Totally-enclosed semiconductor process equipment and its manual loading and unloading module

Abstract

The utility model discloses a kind of fully-enclosed semiconductor process equipment and its manual feeding and discharging module, manual feeding and discharging module, comprising: manual feeding platform;Positioning plate, fixed on the manual feeding platform, for positioning wafer holder in X axis and Y axis direction;Compression assembly, fixed on the manual feeding platform, for positioning wafer holder in Z axis direction.The fully-enclosed semiconductor process equipment and its manual feeding and discharging module described above, due to being provided with manual feeding and discharging module, so that equipment can be used in ordinary clean environment without inert gas, expand the function of equipment.

Description

TECHNICAL FIELD

[0001] The utility model relates to a semiconductor technical field especially relates to a full -enclosed semiconductor process equipment and manual feeding and discharging module. BACKGROUND

[0002] With the development of semiconductor devices to ultra-fine integration, the process technology to the environment cleanliness and inert atmosphere requirement increasingly strict. In wafer processing, if contact with air will face oxidation, contamination deposition and electrostatic discharge multiple risks, these problems will directly affect product yield and device performance. In order to ensure the process quality, need to maintain vacuum or inert gas environment in the whole processing process, to prevent wafer surface oxidation and pollution.

[0003] The existing full -enclosed semiconductor process equipment usually only in the need inert gas closed environment use, cannot be used as ordinary clean environment without inert gas, single function. UTILITY MODEL CONTENTS

[0004] Based on this, the utility model provides a full -enclosed semiconductor process equipment and manual feeding and discharging module, make equipment can be used in ordinary clean environment without inert gas.

[0005] A full -enclosed semiconductor process equipment's manual feeding and discharging module, include:

[0006] Manual feeding platform;

[0007] Positioning card, fixed on the manual feeding platform, for positioning wafer holder in X axis and Y axis direction;

[0008] Compression assembly, fixed on the manual feeding platform, for positioning wafer holder in Z axis direction.

[0009] In one embodiment, the positioning card is symmetrical with several positioning steps along the two sides of X axis direction, and the width of several positioning steps gradually increases along the insertion direction.

[0010] In one embodiment, the compression assembly includes:

[0011] Block pipe, extend along Z axis direction, and fixed on the manual feeding platform;

[0012] Compression piece, including pressure strip and guide shaft, the guide shaft extends along Z axis direction, and the lower end is inserted into the block pipe, and can be freely moved between the compression position and the release position, the pressure strip extends in the plane defined by X axis and Y axis together, and one end is connected with the upper end of the guide shaft;

[0013] Elastic component, for exerting downward elastic force on the guide shaft.

[0014] In one embodiment, the baffle tube is provided with a guide groove, the guide groove includes a horizontal section extending in the circumferential direction and a vertical section extending in the axial direction, the upper end of the vertical section is connected to one end of the horizontal section, and the lower end of the guide shaft is provided with a sliding member that can slide freely in the guide groove.

[0015] In one embodiment, the upper end of the guide shaft is provided with a support portion extending in a horizontal direction, and one end of the pressure strip is provided with a connecting portion. The connecting portion and the support portion are stacked together and fixed together by screws.

[0016] In one embodiment, the clamping member further includes a plurality of elastic pads fixed to the lower surface of the clamping strip.

[0017] In one embodiment, the clamping assembly further includes a linear bearing disposed between the lower end of the guide shaft and the stop tube.

[0018] In one embodiment, the clamping assembly further includes a dustproof tube that is sleeved over the outside of the retaining tube.

[0019] In one embodiment, the manual feeding platform includes a lower support plate, an upper support plate, and a vertical support plate, with the upper support plate and the lower support plate arranged vertically above and below each other, and the vertical support plate vertically positioned between the upper support plate and the lower support plate.

[0020] A fully enclosed semiconductor process equipment, including a manual loading and unloading module for the fully enclosed semiconductor process equipment.

[0021] The aforementioned fully enclosed semiconductor process equipment and its manual loading / unloading module, due to the inclusion of a manual loading / unloading module, allows the equipment to be used in ordinary clean environments where inert gases are not required, thus expanding the equipment's functionality. Attached Figure Description

[0022] Figure 1 This is a perspective view of a fully enclosed semiconductor process apparatus according to one embodiment of the present invention.

