A multi-colour light source

Abstract

The utility model discloses a multicolor light source relates to light source technical field, and multicolor light source includes copper base plate, direct eutectic chip and fluorescent glue excitation unit, and direct eutectic chip and copper base plate eutectic combination realizes circuit conduction, and fluorescent glue excitation unit and copper base plate eutectic combination realize circuit conduction, wherein, fluorescent glue excitation unit includes ceramic substrate and sets up first blue light chip on ceramic substrate, and ceramic substrate and first blue light chip eutectic combination realizes circuit conduction, and the surface of first blue light chip is equipped with fluorescent glue layer. The utility model can solve in the multicolor light source integrated manufacturing process, because of the sputtering and diffusion in fluorescent glue spraying process, lead to the defect such as color mutual interference, yellow circle obvious and the poor light consistency between.

Description

Technical Field

[0001] This utility model relates to the field of light source technology, and in particular to a multicolor light source. Background Technology

[0002] Multicolor light sources, as important light-emitting devices, typically require the integration of multiple colors of light, such as red, green, blue, warm, cool, lemon, and amber. In existing manufacturing processes, red, green, and blue chips can be directly bonded to a copper substrate using flux through a eutectic bonding process to achieve circuit conduction and emit the target color. However, warm, cool, lemon, and amber colors cannot be emitted directly from a single chip; they require the application of a specific formulation of liquid phosphor to the emitting surface of a blue chip. After excitation, the phosphor is converted to the target color. In practice, such blue chips also need to first achieve eutectic bonding with a copper substrate to establish circuit conduction. Then, according to the color requirements, the phosphor is locally applied to the chip's surface. After the phosphor cures, it undergoes processes such as splitting and testing to ultimately form a multicolor integrated light source.

[0003] However, since chips of multiple colors need to be integrated on the same substrate, when using a stencil to shield non-coated areas for localized coating, the opening size of the stencil is usually larger than the chip itself. This causes the liquid phosphor to easily extend beyond the pre-defined chip area, resulting in sputtering. This sputtering not only contaminates adjacent color chips, causing them to fail to meet luminous performance standards, but also forms excess phosphor residue around the chips. When the light source is turned on, this excess phosphor will produce a noticeable yellow ring effect, severely affecting light output quality and visual effects. Furthermore, to prevent mutual interference between different color areas during the coating process, the spacing between chips is often forced to increase, making it difficult to achieve ideal spatial mixing effects between different color spots during final light combining applications, thus reducing overall color consistency. Utility Model Content

[0004] The technical problem to be solved by this utility model embodiment is that in the process of multi-color light source integration manufacturing, due to the sputtering and diffusion during the fluorescent adhesive spraying process, defects such as mutual interference between colors, obvious yellow rings, and poor light combination consistency are caused.

[0005] To address the aforementioned problems, this utility model provides a multicolor light source, comprising:

[0006] Copper substrate;

[0007] The direct eutectic chip achieves circuit conduction by eutectic bonding with the copper substrate;

[0008] A fluorescent adhesive excitation unit is eutectic bonded to and electrically connected to the copper substrate. The fluorescent adhesive excitation unit includes a ceramic substrate and a first blue light chip disposed on the ceramic substrate. The ceramic substrate and the first blue light chip are eutectic bonded to achieve circuit conduction. The surface of the first blue light chip is provided with a fluorescent adhesive layer.

[0009] A further technical solution is that the direct eutectic chip includes at least one of a red light chip, a green light chip, and a second blue light chip.

[0010] A further technical solution is that the fluorescent gel excitation unit includes at least one of a warm light excitation unit, a cold light excitation unit, a lemon light excitation unit, and an amber light excitation unit.

[0011] A further technical solution is that the number of direct eutectic chips is multiple, the number of phosphor excitation units is multiple, and the multiple direct eutectic chips and multiple phosphor excitation units are arranged in an array on the copper substrate.

[0012] A further technical solution is that the spacing between any two adjacent light-emitting units is less than 0.3 mm, wherein the light-emitting unit includes a direct eutectic chip and the phosphor excitation unit.

[0013] A further technical solution is that the number of direct eutectic chips is multiple, and the ceramic substrate has the same size as the first blue light chip.

