System for monitoring and controlling processing of microelectronic substrates

Abstract

The present disclosure relates to a system for monitoring and controlling processing of microelectronic substrates. The system includes: a housing having sealed doors, each sealed door having a front side and a back side; one or more wet parts cabinets configured on the front side of each sealed door, wherein each wet parts cabinet is divided into a plurality of clusters and occupies one or more chemical workstations, the chemical workstations configured to perform one or more analytical applications; one or more electrical cabinets configured on the back side of each sealed door, wherein each electrical cabinet is configured to include electrical components for controlling operation of the workstations; one or more chemical cabinets for storing and providing chemicals required by the analytical applications run through the workstations; and an interface for connecting with one or more computing devices, wherein the analytical applications can be monitored and controlled through the computing devices, wherein a negative pressure is maintained in the wet parts cabinets and an overpressure is maintained in the electrical cabinets. The system has the advantage of occupying less footprint.

Description

[0001] This application is a divisional application of Chinese Patent Application No. 202420642346.0, filed on March 29, 2024, entitled "System for Monitoring and Controlling Processing of Microelectronic Substrates", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This document discloses a system for controlling the fabrication of microelectronic substrates. Specifically, it describes a system for monitoring and controlling the processing of substrates using electrolysis and electroless techniques. Specifically, it is intended for application in the semiconductor industry for analyzing / controlling the concentration of components in a processing bath. Background Technology

[0003] Microelectronic devices are manufactured by depositing and removing multiple layers of material on a substrate such as a silicon wafer to produce a large number of individual devices. For example, layers of photoresist, conductive material, and dielectric material are deposited, patterned, etched, planarized, etc., to form features in and / or on the substrate. These features are arranged to form integrated circuits (ICs), MEMS, and other microelectronic structures.

[0004] Wet chemical processing is commonly used to form features on microelectronic substrates. Wet chemical processing is typically performed in wet chemical processing tools that have multiple processing chambers for a combination of cleaning, etching, electrochemical deposition, and rinsing. Electrochemical deposition processes include electrolytic deposition and electroless deposition; in electrolytic deposition, an external current is applied to the substrate, while in electroless deposition, no external current is supplied to the substrate.

[0005] This typically includes the ability to monitor the chemical composition or chemical activity of the electrolyte used in one of the aforementioned processes. This is done to control the concentration of the electrolyte's chemical composition in such a way that consistent processing of multiple substrates is maintained throughout the electrolyte's lifespan. Typically, analytical techniques must be specifically developed for each component in an electrolyte, targeting specific combinations and concentrations of components present in that particular electrolyte. Methods for monitoring electrolyte composition particularly involve electroanalytical methods. Titration (also known as titration and volumetric analysis) is a very common absolute method for quantitative chemical analysis, determining the concentration of identified / known substances with very high precision. Electrochemical analysis utilizes potential / current to reduce / electroplate and oxidize / strip metal components onto / from a rotating disk electrode (RDE). Absorption spectrophotometers utilize the different optical characteristics of different chemical substances. By transmitting light through a sample and analyzing the transmission intensity over a wide wavelength range, the concentration of a specific substance can be determined. High-performance liquid chromatography (HPLC) works by separating and detecting components in a single tank. It analyzes leachates in organic additives, complexing agents, decomposition products, and photoresist components.

[0006] Traditionally, separate analytical methods are used to represent the concentration of each known component in an electrolyte. Designing analytical techniques or methods for each component of an electrolyte using electroanalysis, HPLC, titration, NIR spectroscopy, etc., can be time-consuming and expensive. Furthermore, some commercial additives contain two or more components, which may be impossible to separate if the chemical types are not known beforehand. Monitoring each chemical component of these electrolytes can be complex because various interactions can occur between the components as their respective concentrations change and the electrolyte ages. Electrolyte aging can lead to the decomposition of one or more of its components due to oxidative, reducing, or catalytic activity, or it may involve interactions with hardware or substrates in contact with the electrolyte during its lifetime, or other contamination.

[0007] Therefore, there is a need for an apparatus or system that allows for the monitoring and control of electrolyte composition during high-volume manufacturing (HVM), in cleanroom environments, and within a single structure. Furthermore, this apparatus or system should be adaptable to various analytical techniques. The utility model described herein addresses these needs. Utility Model Content

[0008] In one aspect of this invention, a system for monitoring and controlling the quality of solutions used to process microelectronic substrates is disclosed. This system is modular, flexible, and scalable, and is configured to connect with similar systems to form a larger system. The system allows comprehensive access to data collected and generated through measurement and analysis methods. This enables better characterization, troubleshooting, and process improvement.

