LED support lamp bead structure

Abstract

The utility model discloses a kind of LED support lamp pearl structures, including support body and the LED chip in the bowl cup of being arranged in it, the support body has opposite first surface and second surface, and third surface connecting the first surface and second surface;The opening of the bowl cup is located first surface;The LED chip is electrically connected with metal pin, the metal pin extends from bowl cup outward and partially exposes second surface and third surface, define its in second surface the endpoint of third surface away from as distal endpoint;The first surface recess is formed with air-void portion to isolate opening and third surface at third surface place adjacent to it. In the utility model, by the setting of air-void portion, in the glue pouring process, on the one hand, stop face plays the role of limiting glue flow, to avoid pollution LED chip light emitting surface;On the other hand, the stop face plays a reference role, can better waterproof treatment to metal pin.

Description

Technical Field

[0001] This utility model relates to the field of LED technology, and in particular to an LED bracket lamp bead structure. Background Technology

[0002] LED bracket-mounted LED chips, as a common internal structure for light-emitting diodes, are widely used in various lighting equipment and electronic devices. By mounting LED chips on a bracket and combining them with optical components, they achieve efficient and energy-saving light output, playing a vital role in indoor and outdoor lighting, display backlighting, and other fields. With the expansion of application scenarios, the requirements for the reliability and durability of LED bracket-mounted LED chips are increasing, especially external waterproofing, which has become a key indicator.

[0003] The LED bracket structure requires metal leads to connect the internal LED chip and external circuit components, inevitably resulting in some of these metal leads being exposed on the bracket body surface. Generally, these exposed metal leads are soldered to external circuit components to achieve a reliable electrical connection. After connection, the metal leads need to be waterproofed to prevent moisture, corrosion, and other environmental factors from causing electrical connection failure or performance degradation, ensuring long-term stable operation. In this case, when applying potting compound to the metal leads on the outer surface of the LED bracket structure for waterproofing, it is necessary to combine... Figure 1 As shown, if the LED bracket's LED bead opening faces upwards, because some sides of the bracket body lack metal leads or have numerous blank areas without metal leads, the adhesive easily covers these non-target areas during potting due to its fluidity. This not only significantly increases adhesive consumption and resource waste but also reduces potting efficiency. Furthermore, the cured waterproof adhesive affects the flatness of these non-target areas. If the bracket is placed on its side during potting, the adhesive easily seeps into the interior from the opening and may even adhere to the LED chip surface, contaminating the LED chip's light-emitting surface, leading to color deviation and changes in the emission angle, thus affecting overall optical performance. Therefore, it is urgent to improve the LED bracket's LED bead structure to better waterproof the metal leads. Summary of the Invention

[0004] The purpose of this invention is to provide an LED bracket lamp bead structure that solves the problem of poor waterproofing of the metal pins in existing LED bracket lamp bead structures.

[0005] To achieve this objective, the present invention adopts the following technical solution: An LED bracket lamp bead structure includes a bracket body and an LED chip disposed in its bowl. The bracket body has a first surface and a second surface opposite to each other, and a third surface connecting the first surface and the second surface. The opening of the bowl is located on the first surface. The LED chip is electrically connected to a metal pin, which extends outward from inside the bowl and is partially exposed on the second and third surfaces. The endpoint on the second surface that is far from the third surface is defined as the far end point. A recessed portion is formed on the first surface adjacent to the third surface to isolate the opening and the third surface. The recessed portion has a stop surface facing the third surface on the side close to the first surface. The distance between the stop surface and the third surface is greater than the distance between the distal end point and the third surface. The metal pins are covered with a waterproof adhesive layer.

[0006] Furthermore, the bowl is filled with an internal encapsulating adhesive, the filling surface of which is lower than the first surface.

[0007] Furthermore, a light-concentrating guide post that completely covers the opening is provided on the first surface.

[0008] Furthermore, the light-concentrating guide post is connected to the support body by a light-transmitting adhesive.

[0009] Furthermore, the internal encapsulating adhesive is a mist adhesive and / or a white gloss adhesive; The number of bowls and cups is at least one.

[0010] Furthermore, when there is one bowl / cup, the bowl / cup is filled with a mist-like adhesive; when there are two bowl / cups, the smaller bowl / cup is filled with a white light adhesive, and the larger bowl / cup is filled with a mist-like adhesive.

[0011] Furthermore, the clearance portion extends to the third surface.

[0012] Furthermore, the clearance section is provided with a column, and the column has a supporting surface that is coplanar with the third surface.

