Automatic cleaning of wafers

Abstract

The utility model relates to the technical field of semiconductor processing, concretely to automatic cleaning wafer device, including the connecting pipe, the one side of connecting pipe is connected with electromagnetic conversion valve, the other side of connecting pipe is connected with electromagnetic pressure regulating valve, the one side of electromagnetic conversion valve is connected with vacuum air pipe, the one side of electromagnetic conversion valve still is connected with cleaning gas pipe, the one side of electromagnetic pressure regulating valve is connected with the air tail pipe of breathing, the one side of air tail pipe of breathing is connected with cleaning suction nozzle assembly, the utility model discloses automatic cleaning wafer device mainly is through connecting pipe two sides respectively connecting electromagnetic conversion valve and electromagnetic pressure regulating valve, through vacuum air pipe to the air tail pipe of breathing and cleaning suction nozzle assembly suction, make the air hole way near on suction nozzle disc body and the air pressure reduction in the middle part of auxiliary limit ring, the wafer close is sucked into the auxiliary limit ring, through electromagnetic conversion valve replacement cleaning gas pipe ventilation, adjust the air pressure of adjusting electromagnetic pressure regulating valve, make the gas that blows can blow out the dust on wafer and wafer will not fly out, realize the automatic cleaning of wafer in the process of loading piece.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing technology, specifically to an automatic wafer cleaning device. Background Technology

[0002] Wafers are the core basic material for semiconductor manufacturing. They are usually made of high-purity single-crystal silicon (or other semiconductor materials such as silicon carbide and gallium arsenide) and are in the shape of a circular thin film. After the surface is precisely polished, hundreds of millions of transistors and circuits can be integrated through processes such as photolithography and etching. Finally, they are cut into individual chips. The purity of the wafer and the integrity of the crystal structure directly determine the chip performance. Wafers are the "cornerstone" of devices such as smartphones and computers in the electronics industry.

[0003] Chinese Patent No. CN210443534U discloses a wafer loading device, comprising: a wafer stage having a platform for fixing wafers, the wafer stage being arranged vertically and mounted on a first translation mechanism, the first translation mechanism driving the wafer stage to perform XY motion in the vertical plane; a wafer picking device comprising: a wafer picking arm and a pivoting mechanism, the wafer picking arm being driven by the pivoting mechanism to pivot 90° in a plane perpendicular to the platform; a wafer loading stage having a working surface for fixing substrates, the wafer loading stage being arranged horizontally and mounted on a second translation mechanism, the second translation mechanism driving the wafer loading stage to perform XY motion in the horizontal plane; and a cam mechanism comprising cams respectively disposed at the wafer picking position and the wafer loading position. This invention, by vertically arranging the wafer stage, allows one wafer picking arm to complete both wafer picking and wafer loading operations, overcoming the errors caused by multiple arms relaying wafer picking, and also improving the efficiency of wafer loading.

[0004] In the above-mentioned scheme and existing technology, when wafers are loaded into the wafer production process, dust and dirt will be generated on the wafers as they are transported from the previous process to the loading process. The dust and dirt on the wafers cannot be effectively removed before loading, which will affect the next process. The nozzles used for wafer loading cannot achieve the cleaning function during transportation, and the wafers need to be cleaned separately again, which is very inconvenient. Utility Model Content

[0005] The purpose of this invention is to provide an automatic wafer cleaning device to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: an automatic wafer cleaning device includes a connecting pipe, an electromagnetic switching valve connected to one side of the connecting pipe, an electromagnetic pressure regulating valve connected to the other side of the connecting pipe, a vacuum pipe connected to one side of the electromagnetic switching valve, a cleaning air pipe connected to one side of the electromagnetic switching valve, a ventilation tailpipe connected to one side of the electromagnetic pressure regulating valve, and a cleaning nozzle assembly connected to one side of the ventilation tailpipe.

[0007] Preferably, the cleaning nozzle assembly includes a nozzle disc body, one side of which is connected to the vent tailpipe, and the other side of which is provided with uniformly distributed air outlet channels. One side of the air outlet channels converges and connects to the vent tailpipe, and an auxiliary limiting ring is fixedly connected to one side of the nozzle disc body.

[0008] Preferably, a wafer is movably inserted into the auxiliary limiting ring.

[0009] Preferably, the auxiliary limiting ring is provided with ash discharge holes, which are evenly distributed at the connection between the auxiliary limiting ring and the suction nozzle disc.

[0010] Preferably, the auxiliary limiting ring has a pin groove evenly provided on one side, and a hemispherical extrusion pin is inserted into the pin groove, with one side of the hemispherical extrusion pin being extruded onto the wafer.

[0011] Preferably, a lightweight spring is fixedly connected to one side of the hemispherical extrusion pin, and the lightweight spring is fixedly connected to one side of the pin groove.

