Semiconductor chip substrate automatic detection device

Abstract

The utility model relates to a kind of semiconductor chip substrate automatic detection device, including box, the feeding mechanism being located in box, detection mechanism;Feeding mechanism includes the rack with discharge port on one side, the load plate moving up and down in the front of discharge port, the first drive part of driving load plate, first clamping piece for being used to clamp the substrate to be measured in rack to load plate and slide on load plate front and back, the second drive part of driving first clamping piece;Detection mechanism includes the slide way being provided along horizontal direction and having first and second sections, for moving substrate to be measured from load plate to first section and moving mechanism, the second clamping piece for being used to clamp substrate to be measured to drive it to slide on slide way and slide between first and second sections, the third drive part of driving second clamping piece, detection sensor being arranged at second section.This utility model not only reduces artificial cost, improves detection efficiency;Also provide realization basis for automatic detection, plastic package processing.

Description

Technical Field

[0001] This utility model relates to an automatic inspection device for semiconductor chip substrates, which is applicable to the field of semiconductor chip processing technology. Background Technology

[0002] Semiconductor chip molding is a crucial step in the chip packaging process, protecting the components and circuitry within the chip from moisture, dust, and harmful gases. Since visual inspection of the chip and substrate is impossible after molding and curing, it's essential to inspect the chip substrate for damage beforehand to prevent defects caused by incorrect chip placement or substrate breakage. Currently, most inspection processes rely on manual visual inspection. Inspectors manually place the substrate in an inspection fixture and then visually inspect it using inspection lenses and supplementary lighting to ensure substrate quality. However, manual inspection is not only costly but also inefficient. Furthermore, with the continuous development of intelligent factory technology, production workshops are increasingly moving towards automation and unmanned operation, and existing manual visual inspection methods are no longer sufficient to meet the demands of automated production. Utility Model Content

[0003] To address the shortcomings of the existing technology, this invention proposes an automatic detection device for semiconductor chip substrates.

[0004] The technical solution adopted by this utility model is: an automatic detection device for semiconductor chip substrates, including a housing, a feeding mechanism for loading the substrate to be tested and a detection mechanism for detecting the substrate to be tested, which are disposed in the housing.

[0005] The loading mechanism includes a rack with a discharge port on one side, a carrier plate movably positioned in front of the discharge port, a first drive unit for moving the carrier plate, a first clamping member slidably mounted on the carrier plate in the front-back direction for clamping the substrate to be tested from the rack onto the carrier plate, and a second drive unit for moving the first clamping member. In actual production, an operator loads the substrate to be tested onto the rack. Specifically, the substrates to be tested are stacked vertically in the rack. Then, the first drive unit moves the carrier plate to the height corresponding to any substrate to be tested. The second drive unit then drives the first clamping member to slide to the discharge port, clamping the corresponding substrate to be tested. The second drive unit then moves the first clamping member away from the discharge port, clamping the corresponding substrate to be tested onto the carrier plate for subsequent transfer to the testing mechanism for inspection, thus achieving automatic loading. Specifically, the first clamping member is a pneumatic gripper.

[0006] The testing mechanism includes a slide rail arranged horizontally and having a first section and a second section; a transfer mechanism for transferring the substrate under test from the carrier plate to the first section; a second clamping member slidably disposed between the first and second sections and used to clamp the substrate under test and drive it to slide on the slide rail; a third driving unit for driving the second clamping member to slide; and a detection sensor disposed in the second section. After the substrate under test is transferred from the carrier plate to the first section of the slide rail by the transfer mechanism, the second clamping member clamps the substrate under test, and the third driving unit drives the substrate under test to slide to the second section, passing the detection sensor during the slide so that the detection sensor can detect the substrate under test. This achieves automatic loading and testing of the substrate under test, reducing the cost of manual testing and improving testing efficiency. Furthermore, the slide rail, the second clamping member, and the third driving unit can be connected to the subsequent molding process of chip packaging to achieve automated testing and molding processing. Specifically, the second clamping member is configured as a pneumatic gripper; the detection sensor is configured as a reflective fiber optic sensor.

[0007] Furthermore, a feed inlet is provided on the other side of the rack, and several material placement slots extending vertically from the feed inlet to the discharge outlet are provided on the inner wall of the rack. Before testing, the operator inserts the substrates to be tested into the material placement slots, facilitating the second clamping component to pick up the substrates. Optionally, the rack can be detachably embedded in the side wall of the housing. Before testing, the rack pre-loaded with the substrates to be tested can be embedded in the side wall of the housing to improve efficiency.

