Die bonding mechanism and die bonding apparatus

Abstract

The utility model discloses a kind of wafer mounting mechanism and die bonding equipment, it is related to die bonding technical field, wherein, wafer mounting mechanism rack and take crystal and paste mechanism, take crystal and paste mechanism is installed in the rack, the take crystal and paste mechanism includes the continuous distribution of wafer disc along first space axis, overturn group and paste group;The first space axis is inclined and adjustable angle setting relative to horizontal plane.This utility model's technical scheme is by using the continuous distribution of wafer disc, overturn group and paste group of take crystal and paste mechanism along first space axis;First space axis is inclined and adjustable angle setting relative to horizontal plane, so that multiple mechanisms can be inclined arrangement layout along a slant line on rack, to reduce the waste of longitudinal space caused by linear layout in horizontal plane, and take crystal and paste mechanism is inclined setting, the height of take crystal and paste mechanism drops, and the difficulty of operator maintenance and repair is reduced.

Description

Technical Field

[0001] This utility model relates to the field of die bonding technology, and in particular to a wafer mounting mechanism and die bonding equipment. Background Technology

[0002] Die bonding equipment is used in semiconductor packaging and LED manufacturing, and its main function is to fix the wafer onto the substrate.

[0003] Existing die bonding equipment is equipped with wafer platforms, transfer mechanisms, and mounting mechanisms. These mechanisms are mostly arranged vertically on the vertical plane of the rack or linearly on the horizontal plane of the rack, resulting in insufficient flexibility in spatial layout and low space utilization. Utility Model Content

[0004] The main purpose of this invention is to propose a wafer mounting mechanism and die bonding equipment, which aims to solve the problem of low space utilization in existing die bonding mechanisms.

[0005] To achieve the above objectives, the wafer mounting mechanism proposed in this utility model includes: a frame and a wafer picking and placing mechanism. The wafer picking and placing mechanism is mounted on the frame and includes wafer disks, flipping groups and placing groups continuously distributed along a first spatial axis. The first spatial axis is inclined relative to the horizontal plane and is set at an adjustable angle.

[0006] In some embodiments, the flipping assembly is mounted at an angle to the rack, the flipping assembly having at least one rotating arm with a first suction nozzle, the rotating arm being configured to receive a wafer from the wafer disk and to flip and change position, such that the rotating arm is flipped from a pick-up position facing the wafer disk to a placement position facing the placement group, so as to transfer the wafer to the placement group.

[0007] The chip assembly is configured to receive the chip transferred from the flip assembly and, through rotation and spatial pose transformation, convert the chip from a pick-up posture to a mounting posture.

[0008] The flipping group has at least one rotating arm configured to receive a wafer from the wafer disk and flip its position so that the rotating arm flips from a pick-up position facing the wafer disk to a placement position facing the placement group, so as to transfer the wafer to the placement group.

[0009] In some embodiments, the flipping assembly includes a first rotating arm and a second rotating arm, and the flipping assembly further includes a first driving component. The first rotating arm and the second rotating arm are arrayed on the output shaft of the first driving component, and the first rotating arm and the second rotating arm are equipped with a first suction nozzle. One of the first rotating arm and the second rotating arm is positioned towards the wafer disk to pick up the wafer from the wafer disk, and the other of the first rotating arm and the second rotating arm is positioned towards the chip assembly to transfer the wafer to the chip assembly; the first driving assembly is used to drive the first rotating arm and the second rotating arm to rotate around the output shaft of the first driving assembly, so that the first rotating arm rotates to the chip position and the second rotating arm rotates to the pick-up position.

[0010] In some embodiments, the patch group includes: A rotary arm assembly, the rotary arm assembly including at least two mounting arms, wherein at least one of the mounting arms is equipped with a rotation drive, and the mounting arm is equipped with a second suction nozzle; and The second drive assembly includes a flip drive, a lifting drive, and a rotation drive. The flip drive is used to drive the rotating arm assembly to flip, the rotation drive is used to control the second suction nozzle to rotate around its axis, and the lifting drive is used to drive the second suction nozzle to move in the height direction.

[0011] In some embodiments, the wafer disk is configured such that: the wafer disk moves in one or both of the first and second directions of the rack to adjust the position of the wafer disk in the rack; the wafer disk is tilted outward relative to the rack and has a rotational angle relative to the horizontal axis.

[0012] In some embodiments, the first suction nozzle has a built-in independent vacuum channel, the first suction nozzle is movably mounted on the first rotating arm, and is inclined relative to the first rotating arm.