[0023] Figure 2 for Figure 1 An exploded view of the fully enclosed semiconductor process equipment shown.

[0024] Figure 3 for Figure 1 A cross-sectional view of the fully enclosed semiconductor process equipment shown in the diagram;

[0025] Figure 4 for Figure 1 A longitudinal sectional view of the fully enclosed semiconductor process equipment shown.

[0026] Figure 5 for Figure 1 An exploded view of the enclosure of the fully enclosed semiconductor process equipment shown in the diagram;

[0027] Figure 6 for Figure 5 A perspective view of the main body of the box shown in the diagram;

[0028] Figure 7 for Figure 1 The layout diagram of the handling module, manual loading and unloading module, edge finding module, and identification module of the fully enclosed semiconductor process equipment shown in the figure;

[0029] Figure 8 This is a 3D view of the manual loading and unloading module;

[0030] Figure 9 This is an exploded structural diagram of some parts of the manual loading and unloading module;

[0031] Figure 10 This is a cross-sectional view of the clamping component of the manual loading and unloading module;

[0032] Figure 11 for Figure 10 Front view of the baffle tube of the clamping assembly shown;

[0033] Figure 12 This is a diagram showing the fit between the positioning plate and the wafer carrier of the manual loading / unloading module.

[0034] Explanation of reference numerals in the attached figures

[0035] 1-Base frame;

[0036] 11-outriggers;

[0037] 2-Semiconductor equipment body;

[0038] 21-Box;

[0039] 211-Main box;

[0040] 2111 - First side plate;

[0041] 2112 - Second side panel;

[0042] 2113 - Third side panel;

[0043] 2114 - Fourth side panel;

[0044] 2115 - Base Plate;

[0045] 2116 - Top Slab;

[0046] 2117 - Window;

[0047] 2118 - Air outlet;

[0048] 2119 - Return air vent;

[0049] 2120 - Left opening;

[0050] 2121 - Right opening;

[0051] 2122 - Air Intake;

[0052] 2124 - Top opening;

[0053] 212 - Left sealing plate;

[0054] 213 - Right sealing plate;

[0055] 2131 - Manual door;

[0056] 2132 - Internal maintenance door;

[0057] 214 - Sealed top cover;

[0058] 215 - Diffuser plate;

[0059] 216-Upper cavity;

[0060] 217 - Lower cavity;

[0061] 22-Air purification module;

[0062] 221 - Return air duct;

[0063] 222 - Air Filter;

[0064] 23-Support frame;

[0065] 231-Left support frame;

[0066] 232-Right support frame;

[0067] 233-Large slab;

[0068] 24-Manual loading and unloading module;

[0069] 241 - Manual feeding platform;

[0070] 2411 - Lower support plate;

[0071] 2412 - Upper support plate;

[0072] 2413 - Vertical support plate;

[0073] 242-Positioning plate;

[0074] 2421 - Positioning Step;

[0075] 243 - Clamping assembly;

[0076] 2431-Baffle;

[0077] 24311-Guide slot;

[0078] 24312-Horizontal segment;

[0079] 24313 - Vertical segment;

[0080] 24314 - Sliding component;

[0081] 2432 - Pressing strip;

[0082] 2433 - Guide shaft;

[0083] 2435 - Bearing;

[0084] 2436 - Dustproof pipe;

[0085] 2437 - Support section;

[0086] 2438 - Connector;

[0087] 2439 - Elastic Pad;

[0088] 244 - Wafer rack;

[0089] 25 - Transport module;

[0090] 251 - Base;

[0091] 252-Robotic Arm;

[0092] 26-Edge Finding Module;

[0093] 261 - Edge finder;

[0094] 27 - Recognition Module;

[0095] 28 - Wafer processing or testing module;

[0096] 3-Wafer transport protection device;

[0097] 321-SMIF box;

[0098] 322-SMIF transfer box;

[0099] 4-Electrical appliance cabinet. Detailed Implementation

[0100] To make the above-mentioned objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described clearly and completely below with reference to the accompanying drawings. Obviously, the specific details described below are only a part of the embodiments of this utility model, and this utility model can be implemented in many other embodiments different from those described herein. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0101] In this document, when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The directional terms such as "front," "back," "up," and "down" are defined based on the location of the components in the accompanying drawings and their relative positions, and are merely for clarity and convenience in expressing the technical solution. It should be understood that the use of these directional terms should not limit the scope of protection claimed by this utility model.