[0008] Furthermore, a material loading groove for supporting the substrate under test is formed on the material carrier plate along the sliding direction of the first clamping member. One end of the material loading groove is connected to the discharge port, and the first clamping member is slidably disposed in the material loading groove. By forming the material loading groove, it is convenient for the first clamping member to clamp the substrate under test onto the material carrier plate. On the other hand, the material loading groove can limit the position of the substrate under test on the material carrier plate, making it convenient for the transfer mechanism to pick up the substrate under test.

[0009] Furthermore, the second drive unit includes at least one first slide rail fixed to the bottom surface of the material carrier plate, a first slide block slidably connected to the first slide rail, a first driver for driving the first slide block to slide, and a first clamping member fixedly connected to the first slide block, thereby realizing the second drive unit driving the first clamping member.

[0010] Furthermore, the first drive unit includes at least four first cylinders whose cylinder bodies are fixed inside the housing and whose output shafts are fixedly connected to the material carrier plate. The at least four first cylinders are respectively connected to the corners of the material carrier plate. The material carrier plate is driven to move up and down by the first cylinders. The at least four first cylinders can ensure that the material carrier plate moves smoothly during the movement.

[0011] Furthermore, the slide has a pair of parallel guide rails, and the third drive unit includes at least one second slide rail disposed between the pair of guide rails and parallel to the guide rails, a second slide block slidably connected to the second slide rail, a second driver for driving the second slide block to slide, and a second clamping member fixedly connected to the second slide block, thereby realizing the third drive unit driving the second clamping member.

[0012] Furthermore, the testing mechanism also includes a pair of pressure plates rotatably disposed on both sides of the slide rail along a rotation axis parallel to the slide rail, and a third actuator for driving the pressure plates to rotate. The pair of pressure plates are disposed in the first section, and the pressure plates have at least two working positions through their rotation. When they are in the first working position, each pressure plate is away from the guide rail on its side; when the pressure plate is in the second working position, each pressure plate is close to the guide rail on its side, and the upper end of each pressure plate and the top surface of the guide rail on its side form a groove for the substrate under test to slide. When the transfer mechanism transfers the substrate under test to the first section of the slide rail, the third actuator drives the pressure plates to rotate to the first working position to facilitate the transfer mechanism in placing the substrate under test. After placement, the third actuator drives the pressure plates to rotate to the second working position to confine the substrate under test within the groove formed by the pressure plates and the top surface of the guide rail, preventing the substrate under test from shifting position during sliding and improving testing accuracy.

[0013] Furthermore, the transfer mechanism includes a suction cup movably disposed between the carrier plate and the first section for picking up the substrate to be tested, and a third drive assembly for driving the suction cup to move. The third drive assembly includes a fixed plate fixedly disposed inside the housing and located above the loading mechanism and the detection mechanism, at least one third slide rail fixedly disposed on the fixed plate, a second cylinder slidably connected to the third slide rail, and a fourth driver for driving the second cylinder to slide. The output shaft of the second cylinder is disposed downward, and the suction cup is fixedly connected to the output shaft of the second cylinder. The second cylinder is driven to slide along the third slide rail by the fourth driver, thereby realizing the reciprocating movement of the suction cup between the loading mechanism and the detection mechanism. The suction cup is driven to move up and down by the second cylinder, which facilitates the picking up or placing of the substrate to be tested.

[0014] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: The automatic semiconductor chip substrate inspection device of this utility model realizes the automatic inspection process of semiconductor chip substrate through the feeding mechanism and the inspection mechanism, which not only reduces the cost of manual inspection, but also improves the inspection efficiency; and through the slide, the second clamping member and the third driving part, the inspection device can be connected to the subsequent molding process of chip packaging, so as to realize automated inspection and molding processing. Attached Figure Description