[0013] The wafer disk is equipped with a push pin assembly, which includes a top cap and a push pin structure. The push pin structure is disposed inside the top cap and extends out relative to the top cap to push out the wafer. The push pin structure is disposed facing a first suction nozzle, and the push pin structure and the first suction nozzle are disposed on the same axis. The first suction nozzle is used to pick up the wafer on the push pin structure.

[0014] In some embodiments, the frame is equipped with a rotation adjustment mechanism, which includes a universal joint and a third drive assembly. The universal joint is mounted on the frame, and the third drive assembly is disposed on the universal joint. The output shaft of the third drive assembly is connected to the ejector pin assembly. The third drive assembly is used to drive the ejector pin assembly to rotate, thereby adjusting the rotation angle of the ejector pin structure and the angle of the wafer on the ejector pin structure.

[0015] In some embodiments, the wafer disk includes a movable wafer disk, a first traverse assembly, and a second traverse assembly; a fixed body of the first traverse assembly is mounted on the rack, the movable wafer disk and the fixed body of the second traverse assembly are mounted on a movable body of the first traverse assembly, the movable body of the first traverse assembly moves relative to the rack in a first direction to adjust the position of the movable wafer disk and the second traverse assembly in the first direction; the movable wafer disk is mounted on the movable body of the second traverse assembly, the movable body of the second traverse assembly moves relative to the rack in a second direction to adjust the position of the movable wafer disk and the second traverse assembly in the first direction.

[0016] In some embodiments, the frame includes a fixed platform and a vertical frame, the vertical frame being mounted on the fixed platform, the fixed platform being inclined relative to a horizontal axis, and an adjustable angle being formed between the fixed platform and the horizontal axis.

[0017] This utility model also proposes a die bonding device, which includes a wafer mounting mechanism.

[0018] The technical solution of this utility model adopts a method in which the wafer disk, flipping group and the chip mounting group of the chip picking and mounting mechanism are continuously distributed along a first spatial axis. The first spatial axis is inclined relative to the horizontal plane and is set at an adjustable angle, so that multiple mechanisms can be arranged inclinedly along a diagonal line on the rack, thereby reducing the waste of longitudinal space caused by the linear layout on the horizontal plane. In addition, the inclined setting of the chip picking and mounting mechanism reduces the height of the chip picking and mounting mechanism, thereby reducing the difficulty of inspection and maintenance for operators. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A schematic diagram of an embodiment of the die bonding device provided by this utility model; Figure 2 A schematic diagram of the structure of the die bonding device provided by this utility model in another view of the following embodiment; Figure 3 A partial structural schematic diagram of an embodiment of the die bonding device provided by this utility model; Figure 4 for Figure 3 A magnified view of a section at point H in the middle; Figure 5 A schematic diagram of the structure of a wafer disk and flipping assembly in the die bonding equipment provided by this utility model; Figure 6 for Figure 5 A magnified view of a section at point G in the middle; Figure 7 A schematic diagram of an embodiment of the die bonding equipment provided by this utility model, in which the fixed stage is parallel to the horizontal axis; Figure 8 A schematic diagram of an embodiment of the die bonding equipment provided by this utility model, in which the fixing stage is tilted relative to the horizontal axis; Figure 9 This is a schematic diagram of the structure of several embodiments of the die bonding equipment provided by this utility model.

[0021] Explanation of icon numbers: 100. Die bonding equipment; A. First spatial axis; 10. Frame; 11. Fixing table; 12. Stand; 13. Mounting bracket; 20. Die-attaching mechanism; 21. Wafer disk; 22. Moving wafer disk; 211. First transverse shift assembly; 2111. Fixing body of the first transverse shift assembly; 2112. Movable body of the first transverse shift assembly; 212. Second transverse shift assembly; 2121. Fixing body of the second transverse shift assembly; 2122. Movable body of the second transverse shift assembly; 213. Wafer; 214. Ejector pin assembly; 22. Tilting assembly; 221. Rotating arm; 2211. First rotating arm; 2212. Second rotating arm; 2123. First suction nozzle; 222. First drive assembly; 23. Patch assembly; 24. Binding arm; 241. First binding arm; 242. Second binding arm; 243. Third binding arm; 240. Second nozzle; 25. Second drive assembly; 251. Tilting drive; 252. Lifting drive; 253. Rotation drive; 26. Third drive component; 51. First video camera; 52. Second video camera.

[0022] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0024] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0025] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0026] Die bonding equipment is used in semiconductor packaging and LED manufacturing, and its main function is to fix the wafer onto the substrate.

[0027] Existing die bonding equipment is equipped with wafer platforms, transfer mechanisms, and mounting mechanisms. These mechanisms are mostly arranged vertically on the vertical plane of the rack or linearly on the horizontal plane of the rack, resulting in insufficient flexibility in spatial layout and low space utilization.