[0102] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0103] See Figure 1 One embodiment of the fully enclosed semiconductor process equipment of this utility model includes a base frame 1, a semiconductor equipment body 2, and a wafer transfer protection device 3. For ease of explanation, a three-dimensional coordinate system is defined in this embodiment, where the X-axis and Y-axis represent two orthogonal directions on the horizontal plane, and the Z-axis represents the vertical direction. This coordinate system is used to accurately describe the spatial positional relationship and movement direction of each component.

[0104] The base frame 1 is located at the bottom of the equipment, supporting the entire structure and ensuring its stability. The semiconductor equipment body 2 is mounted on top of the base, forming the core working unit of the equipment. The wafer transfer protection device 3 is located at a corresponding position on the semiconductor equipment body 2, mainly used to protect the wafer during wafer transfer, preventing contamination and damage.

[0105] Base frame 1

[0106] The base frame 1 is the basic support structure of this utility model, and its main function is to provide a stable support platform for the semiconductor equipment body 2 and the wafer transfer protection device 3. Figure 1 , 2As shown, the base frame 1 in this embodiment adopts a rectangular structure design extending along the X and Y axes. This structure not only has good load-bearing capacity, but also facilitates the spatial layout and installation of the equipment. Preferably, multiple support legs 11 are provided on the bottom surface of the base frame 1.

[0107] Semiconductor equipment body 2

[0108] See Figure 1 In this embodiment, the semiconductor equipment body 2 is the core part of the entire equipment, mainly including a housing 21, an air purification module 22, a support frame 23, a handling module 25, a manual loading and unloading module 24, an edge finding module 26, an identification module 27, a wafer process module 28, and an electrical cabinet 4, etc. The specific structure and function of each part are described in detail below:

[0109] Box 21

[0110] The enclosure 21 adopts a split-chamber design, comprising an upper cavity 216 and a lower cavity 217. The structure of the enclosure 21 includes a main enclosure 211, a left sealing plate 212, a right sealing plate 213, and a sealing top cover 214.

[0111] The main housing 211 is welded to the base frame 1. The structure of the main housing 211 includes: a first side plate 2111 and a second side plate 2112 arranged opposite each other along the X-axis, a third side plate 2113 and a fourth side plate 2114 arranged opposite each other along the Y-axis, and a bottom plate 2115 and a top plate 2116 arranged along the Z-axis. Among them, the third side plate 2113 is provided with a window 2117, an air outlet 2118 and an air return outlet 2119. The window 2117 communicates with the lower cavity 217 and is mainly used for wafer loading and unloading operations. The window 2117 is equipped with an automatically lifting door (not shown in the figure), which can be closed when the SMIF transfer box 322 is opened and opened after the air inside the SMIF transfer box 322 is replaced with inert gas, thereby ensuring that the internal air pressure and cleanliness remain constant. The air outlet 2118 is connected to the lower cavity 217, and the gas in the lower cavity 217 is discharged through the air outlet 2118; the return air outlet 2119 is connected to the upper cavity 216, and the discharged gas enters the upper cavity 216 after passing through the return air pipe 221.

[0112] The first side plate 2111 has a left opening 2120, an air inlet 2122, and an exhaust port (not shown in the figure). The air inlet 2122 communicates with the upper cavity for inputting clean nitrogen, and the exhaust port communicates with the lower cavity for discharging mixed impurity gas. The second side plate 2112 has a right opening 2121. The top plate 2116 has a top opening 2124. The left opening 2120, right opening 2121, and top opening 2124 all facilitate the inspection and maintenance of the equipment.

[0113] In one embodiment, the first side plate 2111, the second side plate 2112, the third side plate 2113, the fourth side plate 2114, and the bottom plate 2115 are sheet metal parts, which are assembled by sealing welding.

[0114] The left sealing plate 212 is fixed at the left opening 2120 to seal the left opening 2120. The right sealing plate 213 has an upper left opening and a lower left opening arranged vertically. The upper left opening and the lower left opening are respectively equipped with a manual door 2131 and an internal maintenance door 2132. The right sealing plate 213 is used to seal the right opening 2121, and the sealing top cover 214 is used to seal the top opening 2124. The key point of the fully enclosed structure layout is to ensure its airtightness. However, airtightness and ease of maintenance are somewhat conflicting. This layout takes into account both the convenience of maintenance and the airtightness. There is a detachable left sealing plate 212 and a right sealing plate 213 on each side of the main housing 211. They can be removed for the installation of the wafer process module 28. The sealing plates are equipped with manual doors 2131, which can be opened for loading and unloading wafers or for maintenance of internal equipment in the absence of inert gas.