[0015] The following sections will describe some specific embodiments of the present invention in a detailed manner by way of example and not limitation, with reference to the accompanying drawings. The same reference numerals in the drawings denote the same or similar components or parts. Those skilled in the art should understand that these drawings are not necessarily drawn to scale. In the drawings: Figure 1 This is a schematic diagram of the structure of one embodiment of the present utility model. Figure 1 ; Figure 2 yes Figure 1 Enlarged structure of the feeding mechanism in the illustrated embodiment Figure 1 ; Figure 3 yes Figure 1 Enlarged structure of the feeding mechanism in the illustrated embodiment Figure 2 ; Figure 4 yes Figure 1 Structural diagram of the embodiment shown Figure 2 ; Figure 5 yes Figure 1 Enlarged view of the transfer mechanism in the illustrated embodiment; Figure 6 yes Figure 1 An enlarged view of the detection mechanism in the illustrated embodiment; The annotations in the attached figures are explained as follows: 1. Housing; 2. Feeding mechanism; 21. Material rack; 211. Discharge port; 212. Inlet port; 213. Material trough; 22. Carrying plate; 221. Carrying trough; 23. First drive unit; 231. First cylinder; 24. First clamping component; 25. Second drive unit; 251. First slide rail; 252. First slide block; 253. First driver; 3. Detection mechanism; 31. Slide rail; 311. Guide rail; 32. Transfer mechanism; 321. Suction cup; 322. Third drive assembly; 323. Fixing plate; 324. Third slide rail; 325. Second cylinder; 326. Fourth driver; 33. Second clamping component; 34. Third drive unit; 341. Second slide rail; 342. Second slide block; 343. Second driver; 35. Detection sensor; 36. Pressure plate; 37. Third driver. Detailed Implementation

[0016] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0017] In the description of this utility model, it should be noted that the terms "front" and "back" regarding direction are defined according to the discharge direction of the substrate under test. Specifically, the direction in which the substrate under test is discharged from the feed rack is "front," and the opposite direction is "back." The terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0018] Reference Appendix Figure 1-6 The automatic semiconductor chip substrate testing device in this embodiment includes a housing 1, a loading mechanism 2 for loading the substrate to be tested and a testing mechanism 3 for testing the substrate to be tested, which are disposed in the housing 1.

[0019] The loading mechanism 2 includes a material rack 21 with a discharge port 211 on one side, a carrier plate 22 movably disposed in front of the discharge port 211, a first drive unit 23 for driving the carrier plate 22 to move, a first clamping member 24 slidably disposed on the carrier plate 22 in the front-back direction for clamping the substrate to be tested in the material rack 21 onto the carrier plate 22, and a second drive unit 25 for driving the first clamping member 24 to move. In actual production, the operator loads the substrate to be tested onto the material rack 21. The substrates to be tested are stacked vertically in the rack 21. The first drive unit 23 drives the carrier plate 22 to move to the height corresponding to any substrate under test. Then, the second drive unit 25 drives the first clamping member 24 to slide to the discharge port 211, clamping the corresponding substrate. The second drive unit 25 then drives the first clamping member 24 away from the discharge port 211, picking up the corresponding substrate and placing it onto the carrier plate 22 for subsequent transfer to the testing mechanism 3 for inspection, thus achieving automatic feeding. Specifically, the first clamping member 24 is a pneumatic gripper.

[0020] The testing mechanism 3 includes a slide 31 arranged horizontally and having a first section and a second section; a transfer mechanism 32 for transferring the substrate to be tested from the carrier plate 22 to the first section; a second clamping member 33 slidably disposed between the first and second sections and used to clamp the substrate to be tested and drive it to slide on the slide 31; a third driving unit 34 for driving the second clamping member 33 to slide; and a detection sensor 35 disposed in the second section. After the substrate to be tested on the carrier plate 22 is transferred to the first section of the slide 31 by the transfer mechanism 32, the substrate to be tested is clamped by the second clamping member 33 and driven by the third driving unit 34 to slide to the second section, passing the detection sensor 35 during the slide so that the detection sensor 35 can detect the substrate to be tested. This enables automated feeding and inspection of the substrate under test, reducing costs associated with manual inspection and improving inspection efficiency. Furthermore, the slide rail 31, the second clamping member 33, and the third driving unit 34 allow for connection with subsequent molding processes in chip packaging, facilitating automated inspection and molding. Specifically, the second clamping member 33 is configured as a pneumatic gripper; the detection sensor 35 is configured as a reflective fiber optic sensor.

[0021] In a more preferred embodiment, a feed inlet 212 is provided on the other side of the rack 21, and several material placement slots 213 extending vertically from the feed inlet 212 to the discharge outlet 211 are provided on the inner wall of the rack 21. Before testing, the operator inserts the substrate to be tested into the material placement slots 213 respectively, so that the second clamping member 33 can clamp the substrate to be tested. In another more preferred embodiment, the rack 21 is detachably embedded in the side wall of the housing 1. Before testing, the rack 21 pre-loaded with the substrate to be tested can be embedded in the side wall of the housing 1 to improve efficiency.