[0028] This utility model proposes a wafer 213 mounting mechanism. Please refer to [link / reference]. Figure 1 , Figure 7 and Figure 8 The wafer 213 mounting mechanism proposed in this utility model includes: a frame 10 and a wafer picking and mounting mechanism 20. The wafer picking and mounting mechanism 20 is mounted on the frame 10. The wafer picking and mounting mechanism 20 includes a wafer disk 21, a flipping group 22 and a mounting group 23 continuously distributed along a first spatial axis A. The first spatial axis A is inclined relative to the horizontal plane and is set at an adjustable angle.

[0029] The technical solution of this utility model adopts a method in which the wafer disk 21, flip group 22 and patch group 23 of the chip picking and patching mechanism 20 are continuously distributed along the first spatial axis A. The first spatial axis A is inclined relative to the horizontal plane and is set at an adjustable angle, so that multiple mechanisms can be arranged inclinedly along a diagonal line on the frame 10, thereby reducing the waste of longitudinal space caused by the linear layout on the horizontal plane. In addition, the inclined setting of the chip picking and patching mechanism 20 reduces the height of the chip picking and patching mechanism 20, thereby reducing the difficulty of inspection and maintenance by operators.

[0030] Please see Figure 1 , Figure 7 and Figure 8 To allow for more flexible placement of the chip mounting mechanism 20, the first spatial axis A is inclined relative to the horizontal plane at an adjustable angle. The included angle ∠h is greater than or equal to 60 degrees and less than or equal to 120 degrees.

[0031] In one embodiment, the included angle ∠h is designed to be adaptively adjustable by ±30 degrees based on a reference angle. When the reference angle is 90 degrees, the adjustment range of the included angle ∠h covers 60 to 120 degrees. This adjustable angle design allows the die-attaching mechanism 20 to overcome the limitations of traditional vertical layouts and be arranged on an inclined plane forming an acute or obtuse angle with the horizontal plane. Specifically, when the included angle ∠h is in the range of 60 to 90 degrees, the die-attaching mechanism 20 can be arranged on an inclined die-attaching plane extending from the upper left to the horizontal plane. In this case, the die-attaching plane forms an acute angle with the horizontal plane. At this time, the positions of the wafer disk 21, the flip group 22, and the attach group 23 of the die-attaching mechanism 20 can be arranged in a descending order from the upper left towards the horizontal plane.

[0032] When the included angle ∠h is in the range of 90 degrees to 120 degrees, the chip mounting mechanism 20 can be arranged on an inclined plane from the upper right to the horizontal plane. At this time, the wafer disk 21 is located at the highest point, that is, at the upper right, the flipping group 22 is next, and the mounting group 23 is located at the lowest point, close to the horizontal plane.

[0033] By tilting the die-attachment plane of the die-attachment mechanism 20, vertical space can be saved. When the die-attachment mechanism 20 is arranged vertically in the longitudinal plane, it becomes too tall, making inspection and maintenance difficult for operators. This invention tilts the die-attachment plane of the die-attachment mechanism 20, reducing the overall height of the die-bonding equipment 100 and simplifying inspection and maintenance for operators.

[0034] An angle greater than or equal to 60 degrees and an angle less than or equal to 120 degrees can reduce the problems of the chip picking and mounting mechanism 20 being too compact and crowded with the mechanism placed on the horizontal plane, the easy interference between multiple components, and the increased maintenance difficulty caused by an angle that is too small.

[0035] Please see Figure 3 , Figure 4 and Figure 7 The flipping assembly 22 is mounted at an angle on the rack 10. The flipping assembly 22 has at least one rotating arm 221. The rotating arm 221 is configured to receive the wafer 213 from the wafer disk 21 and flip to change its position so that the rotating arm 221 is flipped from the pick position facing the wafer disk 21 to the place position facing the place assembly 23, so as to transfer the wafer 213 to the place assembly 23.

[0036] As the core module in the chip pick-and-place mechanism 20, the flip group 22 realizes the spatial orientation transformation of the chip 213. The core function of the flip group 22 is to complete the transfer of the chip 213 from the wafer disk 21 to the placement group 23 through the flipping action.

[0037] Specifically, the flipping assembly 22 achieves the position and orientation change of the wafer 213 through the rotational movement of at least one rotating arm 221: when the wafer 213 on the wafer disk 21 is picked up, the rotating arm 221 first receives the wafer 213 at the pick-up position facing the wafer disk 21, at which time the surface of the wafer 213 is usually facing upward to adapt to the loading posture of the wafer disk 21; then the rotating arm 221 rotates a certain angle around its pivot to move the wafer 213 from the pick-up position to the mounting position facing the mounting assembly 23, during which the surface of the wafer 213 is facing downward to match the requirements of the mounting assembly 23 for the die bonding posture.