[0012] Compared with the prior art, the beneficial effects of this utility model are: The automatic wafer cleaning device proposed in this utility model mainly involves connecting an electromagnetic switching valve and an electromagnetic pressure regulating valve to both sides of a connecting pipe. The electromagnetic switching valve is connected to a cleaning air pipe and a vacuum pipe. Air is drawn into the ventilation tailpipe and cleaning nozzle assembly through the vacuum pipe, which reduces the air pressure near the air outlet on the nozzle plate and in the middle of the auxiliary limiting ring. The wafer that is close to the nozzle is sucked into the auxiliary limiting ring and squeezed through the hemispherical extrusion pin. The cleaning air pipe is replaced by the electromagnetic switching valve, and the air pressure is adjusted by the electromagnetic pressure regulating valve. The blown air blows the dust on the wafer out of the dust discharge hole and prevents the wafer from being blown out of the auxiliary limiting ring, thus realizing automatic cleaning of the wafer during the wafer mounting process. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of an automated wafer cleaning device. Figure 2 This is a schematic diagram of the structure of an automated wafer cleaning device. Figure 3 This is a partial structural cross-sectional view of an automated wafer cleaning device; Figure 4 for Figure 3 Enlarged diagram of part A in the middle.

[0014] In the diagram: 1. Connecting pipe; 2. Electromagnetic conversion valve; 3. Electromagnetic pressure regulating valve; 4. Cleaning air pipe; 5. Ventilation tailpipe; 601. Suction nozzle disc; 602. Air outlet channel; 603. Auxiliary limit ring; 604. Wafer; 605. Ash discharge hole; 606. Pin groove; 607. Hemispherical extrusion pin; 608. Lightweight spring; 7. Vacuum air pipe. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of this utility model clear and complete, the embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only some, not all, embodiments of this utility model, and are merely used to explain the embodiments of this utility model. They are not intended to limit the embodiments of this utility model. All other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0016] Please see Figures 1-4 The present invention provides the following two preferred embodiments: Example 1: An automatic wafer cleaning device includes a connecting pipe 1. One side of the connecting pipe 1 is connected to an electromagnetic switching valve 2, and the other side is connected to an electromagnetic pressure regulating valve 3. One side of the electromagnetic switching valve 2 is connected to a vacuum pipe 7, and the other side is also connected to a cleaning air pipe 4. One side of the electromagnetic pressure regulating valve 3 is connected to a ventilation tailpipe 5, and the other side of the ventilation tailpipe 5 is connected to a cleaning nozzle assembly. The cleaning nozzle assembly includes a nozzle disc 601. One side of the nozzle disc 601 is connected to the ventilation tailpipe 5, and the other side of the nozzle disc 601 is evenly provided with air outlet channels 602. One side of the air outlet channels 602 converges and connects to the ventilation tailpipe 5. An auxiliary limiting ring 603 is fixedly connected to one side of the nozzle disc 601. A wafer 604 is movably inserted into the auxiliary limiting ring 603. The auxiliary limiting ring 603 is provided with dust discharge holes 605, which are evenly distributed at the connection between the auxiliary limiting ring 603 and the nozzle disc 601.

[0017] In use, connect the electromagnetic switching valve 2 and the electromagnetic pressure regulating valve 3 to both sides of the connecting pipe 1, respectively. Connect the cleaning air pipe 4 and the vacuum pipe 7 to one side of the electromagnetic switching valve 2. One side of the cleaning air pipe 4 is connected to the cleaning air source, and one side of the vacuum pipe 7 is connected to the vacuuming device. The electromagnetic switching valve 2 allows switching between the cleaning air pipe 4 and the vacuum pipe 7, thus switching between the cleaning air source and the vacuuming device. First, by adjusting the electromagnetic switching valve 2, the vacuuming device is opened, and the cleaning air pipe 4 is closed. The vacuuming device draws in external air through the ventilation tailpipe 5. A cleaning nozzle assembly is connected to one side of the ventilation tailpipe 5. The nozzle disc 601 on the cleaning nozzle assembly is connected to the ventilation tailpipe 5. Multiple sets of air outlet channels 602 are provided on one side of the nozzle disc 601, evenly arranged in a ring on the nozzle disc 601. The multiple sets of air outlet channels 602 converge and connect to the ventilation tailpipe 5 on one side. The ventilation tailpipe 5 draws in external air through the air outlet channels 602. The air pressure near the vent 602 causes a decrease in the air pressure near the vent 602. The auxiliary limiting ring 603 on the cleaning nozzle assembly is fixedly connected to one end of the nozzle disc 601, and the air pressure in the middle of the auxiliary limiting ring 603 also decreases. When one side of the auxiliary limiting ring 603 is brought close to the wafer 604 to be mounted, due to the pressure difference on both sides of the wafer 604, the wafer 604 is drawn towards the vent 602 where the air pressure is lower. The negative pressure caused by the vacuum device is relatively large in this area. The dust discharge hole 605 does not affect the wafer 604 being sucked into the auxiliary limiting ring 603. After the wafer 604 is sucked into the auxiliary limiting ring 603, the vacuum device is turned off, and the cleaning air pipe 4 is opened by adjusting the electromagnetic conversion valve 2. The cleaning air source is supplied to the connecting pipe 1 and the vent tail pipe 5. The gas is discharged through the air outlet 602. The discharged gas cleans the dust on the surface of the wafer 604 and blows the dust out from the dust discharge hole 605 around the auxiliary limiting ring 603.