[0009] In one aspect of this invention, the system includes a housing with sealed doors, each door having a front side and a rear side. The system also includes one or more wet parts cabinets disposed on the front side of each sealed door, wherein each wet parts cabinet is divided into multiple clusters and occupies one or more chemical workstations configured to perform one or more analytical applications. The system further includes one or more electrical cabinets disposed on the rear side of each sealed door, wherein each electrical cabinet is configured to include electrical components for controlling the operation of the workstations. The system also includes one or more chemical cabinets for storing and providing chemicals required for the analytical applications run through the workstations, and interfaces for connecting to one or more computing devices, wherein the analytical applications can be monitored and controlled via the computing devices.

[0010] Appropriately, the system is configured to maintain negative pressure in the wet parts cabinet and overpressure in the electrical cabinet.

[0011] The system can flexibly increase or decrease the number of clusters it occupies, as appropriate.

[0012] Appropriately, the system is modular in nature, and the chemical workstation can be installed as a modular workstation for performing different analytical methods.

[0013] Appropriately, the system is configured to connect with similar systems to form a larger system for performing electrical analysis applications.

[0014] Appropriately, a wet parts cabinet includes a Lego-like structure on which standard chemical and analytical modules are mounted.

[0015] Appropriately, the interface may include a wired interface, a wireless interface, or a combination of both.

[0016] Appropriately, the execution process and analysis results of the analytics application running on the workstation can be displayed on the screen of the computing device.

[0017] Appropriately, errors in the execution of analytical applications running on workstations can be corrected using computing devices.

[0018] Appropriately, the workstation may include one or more of the following: titration workstation, electrochemical analysis-CVS workstation, high-performance liquid chromatography (HPLC) workstation, and spectrophotometer workstation.

[0019] According to another aspect of the present invention, the system includes a memory unit configured to store the configuration and parameters of an analysis application running on a workstation.

[0020] According to another aspect of the present invention, the system includes a capacity top tray configured to provide support to the upper structure of the modular system, which includes a wet parts cabinet and an electrical cabinet.

[0021] According to another aspect of the present invention, the system includes a capacity bottom tray configured to provide support to the bottom structure of the system, including a chemical cabinet.

[0022] Appropriately, the electrical cabinet is configured to control the power supplied to the workstations to ensure the controlled execution of applications. The electrical cabinet is also configured to provide interconnectivity between workstations used for performing analytical applications.

[0023] Appropriately, each sealed door includes a sealing strip on its outer edge to seal the wet parts cabinet from the electrical cabinet when the sealed door is closed.

[0024] Appropriately, the sealing strip is configured to maintain different pressure conditions in the wet parts cabinet and the corresponding electrical cabinet. The sealing strip maintains negative pressure in the wet parts cabinet to prevent chemical leakage into the electrical cabinet and from the system. The sealing strip also maintains overpressure in the electrical cabinet to prevent the intrusion of chemical vapors and dust.

[0025] Appropriately, overvoltage is maintained in the electrical cabinet by means of a fan located on the upper side of the system.

[0026] According to another aspect of the present invention, the system includes a ventilation and exhaust device for drawing air out of wet parts cabinets and chemical cabinets.

[0027] Appropriately, the housing includes a door that allows the operator to observe the exterior of the wet parts cabinet, which is transparent or translucent, and the door is designed as a foldable double-section door to reduce the area covered when open.

[0028] According to another aspect of the present invention, the system includes a pressure sensor configured to detect pressure values ​​in a wet parts cabinet and a chemical cabinet. The system also includes an operation indicator that displays the pressure sensor values ​​in a color-coded format.

[0029] According to another aspect of this invention, a pressure control system is also included in the wet parts cabinet and the chemical cabinet.

[0030] According to another aspect of the present invention, the system includes a leak sensor configured to detect leakage of liquid from a wet parts cabinet, and displays the leakage status in a color-coded format via an optical indicator on the leak sensor.

[0031] Appropriately, chemical cabinets are provided with retractable shelves to facilitate convenient loading / unloading of chemicals. Attached Figure Description

[0032] To better understand the implementation methods and to show how they can be implemented, reference will now be made to the accompanying drawings purely by way of example.