[0013] Furthermore, the bottom of the bowl / cup is provided with at least one metal pad for mounting an LED chip; the metal pad is electrically connected to and fixedly mounted to a metal pin.

[0014] Furthermore, the cross-section of the focusing guide post is semi-elliptical, and the major axis of the semi-ellipse is parallel to the optical axis of the overall optical system.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The LED bracket lamp bead structure provided by this utility model, through the setting of the clearance portion, serves two purposes during the glue-filling process. Firstly, the stop surface restricts the flow of glue, ensuring that the metal leads are completely covered while preventing glue from entering the cup through the opening and contaminating the LED chip's light-emitting surface. Secondly, the stop surface acts as a reference; when the level of the waterproof glue approaches or contacts the stop surface, the glue-filling operation is stopped, and the glue is allowed to cure, thus forming a complete waterproof layer covering the metal leads and providing waterproofing. The design of the LED bracket lamp bead structure in this embodiment allows for a side-mounted method when filling the metal leads with glue, thereby optimizing the distribution of the waterproof glue, reducing the amount of waterproof glue used, and improving glue-filling efficiency, resulting in better waterproofing of the metal leads.

[0016] In this embodiment, the internal encapsulating adhesive not only protects the LED chip from mechanical and environmental influences, but also achieves the desired optical effects, such as scattering or transmission, by selecting different adhesives, thereby improving the lighting quality; the setting of the focusing guide post converges the light, improves the light efficiency and directionality, reduces light loss, and achieves a more concentrated beam output. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0019] Figure 1 This is a three-dimensional schematic diagram of the LED bracket and lamp bead structure in the prior art; Figure 2 This is a three-dimensional schematic diagram of the LED bracket lamp bead structure in this utility model; Figure 3 This is a three-dimensional schematic diagram of the LED bracket lamp bead structure in this utility model after the focusing guide pillar is hidden; Figure 4 This is a top view of the LED bracket lamp bead structure in this utility model with the focusing guide column removed; Figure 5This is a side view of the LED bracket lamp bead structure in this utility model, with the bracket body placed on its side.

[0020] Illustration: 1. Support body; 11. Bowl / cup; 12. First surface; 13. Second surface; 14. Third surface; 15. Clearance; 151. Stop surface; 16. Column; 161. Supporting surface; 2. LED chip; 3. Metal pin; 4. Metal pad; 5. Focusing light guide column. Detailed Implementation

[0021] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0022] In the description of this utility model, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component centrally located at the same time.

