arranged at intervals in one direction, and the first contact surface of the driving chip 1213 in contact with the second light-emitting chip 1214 and the second contact surface of the chip holder 1211 in contact with the two first light-emitting chips 1212 are flush.

[0129] In this embodiment, there are two first light-emitting chips 1212. The two first light-emitting chips 1212 emit light of different colors, and the two first light-emitting chips 1212 emit light of different colors from the second light-emitting chip 1214. Multiple colors can be displayed by mixing the light, thereby improving the color display richness of the light-emitting component 121. The arrangement of the two first light-emitting chips 1212 and the second light-emitting chip 1214 can be such that one first light-emitting chip 1212, the second light-emitting chip 1214, and another first light-emitting chip 1212 are arranged alternately in one direction, or one first light-emitting chip 1212, the other first light-emitting chip 1212, and the second light-emitting chip 1214 are arranged alternately in one direction. Flexible packaging of multiple light-emitting chips can be achieved through different arrangement methods.

[0130] In some embodiments, the first light-emitting chip 1212 may be a red light-emitting chip for emitting red light or a yellow light-emitting chip for emitting yellow light.

[0131] In this embodiment, compared to light-emitting chips emitting other colors of light, the red light-emitting chip emitting red light and the yellow light-emitting chip emitting yellow light have smaller material band gaps. As the temperature of the red and yellow light-emitting chips rises, the band gaps of their corresponding materials shrink due to lattice vibrations. Furthermore, the band gap shrinkage rate caused by temperature is much greater for the materials corresponding to the red and yellow light-emitting chips than for the materials of other light-emitting chips, which may lead to color shift issues. Moreover, with the narrower band gap, defect energy levels (such as impurities and lattice vacancies) in the materials corresponding to the red and yellow light-emitting chips are more likely to fall into the band gap, becoming non-radiative recombination centers. Charge carriers are less likely to release photons through radiative transitions and instead release heat through the defect energy levels, resulting in a greater decrease in luminous efficiency. In this embodiment, the second light-emitting chip 1214 is a red light-emitting chip for emitting red light or a yellow light-emitting chip for emitting yellow light. The second light-emitting chip 1214 is disposed on the driving chip 1213, while the first light-emitting chip 1212 and the driving chip 1213 are disposed on the chip support 1211. Thus, the red light-emitting chip or the yellow light-emitting chip is disposed on a different substrate from the first light-emitting chip 1212, which can reduce the impact of the heat generated by the first light-emitting chip 1212 on the red light-emitting chip or the yellow light-emitting chip. The luminous efficiency of the red or yellow light-emitting chip is affected by temperature more than that of the first light-emitting chip 1212. The temperature detection unit 1215 is located in the driver chip 1213, and the red or yellow light-emitting chip is located on the driver chip 1213. The temperature detection unit 1215 can more accurately detect the temperature of the red or yellow light-emitting chip, improve the accuracy of temperature detection, identify the temperature-related effects of the red or yellow light-emitting chip, and enable the driver chip 1213 to accurately compensate for the color accuracy loss caused by the temperature rise of the red or yellow light-emitting chip, avoid the color shift of the light emitted by the light-emitting component 121, and improve the display effect of the light-emitting component 121.

[0132] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0133] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A light-emitting component, characterized in that, The light-emitting component includes: Chip bracket; The first light-emitting chip and the driving chip are arranged at intervals on the support surface of the chip holder; The second light-emitting chip is disposed on the driving chip and in contact with the driving chip. It emits light of a different color than the first light-emitting chip. The luminous efficiency of the second light-emitting chip is affected by temperature to a greater extent than that of the first light-emitting chip. The driving chip is connected to the first light-emitting chip and the second light-emitting chip respectively, and is used to drive the first light-emitting chip and the second light-emitting chip to emit light.

2. The light-emitting component according to claim 1, characterized in that, The chip holder has a groove, the driving chip is disposed in the groove, and the first contact surface of the driving chip that contacts the second light-emitting chip and the second contact surface of the chip holder that contacts the first light-emitting chip are flush.