[0014] A further technical solution is that the coverage area of ​​the fluorescent adhesive layer is limited to the surface area of ​​the ceramic substrate.

[0015] Compared with the prior art, the technical effects achieved by the embodiments of this utility model include:

[0016] This invention proposes a multicolor light source comprising a copper substrate, a direct eutectic chip, and a phosphor excitation unit. The direct eutectic chip is eutecticly bonded to the copper substrate to achieve circuit conduction; the phosphor excitation unit is eutecticly bonded to the copper substrate to achieve circuit conduction. The phosphor excitation unit comprises a ceramic substrate and a first blue light chip disposed on the ceramic substrate, with the ceramic substrate and the first blue light chip eutecticly bonded to achieve circuit conduction. This invention effectively solves key technical challenges in multicolor light source manufacturing by designing the phosphor excitation unit as an independent module with the ceramic substrate as its carrier. This structure isolates the phosphor coating process within an independent unit, fundamentally avoiding color contamination of adjacent chips by colloid sputtering and significantly improving product yield. Simultaneously, the physical boundaries of the ceramic substrate strictly limit phosphor diffusion, completely eliminating the yellow ring phenomenon generated during light emission and improving visual effects. Furthermore, the modular design allows for a more compact chip arrangement, enabling thorough mixing of different colors in the near field, greatly improving the consistency of color and the uniformity of the light spot after light combination, and overall enhancing the performance and reliability of the multicolor light source. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] One or more embodiments are illustrated by way of example with reference numerals in the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0020] Figure 1 This is a cross-sectional schematic diagram of a multicolor light source proposed in an embodiment of the present invention.

[0021] Figure 2 This is a top view schematic diagram of a multicolor light source proposed in an embodiment of the present invention.

[0022] Figure Labels

[0023] Copper substrate 10, ceramic substrate 20, red light chip 30, green light chip 40, second blue light chip 50, warm light excitation unit 60, cold light excitation unit 70, lemon light excitation unit 80, amber light excitation unit 90. Detailed Implementation

[0024] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Similar component reference numerals in the drawings represent similar components. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0025] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0026] It should also be understood that the terminology used in this specification of embodiments of the present invention is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of the present invention. As used in this specification of embodiments of the present invention and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0027] See Figures 1-2 This utility model embodiment proposes a multicolor light source, which includes a copper substrate 10, a direct eutectic chip, and a phosphor excitation unit. The specific structure is described below:

[0028] The direct eutectic chip is eutecticly bonded to the copper substrate 10 to achieve circuit conduction; the fluorescent adhesive excitation unit is eutecticly bonded to the copper substrate 10 to achieve circuit conduction. The fluorescent adhesive excitation unit includes a ceramic substrate 20 and a first blue light chip disposed on the ceramic substrate 20. The ceramic substrate 20 and the first blue light chip are eutecticly bonded to achieve circuit conduction. The surface of the first blue light chip is provided with a fluorescent adhesive layer.

[0029] Furthermore, the direct eutectic chip includes at least one of a red light chip 30, a green light chip 40, and a second blue light chip 50. This invention is not specifically limited; for example, in this embodiment, the direct eutectic chip includes a red light chip 30, a green light chip 40, and a second blue light chip 50. The aforementioned direct eutectic chip can achieve a robust mechanical connection and low-resistance circuit interconnection directly with the copper substrate 10 through a mature eutectic process, emitting the corresponding target primary color light directly without requiring an additional phosphor conversion step.

[0030] Furthermore, the fluorescent adhesive excitation unit includes at least one of a warm light excitation unit 60, a cold light excitation unit 70, a lemon light excitation unit 80, and an amber light excitation unit 90. This invention is not specifically limited; in this embodiment, the fluorescent adhesive excitation unit includes a warm light excitation unit 60, a cold light excitation unit 70, a lemon light excitation unit 80, and an amber light excitation unit 90. The warm light excitation unit 60 emits warm light, the cold light excitation unit 70 emits cold light, the lemon light excitation unit 80 emits lemon light, and the amber light excitation unit 90 emits amber light. Warm light, cold light, lemon light, and amber light typically cannot be directly generated by a single semiconductor chip; they require a first blue light chip to excite a fluorescent adhesive with a specific formulation to achieve color conversion.