[0033] Referring now specifically to the details of the accompanying drawings, it is emphasized that the details shown are by way of example only and for the purpose of illustrative discussion of the selected embodiments, and are presented to provide what is considered the most useful and readily understood description of the principles and concepts. In this regard, no attempt is made to show structural details in more detail than necessary for a basic understanding; the description, taken in conjunction with the drawings, enables those skilled in the art to understand how the various alternative embodiments can be put into practice. In the drawings: Figure 1 A front view of a system 100 configured to monitor and control electrochemical technology according to one aspect of the present invention is shown; Figure 2A The external dimensions of a “dual cluster” device 200a according to an exemplary embodiment of the present invention are shown; Figure 2B and Figure 2C Schematic diagrams of dual-cluster devices 200b and 200c according to other aspects of the present invention are shown; Figure 2DA schematic diagram of a single cluster device 200d according to another aspect of the present invention is shown; Figure 3A An open structural diagram of a dual-cluster process control device including a wet parts cabinet configuration according to an embodiment of the present invention is shown. Figure 3B An open view of a dual-cluster process control device with retractable shelves is shown. Figure 4 A diagram showing the opening structure of a process control device with an open modular door is provided. Figure 5A A schematic front view of a process control device 500 showing various structural components is shown; Figure 5B A schematic top view of the process control equipment displayed in the electrical cabinet is shown; Figure 6A An open structural diagram of a process control device including a single-cluster wet parts cabinet configuration according to an embodiment of the present invention is shown. Figure 6B A schematic diagram of a dual-cluster wet parts cabinet configuration according to another embodiment of the present invention is shown; Figure 7 An open structural diagram of a process control device including a single cluster wet parts cabinet configuration according to another embodiment of the present invention is shown. Figure 8 The electrical cabinet 800 behind the module door of the process control equipment is shown; Figure 9 A multi-slot wafer-level package (WLP) board setup connected to a dual-cluster system according to an embodiment of the present invention is shown; Figure 10 The operation indicators on the process control equipment are shown; Figure 11 and Figure 12 A leak sensor is shown in a wet parts cabinet; Figure 13 The fan is shown beneath a cover on top of the device frame; Figure 14A , Figure 14B and Figure 14C The titration workstation, electrochemical analysis CVS workstation, and high-performance liquid chromatography (HPLC) workstation are shown respectively. Figure 15 A barcode / QR code reader on a process control device is shown; and Figure 16 An exemplary system for implementing various aspects of the present invention is shown. Detailed Implementation

[0034] This disclosure relates to an apparatus or system capable of monitoring and controlling the composition of an electrolyte solution within a single structure. The system is flexible, scalable, and tailored to the application. It includes a Lego-like structure that allows for the mounting of different chemical analysis modules. Various metrology units can be mounted as modular workstations for performing different analytical methods. Each workstation can perform defined tasks such as analysis, sampling, standard creation, etc. To simplify maintenance, these workstations can be equipped with the same equipment and components as often as possible. The system can be a highly customizable wafer-level package (WLP) platform supporting multiple metals.

[0035] In a particular implementation of the system, the system can allow process control via liquid replenishment, solid replenishment (direct metal replenishment (DMR)), discharge and feed to keep decomposition products and / or impurities below desired ranges, and can be used for the discharge and replenishment of ECP chemicals.

[0036] In other embodiments of the system, the system may include software for storing workstation configurations and parameters. The workstation process can be synchronized according to applications. The software can also independently update, repair, and maintain the workstation without affecting the operation of other modules.

[0037] Detailed embodiments of the present invention are disclosed herein as needed; however, it should be understood that the disclosed embodiments are merely examples of the present invention and may be implemented in various and alternative forms. These figures are not necessarily to scale; some features may be exaggerated or minimized to show details of specific components. Therefore, the specific structural and functional details disclosed herein should not be construed as limiting, but merely as a representative basis for teaching those skilled in the art to employ the present invention in different ways.

[0038] It should be noted that the systems and methods disclosed herein may be applied in ways other than the details of the construction and arrangement of the components or methods described in the specification or shown in the drawings and examples. The systems and methods disclosed herein may be implemented in other ways or with various techniques.

[0039] In the practice or testing of the embodiments of this disclosure, alternative methods and materials similar to or equivalent to those described herein may be used. However, the specific methods and materials described herein are for illustrative purposes only. These materials, methods, and examples are not intended to be limiting. Therefore, various procedures or components may be appropriately omitted, substituted, or added in various embodiments. For example, these methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Furthermore, aspects and components described with respect to certain embodiments may be combined in various other embodiments.

