Wafer heating device

Abstract

The utility model discloses a kind of wafer heating devices, including main body disc and baffle;Main body disc back is equipped with multiple heating zones distributed from inside to outside radially, each heating zone is equipped with independent heating wire to realize partition independent temperature control;Front surface is equipped with the first fluid cooling flow channel that extends spirally from middle portion and covers each heating zone, flow channel two ends are respectively connected with first inlet hole and first outlet hole, baffle is fixed on the front surface of main body disc to close flow channel, by partition independent heating, different radial area can be dynamically adjusted heating power, while spiral cooling flow channel is passed into cooling medium, central gathered heat is conducted to all around to compensate outer ring heat loss.The utility model is through the combination temperature control means of "partition temperature control+heat conduction compensation", effectively solve the inside and outside temperature difference problem in wafer heating process, significantly improve wafer surface temperature uniformity, applicable to high-precision semiconductor cleaning process.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, and in particular relates to a wafer heating device. Background Technology

[0002] In semiconductor cleaning equipment, many processes need to be carried out under certain temperature conditions. Although existing wafer heating devices can ensure the temperature uniformity of various parts of the wafer surface as much as possible, it is inevitable that the center of the wafer is a heat accumulation area, and heat will accumulate. On the other hand, the outer ring area of ​​the wafer is in direct contact with the air inside the chamber, so the heat in this area can be easily dissipated into the chamber air. Therefore, how to further reduce the temperature difference between the inner and outer rings of the wafer is an urgent problem to be solved. Utility Model Content

[0003] Based on this, a wafer heating device is provided to address the aforementioned technical problems.

[0004] The technical solution adopted in this utility model is as follows:

[0005] A wafer heating device includes a main disk with heating wires on it. The device further includes a baffle. The back of the main disk has multiple heating zones radially distributed from the inside out, each heating zone having an evenly distributed independent heating wire. The front of the main disk has a first fluid cooling channel extending spirally from the center outwards and covering each heating zone. The main disk also has a first inlet and a first outlet. The first inlet communicates with one end of the first fluid cooling channel located in the center of the main disk, and the first outlet communicates with the other end of the first fluid cooling channel. The baffle is disc-shaped and is fixed to the front of the main disk to seal the first fluid cooling channel.

[0006] This invention features a main body with multiple radially distributed heating zones, each equipped with an evenly distributed independent heating wire, allowing for independent heating of each zone and thus enabling individual temperature control of multiple heating zones. Furthermore, the main body also features a spiral-shaped first fluid cooling channel, through which a cooling medium (such as air) flows from the center along the spiral path, transferring heat from the center to the surrounding areas. Thus, through the aforementioned combined temperature control methods, the problem of internal and external temperature differences during wafer heating in the prior art is solved. Attached Figure Description

[0007] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments:

[0008] Figure 1 A three-dimensional structural schematic diagram of a wafer heating device provided in an embodiment of this utility model;

[0009] Figure 2 This is an exploded view of an embodiment of the present utility model;

[0010] Figure 3 This is a schematic diagram of the back of the main body disk in an embodiment of the present utility model;

[0011] Figure 4 This is a schematic diagram of the front structure of the main plate of this utility model embodiment;

[0012] Figure 5 This is a schematic diagram of the heating wire in an embodiment of the present invention;

[0013] Figure 6 This is a schematic diagram of the baffle structure according to an embodiment of the present utility model;

[0014] Figure 7 This is a schematic diagram of the cover plate according to an embodiment of the present utility model;

[0015] Figure 8 This is a schematic diagram of the structure of the first heat-resistant plate in an embodiment of the present utility model;

[0016] Figure 9 This is a schematic diagram of the structure of the second heat-resistant plate in an embodiment of the present invention;

[0017] Figure 10 This is a schematic diagram of the second fluid cooling channel of the second heat-resistant plate in an embodiment of the present invention. Detailed Implementation

[0018] The embodiments of this utility model will be described below with reference to the accompanying drawings. It should be noted that the embodiments described in this specification are not exhaustive and do not represent the only embodiments of this utility model. The following corresponding embodiments are only for clearly illustrating the utility model content of this patent and are not intended to limit its implementation. For those skilled in the art, different variations and modifications can be made based on the described embodiments. Any obvious variations or modifications that fall within the technical concept and utility model content of this utility model are also within the protection scope of this utility model.

[0019] like Figure 1 and Figure 2 As shown in the figure, this application provides a wafer heating device, including a main plate 1100, a cover plate 1200, a heat spreader 1300, a first heat-resistant plate 1400, a second heat-resistant plate 1500, and a temperature sensor 1600.