[0031] In its specific implementation, the core of this multicolor light source lies in constructing a composite structure system comprising a copper substrate 10, a direct eutectic chip, and a phosphor excitation unit. The direct eutectic chip is mechanically fixed and electrically connected to the copper substrate 10 via eutectic bonding, forming the basic light-emitting part of the light source. Furthermore, the phosphor excitation unit can be considered an independent prefabricated module, containing a ceramic substrate 20 on which a first blue light chip is fixed via eutectic bonding. A specific phosphor layer is then applied to the light-emitting surface of the first blue light chip to excite the corresponding light. Finally, this complete phosphor excitation unit is integrated onto the main copper substrate 10 via eutectic bonding.

[0032] The modular structural design described above primarily eliminates potential contamination from the phosphor coating process. Since the first blue LED chip, requiring phosphor conversion, is pre-mounted on a separate ceramic substrate 20 for phosphor coating and curing, this most prone-to-sputtering step is completely removed from the copper substrate 10 integrating multiple chips. Therefore, regardless of how the liquid phosphor spreads during coating, its influence is strictly confined to the area of ​​the separate ceramic substrate 20, fundamentally preventing phosphor sputtering onto nearby red, green, or other direct eutectic chips. This directly solves the problem of color impurity and performance degradation caused by interference between different colors of light, significantly improving product yield.

[0033] Furthermore, this modular structure effectively eliminates the yellow ring phenomenon that appears after the light source is illuminated. The ceramic substrate 20, as a platform with clearly defined physical boundaries, provides a natural and insurmountable constraint on the spraying range of the phosphor adhesive layer. The phosphor adhesive is firmly confined within the surface area of ​​the ceramic substrate 20, preventing it from flowing or adhering to unintended areas. When the light source is illuminated, the luminescent area is precisely controlled within the phosphor adhesive-covered area on the ceramic substrate 20, avoiding unwanted stray light caused by excess or irregular phosphor adhesive at the edges. This ensures the regularity of the emitted light morphology and the purity of the light color, significantly improving visual quality.

[0034] Furthermore, this modular structure lays a solid foundation for achieving higher-density chip layouts and superior optical mixing effects. Since the phosphor excitation unit is integrated as a single module onto the copper substrate 10, its planar space is primarily determined by the module's own dimensions, eliminating the need for additional safety clearances for the positioning and operation of the stencil, as required by traditional screen printing processes. This allows designers to arrange direct eutectic chips and phosphor excitation units with extremely small spacing. When different colored light-emitting points are highly concentrated in physical space, their emitted light begins to mix fully in the near field, forming a uniform, grain-free composite light spot in the far field, significantly improving the color consistency and spot uniformity after multicolor combining.

[0035] Furthermore, this modular structure also brings the added benefits of process optimization and improved reliability. The prefabrication of the phosphor excitation units allows for independent testing and sorting, ensuring that only units with qualified optical performance are integrated into the final product. This enhances overall manufacturing flexibility and the performance consistency of the final product. Simultaneously, the excellent thermal conductivity of the ceramic substrate 20, combined with the low thermal resistance resulting from the eutectic bonding, provides an efficient heat dissipation path for the chip, helping to maintain a stable junction temperature during operation and thus ensuring the long-term lifespan of the light source and the stability of its color parameters.

[0036] This invention systematically solves many inherent defects in the fluorescent adhesive spraying process, such as sputtering contamination, yellow ring formation, and poor light combining consistency, by introducing a core structural innovation of a fluorescent adhesive excitation unit with a ceramic substrate 20 as the carrier. It not only directly improves the production yield, light output quality, and optical performance of multicolor light sources, but also enhances the flexibility of the manufacturing process and the reliability of the products through a modular approach, thereby achieving a significant improvement in the overall performance of multicolor light sources.

[0037] In some preferred embodiments, there are multiple direct eutectic chips and multiple phosphor excitation units, and the multiple direct eutectic chips and multiple phosphor excitation units are arranged in an array on the copper substrate 10.