[0022] In a more preferred embodiment, a material carrier plate 22 is provided with a material carrier groove 221 for supporting the substrate to be tested along the sliding direction of the first clamping member 24. One end of the material carrier groove 221 is connected to the discharge port 211. The first clamping member 24 is slidably disposed in the material carrier groove 221. By providing the material carrier groove 221, it is convenient for the first clamping member 24 to clamp the substrate to be tested onto the material carrier plate 22. On the other hand, the material carrier groove 221 can limit the position of the substrate to be tested on the material carrier plate 22, making it convenient for the transfer mechanism 32 to pick up the substrate to be tested.

[0023] In a more preferred embodiment, the second drive unit 25 includes at least one first slide rail 251 fixed to the bottom surface of the carrier plate 22, a first slide block 252 slidably connected to the first slide rail 251, a first driver 253 for driving the first slide block 252 to slide, and a first clamping member 24 fixedly connected to the first slide block 252, thereby realizing the second drive unit 25 driving the first clamping member 24.

[0024] In a more preferred embodiment, the first drive unit 23 includes at least four first cylinders 231 whose cylinder bodies are fixed inside the housing 1 and whose output shafts are fixedly connected to the material plate 22. The at least four first cylinders 231 are respectively connected to the corners of the material plate 22. The material plate 22 is driven to move up and down by the first cylinders 231. The at least four first cylinders 231 can ensure that the material plate 22 moves smoothly during the movement.

[0025] In a more preferred embodiment, the slide 31 has a pair of parallel guide rails 311, and the third drive unit 34 includes at least one second slide rail 341 disposed between the pair of guide rails 311 and parallel to the guide rails 311, a second slide block 342 slidably connected to the second slide rail 341, a second driver 343 for driving the second slide block 342 to slide, and a second clamping member 33 fixedly connected to the second slide block 342, thereby realizing the drive of the second clamping member 33 by the third drive unit 34.

[0026] In a more preferred embodiment, the detection mechanism 3 further includes a pair of pressure plates 36 rotatably disposed on both sides of the slide rail 31 along a rotation axis parallel to the slide rail 31, and a third driver 37 for driving the pressure plates 36 to rotate. The pair of pressure plates 36 are disposed in the first section, and the pressure plates 36 have at least two working positions by rotating. When they are in the first working position, each pressure plate 36 is away from the guide rail 311 on its side. When the pressure plates 36 are in the second working position, each pressure plate 36 is close to the guide rail 311 on its side, and the upper end of each pressure plate 36 and the top surface of the guide rail 311 on its side form a groove for the substrate to be tested to slide (not shown in the figure). When the transfer mechanism 32 transfers the substrate to be tested to the first section of the slide 31, the third driver 37 drives the pressure plate 36 to rotate to the first working position, so that the transfer mechanism 32 can place the substrate to be tested. After the placement is completed, the third driver 37 drives the pressure plate 36 to rotate to the second working position, so as to restrict the substrate to be tested within the slide groove formed by the pressure plate 36 and the top surface of the guide rail 311, prevent the substrate to be tested from shifting position during the sliding process, and improve the detection accuracy.

[0027] In a more preferred embodiment, the transfer mechanism 32 includes a suction cup 321 movably disposed between the carrier plate 22 and the first section for picking up the substrate to be tested, and a third drive assembly 322 for driving the suction cup 321 to move. The third drive assembly 322 includes a fixed plate 323 fixedly disposed inside the housing 1 and located above the loading mechanism 2 and the detection mechanism 3, at least one third slide rail 324 fixedly disposed on the fixed plate 323, a second cylinder 325 slidably connected to the third slide rail 324, and a fourth driver 326 for driving the second cylinder 325 to slide. The output shaft of the second cylinder 325 is disposed downward, and the suction cup 321 is fixedly connected to the output shaft of the second cylinder 325. The fourth driver 326 drives the second cylinder 325 to slide along the third slide rail 324, thereby realizing the reciprocating movement of the suction cup 321 between the loading mechanism 2 and the detection mechanism 3. The second cylinder 325 drives the suction cup 321 to move up and down, which facilitates the picking up or placing of the substrate to be tested.

[0028] Due to the application of the above technical solution, this utility model has the following advantages compared with the prior art: The automatic semiconductor chip substrate inspection device of this utility model realizes the automatic inspection process of semiconductor chip substrate through the feeding mechanism and the inspection mechanism, which not only reduces the cost of manual inspection, but also improves the inspection efficiency; and through the slide, the second clamping member and the third driving part, the inspection device can be connected to the subsequent molding process of chip packaging, so as to realize automated inspection and molding processing.

[0029] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the protection scope of this utility model.