[0020] In this embodiment, the front side of the wafer heating device faces down and the back side faces up, and it is used to heat the wafer below. Therefore, the front side and back side mentioned below refer to the lower surface and the upper surface, respectively.

[0021] The main body plate 1100 is made of quartz material, and its back has three heating zones distributed radially from the inside out, such as... Figure 3 As shown, each heating zone has heating wire grooves, namely an inner groove 1110, a middle groove 1120, and an outer groove 1130. Independent heating wires are fixed in the inner groove 1110, the middle groove 1120, and the outer groove 1130, respectively, namely an inner heating wire 1111, a middle heating wire 1121, and an outer heating wire 1131. (See [reference]). Figure 5 Each heating wire groove has a multi-turn structure, which allows the heating wire to be evenly distributed in the corresponding heating area.

[0022] like Figure 4 As shown, the front of the main body disk 1100 has a first fluid cooling channel 1140 that extends spirally outward from the center and covers three heating zones. The first fluid cooling channel 1140 is closed by a disc-shaped baffle 1170 located on the front of the main body disk 1100. The baffle 1170 is also made of quartz material. The structure of the baffle 1170 is shown in [reference needed]. Figure 6 .

[0023] The main body disk 1100 also has a first inlet hole 1150 and a first outlet hole 1160. The first inlet hole 1150 is connected to one end of the first fluid cooling channel 1140 located in the middle of the main body disk, and the first outlet hole 1160 is connected to the other end of the first fluid cooling channel 1140. In this embodiment, the first fluid cooling channel is an air-cooled channel.

[0024] Based on the structure of the main body disk 1100, the main body disk 1100 can be heated independently in the inner, middle and outer sections, so that the temperature of the three heating zones can be controlled separately. In addition, the spiral-shaped first fluid cooling channel 1140 introduces air from the center of the main body disk 1100, and the air conducts the heat from the center to the surrounding area to compensate. Thus, the problem of the temperature difference between the inside and outside of the wafer when it is heated in the prior art is solved by the above-mentioned combined temperature control method.

[0025] like Figure 2 As shown, the second heat-resistant plate 1500, the first heat-resistant plate 1400, the main plate 1100, the baffle 1170, the heat-spreading plate 1300 and the cover plate 1200 are arranged from top to bottom.

[0026] The cover plate 1200 is made of quartz and is disc-shaped, and it is located on the front of the baffle 1170.

[0027] The back edge of the cover plate 1200 has multiple retaining nut seats 1210, see [reference]. Figure 7 .

[0028] The heat spreader 1300 is made of graphene, and there are three of them. They are arranged radially, corresponding one above the other to the three heating zones. Each heat spreader 1300 is annular. (See attached image.) Figure 7This is used to ensure that the temperature of each heating zone is uniformly conducted downwards in the form of a toroidal surface.

[0029] The first heat-insulating plate 1400 is used to ensure downward heat conduction and upward heat insulation. It is made of ceramic fiber insulation cotton and is located on the back side of the main plate 1100. Figure 8 As shown, it has three pairs of first heating wire lead holes 1410 corresponding to the three heating zones, as well as a second inlet hole 1420 and a second outlet hole 1430. The second inlet hole 1420 and the second outlet hole 1430 correspond vertically to the first inlet hole 1150 and the first outlet hole 1160 of the main body disk 1100, respectively.

[0030] The second heat-insulating plate 1500 further isolates the upward conduction of temperature. It is located on the back side of the first heat-insulating plate 1400. It is fixed to the cover plate 1200 by multiple bolts 1570 passing downward through the first heat-insulating plate 1400, the main plate 1100, and the heat-spreading plate 1300, thereby fixing the second heat-insulating plate 1500, the first heat-insulating plate 1400, the main plate 1100, the heat-spreading plate 1300, and the cover plate 1200 together.

[0031] like Figure 10 As shown, the second heat-resistant plate 1500 has evenly distributed second fluid cooling channels 1510 inside. In this embodiment, the second fluid cooling channels 1510 are water-cooled channels. In this embodiment, the second heat-resistant plate 1500 is composed of two plates, upper and lower, joined together. The second fluid cooling channels 1510 are located on the front of the upper plate and are closed by the lower plate.

[0032] like Figure 9 and Figure 10 As shown, the second heat-resistant plate 1500 also has three pairs of second heating wire leads 1520, a third inlet 1530 and a third outlet 1540, and a fourth inlet 1550 and a fourth outlet 1560, which correspond one-to-one with the three pairs of first heating wire leads 1410.