3. The light-emitting component according to claim 2, characterized in that, The number of the first light-emitting chips is two, and the two first light-emitting chips emit light of different colors; The chip support includes a main body and two protrusions. The protrusions protrude from the main body, and the portion of the main body between the two protrusions forms the groove. The two first light-emitting chips are respectively disposed on the two protrusions.

4. The light-emitting component according to claim 1, characterized in that, The surface layer of the chip holder near the first light-emitting chip and the driving chip is a metal layer, and the first light-emitting chip and the driving chip are respectively arranged on the metal layer.

5. The light-emitting component according to claim 1, characterized in that, The driving chip is configured with a first power supply terminal and a second power supply terminal; the second light-emitting chip is configured with a first polarity electrode and a second polarity electrode, the polarities of the first polarity electrode and the second polarity electrode being opposite. The second light-emitting chip is integrated on the driver chip, and the first polar electrode of the second light-emitting chip is connected to the first power supply terminal of the driver chip, and the second polar electrode of the second light-emitting chip is connected to the driver unit on the driver chip. The chip holder is configured with a first power supply pin and a second power supply pin. The first power supply pin is connected to the first power supply terminal of the driver chip via a first lead, and the second power supply pin is connected to the second power supply terminal of the driver chip via a second lead.

6. The light-emitting component according to claim 5, characterized in that, The first light-emitting chip is configured with a first polar electrode and a second polar electrode, and the first polar electrode and the second polar electrode of the first light-emitting chip are respectively located on the first surface of the first light-emitting chip near the chip carrier; The light-emitting component includes a first power supply pad and a second power supply pad disposed on the chip carrier. The first power supply pad is in contact with the first polar electrode of the first light-emitting chip, and the second power supply pad is in contact with the second polar electrode of the first light-emitting chip. The chip holder is configured with a third power supply pin, which is connected to the second power supply pad via a third lead; the driver chip is configured with a driver terminal connected to the driver unit, which is connected to the first power supply pad via a fourth lead.

7. The light-emitting component according to claim 5, characterized in that, The first light-emitting chip is configured with a first polar electrode and a second polar electrode. The first polar electrode of the first light-emitting chip is disposed on a first surface of the first light-emitting chip close to the chip support, and the second polar electrode of the first light-emitting chip is disposed on a second surface of the first light-emitting chip away from the chip support. The chip support is provided with a third power supply pin, which is connected to the second polarity electrode of the first light-emitting chip via a fifth lead; the driving chip is provided with a driving end connected to the driving unit, which is connected to the first polarity electrode of the first light-emitting chip via a sixth lead.

8. The light-emitting component according to any one of claims 1-7, characterized in that, The light-emitting component includes: A temperature detection unit is located in the driver chip and is used to detect the temperature of the first light-emitting chip.

9. The light-emitting component according to any one of claims 1-7, characterized in that, There are two first light-emitting chips, and the two first light-emitting chips emit light of different colors; One first light-emitting chip, one second light-emitting chip, and another first light-emitting chip are arranged at intervals along one direction; or, one first light-emitting chip, another first light-emitting chip, and another second light-emitting chip are arranged at intervals along the one direction.

10. The light-emitting component according to any one of claims 1-7, characterized in that, The second light-emitting chip is a red light-emitting chip for emitting red light or a yellow light-emitting chip for emitting yellow light.

11. A display device, characterized in that, The display device includes: Display panel, used to display images; A backlight module is used to provide a light source for the display panel. The backlight module includes a plurality of light-emitting components, each of which includes: Chip bracket; Blue light-emitting chip; Green light-emitting chip; The driver chip, the blue light-emitting chip, the green light-emitting chip and the driver chip are arranged at intervals on the support surface of the chip holder; A red light-emitting chip is disposed on the driver chip and is in contact with the driver chip; A temperature detection unit is provided in the driver chip, and the temperature detection unit is used to detect the temperature of the red light-emitting chip.

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