[0115] In addition, the housing 21 also includes a diffuser plate 215, which is disposed inside the main housing 211 to form the upper cavity 216 and the lower cavity 217. The diffuser plate 215 is covered with holes to ensure uniform airflow distribution, thereby optimizing gas circulation efficiency.

[0116] Air purification module 22

[0117] like Figure 4 As shown, the air purification module 22 is used to purify the internal environment of the enclosure 21. The air purification module 22 includes a return air duct 221 and an air filter 222. The return air duct 221 is located on the front side of the enclosure 21, and its upper and lower ends are connected to the return air inlet 2119 and the air outlet 2118 on the third side panel 2113, respectively, forming a complete circulation channel.

[0118] Air filter 222 is installed in the upper cavity 216, forming a complete purification loop with the entire airflow circulation system. Clean nitrogen is input through air inlet 2122, filtered by air filter 222, and then enters the lower cavity 217. After filling the lower cavity 217, it flows back to the upper cavity 216 through return air pipe 221, completing the filtration cycle.

[0119] In a preferred embodiment, the air filter 222 is a fan filter unit (FFU), which consists of a high-efficiency particulate air (HEPA) filter or an ultra-high-efficiency particulate air (ULPA) filter, a miniature fan, and a housing.

[0120] Support frame 23

[0121] like Figure 2 As shown, the support frame 23 of this utility model is the internal skeleton structure of the entire equipment, used to provide a stable mounting platform for each functional module. The support frame 23 includes a left support frame 231 and a right support frame 232 arranged along the X-axis, and a large plate 233 fixed on the left support frame 231.

[0122] Transport Module 25

[0123] like Figure 7 As shown, in this embodiment, the handling module 25 is opposite to the window 2117 and is fixedly positioned approximately in the middle of the large board 233. This handling module 25 is used to perform automated wafer handling processes, specifically including the following workflow:

[0124] 1. Grab the wafer to be tested from the wafer carrier 244 on the wafer transfer protection device 3 or the manual loading / unloading module 24;

[0125] 2. The wafer is moved to the edge-finding module 26 for edge-finding and positioning;

[0126] 3. Move the wafer to the recognition module 27 to take a picture of the character code;

[0127] 4. After identification is completed, the wafer is transferred to wafer process module 28 for relevant parameter measurement;

[0128] 5. After the measurement process is completed, the wafer is transported.

[0129] In a preferred embodiment, the handling module 25 includes a base 251 and a robotic arm 252. The robotic arm 252 adopts a multi-degree-of-freedom robotic arm structure, which can realize the precise grasping, handling, and placement of wafers in three-dimensional space. The motion trajectory and positional accuracy of the robotic arm 252 are controlled in real time by the control system to ensure the safety and reliability of the wafer 9 during the handling process.

[0130] Manual loading and unloading module 24

[0131] like Figures 8-12 As shown, the manual loading / unloading module 24 is mounted on the large board 233 and is used to load and unload the wafer rack 244. The manual loading / unloading module 24 includes a manual loading platform 241, a positioning plate 242, and a clamping assembly 243.

[0132] The manual loading platform 241 is the basic support platform for the entire manual loading / unloading module 24, responsible for supporting the wafer rack 244 and providing stable loading and unloading operations. The manual loading platform 241 consists of a lower support plate 2411, an upper support plate 2412, and a vertical support plate 2413. The lower support plate 2411 is fixedly mounted on the large plate 233, providing stable bottom support for the entire platform. The upper support plate 2412 is installed above the lower support plate 2411, forming the upper structure supporting the platform. The vertical support plate 2413 is vertically positioned between the upper support plate 2412 and the lower support plate 2411 to enhance the stability of the entire structure and ensure that the upper support plate 2412 does not deform in the vertical direction. This structural design ensures the stability and load-bearing capacity of the platform, providing a solid foundation for the precise loading and unloading of the wafer rack 244.