[0038] In practice, by arranging multiple direct eutectic chips and multiple phosphor excitation units in an array on the copper substrate 10, an orderly spatial distribution of the light source dot matrix is ​​achieved. This regular array layout firstly facilitates unified optical design during the packaging stage, resulting in better consistency and directionality of the light emitted from each light-emitting unit. Secondly, the array arrangement simplifies the wiring design of the driving circuit, enabling more uniform power distribution and reducing brightness unevenness caused by differences in line impedance.

[0039] In some preferred embodiments, the spacing between any two adjacent light-emitting units is less than 0.3 mm, wherein the light-emitting unit includes a direct eutectic chip and the phosphor excitation unit.

[0040] In practice, by controlling the spacing between any two adjacent light-emitting units to a minimum value (e.g., less than 0.3 mm), the integration and optical performance of the light source are greatly improved.

[0041] In some preferred embodiments, there are multiple direct eutectic chips, and the ceramic substrate 20 has the same size as the first blue light chip.

[0042] In practice, by making the ceramic substrate 20 the same size as the first blue light chip, the phosphor excitation unit achieves extreme compactness in structure. The ceramic substrate 20 not only serves as a support and heat dissipation component, but its contours also act as a natural physical barrier, strictly limiting the phosphor coating area to within the substrate surface. This size-matching design minimizes the ineffective area of ​​the unit, ensuring that each phosphor excitation unit occupies almost the same space on the copper substrate 10 as the chip itself.

[0043] In some preferred embodiments, the coverage area of ​​the fluorescent adhesive layer is limited to the surface area of ​​the ceramic substrate 20.

[0044] In practice, the coverage area of ​​the fluorescent adhesive layer is explicitly limited to the surface area of ​​the ceramic substrate 20, which provides a direct structural constraint and guarantee for completely eliminating the yellow ring phenomenon. Since the fluorescent adhesive is strictly confined to the ceramic substrate 20, the light-emitting area is precisely defined after the light source is turned on, completely avoiding the undesirable stray light, i.e., the yellow ring, caused by the uncontrolled light emission of the fluorescent adhesive in the edge area.

[0045] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0046] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0047] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0048] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0049] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0050] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. The illustrative expressions of the above terms in this specification should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0051] Obviously, those skilled in the art can make various modifications and variations to this utility model without departing from its spirit and scope. Since these modifications and variations fall within the scope of the claims of this utility model and their equivalents, this utility model also intends to include these modifications and variations.

[0052] The above description describes specific embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this utility model, and these modifications or substitutions should all be covered within the scope of protection of this utility model. Therefore, the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A multicolor light source, characterized in that, include: Copper substrate; The direct eutectic chip achieves circuit conduction by eutectic bonding with the copper substrate; A fluorescent adhesive excitation unit is eutectic bonded to the copper substrate to achieve circuit conduction. The fluorescent adhesive excitation unit includes a ceramic substrate and a first blue light chip disposed on the ceramic substrate. The ceramic substrate and the first blue light chip are eutectic bonded to achieve circuit conduction. The surface of the first blue light chip is provided with a fluorescent adhesive layer.

2. The multicolor light source according to claim 1, characterized in that, The direct eutectic chip includes at least one of a red light chip, a green light chip, and a second blue light chip.

3. The multicolor light source according to claim 1, characterized in that, The fluorescent gel excitation unit includes at least one of a warm light excitation unit, a cold light excitation unit, a lemon light excitation unit, and an amber light excitation unit.

4. The multicolor light source according to claim 1, characterized in that, The number of direct eutectic chips is multiple, and the number of phosphor excitation units is multiple. The multiple direct eutectic chips and multiple phosphor excitation units are arranged in an array on the copper substrate.

5. The multicolor light source according to claim 4, characterized in that, The spacing between any two adjacent light-emitting units is less than 0.3 mm, wherein the light-emitting unit includes a direct eutectic chip and the phosphor excitation unit.

6. The multicolor light source according to claim 1, characterized in that, The number of direct eutectic chips is multiple, and the ceramic substrate has the same size as the first blue light chip.

7. The multicolor light source according to claim 1, characterized in that, The coverage area of ​​the fluorescent adhesive layer is limited to the surface area of ​​the ceramic substrate.

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