[0038] Please see Figure 3 , Figure 4 and Figure 5To eliminate the time gap in single-arm designs where one action must be completed before the next can begin, the flipping assembly 22 includes a first rotating arm 2211 and a second rotating arm 2212. The flipping assembly 22 also includes a first driving component 222. The first rotating arm 2211 and the second rotating arm 2212 are arrayed on the output shaft of the first driving component 222. Both the first rotating arm 2211 and the second rotating arm 2212 are equipped with first suction nozzles 2213. One of the first rotating arm 2211 and the second rotating arm 2212 is positioned towards the wafer disk 21 to pick up the wafer 213 from the wafer disk 21, while the other is positioned towards the mounting group 23 to transfer the wafer 213 to the mounting group 23. The first driving component 222 drives the first rotating arm 2211 and the second rotating arm 2212 to rotate around the output shaft of the first driving component 222, causing the first rotating arm 2211 to rotate to the mounting position and the second rotating arm 2212 to rotate to the pickup position.

[0039] Specifically, the first rotating arm 2211 and the second rotating arm 2212 are arranged in a symmetrical array on the output shaft of the first driving assembly 222. When the first rotating arm 2211 is in the pick-up position facing the wafer disk 21, the suction nozzle at the end of the first rotating arm 2211 picks up the wafer 213 on the wafer disk 21. At the same time, the second rotating arm 2212 is located in the placement position facing the placement group 23 to transfer the wafer 213 picked up in the previous cycle to the placement group 23. Driven by the first driving assembly 222, the output shaft drives the first rotating arm 2211 and the second rotating arm 2212 to rotate synchronously, so that the positions and functions of the two rotating arms 221 are interchanged. The first rotating arm 2211, which originally picked up the wafer 213, turns to the placement position to perform wafer 213 transfer, while the second rotating arm 2212 turns to the pick-up position to prepare for the next round of wafer 213 pick-up. This alternating operation mode enables seamless integration of the die picking and chip mounting processes, eliminating the time gaps that require waiting for one action to be completed before the next action can begin, as is present in single-arm designs.

[0040] In one embodiment, the first driving component 222 is a motor. Both the first rotating arm 2211 and the second rotating arm 2212 are provided with a first suction nozzle 2213. The first suction nozzle 2213 has a built-in independent vacuum channel for adsorbing the wafer 213 at the pickup position. The first suction nozzle 2213 is located on the first rotating arm 2211 and is inclined relative to the first rotating arm 2211. The first suction nozzle 2213 is correspondingly arranged with the ejector pin structure mounted on the wafer disk 21. The first suction nozzle 2213 and the ejector pin structure are on the same axis to ensure that the first suction nozzle 2213 adsorbs the wafer 213 on the ejector pin structure.

[0041] Further, please refer to Figure 4 , Figure 7 and Figure 8The die bonding apparatus 100 also includes a first vision camera 51 and a second vision camera 52. The first vision camera 51 captures images of the wafer 213 on the wafer disk 21 to determine the position of the wafer 213 on the wafer disk 21 using an algorithm. The method for determining the position of the wafer 213 on the wafer disk 21 using the algorithm can be an existing analytical calculation method. The second vision camera 52 captures images of the position of the wafer 213 adsorbed by the first suction nozzle 2213 of the first rotating arm 2211. Both the first vision camera 51 and the second vision camera 52 can be CCD or CMOS.

[0042] In order to achieve precise placement of the chip 213, the chip group 23 is configured to receive the chip 213 from the flip group 22 and, through rotation and spatial pose transformation, convert the chip 213 from the pick-up posture to the placement posture.

[0043] The chip assembly 23 has a bonding arm 24, which has a receiving position, a rotation position, and a placement position during the flipping process. When the bonding arm 24 rotates to the receiving position, it receives the chip 213 from the flipping assembly 22; when it rotates to the rotation position, it can rotate a certain angle to adjust the placement posture of the chip 213; when it rotates to the placement position, it descends to attach the chip 213 to the substrate unit 42 on the feed assembly 40.