[0133] The positioning plate 242 is fixed on the manual loading stage 241 and is used for precise positioning of the wafer rack 244 in the X and Y axis directions. The positioning plate 242 has several positioning steps 2421 symmetrically arranged on both sides of the X-axis, while the wafer rack 244 has a bottom groove (not shown in the figure) extending along the X-axis direction at its lower end. When the wafer rack 244 is placed on the stage, the front end of the positioning plate 242 inserts into the bottom groove, and the positioning steps 2421 engage with the two sides of the bottom groove opening to achieve positioning of the wafer rack 244. Through the engagement of the positioning steps 2421 and the bottom groove, precise positioning of the wafer rack 244 is achieved, ensuring the stability of the wafers during handling and avoiding potential damage or measurement errors caused by offset or shaking. Furthermore, the positioning plate 242 can position wafer racks 244 for 2-8 inch wafers.

[0134] The clamping assembly 243 is used to clamp and limit the wafer holder 244 in the Z-axis direction, ensuring the stability of the wafer holder 244 in the vertical direction. The clamping assembly 243 includes a stop tube 2431, a clamping element, and an elastic element (not shown in the figure). The stop tube 2431 is located below the upper support plate 2412, and its upper end is fixed to the upper support plate 2412, serving as a guide and fixation element. The clamping element includes a pressure bar 2432 and a guide shaft 2433. The pressure bar 2432 extends horizontally and is used to apply a downward clamping force; the guide shaft 2433 extends vertically, and its lower end is inserted into the stop tube 2431, allowing it to move freely between the clamped and released positions. The elastic element is used to apply a downward elastic force to the guide shaft 2433, thereby ensuring the clamping of the wafer holder 244 in the Z-axis direction. The design of the clamping component 243 ensures that the wafer carrier 244 is firmly fixed during loading and unloading, preventing instability or positional shift during handling due to vibration or other external forces. Simultaneously, the addition of elastic components enhances the flexibility of the clamping, allowing it to be released when needed, ensuring ease of operation.

[0135] Preferably, the baffle 2431 is provided with a "7"-shaped guide groove 24311, which includes a horizontal segment 24312 extending in the circumferential direction and a vertical segment 24313 extending in the axial direction. The upper end of the vertical segment 24313 is connected to one end of the horizontal segment 24312, and the lower end of the guide shaft 2433 is provided with a sliding member 24314, which can slide freely within the guide groove 24311. In the pressed position, the sliding member 24314 is located within the vertical segment 24313 of the guide groove 24311; in the released position, the sliding member 24314 is located within the horizontal segment 24312 of the guide groove 24311. The guide groove 24311 allows the pressure strip 2432 to switch only 90 degrees, thereby limiting the forward and backward movement of the positioning plate 242.

[0136] To improve the stability of the guide shaft 2433 and extend its service life, the clamping assembly 243 also includes a bearing 2435, which is disposed between the lower end of the guide shaft 2433 and the stop tube 2431 to ensure the smooth operation of the guide shaft 2433 during movement.

[0137] The clamping assembly 243 also includes a dustproof tube 2436, which is sleeved on the outside of the retaining tube 2431. Semiconductor equipment has strict requirements on dust generation. All friction-related components of this device are housed within a dustproof tube 2436, which is held in place by pressure plates on both sides. Therefore, all dust generated by rotational friction falls inside the tube and does not disperse into the air, contaminating the wafer products.

[0138] To prevent dust and contaminants from entering the clamping assembly 243, a dustproof tube 2436 is added, which is fitted outside the baffle tube 2431 to ensure the cleanliness of the equipment during long-term operation.

[0139] Preferably, the upper end of the guide shaft 2433 is provided with a support portion 2437 extending horizontally, and one end of the pressure strip 2432 is provided with a connecting portion 2438. The connecting portion 2438 and the support portion 2437 are stacked together and fixed together by screws. Through the cooperative design of the support portion 2437 and the connecting portion 2438, the clamping component can achieve precise clamping force distribution, improve the stability of the wafer rack 244, and also enhance the overall structural robustness. Multiple elastic pads 2439 are installed inside the pressure strip 2432 to increase friction.

[0140] In use, the wafer carrier 244 is placed on the manual loading stage 241 and gently pushed to the positioning plate 242. The positioning plate 242 restricts the movement in the left and right directions. At this time, the pressure bar 2432 is raised and rotated to press down the wafer carrier 244 to achieve the purpose of fixing.