[0040] Now for reference Figure 1 The diagram shows a front view of a system 100 configured to monitor and control electrochemical techniques according to one aspect of the present invention. System 100 includes a process control device having a housing / frame 101 divided into multiple compartments / cabinets, and comprising (analytical) clusters (in this example, a dual-cluster configuration). Housing 101 has two transparent or semi-transparent external protective doors 102 and 102', which can be designed as foldable double-section doors (102a, 102b, 102'a, and 102'b) to reduce the area covered when open. The protective doors are preferably not sealed, allowing limited air circulation from the environment. Each cluster is configured to occupy multiple modular workstations for performing different analytical methods, which will be further described below. Housing 101 is flexible and scalable and can occupy fewer or more analytical clusters (additional clusters). The protective doors (102a, 102b, 102'a, and 102'b) can be removed from their hinges for maintenance / repair procedures. The protective doors (102a, 102b, 102'a and 102'b) can be set by turning on the detector (switch), which completely or partially shuts down system operation for safety reasons.

[0041] Figure 2A The external dimensions of the housing of a dual-cluster device 200a according to an exemplary embodiment of the present invention are shown. The device 200a is shown with structural dimensions of 1.27 × 0.56 meters. Figure 2B and Figure 2C Schematic diagrams of dual cluster devices 200b and 200c with openable external protective doors according to other aspects of the present invention are shown. Figure 2D A schematic diagram of a single-cluster device 200d according to another aspect of the present invention is shown. It should be clearly understood that the above-described dimensions and structural components are exemplary in nature and should not limit the scope of the present invention. Device 101 is flexible to occupy any desired number of clusters depending on the application.

[0042] See again Figure 1 Device 101 is connected to human-machine interface 103 via connection medium 104. HM interface 103 can be a communication device, such as a personal computer, laptop, mobile phone, tablet, paging device, etc. Communication device 103 can be connected to process control device 101 via wired or wireless connection medium 104. Wired medium can include Ethernet cable, fiber optic cable, etc. Wireless medium can include one or more of the following: Internet, Bluetooth network, wired LAN, wireless LAN, WiFi network, Zigbee network, Z-Wave network, or Ethernet. HM interface 103 can be placed near process control device 101, such as... Figure 1As shown in the diagram. Alternatively, the HM interface 103 can be placed remotely from the process control device 101. The HM interface can be connected to more than one process control device, allowing users to control different process control devices through the same communication device. In another embodiment, two or more HM interfaces can be connected to a single process control device, enabling multiple operators to monitor and control the operation of the process control device.

[0043] Data from various electrochemical and analytical processes performed in the workstations (their chemical composition and concentration, expected and actual ranges, operating conditions including errors and malfunctions, replenishment requirements, process times (elapsed and remaining time), analytical results, etc.) are transmitted from process control device 101 to communication device 103. Communication device 103 can be configured to include a display screen that allows the operator full access to the data collected and generated by the measurement and analytical methods running in the various workstations of process control device 101. For example, the screen can provide information about the liquids used in the electrochemical processes, including their current levels, lower and upper threshold limits, deviations from expected ranges, contamination levels, etc. Communication device 103 can also control the process directly via commands from communication device 103 or by accessing the workstations of process control device 101. Communication device 103 can also enable feature identification, troubleshooting, and process improvement.

[0044] According to one aspect of this invention, system 100 offers the advantage of occupying less coverage area because it can be mounted close to a wall and is fully accessible from the front during operation. All internal compartments / modules of device 101 are accessible from the front. The rear of device 101 can be closed after assembly or repair at the workstation. The device can also be maintained or inspected from the front, providing convenient access for the operator.

[0045] refer to Figure 3AThe diagram 300a shows an open structure of a process control device 301, comprising a dual-cluster or dual-wet parts cabinet configuration, according to an embodiment of the present invention. Device 301 includes two (analytical) clusters formed by modular doors 302a and 302b. Modular doors 302a and 302b include frames divided into multiple sub-clusters 303 having standard dimensions (e.g., 10 × 10 cm). Specific metering or operating units may occupy areas of one or more of these sub-clusters 303. These metering units may be configured as workstations “separate” from standard sub-modules, which have the dimensions of one or more sub-clusters and can be assembled onto the frames of modular doors 302a and 302b. In a particular embodiment of the present invention, the weight of each individual sub-cluster module is limited to 1 kg—the total weight of the metering modules does not exceed, for example, 60 kg for a 6 × 10 cluster (to maintain the stable center of gravity of the entire system). Empty sub-clusters 304 are covered by removable panels made of chemically resistant materials (e.g., plastic), assembled onto the frames of the modular doors, and sealed.