[0023] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0024] This embodiment provides an LED bracket lamp bead structure. Through structural improvements, the metal pins 3 are better waterproofed, effectively protecting them from moisture and corrosion, and ensuring long-term electrical stability. Combined with... Figures 2-4As shown, the LED bracket lamp bead structure includes a bracket body 1 and an LED chip 2 disposed within its cup 11. The bracket body 1 provides mechanical support for the overall structure. There is at least one cup 11 for accommodating various components, such as the LED chip 2. The LED chip 2 emits specific light. The bracket body 1 has opposing first surfaces 12 and second surfaces 13, and a third surface 14 connecting the first surface 12 and the second surface 13. It should be noted that the bracket body 1 also has other surfaces. Since the first surface 12, second surface 13, and third surface 14 are the main reference surfaces used in describing the LED bracket lamp bead structure of this embodiment and appear frequently, while other surfaces are less frequently mentioned in the functional description, they are not individually named. However, this does not mean that the number of surfaces of the bracket body 1 is limited to three; the actual structure includes more surfaces. The opening of the cup 11 is located on the first surface 12. Specifically, the bracket body 1 is recessed inward on the first surface 12 to form at least one cup 11 with an opening. The LED chip 2 is installed within the cup 11, and the cup 11 helps to concentrate the light. The LED chip 2 is electrically connected to metal pins 3, which are connected to the electrodes of the LED chip 2 by soldering or bonding to achieve electrical conduction. The metal pins 3 extend outward from the inside of the bowl 11 and are partially exposed on the second surface 13 and the third surface 14. Specifically, the LED chip 2 is mounted at the bottom of the bowl 11, and the second surface 13 is positioned opposite the first surface 12, i.e., the second surface 13 is located at the outer bottom, corresponding to the bottom of the bowl 11. Therefore, when the metal pins 3 extend outward, they extend from the second surface 13 and then to the third surface 14. This extension design facilitates external circuit connection. In a specific embodiment, the endpoint of the metal pin 3 on the second surface 13 furthest from the third surface 14 is defined as the far endpoint. This definition provides a reference for subsequent descriptions of distance and positional relationships. A recessed area 15 is formed on the first surface 12 adjacent to the third surface 14 to isolate the opening and the third surface 14. The design of the recessed area 15 aims to physically isolate the opening of the bowl 11 and the third surface 14 during the potting process, preventing waterproof adhesive from seeping into the interior of the bowl 11 from the opening. The recessed portion 15 is not connected to the cup 11. This non-connection design prevents the waterproof adhesive from contaminating the interior of the cup 11 and affecting its optical performance. It should be noted that the waterproof adhesive is primarily used for insulation and moisture protection, protecting the metal pins 3. If it seeps into the interior of the cup 11, it can easily adhere to the optical surface, causing light scattering or color deviation, affecting the luminescence effect and optical performance, and causing contamination. In a specific embodiment, the recessed portion 15 extends to both sides of the support body 1, i.e., the sides of the first surface 12 and the third surface 14, ensuring that the recessed portion 15 covers the entire adjacent area.The clearance portion 15 has a stop surface 151 facing the third surface 14 on the side near the first surface 12. The stop surface 151 is used to restrict the flow of glue during the glue pouring process, reducing the amount of waterproof glue that may enter from the opening due to capillary action. The distance between the stop surface 151 and the third surface 14 is greater than the distance between the distal end and the third surface 14. This distance relationship ensures that the glue can completely cover the metal pin 3 without overflowing. The clearance portion 15 extends to the third surface 14, making the clearance portion 15 a continuous structure, which helps to simplify the structural design and may reduce the overall volume and weight. At this time, the longitudinal section of the corresponding part of the bracket body 1 forms an L-shaped notch, which is the clearance portion 15. A column 16 is provided on the clearance portion 15. The column 16 has a supporting surface 161 that is coplanar with the third surface 14. The column 16 plays an auxiliary supporting role to ensure that the bracket body 1 is placed stably when waterproof glue is poured on the outside. Furthermore, the number of the uprights 16 is at least one. When only one upright is provided, it is located in the middle of the clearance portion 15, so that the bracket body 1 maintains balance and stability during the glue pouring process. When only two uprights 16 are provided, they are located at both ends of the clearance portion 15, so that the uprights 16 form symmetrical support at both ends of the clearance portion 15, enhancing the overall structural stability. In a specific embodiment, the clearance portion 15 protrudes and extends towards the first surface 12 to form the upright 16. At this time, the side of the upright 16 is coplanar with the third surface 14, and a U-shaped groove is formed between the upright 16 and the stop surface 151. The U-shaped groove helps to observe and control the glue. In other embodiments, the upright 16 extends from the stop surface 151 towards the third surface 14, and the end face of the upright 16 is coplanar with the third surface 14, so as to provide different support methods.

[0025] The metal pin 3 is externally covered with a waterproof adhesive portion, which serves as insulation and moisture protection, protecting the metal pin 3 from environmental influences. The waterproof adhesive portion is formed by the waterproof adhesive adhering to the surface of the metal pin 3 and solidifying. When applying waterproof adhesive to the exterior of the bracket body 1, it is combined with... Figure 5As shown, the bracket body 1 is placed on its side, with the third surface 14 located on the bottom surface, and the stop surface 151 positioned above the distal end. During the potting process, the clearance portion 15, especially the stop surface 151, serves two purposes: firstly, it restricts the flow of adhesive, ensuring that the metal pins 3 are completely covered while preventing adhesive from entering the cup 11 through the opening, thus avoiding contamination of the LED chip 2's light-emitting surface; secondly, the stop surface 151 serves as a reference. When the waterproof adhesive surface approaches or contacts the stop surface 151, the potting operation is stopped, and the adhesive is allowed to cure, thereby forming a complete waterproof layer covering the metal pins 3. In a specific embodiment, the waterproof adhesive can be a material such as epoxy resin, which has good waterproofness and durability. Furthermore, during adhesive application, the bracket body 1 is placed on its side with the third surface 14 facing downwards. Since the metal pins 3 are mainly located on the third surface 14, the adhesive flows preferentially to the third surface 14 under gravity during application, thus concentrating on covering the metal pins 3 until they are completely encapsulated, forming an effective waterproof layer. This also reduces the flow of adhesive to other areas. For example, if there are no metal pins 3 on the surface of the bracket body 1 directly opposite the third surface 14, no adhesive application is needed, thereby improving coverage accuracy and efficiency. Simultaneously, when the clearance portion 15 extends to the third surface 14, the area of ​​the third surface 14 decreases, resulting in a reduction in the area of ​​blank areas on the third surface 14 without metal pins 3. This design allows the waterproof adhesive to more concentratedly cover the metal pins 3 during the application process. The reduction in the blank area on the third surface 14, combined with the side-mounted arrangement of the bracket body 1, helps optimize the distribution of waterproof adhesive, reduce the amount of waterproof adhesive used, and improve the efficiency of adhesive application. If the bracket body 1 is placed upright during glue application, i.e., the second surface 13 is located below, since there are no metal pins 3 on the surface of the bracket body 1 directly opposite the third surface 14, and there are a large number of blank areas without metal pins 3 on the two sides of the third surface 14 and the second surface 13, the glue is very likely to cover these blank areas due to its fluidity. This not only significantly increases glue consumption, leading to resource waste, but also reduces glue application efficiency. In addition, the cured waterproof glue also affects the flatness of those blank areas without metal pins 3. It should be noted that in this embodiment, the LED bracket lamp bead structure achieves waterproofing of the metal pins 3 by welding them after they are electrically connected to external circuit components and then performing glue application.