[0033] Among them, the three first heating wire lead hole pairs 1410 and the three second heating wire lead hole pairs 1520 constitute three heating wire lead channel pairs corresponding to the inner ring heating wire 1111, the middle ring heating wire 1121 and the outer ring heating wire 1131, respectively. Each heating wire lead channel pair consists of two channels, which lead out the positive and negative terminals of the corresponding heating wires, respectively.

[0034] The third inlet hole 1530 and the third outlet hole 1540 correspond vertically to the second inlet hole 1420 and the second outlet hole 1430, respectively. The first inlet hole 1150, the second inlet hole 1420, the third inlet hole 1530, the first outlet hole 1160, the second outlet hole 1430, and the third outlet hole 1540 constitute the fluid inlet channel and the fluid outlet channel of the first fluid cooling channel 1140. The first inlet connector 1710 and the first outlet connector 1720, respectively, are fixed on the back of the second heat shield 1500. See Figure 1 .

[0035] like Figure 10 As shown, the fourth inlet hole 1550 and the fourth outlet hole 1560 are respectively connected to the second fluid cooling channel 1510 for fluid inflow and outflow.

[0036] The fourth inlet hole 1550 and the fourth outlet hole 1560 are respectively provided with a second inlet connector 1810 and a second outlet connector 1820 fixed on the back of the second heat shield 1500, see [reference]. Figure 1 .

[0037] like Figure 1 As shown, there are three temperature sensors 1600, which are fixed on the back of the second heat-resistant plate 1500 and extend from top to bottom to the corresponding heating zone to detect the temperature of each heating zone, so as to facilitate zoned temperature control of each heating zone.

[0038] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A wafer heating device, comprising a main disk, wherein a heating wire is disposed on the main disk, characterized in that, It also includes a baffle. The back of the main body disk has multiple heating zones radially distributed from the inside out. Each heating zone is provided with an evenly distributed independent heating wire. The front of the main body disk has a first fluid cooling channel that extends spirally from the center outward and covers each heating zone. The main body disk also has a first inlet and a first outlet. The first inlet is connected to one end of the first fluid cooling channel located in the middle of the main body disk, and the first outlet is connected to the other end of the first fluid cooling channel. The baffle is disc-shaped and is fixed to the front of the main body disk to close the first fluid cooling channel.

2. The wafer heating device according to claim 1, characterized in that, The back of the main plate has three heating zones that are radially distributed from the inside out.

3. The wafer heating device according to claim 2, characterized in that, Each heating zone has a heating wire groove for arranging the corresponding heating wires.

4. The wafer heating device according to claim 1, characterized in that, It also includes a disc-shaped cover plate fixed to the front of the baffle, and a plurality of heat spreaders are provided between the baffle and the cover plate, which correspond one-to-one with the plurality of heating zones and are arranged radially in sequence.

5. A wafer heating device according to claim 4, characterized in that, The heat spreader is a heat spreader made of graphene.

6. A wafer heating device according to claim 1, characterized in that, It also includes a first heat-resistant plate, which is fixed to the back side of the main plate. The first heat-resistant plate has multiple pairs of first heating wire lead holes corresponding to multiple heating zones, as well as a second inlet hole and a second outlet hole. The second inlet hole and the second outlet hole correspond vertically to the first inlet hole and the first outlet hole, respectively.

7. A wafer heating device according to claim 6, characterized in that, The first heat-insulating plate is made of ceramic fiber insulation cotton.

8. A wafer heating device according to claim 6, characterized in that, It also includes a second heat-resistant plate, which is fixed to the back side of the first heat-resistant plate. The second heat-resistant plate has evenly distributed second fluid cooling channels inside. The second heat-resistant plate also has multiple pairs of second heating wire lead holes that correspond one-to-one with multiple pairs of first heating wire lead holes, a third inlet hole and a third outlet hole, and a fourth inlet hole and a fourth outlet hole. The third inlet hole and the third outlet hole correspond one-to-one with the second inlet hole and the second outlet hole, respectively. The fourth inlet hole and the fourth outlet hole are respectively connected to the second fluid cooling channels.

9. A wafer heating device according to claim 8, characterized in that, It also includes multiple temperature sensors that correspond one-to-one with multiple heating zones. The multiple temperature sensors are fixed to the back of the second heat-resistant plate and extend from top to bottom to the corresponding heating zone.

10. A wafer heating device according to claim 4, characterized in that, The main plate is made of quartz, the baffle is made of quartz, and the cover is made of quartz.

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