[0044] Specifically, the placement group 23 is used to convert the wafer 213 from the pick-up posture to the placement posture. When the placement group 23 receives the wafer 213 from the flip group 22, the bonding arm 24 on the placement group 23 first picks up the wafer 213, and then the bonding arm 24 of the placement group 23 flips to the self-rotation position, driving the wafer 213 to rotate around the normal direction of the wafer 213 by a certain angle, so that the placement posture of the wafer 213 is corrected, which can ensure that the electrode direction of the wafer 213 matches the pad pattern on the substrate unit 42; then, the bonding arm 24 continues to flip to the placement position to place the wafer 213 onto the substrate unit 42 on the pull group 40.

[0045] Please see Figure 3 , Figure 4 and Figure 9 The patch assembly 23 includes a rotating arm assembly and a second drive assembly 25. The rotating arm assembly includes at least two binding arms 24, and can be extended to six binding arms 24. At least one binding arm 24 is equipped with a rotation drive 253, and the binding arm 24 is equipped with a second suction nozzle 240. The second drive assembly 25 includes a tilt drive 251, a lifting drive 252, and a rotation drive 253. The tilt drive 251 drives the rotating arm assembly to tilt, the rotation drive 253 controls the second suction nozzle 240 to rotate about its axis, and the lifting drive 252 drives the second suction nozzle 240 to move in the height direction.

[0046] At least two binding arms 24 are arranged in an array on the output shaft of the flip drive 251, which is used to drive the at least two binding arms 24 to flip.

[0047] Optionally, the mounting assembly 23 is provided with two bonding arms 24, which are symmetrically distributed at 180 degrees. The two bonding arms 24 are driven by the flipping drive 251 of the second drive assembly 25 to perform a reciprocating flipping motion around the horizontal axis from 0 degrees to 180 degrees. The second nozzle 240 of one bonding arm 24 receives the wafer 213 transferred from the flipping assembly 22 at the receiving position, and the second nozzle 240 of the other bonding arm 24 can perform the action of pressing the wafer 213 at the mounting position.

[0048] In one embodiment, please refer to Figure 4 and Figure 9 When the placement group 23 adopts a circumferential layout with three bonding arms divided into 120-degree sections, the three bonding arms 24 are evenly distributed on the output shaft of the flip drive 251, spaced 120 degrees apart, forming a stable triangular symmetrical structure. This allows each bonding arm 24 to sequentially pass through the three key stations—receiving position, rotation position, and placement position—during rotation, achieving a continuous and uninterrupted wafer 213 placement cycle. When the second nozzle 240 of the first bonding arm 241 completes the wafer 213 handover with the flip group 22 at the receiving position, the second nozzle 240 of the second bonding arm 242 is fine-tuning the wafer 213 placement posture at the rotation position, while the second nozzle 240 of the third bonding arm 243 simultaneously performs the wafer 213 pressing action at the placement position. The operations of the three stations—receiving position, rotation position, and placement position—can be performed simultaneously to improve the working efficiency of the placement group 23. Among them, the bonding arms 24 on the chip assembly 23 can all be piezoelectric ceramic arms, so as to achieve micron-level position adjustment, so that the position of the wafer 213 falling or the fine adjustment of the wafer 213 mounting posture can be adjusted at the micron level.

[0049] Please refer to Figure 4 and Figure 5The flipping group 22 adopts a symmetrical layout of two rotating arms 221 degrees. When the first nozzle 2213 of the first rotating arm 2211 completes the tilting pickup of the wafer 213 of the ejector pin structure, the first nozzle 2213 of the second rotating arm 2212 simultaneously receives the displacement wafer 213 in the patch group 23. The first rotating arm 2211 and the second rotating arm 2212 work alternately in half rotation through the first drive component 222, which shortens the waiting time of using single-arm flipping. The three bonding arms of the chip assembly 23 are arranged in a 120-degree circular array and cooperate with the flip assembly 22: when the rotating arm 221 of the flip assembly 22 transfers the wafer 213 to the receiving position of the chip assembly 23, one bonding arm 24 in the chip assembly 23 is in the receiving position, the second nozzle 240 of the other bonding arm 24 performs wafer 213 attitude compensation from 0 degrees to 360 degrees in the self-rotation position, and the second nozzle 240 of the third bonding arm 243 descends and presses at the placement position to attach the wafer 213 to the substrate unit 42. The chip assembly 23 and the flip assembly 22 can work in sequence in time, which improves the working efficiency of the die bonding equipment 100.

[0050] Please see Figure 2 , Figure 5 and Figure 6 The wafer disk 21 is configured such that the wafer disk 21 moves in one or both of the first and second directions in the rack 10 to adjust the position of the wafer disk 21 in the rack 10; the wafer disk 21 is tilted outward relative to the rack 10 and has a rotation angle relative to the horizontal axis.

[0051] The first direction is the Y-axis direction, and the second direction is the X-axis direction. The rotation angle ∠f of the wafer disk 21 relative to the horizontal axis is less than or equal to 30 degrees.