[0141] Edge finding module 26

[0142] likeFigure 7 As shown, the edge-finding module 26 is installed on one side of the transport module 25 and is mainly used to realize automatic edge-finding and positioning of the wafer. The design of this module ensures that the wafer can be accurately aligned during transport, providing an accurate positioning reference for subsequent processing and measurement operations.

[0143] Recognition Module 27

[0144] like Figure 7 As shown, the identification module 27 is installed on one side of the handling module 25 and is mainly used for optical character recognition (OCR) of the character codes on the back of the wafer. This module uses precise optical recognition technology to scan and interpret the character codes on the wafer surface, so as to facilitate tracking and identification in subsequent processing.

[0145] Wafer process module

[0146] The wafer process module 28 is mounted on one side of the transport module 25 and is mainly used for precise measurement of various geometric parameters of the wafer, including but not limited to: wafer flatness, warpage, thickness uniformity, and surface morphology. The wafer process module is existing technology and will not be described in detail here.

[0147] Wafer transport protection device 3

[0148] The wafer transfer protection device 3 is located on one side of the semiconductor equipment body 2 and is used to achieve automatic sealing and wafer picking. The wafer transfer protection device 3 includes an SMIF box 321, an SMIF transfer box 322, and a cover opening mechanism.

[0149] The SMIF box 321 is fixedly connected to the box body 21 by screws, and a sealing ring is used to seal the connection. The SMIF box 321 includes a box body (not shown in the figure) and a lid opening mechanism (not shown in the figure).

[0150] The SMIF transfer box 322 is used to transfer wafers between various wafer processing devices, providing a clean wafer storage environment and preventing wafer contamination during transfer. The SMIF transfer box 322 has a housing and an openable lid with locked and unlocked states. When the lid is locked, the housing and lid are fixed together, forming an inner cavity that is sealed. When the lid is unlocked, the housing can be separated from the door, allowing the inner cavity to communicate with a window. An opening mechanism is used to open the lid, allowing communication between the inner cavity and the window. As an example, the opening mechanism includes a sleeve that can extend and retract relative to the SMIF box 321, with a rear opening on the rear side of the sleeve. When the sleeve retracts, the housing and lid are sealed together; when the sleeve extends, it moves the lid upward, opening the lid and allowing communication between the rear opening on the sleeve and the window.

[0151] Appliance cabinet 4

[0152] Electrical cabinet 4 is installed at the rear of the equipment and is used to house the circuit boards, controllers, and other electronic components inside the equipment. The design of the electrical cabinet ensures that the electrical system of the equipment operates in a safe and convenient environment, while providing centralized management and maintenance space for electrical components.

[0153] The fully enclosed semiconductor process equipment described in this application employs a completely sealed environment to ensure that the wafer is not contaminated by external factors during the process and that the internal environment remains stable. Throughout the process, the system utilizes various automated control methods to achieve gas replacement, environmental monitoring, and automated transfer, thereby ensuring the efficiency, safety, and stability of the process.

[0154] 1. Start-up and cleaning of the internal chamber

[0155] After startup, the air inside chamber 21 is first purged to ensure that the internal environment of chamber 21 meets high cleanliness requirements. The purge process is accomplished by replacing the air inside chamber 21 with an inert gas (such as nitrogen or argon).

[0156] The specific method involves opening the air inlet valve to introduce inert gas. After being filtered by the air purification module 22 in the upper chamber 216, the inert gas flows to the lower chamber 217. During this process, the air purification module 22 applies air pressure to drive airflow circulation, causing the inert gas to mix with the air.

[0157] The mixed gas flows back to the upper cavity 216 through the return air duct 221, and then is discharged through the exhaust port, completing the entire air replacement process. Water and oxygen sensors and temperature and humidity sensors continuously monitor the internal environment to ensure that parameters such as temperature, humidity, and oxygen concentration reach the set values.

[0158] This replacement process effectively cleans the air inside the chamber 21 and adjusts the internal environment to a suitable inert gas environment, ensuring that subsequent operations are not contaminated.

[0159] 2. Internal environment monitoring and air pressure control

[0160] Once the internal environment reaches the set value, the exhaust and intake ports close, and the inert gas begins to circulate. At this time, the system continues to filter the gas through the air purification module 22 to maintain an oxygen-free environment inside the enclosure 21.