[0046] refer to Figure 4 The diagram 400 shows the opening structure of the process control device 401 with an open module door 402. Behind the module door 402 of the wet parts cabinet—the compartment containing the chemical modules is located in the electrical cabinet 407, which mainly includes low-voltage electronic / electrical modules (controllers, etc.)—the low-voltage modules are shown as partially assembled.

[0047] The module door 402 has a (rubber / silicone) sealing strip 409 on its outer edge, which provides a seal for the wet parts cabinet and electrical cabinet when the module door 402 is closed.

[0048] Seal 409 prevents chemical contamination of electronic / electrical modules by creating different pressure conditions in the two compartments—underpressure (relative to ambient) in the wet parts cabinet and overpressure in the electrical cabinet.

[0049] Electrical cabinet 407 includes low-voltage electronic / electrical modules (controllers, etc.), electrical connectors in the form of copper or fiber optic cables, voltage / current stabilizers, regulators, protection circuits, switches, temperature and pressure controllers, etc. Electrical cabinet 407 is configured to interconnect various clusters of workstations. Electrical cabinet 407 also provides interconnectivity between different workstations used to perform applications. Electrical cabinet 407 controls the power supplied to the various workstations to ensure the controlled execution of the application.

[0050] The wet parts cabinet preferably contains a negative pressure relative to the environment to prevent chemical leaks into the electrical cabinet and from the system into the environment. During operation, operators are protected from chemical leaks by a monitored protective door. As shown in Figure 5, in the event of a leak, the liquid is collected in a monitored secondary container in chemical cabinet 503 for further evacuation.

[0051] Air is continuously drawn out of the wet parts cabinet and replaced by outside air through the equipment's exhaust system. (Reference) Figure 5A An exhaust device (also known as a ventilation exhaust device, exhaust ventilation device, or ventilation device) can be installed at the top of the equipment 500. 506 Figure 10 The arrows indicate the side and bottom locations of the exhaust device. The exhaust device of this system can be connected to the FAB's exhaust system. Exhaust ventilation device 506 is connected to the wet parts cabinet 501 and the chemical cabinet 503. In a preferred embodiment, the air in these cabinets is exchanged at least three times per minute. The pressure in the exhaust pipe of ventilation device 506 is detected by a pressure sensor. In a particular embodiment, it is typically maintained at 75-120 m at the sensor. 3 The pressure is 60-150 Pascals / h. If the pressure difference between the ambient pressure and the pressure in the exhaust pipe of the ventilation device 506 exceeds the range, the pressure sensor detects it and displays it on the operation indicator 505.

[0052] Figure 6B A schematic diagram of a dual-cluster or dual-wet parts cabinet configuration with 6×12 clusters 602 is shown. Figure 6A and Figure 7 Open structure diagrams 600A and 700 are shown respectively of process control equipment including a single wet parts cabinet configuration with 6×12 clusters 601 and 701 according to other embodiments of the present invention.

[0053] Workstations can be clustered across various sub-clusters to perform different electrochemical and analytical processes, such as Figure 14A , Figure 14B and Figure 14C As shown in the diagram. Each workstation performs a defined task, such as analysis, sampling, standard creation, etc., depending on the application. For example, a titration workstation 1400A can be formed by clusters on modular gates. Titration is a very common absolute method for quantitative chemical analysis, determining the concentration of an identified / known substance with very high precision. Various titration workstations can include acid-base titration workstations, photometric titration (PHT) workstations, stability index workstations, reduction / oxidation workstations, etc.

[0054] In an alternative implementation, the electrochemical analysis-CVS workstation 1400B can be formed by clusters on module gates. Electrochemical analysis techniques utilize potential / current to reduce / electroplate and oxidize / strip metallic components onto / from a rotating disk electrode (RDE). The current-voltage curves are measured and evaluated to obtain analytical results. Various electrochemical analysis workstations may include accelerator / leveler workstations, suppressor workstations, inorganic stability (Pb) workstations, etc.

[0055] In another embodiment, the high-performance liquid chromatography (HPLC) workstation 1400C can be formed by clusters on modular gates. HPLC operates by separating and detecting components in individual tanks. It analyzes organic additives, complexing agents, decomposition products, and leachates from photoresists.

[0056] During operation, depending on the respective workstation, liquids (chemicals, water, etc.) are moved into / out of the wet parts cabinet. Liquids may be temporarily stored in containers and mixed, heated, or cooled as required. All liquids can be monitored and analyzed via various sensors located within the process control equipment. To simplify maintenance, different workstations can be equipped with the same standard equipment and components as frequently as possible. The process control equipment may also include software for executing, controlling, and modifying processes on the process control equipment. Equipment configuration / parameters are stored in the process control equipment's memory. The software also synchronizes sequences within the cluster and across different workstations. The software also allows operators to add, delete, and modify sequences executed in workstations. Furthermore, the software allows operators to add, delete, and modify applications executed in workstations.