[0052] Please see Figure 5 and Figure 6 The wafer disk 21 includes a movable wafer disk 22, a first transverse component 211, and a second transverse component 212. The fixed body 2111 of the first transverse component is mounted on the frame 10, and the fixed body 2121 of the movable wafer disk 22 and the second transverse component is mounted on the movable body 2112 of the first transverse component. The movable body 2112 of the first transverse component moves relative to the frame 10 in a first direction to adjust the position of the movable wafer disk 22 and the second transverse component 212 in the first direction. The movable wafer disk 22 is mounted on the movable body of the second transverse component 212, and the movable body of the second transverse component 212 moves relative to the frame 10 in a second direction to adjust the position of the movable wafer disk 22 and the second transverse component 212 in the first direction.

[0053] Specifically, please refer to Figure 5 and Figure 6The wafer disk 21 includes a movable wafer disk 22, a first transverse sliding assembly 211, and a second transverse sliding assembly 212. The fixed body 2111 of the first transverse sliding assembly is mounted on the support frame 12. The movable wafer disk 22 and the fixed body 2121 of the second transverse sliding assembly are mounted on the movable body 2112 of the first transverse sliding assembly. The movable body 2112 of the first transverse sliding assembly moves relative to the support frame 12 along a first direction to adjust the position of the movable wafer disk 22 and the second transverse sliding assembly 212 in the first direction. The movable wafer disk 22 is mounted on the movable body of the second transverse sliding assembly 212. The movable body of the second transverse sliding assembly 212 moves relative to the support frame 12 along a second direction to adjust the position of the movable wafer disk 22 and the second transverse sliding assembly 212 in the first direction. The wafer disk 21 can move in the first and second directions to adjust its position. The first direction is the Y-axis direction, and the second direction is the X-axis direction. Both the first transverse sliding assembly 211 and the second transverse sliding assembly can be configured as sliders and slide rails.

[0054] In some embodiments, the first suction nozzle 2213 has a built-in independent vacuum channel, and the first suction nozzle 2213 is movably mounted on the first rotating arm 2211 and is inclined relative to the first rotating arm 2211.

[0055] Please see Figure 4 , Figure 7 and Figure 8 The wafer disk 21 is equipped with a push pin assembly 214, which includes a top cap and a push pin structure. The push pin structure is located inside the top cap and extends out relative to the top cap to push out the wafer 213. The push pin structure is arranged facing the first suction nozzle 2213, and the push pin structure and the first suction nozzle 2213 are arranged on the same axis. The first suction nozzle 2213 is used to pick up the wafer 213 on the push pin structure.

[0056] The ejector pin structure is connected to a piezoelectric micro-displacement actuator, which controls the ejection force of the ejector pin structure. The ejection force of the ejector pin structure can be controlled from 0.5N to 5N.

[0057] Specifically, the ejector assembly 214 includes a top cap and an ejector structure, with the ejector structure located inside the top cap. The ejector structure can eject the wafer 213 at a high frequency. A first suction nozzle 2213 on the first rotating arm 2211 vacuum-picks up the wafer 213. The first suction nozzle 2213 has a built-in independent vacuum channel for adsorbing the wafer 213 at the pickup position. The first suction nozzle 2213 is located on the first rotating arm 2211 and is inclined relative to it. The first suction nozzle 2213 is correspondingly positioned to the ejector structure. The first suction nozzle 2213 and the ejector assembly 214 are on the same axis to ensure that the first suction nozzle 2213 adsorbs the wafer 213 onto the ejector structure. This invention ensures that the central axis of the first suction nozzle 2213 coincides with the ejection direction of the ejector structure by tilting the first suction nozzle 2213 and making the ejector structure tiltable and rotatable, thereby ensuring that the adsorption force of the first suction nozzle 2213 acts perpendicularly on the central plane of the wafer 213. After the first suction nozzle 2213 completes adsorption, the ejector pin structure immediately retracts below the top cap plane, and the first suction nozzle 2213 carries the wafer 213 and performs a flipping action with the first rotating arm 2211.

[0058] In some embodiments, the frame 10 is equipped with a rotation adjustment mechanism, which includes a universal joint and a third drive assembly 26. The universal joint is mounted on the frame 10, and the third drive assembly 26 is disposed on the universal joint. The output shaft of the third drive assembly 26 is connected to the ejector pin assembly 214. The third drive assembly 26 is used to drive the ejector pin assembly 214 to rotate, so as to adjust the rotation angle of the ejector pin structure and the angle of the wafer 213 on the ejector pin structure.