[0018] Example 2: Based on Example 1, a pin groove 606 is evenly provided on one side of the auxiliary limiting ring 603. A hemispherical extrusion pin 607 is inserted into the pin groove 606. One side of the hemispherical extrusion pin 607 is extruded onto the wafer 604. A light spring 608 is fixedly connected to one side of the hemispherical extrusion pin 607. One side of the light spring 608 is fixedly connected to one side of the pin groove 606.

[0019] To prevent the wafer 604 from flying out during dust removal, multiple sets of pin slots 606 are provided around the auxiliary limiting ring 603. Movable hemispherical pressing pins 607 are inserted into the pin slots 606. One side of the hemispherical pressing pin 607 is spherical, and the other side is fixedly connected to a lightweight spring 608. One side of the lightweight spring 608 is fixedly connected to the pin slot 606, ensuring that the hemispherical pressing pin 607 does not detach from the pin slot 606. The lightweight spring has a low elastic coefficient; under high vacuum pressure, the wafer 604 is drawn towards the center of the auxiliary limiting ring 603, compressing the hemispherical pressing pin 607 and the lightweight spring 608, completely forcing the hemispherical pressing pin 607 into the pin slot 606. The wafer 604 then passes through the hemispherical pressing pin 607 and is drawn towards the vent 602. Nearby, under the restoring compression action of the lightweight spring 608, the hemispherical compression pin 607 is compressed again to return to its original position, and has a certain limiting effect on the wafer 604 when the vacuum device is closed, preventing the wafer 604 from flying out during the wafer loading and handling process. When the cleaning air pipe 4 is turned on to ventilate, in order to avoid the wafer 604 being compressed by the hemispherical compression pin 607 due to gas impact and thus flying out, the electromagnetic pressure regulating valve 3 is adjusted to reduce the air pressure in the pipe. The air pressure is adjusted so that the thrust on the wafer 604 is less than the compression force of the lightweight spring 608 on the hemispherical compression pin 607. Under the resistance and compression of the hemispherical compression pin 607 on the wafer 604, the wafer 604 can be cleaned of dust by air blowing without flying out, which effectively realizes the self-cleaning function of the wafer 604 during the wafer loading and handling process.

[0020] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automatic wafer cleaning device, comprising a connecting tube (1), characterized in that: The connecting pipe (1) is connected to an electromagnetic switching valve (2) on one side and an electromagnetic pressure regulating valve (3) on the other side. The electromagnetic switching valve (2) is connected to a vacuum pipe (7) on one side and a cleaning air pipe (4) on one side. The electromagnetic pressure regulating valve (3) is connected to a ventilation tailpipe (5) on one side and a cleaning nozzle assembly on one side.

2. The automatic wafer cleaning device according to claim 1, characterized in that: The cleaning nozzle assembly includes a nozzle disc (601), one side of which is connected to the ventilation tailpipe (5), and the other side of which is uniformly provided with air outlet channels (602). One side of the air outlet channels (602) is connected to the ventilation tailpipe (5), and an auxiliary limiting ring (603) is fixedly connected to one side of the nozzle disc (601).

3. The automatic wafer cleaning device according to claim 2, characterized in that: A wafer (604) is movably inserted into the auxiliary limiting ring (603).

4. The automatic wafer cleaning device according to claim 2, characterized in that: The auxiliary limiting ring (603) is provided with ash discharge holes (605), which are evenly distributed at the connection between the auxiliary limiting ring (603) and the suction nozzle disc (601).

5. The automatic wafer cleaning device according to claim 2, characterized in that: The auxiliary limiting ring (603) has a uniformly provided pin groove (606) on one side, and a hemispherical extrusion pin (607) is inserted into the pin groove (606). One side of the hemispherical extrusion pin (607) is extruded onto the wafer (604).

6. The automatic wafer cleaning device according to claim 5, characterized in that: A light spring (608) is fixedly connected to one side of the hemispherical extrusion pin (607), and the light spring (608) is fixedly connected to one side of the pin groove (606).

Images