[0057] See again Figure 5A The diagram illustrates a process control device 500 displaying various structural components. A wet parts cabinet 501, located behind the front door, includes chemical modules (workstations), piping, etc., assembled on a frame divided into standard sub-clusters. The device 500 includes a chemical cabinet 503 that stores various chemicals required for different processes running and / or replenishing via the workstations. The chemical cabinet 503 supplies chemicals to the workstations according to the required applications and schedules. As shown in Figure 3, the chemical cabinet 503 stores the required chemicals in holding devices (e.g., containers, bottles). These holding devices can be any suitable material, including but not limited to plastics, glass, steel, or any other metal that will not react with or contaminate the stored chemicals. Preferably, to facilitate convenient loading / unloading, the chemical cabinet is provided as retractable shelves 306 and 307, which allow for convenient access and organization, such as... Figure 3B As shown in the image.

[0058] Figure 8 An electrical cabinet 800 behind the module door of a process control device is shown. The electrical cabinet 800 includes low-voltage electronic / electrical modules (controllers, etc.), electrical connectors in the form of copper or fiber optic cables, voltage / current stabilizers, regulators, protection circuits, switches, temperature and pressure controllers, etc. The electrical cabinet 800 is configured to interconnect various clusters of workstations. The electrical cabinet 800 also provides interconnectivity between different workstations used to perform applications. The electrical cabinet 800 controls the power supplied to the various workstations to ensure the controlled execution of the application.

[0059] Figure 9A multi-slot wafer-level package (WLP) board setup 901 connected to a dual-cluster system 902 is shown. The WLP board setup 901 may include various tanks for performing sampling and optionally supplementing processes with system 902. Setup 901 may include pre-wetting tanks, rinsing tanks, and tin-silver, nickel, copper, and gold plating units (tanks). System 900 enables fully automated process control, analysis, and integrated dosimetry. System 900 also enables the operation of four STDs and multiple metals with slipflow on the same board.

[0060] refer to Figure 10 Exhaust pressure information is displayed on an operation indicator 1001, which can display this information in a color-coded format. For example, exhaust pressure values ​​within the range are displayed in "green" 1002, while exhaust pressure values ​​outside the range are displayed in "red" 1003. Negative pressure monitoring is performed by a pressure sensor located in the exhaust pipe.

[0061] Now for reference Figure 11 The image shows a leak sensor 1101 in a wet parts cabinet. The leak sensor 1101 detects leaks of liquid (chemicals, water, etc.) from the wet parts cabinet. A "green" optical signal is displayed as long as the leak sensor 1101 does not detect liquid. If the leak sensor 1101 responds, as shown... Figure 12 As shown, the optical signal is "red". When the "red" signal is displayed, one or more of the following action points may be executed automatically; The actuator circuit shuts down immediately.

[0062] The wet parts cabinet workstation does not pump any chemicals.

[0063] The external supply line for filling bulk containers is shut off.

[0064] Abort all current analysis and supplementary tasks.

[0065] The traffic light turned red, and the horn sounded.

[0066] The signal output notifies an external receiver that the process control equipment is no longer ready for use. The signal output can be displayed on a connected communication device.

[0067] In a particular embodiment of this invention, a fan may be provided on the equipment to generate overvoltage in the electrical cabinet. Figure 13The location 1301 of the fan is shown under a cover on top of the frame of device 1300. The fan provides overpressure in the electrical cabinet to prevent the intrusion of chemical vapors / dust. The fan's rotational speed can be displayed on the device 1300 screen or the communication equipment screen, or on a separate indicator. A malfunction in the fan can also be displayed on the device 1300 or communication equipment screen or on an alarm indicator light. A protective cover prevents contact with the operating fan. CDA pressure control (detector / control electronics) can be located in the cabinet. In certain embodiments of this system, the system can allow process control through various steps, including but not limited to liquid replenishment, solid replenishment (direct metal replenishment (DMR)), discharge and feed, to keep decomposition products and / or impurities below desired levels, as well as the discharge and replenishment of ECP chemicals.

[0068] Process control equipment may include, for example Figure 15 The barcode / QR code reader 1501 shown identifies each chemical container before connecting the device to an analytical and / or dosing system. The chemicals may be used for analytical or replenishment purposes. The status of the chemical containers can be displayed on the screen 1502 of the communication device. The expiration date of each chemical can be read and stored in a chemical manager, which can also be displayed on the screen 1502 of the communication device. The system may also include minimum and sub-minimum level sensors for each chemical container.