[0026] The bowl 11 is filled with an internal encapsulating adhesive to encapsulate and protect the LED chip 2 and achieve the desired optical effects. The filling surface of the internal encapsulating adhesive is lower than the first surface 12, providing space for the subsequent molding of the focusing guide post 5 and ensuring a complete interface bonding between the two. The internal encapsulating adhesive is a mist adhesive and / or a white light adhesive. The mist adhesive is used to scatter light for soft illumination, while the white light adhesive provides high light transmittance for focused light beams. It should be noted that the mist adhesive contains a scattering agent, giving it scattering properties, making it suitable for scenarios requiring uniform illumination; the white light adhesive does not contain a scattering agent, giving it high light transmittance, which is beneficial for achieving highly directional light emission.

[0027] A focusing guide post 5, completely covering the opening, is provided on the first surface 12. The focusing guide post 5 is used to converge the light emitted by the LED chip 2, improving luminous efficiency and directionality. In a specific embodiment, the cross-section of the focusing guide post 5 is semi-elliptical. Based on the optical principle of an ellipse, the semi-elliptical cross-section can efficiently converge the light emitted by the LED chip 2 to the focal area through refraction, thereby improving light utilization efficiency. Simultaneously, the major axis of the semi-ellipse is parallel to the optical axis of the overall optical system, minimizing spherical aberration and making the beam more concentrated and uniform, significantly improving focusing performance. It should be noted that the overall optical system refers to a complete optical path system composed of the LED chip 2, the cup 11, and the internal encapsulating adhesive. In a specific embodiment, the major axis of the semi-ellipse is perpendicular to the first surface 12 to achieve parallelism with the optical axis of the overall optical system, optimizing the optical path. The focusing guide post 5 is connected to the support body 1 by a light-transmitting adhesive, which provides adhesion and optical coupling, avoiding interface reflection loss. It should be noted that the light-transmitting adhesive and the internal encapsulating adhesive are different. The light-transmitting adhesive is specifically used to connect the light-concentrating guide post 5, while the internal encapsulating adhesive is used for chip encapsulation. The light-transmitting adhesive and the internal encapsulating adhesive have different optical and physical properties. The light-transmitting adhesive is optimized for interface coupling, while the internal encapsulating adhesive is used for chip protection and light modulation. Using them interchangeably may lead to bonding failure or optical loss. They cannot be used interchangeably. If atomized adhesive is used to encapsulate the light-concentrating guide post 5, the scattering agent in the atomized adhesive will form secondary refraction and reflection, affecting the light-concentrating effect.

[0028] The filling scheme of the internal encapsulating adhesive is determined according to actual needs. Specifically, when there is only one bowl 11, the overall structure is a single bowl 11 structure, suitable for simple lighting needs. The bowl 11 is filled with a mist-like adhesive, which achieves wide-angle light scattering, suitable for ambient lighting. Alternatively, the mist-like adhesive can be used to mix different colors of light through its scattering properties to achieve a uniform multi-color lighting effect, suitable for applications requiring rich colors. When there are two bowls 11, the overall structure is a double bowl 11 structure, suitable for multi-color or mixed optical effects. The smaller bowl 11 is filled with white light adhesive, and the larger bowl 11 is filled with a mist-like adhesive. The white light adhesive provides the main light spot, and the mist-like adhesive provides the background light, achieving a layered lighting effect.