[0059] The third drive component 26 is a motor. The output shaft of the third drive component 26 is connected to the ejector pin component 214, which allows the ejector pin component 214 to rotate 360 ​​degrees, thereby adjusting the angle of the wafer 213 so that the wafer 213 can be adsorbed by the first suction nozzle 2213 in a uniform contact manner across the entire surface, reducing the occurrence of stress concentration on one side of the wafer 213 or wafer 213 cracking due to angle deviation.

[0060] Please see Figure 1 , Figure 2 and Figure 7 The frame 10 includes a fixed platform 11 and a vertical frame 12. The vertical frame 12 is installed on the fixed platform. The fixed platform 11 is inclined relative to the horizontal axis, and an adjustable angle is formed between the fixed platform 11 and the horizontal axis.

[0061] Please refer to Figures 1 and 2. The frame 10 is also movably mounted with a material pulling group 40. The material pulling group 40 has a material belt 41. The first spatial axis A is along the running direction of the material belt 41. Each material belt 41 has multiple base material units 42. The multiple base material units 42 are arranged in a row to form the material belt 41. The number of material belts 41 is at least two, and the at least two material belts 41 are arranged parallel to each other.

[0062] At least two parallel strips 41 are movably mounted on the rack 10, and this can be extended to four. Each strip 41 consists of multiple substrate units 42 arranged linearly, and all strips 41 move synchronously along the first spatial axis A, i.e., the running direction of the strips 41. The pull assembly 40 can move on the rack 10 perpendicular to the running direction of the strips 41, allowing its position to be adjusted. By adjusting the position of the pull assembly 40, the substrate units 42 on the next row of strips 41 can be moved below the placement assembly 23, so that the placement assembly 23 can mount the wafers 213 onto multiple rows of strips 41.

[0063] The substrate unit 42 can be made of materials such as PET or paper.

[0064] In one embodiment, the chip assembly 23 has three bonding arms 24. When the first bonding arm 241 of the chip assembly 23 rotates to the mounting position, the first bonding arm 241 presses the wafer 213 onto the substrate unit 42 of the first tape 41. At this time, the second bonding arm 242 rotates synchronously at the self-rotation position to adjust the mounting posture of the wafer 213, and the third bonding arm 243 returns to the receiving position to pick up the wafer.

[0065] After the second nozzle 240 of the first bonding arm 241 completes the pressing operation, the first bonding arm 241 flips to the receiving position. During the flipping process of the first bonding group, the material pulling group 40 moves on the Y-axis and can rotate, so that when the second bonding arm 242 flips above the material pulling group 40, the second bonding arm 242 can press the wafer 213 onto the substrate unit 42 of the second strip 41. The second nozzle 240 of the third bonding arm 243 of the placement group 23 rotates in the self-rotation position to adjust the placement posture of the new wafer 213, so that the placement group 23 can place the wafer 213 on multiple rows of strips 41.

[0066] Please refer to Figure 1 , Figure 7 and Figure 8 To ensure that the surface of the wafer disk 21 remains parallel to the strip 41 on the feeding assembly 40, the frame 10 includes a fixed platform 11 and a support frame 12. The support frame 12 is mounted on the fixed platform 11, which is inclined relative to the horizontal axis, forming an adjustable angle between the fixed platform 11 and the horizontal axis. The wafer disk 21 is mounted on the support frame 12 to fix the fixed platform 11. The wafer disk 21 rotates synchronously with the inclination of the fixed platform 11, so that the rotation angle ∠f of the wafer disk 21 relative to the horizontal axis is consistent with the adjustable angle.

[0067] When the mounting stage 11 is tilted, it is tilted relative to the horizontal axis. The wafer disk 21 deflects synchronously with the tilt of the mounting stage 11 to ensure that the ejector pin structure vertically lifts the wafer 213 and the direction of the wafer 213's detachment is orthogonal to the plane of the strip 41. As a result, during the subsequent bonding process of the die assembly 23, the wafer 213 can be uniformly bonded to the strip 41 with full surface contact and then bonded to the substrate unit 42. This reduces the occurrence of stress concentration on one side of the wafer 213 or wafer 213 cracking due to angular deviation. In addition, the bonding position of the wafer 213 to the substrate unit 42 is more accurate, which improves the product yield to 99.7%.

[0068] This utility model also proposes a die bonding device 100, which includes a wafer mounting mechanism. The specific structure of the wafer mounting mechanism is as described in the above embodiments. Since this die bonding device 100 adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0069] The above are merely exemplary embodiments of this utility model and do not limit the scope of protection of this utility model. Any equivalent structural transformations made based on the technical concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the scope of protection of this utility model.