[0069] In the case of replenishment, the desired replenishment amount of chemicals is correctly determined to achieve the target concentration in the tank. Liquid and solid replenishment (Direct Metal Replenishment (DMR)) is performed based on ampere time, product-wafer throughput, elapsed time, and analytical results. Discharge and feed are performed to keep decomposed products and / or impurities below the desired range. It can be performed, like replenishment, based on ampere time, product-wafer throughput, elapsed time, and analytical results. Discharge and replenishment of ECP chemicals (low-alpha solder, copper, nickel) are also performed based on ampere time, product-wafer throughput, elapsed time, and analytical results.

[0070] Figure 16An exemplary system 1600 for implementing various aspects of the present invention is shown. System 1600 includes a data processor 1602, a system memory 1604, and a system bus 1616. The system bus 1616 couples system components, including but not limited to the system memory 1604, to the data processor 1602. The data processor 1602 can be any of a variety of available processors. The data processor 1602 refers to any integrated circuit or other electronic device (or collection of devices) capable of performing operations on at least one instruction, including but not limited to Reduced Instruction Set Computing (RISC) processors, CISC microprocessors, microcontroller units (MCUs), CISC-based central processing units (CPUs), and digital signal processors (DSPs). Furthermore, various functional aspects of the data processor 1602 can be implemented individually as software or firmware associated with the processor. Dual microprocessor and other multiprocessor architectures can also be used as the data processor 1602.

[0071] The system bus 1616 can be any of several types of bus architectures, including a memory bus or memory controller, a peripheral bus or external bus, and / or a local bus using any of the various available bus architectures known to those skilled in the art.

[0072] System memory 1604 may include computer-readable storage media, including volatile and non-volatile memory. Non-volatile memory stores the Basic Input / Output System (BIOS), which contains basic routines for transferring information between elements within system 1600. Non-volatile memory may include, but is not limited to, read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory includes random access memory (RAM) used as external cache memory. RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), SynchLink™ DRAM (SLDRAM), Rambus® direct RAM (RDRAM), direct Rambus® dynamic RAM (DRDRAM), and Rambus® dynamic RAM (RDRAM).

[0073] System memory 1604 includes operating system 1606, which performs functions such as managing system resources of system 1600, establishing user interfaces, and executing and providing services to application software. System applications 1608, modules 1610, and data 1612 provide various functions to system 1600.

[0074] System 1600 also includes disk storage 1614. Disk storage 1614 includes, but is not limited to, devices such as disk drives, floppy disk drives, magnetic tape drives, Jaz drives, Zip drives, LS-100 drives, flash memory cards, or memory sticks. Furthermore, disk storage 1614 may include storage media, either independently or in combination with other storage media, including, but not limited to, optical disc drives, such as optical disc ROM devices (CD-ROM), CD recordable drives (CD-R drives), CD rewritable drives (CD-RW drives), or digital universal disc ROM drives (DVD-ROM).

[0075] Users input commands or information into system 1600 through input device 1624. Input device 1624 includes, but is not limited to, pointing devices (such as mice, trackballs, styluses, etc.), keyboards, microphones, joysticks, satellite antennas, scanners, TV tuner cards, digital cameras, digital camcorders, webcams, etc. Input device 1624 is connected to data processor 1602 via interface port 1622 through system bus 1616. For example, interface port 1622 includes serial ports, parallel ports, game ports, and universal serial buses (USB).

[0076] Output device 1620 (such as a monitor, speaker, and printer) is used to provide output from data processor 1602 to a user. As another example, a USB port can be used as input device 1624 to provide input to system 1600 and output information from system 1600 to output device 1620. Output device 1620 is connected to data processor 1602 via system bus 1616 through output adapter 1618. For example, output adapter 1632 may include a video card and a sound card, which provide a means of connection between output device 1620 and system bus 1616.

[0077] System 1600 can communicate with remote communication device 1628 to exchange information. Remote communication device 1628 can be a personal computer, server, router, network PC, workstation, microprocessor-based device, mobile phone, laptop, tablet computer, paging device, peer-to-peer device, or other public network node, etc.

[0078] Network interface 1626 includes wired and / or wireless communication networks, such as local area networks (LANs) and wide area networks (WANs). LAN technologies include Fiber Distributed Data Interface (FDDI), Copper Distributed Data Interface (CDDI), Ethernet, Token Ring, etc. WAN technologies include, but are not limited to, point-to-point links, circuit-switched networks such as Integrated Services Digital Network (ISDN) and its variants, packet-switched networks, and Digital Subscriber Line (DSL).