[0161] The micro differential pressure sensor monitors the air pressure inside the chamber 21 in real time. When the air pressure is detected to be too low, the system will automatically replenish the gas; when the air pressure is too high, the system will automatically exhaust the gas to maintain the air pressure balance.

[0162] The micro differential pressure sensor can accurately control the air pressure inside the housing 21, preventing excessively high or low air pressure from affecting the stability of the working environment, thereby ensuring the normal operation of the equipment.

[0163] 3. Material feeding and SMIF conveyor box 322 gas replacement

[0164] During the loading stage, the sealed SMIF transfer box 322 lid will be opened. At this time, the inside of the SMIF transfer box 322 is filled with air from the external environment, and it cannot be directly connected to the clean environment inside the housing 21.

[0165] The SMIF chamber 321 has an air inlet and an air outlet for gas replacement. When the system detects that the inert gas concentration inside the SMIF chamber 321 is insufficient, it will automatically open the air inlet to fill the SMIF chamber 321 with inert gas and exhaust the air through the air outlet, thus completing the air replacement inside the SMIF chamber 321.

[0166] When the gas concentration reaches the set standard, the system will automatically open the door inside the housing 21, so that the SMIF transfer box 322 can be connected to the clean interior of the housing 21.

[0167] The gas replacement function of the SMIF transfer box 322 ensures that the environment inside the SMIF box is always consistent with the environment inside the enclosure 21, thereby ensuring that the wafer is not subject to any external contamination.

[0168] 4. Wafer Removal and Identification

[0169] Once the SMIF transfer box 322 is connected to the housing 21, the robotic arm extends into the SMIF transfer box 322 to retrieve the wafer and delivers it to the edge finder 261 for edge positioning. The edge finder 261 uses precise positioning technology to identify the edges of the wafer, ensuring that the wafer can be correctly placed in subsequent processes.

[0170] Next, the robotic arm 252 delivers the wafer to the identification module 27, where the character code on the back of the wafer is quickly read by the optical recognition system to obtain the wafer's unique identification information.

[0171] By using edge-finding positioning and OCR character recognition, the precise positioning and unique identification of wafers are ensured throughout the entire production process, avoiding potential errors or confusion during processing.

[0172] 5. Wafer processing and process completion

[0173] After character recognition is completed, the robotic arm 252 places the wafer into the wafer process module 28 for subsequent processing, such as wafer fabrication or inspection. The processing is carried out in a completely enclosed environment to avoid any external contamination.

[0174] After the work is completed, the robotic arm 252 retrieves the processed wafer and places it back into the SMIF transfer box 322. The SMIF box is then closed, and the wafer is protected from contamination throughout the transport process by a sealed lid and inert gas.

[0175] The fully enclosed operation of the process ensures that the wafers maintain a high level of cleanliness during handling, transportation, and storage, avoiding any contamination or damage and improving product quality and production efficiency.

[0176] 6. Wafer Transportation and Safe Delivery

[0177] Finally, after being sealed, the SMIF transfer box 322 can be safely transported to other workstations. Because the entire process takes place in a completely enclosed environment, the wafer can be smoothly transferred from one workstation to another without contamination.

[0178] The sealing and inert gas protection features of the SMIF transport box 322 ensure the safe transport of wafers, effectively preventing damage or contamination during transport and improving the safety and reliability of the process.

[0179] The fully enclosed semiconductor process equipment described in this application ensures that the wafer remains uncontaminated throughout the entire process and maintains a stable, oxygen-free environment through a completely sealed environment design. Key technologies such as gas replacement, internal environment monitoring, gas replacement in the SMIF transfer box 322, and wafer positioning and identification fully guarantee the cleanliness of the wafer and the accuracy of the processing.

[0180] The fully enclosed semiconductor process equipment of this application has the following advantages:

[0181] 1. The entire process is closed, solving the problem of wafer oxidation or contamination.

[0182] This invention effectively avoids oxidation or contamination problems that may occur when wafers are exposed to air during transitions between different environments. By achieving a fully enclosed operating environment, the wafer is always in an oxygen-free, clean gas environment, eliminating adverse effects caused by external contaminants at the source and ensuring the high quality and stability of the wafer throughout the entire process.

[0183] 2. To avoid risks caused by environmental changes, optimize the production line layout.

