Tray-type cleaning machine

Abstract

The utility model relates to a kind of slot type cleaning machine platform, relate to the technical field of semiconductor preparation, the slot type cleaning machine platform provides wafer cleaning tank, clamping device and heat pressure generation device.The clamping device's grab clamps wafer, and through the bearing portion of mutual connection moves wafer to wafer cleaning tank and carries out wafer cleaning, heat pressure generation device is set in the side of bearing portion facing wafer cleaning tank, when wafer cleaning liquid in cleaning liquid mist rises, heat pressure generation device generates heat pressure, so that the side of bearing portion facing wafer cleaning tank barometric pressure increases, inhibits cleaning liquid mist rising, avoids the condensation of cleaning liquid on bearing portion, further avoid the damage of cleaning liquid to wafer when wafer is clamped, ensure the performance of wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, and in particular to a tank-type cleaning machine. Background Technology

[0002] With the rapid advancement of semiconductor manufacturing processes, wafer cleaning technology has become increasingly important. Wafer cleaning processes are divided into tank cleaning machines and single-wafer cleaning machines. Tank cleaning machines are among the most widely used cleaning machines currently available.

[0003] During the tank cleaning process, after the first batch of wafers is processed, the cleaning solution in the wafer cleaning tank may partially condense on the clamping device due to high temperature evaporation. This can cause the cleaning solution to drip onto the second batch of wafers when the clamping device retrieves them, resulting in premature etching of the wafers or defects such as particulate contaminants, which can affect wafer performance. Utility Model Content

[0004] Therefore, it is necessary to provide a tank-type cleaning machine to address the problem of wafer defects caused by chemical solutions.

[0005] To achieve the above objectives, this utility model provides a tank-type cleaning machine, comprising:

[0006] A wafer cleaning tank is used to hold wafer cleaning solution;

[0007] A clamping device is located on one side of the wafer cleaning tank. The clamping device includes a support part and a gripping part connected to each other. The gripping part is used to clamp the wafer, and the support part is used to move the wafer so that the wafer is positioned opposite to the wafer cleaning tank.

[0008] A hot-pressing device is located on the side of the support portion facing the wafer cleaning tank, and is used to generate hot pressure.

[0009] In one embodiment, the tank-type cleaning machine further includes:

[0010] An air jet device is located on the side of the support unit facing the wafer cleaning tank, and is used to jet air onto one side of the wafer cleaning tank.

[0011] In one embodiment, the trough cleaning machine includes one of the aforementioned thermostatic generating devices, and the jetting device includes a plurality of jet nozzles;

[0012] Multiple jet nozzles surround the thermo-pressure generating device.

[0013] In one embodiment, the trough-type cleaning machine includes a plurality of the aforementioned thermostatic generating devices, and the jetting device includes a plurality of jet nozzles;

[0014] The jet nozzles and the thermostatic generating device are arranged in an alternating array.

[0015] In one embodiment, the hot-pressing device includes an infrared lamp.

[0016] In one embodiment, the tank-type cleaning machine further includes:

[0017] An exhaust device is located on the side of the wafer cleaning tank away from the bottom surface and is sleeved with the wafer cleaning tank to exhaust the gas inside the wafer cleaning tank.

[0018] In one embodiment, the exhaust device includes a housing and at least one exhaust port disposed on the housing, the exhaust port being located on the side wall of the housing.

[0019] In one embodiment, the exhaust device includes two exhaust ports arranged opposite to each other.

[0020] In one embodiment, the tank-type cleaning machine further includes:

[0021] An extraction device is located on one side of the exhaust device and is used to extract the gas discharged by the exhaust device.

[0022] In one embodiment, the wafer cleaning tank further includes:

[0023] A cover plate is used to open or close the wafer cleaning tank on the side of the wafer cleaning tank facing the clamping device.

[0024] Compared with existing technologies, the above technical solution has the following unexpected technical effects:

[0025] This tank-type cleaning machine provides a wafer cleaning tank, a clamping device, and a thermostatic generator. The clamping device holds the wafer in its gripper section and moves it into the wafer cleaning tank via an interconnected support section. The thermostatic generator is located on the side of the support section facing the wafer cleaning tank. When the cleaning solution mist rises, the thermostatic generator generates heat pressure, increasing the air pressure on the side of the support section facing the wafer cleaning tank. This suppresses the rising of the cleaning solution mist, preventing condensation of the cleaning solution on the support section and further avoiding damage to the wafer during clamping, thus ensuring wafer performance. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of the structure of a tank-type cleaning machine provided in an embodiment of this application;

[0028] Figure 2 This is a front view of a clamping device provided in an embodiment of this application;

[0029] Figure 3 This is a side view of a clamping device provided in an embodiment of this application;

[0030] Figure 4 A schematic diagram of the arrangement structure of a thermopressurizing device and an air jet provided in an embodiment of this application;

[0031] Figure 5 A schematic diagram of another arrangement of the hot pressure generating device and the jet nozzle provided in an embodiment of this application;

[0032] Figure 6 This is a schematic diagram of the structure of an exhaust device provided in an embodiment of this application;

[0033] Figure 7 This is a schematic cross-sectional view of a trough-type cleaning machine provided in an embodiment of this application.

[0034] Explanation of reference numerals in the attached drawings: 01-Wafer cleaning tank; 02-Clamping device; 021-Bearing part; 022-Gripping part; 03-Wafer; 04-Hot pressing device; 05-Air jet device; 051-Air jet nozzle; 06-Exhaust device; 061-House; 062-Exhaust port. Detailed Implementation

[0035] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0037] It should be understood that when a layer is referred to as "on," "adjacent to," or "connected to" other layers, it can be directly on, adjacent to, or connected to other layers, or there can be intervening layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," or "directly connected to" other layers, there are no intervening layers.