[0079] While preferred embodiments and advantages of the present invention have been disclosed in the above detailed description, the present invention is not limited thereto, but is limited to the scope of the appended claims.

[0080] As will be apparent to those skilled in the art, the present invention can be readily produced in other specific forms without departing from its essential characteristics. Therefore, this embodiment is to be considered merely illustrative and not restrictive, and the scope of the invention is indicated by the claims rather than the foregoing description, and thus all variations thereof are intended to be included therein.

Claims

1. A system for monitoring and controlling the processing of microelectronic substrates, characterized in that, The system includes: The housing has a modular door and two external protective doors, each of which has a front side and a rear side; One or more wet parts cabinets are disposed between the front side of each of the module doors and the external protective door, wherein each of the wet parts cabinets includes a cluster of multiple chemical workstations configured to perform one or more analytical applications; One or more electrical cabinets are disposed behind each of the module doors, wherein each of the electrical cabinets is configured to include electrical components for controlling the operation of the workstation; One or more chemical cabinets for storing and supplying chemicals required for analytical applications run through the workstation; and An interface for connecting to one or more computing devices, wherein the analytics application can be monitored and controlled via the computing devices, and Negative pressure is maintained in the wet parts cabinet and overpressure is maintained in the electrical cabinet.

2. The system for monitoring and controlling the processing of microelectronic substrates according to claim 1, characterized in that, The system is modular, and the chemical workstation can be installed as a modular workstation for performing different electrochemical applications.

3. The system for monitoring and controlling the processing of microelectronic substrates according to claim 1, characterized in that, The system is configured to connect with similar systems to form a larger system for performing the analytical applications.

4. The system for monitoring and controlling the processing of microelectronic substrates according to claim 1, characterized in that, The wet parts cabinet includes a Lego-like structure with chemical and analytical modules installed.

5. The system for monitoring and controlling the processing of microelectronic substrates according to claim 1, characterized in that, The interface includes a wired interface, a wireless interface, or a combination of the wired interface and the wireless interface.

6. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, The execution process and analysis results of the analysis application running on the workstation can be displayed on the screen of the computing device.

7. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, The workstation includes one or more of the following: titration workstation, electrochemical analysis-CVS workstation, high-performance liquid chromatography (HPLC) workstation, and spectrophotometer workstation.

8. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, It also includes a memory unit configured to store the configuration and parameters of the analytics application running through the workstation.

9. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, It also includes a capacity bottom tray configured to provide support to the bottom structure of the system, including the chemical cabinet.

10. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, The electrical cabinet is configured to control the power supplied to the workstation to ensure controlled execution of the application.

11. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, The electrical cabinet is also configured to provide interconnectivity between the workstations used to perform the analytical applications.

12. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, Each of the module doors includes a sealing strip on its outer edge for sealing the wet parts cabinet to the electrical cabinet when the module door is closed.

13. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 12, characterized in that, The negative pressure is maintained in the wet parts cabinet to prevent chemicals from leaking into the electrical cabinet and from the system.

14. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 12, characterized in that, The overpressure is maintained in the electrical cabinet to prevent the intrusion of chemical vapors and / or dust.

15. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 14, characterized in that, The overvoltage is maintained in the electrical cabinet by a fan located on the upper side of the system.

16. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, It also includes a ventilation and exhaust system for drawing air out of the wet parts cabinet and the chemical cabinet.

17. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, The two external protective doors are transparent or semi-transparent for the operator to observe the wet parts cabinet.

18. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 17, characterized in that, The two external protective doors are designed as foldable double doors to reduce the area covered when opened.

19. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, It also includes a pressure sensor configured to detect pressure values ​​in the wet parts cabinet and the chemical cabinet.

20. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 19, characterized in that, It also includes an operation indicator for displaying pressure sensor values ​​in a color-coded format.

21. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, It also includes the pressure control system in the wet parts cabinet and the chemical cabinet.

22. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, The wet parts cabinet includes a leak sensor configured to detect leaks of liquid from the wet parts cabinet.

23. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 22, characterized in that, The leakage status is displayed in a color-coded format by an optical indicator on the leakage sensor.

24. The system for monitoring and controlling the processing of a microelectronic substrate according to claim 1, characterized in that, The chemical cabinet is configured as a retractable shelf to facilitate convenient loading and / or unloading of the chemicals.

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