[0184] Typically, equipment interfaces the output port of the EFEM (Equipment Front-End Module) with the input port of the wafer process module to handle wafer transfer. However, transitions between different environments, especially between clean and conventional environments, often introduce unknown contamination risks. This solution integrates the wafer process module with the EFEM and places them within the same sealed enclosure 21, ensuring the wafer remains in an oxygen-free environment throughout the entire process, thus avoiding potential external environmental impacts. Furthermore, this integrated design allows for a more compact and efficient production line layout, facilitating system installation, commissioning, and maintenance. It also reduces inter-device interaction and interface issues, improving overall efficiency.

[0185] 3. Compatible with 2-8 inch positioning card 242 fixing structure, flexibly adaptable to various wafer sizes.

[0186] This equipment is compatible with 2-8 inch wafer positioning cards 242, accommodating the needs of wafers of different sizes. The housing 21 houses a manual loading stage 241, allowing operation in a standard clean environment without the need for inert gases. The manual stage design eliminates the need for a complex inert gas system in daily use, reducing operating costs and lowering the barrier to entry. The stage securely holds the 2-8 inch wafer positioning cards 242, primarily through the stepped card structure and the fixing strip 2432, ensuring the stability of the positioning cards 242 and preventing wafer movement and misalignment during transport.

[0187] The embodiments described above are merely examples of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model.

Claims

1. A manual loading and unloading module for a fully enclosed semiconductor process equipment, characterized in that, include: Manual feeding platform; A positioning plate, fixed on the manual loading platform, is used to position the wafer caddy in the X and Y axis directions; The clamping assembly is fixed to the manual loading stage and is used to position the wafer rack in the Z-axis direction.

2. The manual loading and unloading module of the fully enclosed semiconductor process equipment according to claim 1, characterized in that, The positioning plate is symmetrically provided with several positioning steps on both sides along the X-axis, and the width of the positioning steps gradually increases along the insertion direction.

3. The manual loading and unloading module of the fully enclosed semiconductor process equipment according to claim 1, characterized in that, The clamping assembly includes: The baffle extends along the Z-axis and is fixed to the manual feeding platform; A clamping component includes a clamping strip and a guide shaft. The guide shaft extends along the Z-axis direction, with its lower end inserted into the stop tube, and is able to move freely between a clamping position and a releasing position. The clamping strip extends along a plane defined by the X-axis and Y-axis, with one end connected to the upper end of the guide shaft. An elastic component is used to apply a downward elastic force on the guide shaft.

4. The manual loading and unloading module of the fully enclosed semiconductor process equipment according to claim 3, characterized in that, The baffle tube is provided with a guide groove, which includes a horizontal section extending in the circumferential direction and a vertical section extending in the axial direction. The upper end of the vertical section is connected to one end of the horizontal section. The lower end of the guide shaft is provided with a sliding member, which can slide freely in the guide groove.

5. The manual loading and unloading module of the fully enclosed semiconductor process equipment according to claim 3, characterized in that, The upper end of the guide shaft is provided with a support portion extending in the horizontal direction, and one end of the pressure strip is provided with a connecting portion. The connecting portion and the support portion are stacked together and fixed together by screws.

6. The manual loading and unloading module of the fully enclosed semiconductor process equipment according to claim 3, characterized in that, The clamping element also includes multiple elastic pads, which are fixed to the lower surface of the clamping strip.

7. The manual loading and unloading module of the fully enclosed semiconductor process equipment according to claim 3, characterized in that, The clamping assembly also includes a linear bearing, which is disposed between the lower end of the guide shaft and the stop tube.

8. The manual loading and unloading module of the fully enclosed semiconductor process equipment according to claim 3, characterized in that, The clamping assembly also includes a dustproof tube, which is sleeved on the outside of the retaining tube.

9. The manual loading and unloading module of the fully enclosed semiconductor process equipment according to any one of claims 1 to 8, characterized in that, The manual feeding platform includes a lower support plate, an upper support plate, and a vertical support plate. The upper support plate and the lower support plate are arranged vertically, and the vertical support plate is vertically arranged between the upper support plate and the lower support plate.

10. A fully enclosed semiconductor process equipment, characterized in that, Includes the manual loading and unloading module of a fully enclosed semiconductor process equipment as described in any one of claims 1 to 9.

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