[0029] The bottom of the bowl 11 is provided with at least one metal pad 4 for mounting the LED chip 2. The metal pad 4 provides electrical connection and mechanical fixing point. The metal pad 4 is electrically connected to and fixedly set with the metal pin 3. In a specific embodiment, the metal pad 4 and the metal pin 3 are connected by welding or bonding, and the metal pad 4 and the LED chip 2 are connected by welding or bonding with metal wires to achieve reliable electrical connection and fixation of the three.

[0030] The LED bracket lamp bead structure provided in this embodiment, through the setting of the clearance portion 15, especially the stop surface 151, serves two purposes during the glue-pouring process. Firstly, it restricts the flow of glue, ensuring that the metal pins 3 are completely covered while preventing glue from entering the cup 11 through the opening, thus avoiding contamination of the light-emitting surface of the LED chip 2. Secondly, the stop surface 151 serves as a reference; when the level of the waterproof glue approaches or contacts the stop surface 151, the glue-pouring operation is stopped, and the glue is allowed to cure, thereby forming a complete waterproof layer covering the metal pins 3. The design of the LED bracket lamp bead structure in this embodiment allows for a side-mounted method when potting the metal pins 3, thereby optimizing the distribution of the waterproof glue, reducing the amount of waterproof glue used, and improving potting efficiency.

[0031] In this embodiment, the internal encapsulating adhesive not only protects the LED chip 2 from mechanical and environmental influences, but also achieves the desired optical effects, such as scattering or transmission, by selecting different adhesives, thereby improving the lighting quality; the setting of the focusing guide post 5 concentrates the light, improves the light efficiency and directionality, reduces light loss, and achieves a more concentrated beam output.

[0032] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. An LED bracket lamp bead structure, characterized in that: Includes a support body (1) and an LED chip (2) disposed in its bowl (11). The support body (1) has a first surface (12) and a second surface (13) opposite to each other, and a third surface (14) connecting the first surface (12) and the second surface (13). The opening of the bowl (11) is located on the first surface (12). The LED chip (2) is electrically connected to a metal pin (3), which extends outward from inside the bowl (11) and is partially exposed on the second surface (13) and the third surface (14). The endpoint of the pin on the second surface (13) that is far from the third surface (14) is defined as the far endpoint. The first surface (12) is recessed near the third surface (14) to form a clearance portion (15) to isolate the opening and the third surface (14). The clearance portion (15) has a stop surface (151) facing the third surface (14) on the side near the first surface (12). The distance between the stop surface (151) and the third surface (14) is greater than the distance between the distal end and the third surface (14). The metal pin (3) is covered with a waterproof adhesive.

2. The LED bracket lamp bead structure according to claim 1, characterized in that: The bowl (11) is filled with an internal encapsulating adhesive, and the filling surface of the internal encapsulating adhesive is lower than the first surface (12).

3. The LED bracket lamp bead structure according to claim 2, characterized in that: A light-concentrating guide post (5) that completely covers the opening is provided on the first surface (12).

4. The LED bracket lamp bead structure according to claim 3, characterized in that: The light-concentrating guide column (5) is connected to the bracket body (1) by a light-transmitting adhesive.

5. The LED bracket lamp bead structure according to claim 2, characterized in that: The internal encapsulating adhesive is a mist adhesive and / or a white gloss adhesive; The number of bowls (11) is at least one.

6. The LED bracket lamp bead structure according to claim 5, characterized in that: When there is one bowl (11), the bowl (11) is filled with a mist adhesive; when there are two bowls (11), the smaller bowl (11) is filled with white light adhesive and the larger bowl (11) is filled with a mist adhesive.

7. The LED bracket lamp bead structure according to claim 1, characterized in that: The clearance portion (15) extends to the third surface (14).

8. The LED bracket lamp bead structure according to claim 7, characterized in that: The clearance section (15) is provided with a column (16), and the column (16) has a supporting surface (161) that is coplanar with the third surface (14).

9. The LED bracket lamp bead structure according to claim 1, characterized in that: The bottom of the bowl (11) is provided with at least one metal pad (4) for mounting LED chip (2); the metal pad (4) is electrically connected to the metal pin (3) and fixedly installed.

10. The LED bracket lamp bead structure according to claim 3, characterized in that: The cross-section of the focusing guide post (5) is semi-elliptical, and the major axis of the semi-elliptical shape is parallel to the optical axis of the overall optical system.

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