Claims

1. A wafer mounting mechanism, characterized in that, include: frame; A die-picking and mounting mechanism is mounted on the frame. The die-picking and mounting mechanism includes a wafer disk, a flipping group, and a mounting group continuously distributed along a first spatial axis. The first spatial axis is inclined relative to the horizontal plane and is set at an adjustable angle.

2. The wafer mounting mechanism as described in claim 1, characterized in that, The flipping assembly is tilted and mounted on the rack. The flipping assembly has at least one rotating arm. The rotating arm is equipped with a first suction nozzle. The rotating arm is configured to receive the wafer from the wafer disk and flip and change its position so that the rotating arm flips from a pick-up position facing the wafer disk to a placement position facing the placement group, so as to transfer the wafer to the placement group. The chip assembly is configured to receive the chip transferred from the flip assembly and, through rotation and spatial pose transformation, convert the chip from a pick-up posture to a mounting posture.

3. The wafer mounting mechanism as described in claim 2, characterized in that, The flipping assembly includes a first rotating arm and a second rotating arm, and the flipping assembly also includes a first driving component. The first rotating arm and the second rotating arm array are arranged on the output shaft of the first driving component, and the first rotating arm and the second rotating arm are equipped with a first suction nozzle. One of the first rotating arm and the second rotating arm is positioned towards the wafer disk to pick up the wafer from the wafer disk, and the other of the first rotating arm and the second rotating arm is positioned towards the patch assembly to transfer the wafer to the patch assembly; The first driving component is used to drive the first rotating arm and the second rotating arm to rotate around the output shaft of the first driving component, so that the first rotating arm rotates to the patch position and the second rotating arm rotates to the pickup position.

4. The wafer mounting mechanism as described in claim 1, characterized in that, The patch group includes: A rotary arm assembly, the rotary arm assembly including at least two mounting arms, wherein at least one of the mounting arms is equipped with a rotation drive, and the mounting arm is equipped with a second suction nozzle; and The second drive assembly includes a flip drive, a lifting drive, and a rotation drive. The flip drive is used to drive the rotating arm assembly to flip, the rotation drive is used to control the second suction nozzle to rotate around its axis, and the lifting drive is used to drive the second suction nozzle to move in the height direction.

5. The wafer mounting mechanism as described in claim 3, characterized in that, The wafer disk is configured such that it can move along one or both of the first and second directions in the rack to adjust its position in the rack. The wafer disk is tilted outward relative to the rack, and the wafer disk has a rotational angle relative to the horizontal axis.

6. The wafer mounting mechanism as described in claim 5, characterized in that, The first suction nozzle has a built-in independent vacuum channel, and the first suction nozzle is movably mounted on the first rotating arm and is inclined relative to the first rotating arm; The wafer disk is equipped with a push pin assembly, which includes a top cap and a push pin structure. The push pin structure is disposed inside the top cap and extends relative to the top cap to push out the wafer. The ejector pin structure is positioned opposite to the first suction nozzle, and the ejector pin structure and the first suction nozzle are located on the same axis. The first suction nozzle is used to pick up the wafer on the ejector pin structure.

7. The wafer mounting mechanism as described in claim 6, characterized in that, The frame is equipped with a rotation adjustment mechanism, which includes a universal joint and a third drive assembly. The universal joint is mounted on the frame, and the third drive assembly is located on the universal joint. The output shaft of the third drive assembly is connected to the ejector pin assembly. The third drive assembly is used to drive the ejector pin assembly to rotate, thereby adjusting the rotation angle of the ejector pin structure and the angle of the wafer on the ejector pin structure.

8. The wafer mounting mechanism as described in claim 1, characterized in that, The wafer disk includes a movable wafer disk, a first transverse shift assembly, and a second transverse shift assembly; The fixed body of the first transverse component is mounted on the frame, and the fixed body of the movable disk and the second transverse component is mounted on the movable body of the first transverse component. The movable body of the first transverse component moves relative to the frame along a first direction to adjust the position of the movable disk and the second transverse component in the first direction. The movable disk is mounted on the second transverse component movable body, which moves relative to the frame in a second direction to adjust the position of the movable disk and the second transverse component in a first direction.

9. The wafer mounting mechanism as described in any one of claims 1 to 8, characterized in that, The frame includes a fixed platform and a vertical frame. The vertical frame is installed on the fixed platform. The fixed platform is inclined relative to the horizontal axis, and an adjustable angle is formed between the fixed platform and the horizontal axis.

10. A die bonding apparatus, characterized in that, Includes a wafer mounting mechanism as described in any one of claims 1 to 9.

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