Claims

1. An automatic inspection device for semiconductor chip substrates, characterized in that: It includes a housing (1), a loading mechanism (2) for loading the substrate to be tested, which is disposed in the housing (1), and a detection mechanism (3) for detecting the substrate to be tested. The feeding mechanism (2) includes a material rack (21) with a discharge port (211) on one side, a carrier plate (22) that is movably disposed in front of the discharge port (211), a first driving part (23) for driving the carrier plate (22) to move, a first clamping member (24) that is slidably disposed on the carrier plate (22) in the front-back direction and used to clamp the substrate to be tested in the material rack (21) onto the carrier plate (22), and a second driving part (25) for driving the first clamping member (24) to move. The detection mechanism (3) includes a slide (31) arranged in a horizontal direction and having a first section and a second section, a transfer mechanism (32) for transferring the substrate to be tested from the carrier plate (22) to the first section, a second clamping member (33) slidably disposed between the first section and the second section and used to clamp the substrate to be tested to drive it to slide on the slide (31), a third driving part (34) for driving the second clamping member (33) to slide, and a detection sensor (35) disposed at the second section.

2. The automatic inspection device for semiconductor chip substrates according to claim 1, characterized in that: The material rack (21) has a feed inlet (212) on the other side, and the inner wall of the material rack (21) is provided with a number of material placement slots (213) extending from the feed inlet (212) to the discharge outlet (211) and arranged vertically.

3. The automatic semiconductor chip substrate inspection device according to claim 1, characterized in that: The material carrier plate (22) is provided with a material carrier groove (221) for supporting the substrate to be tested along the sliding direction of the first clamping member (24). One end of the material carrier groove (221) is connected to the discharge port (211), and the first clamping member (24) is slidably disposed in the material carrier groove (221).

4. The automatic inspection device for semiconductor chip substrates according to claim 1, characterized in that: The second drive unit (25) includes at least one first slide rail (251) fixed to the bottom surface of the material carrier plate (22), a first slide block (252) slidably connected to the first slide rail (251), and a first driver (253) for driving the first slide block (252) to slide. The first clamping member (24) is fixedly connected to the first slide block (252).

5. The automatic inspection device for semiconductor chip substrates according to claim 1, characterized in that: The first drive unit (23) includes at least four first cylinders (231) whose cylinder bodies are fixed inside the housing (1) and whose output shafts are fixedly connected to the material carrier plate (22). At least four of the first cylinders (231) are respectively connected to the corners of the material carrier plate (22).

6. The automatic inspection device for semiconductor chip substrates according to claim 1, characterized in that: The slide (31) has a pair of parallel guide rails (311), and the third drive unit (34) includes at least one second slide rail (341) disposed between the pair of guide rails (311) and parallel to the guide rails (311), a second slide block (342) slidably connected to the second slide rail (341), and a second driver (343) for driving the second slide block (342) to slide. The second clamping member (33) is fixedly connected to the second slide block (342).

7. The automatic semiconductor chip substrate inspection device according to claim 6, characterized in that: The detection mechanism (3) further includes a pair of pressure plates (36) rotatably disposed on both sides of the slide (31) along a rotation axis parallel to the slide (31), and a third driver (37) for driving the pressure plates (36) to rotate. The pair of pressure plates (36) are disposed in the first section. The pressure plates (36) have at least two working positions by rotating. When they are in the first working position, each pressure plate (36) is away from the guide rail (311) on its side. When the pressure plates (36) are in the second working position, each pressure plate (36) is close to the guide rail (311) on its side, and the upper end of each pressure plate (36) forms a groove between the top surface of the guide rail (311) on its side for the substrate to be tested to slide.

8. The automatic inspection device for semiconductor chip substrates according to claim 1, characterized in that: The transfer mechanism (32) includes a suction cup (321) movably disposed between the carrier plate (22) and the first section for picking up the substrate to be tested, and a third drive component (322) for driving the suction cup (321) to move.

9. The automatic inspection device for semiconductor chip substrates according to claim 8, characterized in that: The third drive assembly (322) includes a fixed plate (323) fixedly disposed inside the housing (1) and above the feeding mechanism (2) and the detection mechanism (3), at least one third slide rail (324) fixedly disposed on the fixed plate (323), a second cylinder (325) whose cylinder body is slidably connected to the third slide rail (324), and a fourth driver (326) for driving the second cylinder (325) to slide. The output shaft of the second cylinder (325) is disposed downward, and the suction cup (321) is fixedly connected to the output shaft of the second cylinder (325).

Images