[0038] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0039] Based on the background information, a tank-type wafer cleaning machine consists of a wafer cleaning tank, a water tank, and a drying tank. Wafers are transferred to each tank for processing via a clamping device. During the wafer cleaning process, when the first batch of products finishes processing or is about to enter the chemical tank, a large amount of cleaning fluid mist diffuses upwards due to the high temperature of the wafer cleaning tank. This mist condenses into droplets on the clamping device above the wafer cleaning tank. When the clamping device retrieves the waiting second batch of products, these droplets may fall onto the second batch of wafers, causing premature etching or introducing defects such as particulate contaminants, thus affecting wafer performance.

[0040] Based on this, this application provides a tank-type cleaning machine, which includes a wafer cleaning tank, a clamping device, and a hot-pressing device. The clamping device grips the wafer and moves it into the wafer cleaning tank via an interconnected support portion for cleaning. The hot-pressing device is located on the side of the support portion facing the wafer cleaning tank. When the cleaning fluid mist rises, the hot-pressing device generates hot pressure, increasing the air pressure on the side of the support portion facing the wafer cleaning tank. This suppresses the rise of the cleaning fluid mist, preventing condensation of the cleaning fluid on the support portion, further avoiding damage to the wafer during clamping, and ensuring wafer performance.

[0041] To make the above-mentioned objectives, features and advantages of this application more apparent and understandable, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0042] refer to Figure 1 , Figure 1 This application provides a schematic diagram of the structure of a tank-type cleaning machine; the tank-type cleaning machine includes:

[0043] Wafer cleaning tank 01 is used to hold wafer cleaning solution;

[0044] The clamping device 02 is located on one side of the wafer cleaning tank 01. The clamping device 02 includes a support part 021 and a gripping part 022 connected to each other. The gripping part 022 is used to clamp the wafer 03, and the support part 021 is used to move the wafer 03 so that the wafer 03 is positioned opposite to the wafer cleaning tank 01.

[0045] The hot pressing generating device 04 is located on the side of the support part 021 facing the wafer cleaning tank 01, and is used to generate hot pressing.

[0046] Specifically, the wafer cleaning solution placed in the wafer cleaning tank 01 is a chemical cleaning solution. It should be noted that the wafer cleaning solution needs to clean the wafer 03 at a specific temperature. Therefore, the heating device in the wafer cleaning tank 01 is used to heat the wafer cleaning solution, thereby accelerating the chemical reaction and improving the cleaning effect.

[0047] The clamping device 02 is used for clamping and moving the wafer 03. The clamping device 02 includes a support portion 021 and a gripping portion 022 connected to each other. It should be noted that the support portion 021 is located on one side of the wafer cleaning tank 01, and the gripping portion 022 is located between the support portion 021 and the wafer cleaning tank 01. The support portion 021 and the gripping portion 022 are connected. After the gripping portion 022 clamps the wafer 03, moving the support portion 021 moves the gripping portion 022, thereby moving the wafer 03 to the upper side of the wafer cleaning tank 01, so that the wafer cleaning tank 01 and the wafer 03 are positioned opposite each other, and then the wafer 03 is moved into the wafer cleaning tank 01 for cleaning.

[0048] It should be noted that when the wafer cleaning tank 01 is used to clean the wafer 03, the wafer 03 is first clamped by the clamping device 02 and moved above the wafer cleaning tank 01. At this time, the wafer cleaning fluid may form a cleaning fluid mist due to heating. The cleaning fluid mist formed by the wafer cleaning fluid in the wafer cleaning tank 01 will come into contact with the clamping device 02 when the clamping device 02 is moved above the wafer cleaning tank 01, and condense into water droplets on the clamping device 02.

[0049] In this application, a hot-press generating device 04 is provided on the side of the carrier 021 facing the wafer cleaning tank 01. The hot-press generating device 04 can generate hot pressure above the wafer cleaning tank 01, suppressing the rise of cleaning fluid mist, preventing the formation of cleaning fluid droplets on the clamping device 02, and further preventing damage to the wafer 03 by cleaning fluid droplets when the clamping device 02 clamps the wafer 03, thus ensuring the performance of the wafer 03.

[0050] In this embodiment, the hot-press generating device 04 is disposed on the side of the support portion 021 facing the wafer cleaning tank 01. When the cleaning liquid mist in the wafer cleaning fluid rises, the hot-press generating device 04 generates hot pressure, which increases the air pressure on the side of the support portion 021 facing the wafer cleaning tank 01, suppressing the rise of the cleaning liquid mist and preventing the cleaning liquid from condensing on the support portion 021. This further prevents damage to the wafer 03 by cleaning liquid droplets when clamping the wafer 03, ensuring the performance of the wafer 03.

[0051] In another embodiment of this application, reference is made to Figure 2 , Figure 2 This is a front view of a clamping device provided in an embodiment of this application; see reference. Figure 3 , Figure 3 This is a side view of a clamping device provided in an embodiment of this application; the trough-type cleaning machine also includes:

[0052] The jetting device 05 is located on the side of the support unit 021 facing the wafer cleaning tank 01, and is used to jet gas onto one side of the wafer cleaning tank 01.

[0053] Specifically, the jetting device 05 is located on the side of the support unit 021 facing the wafer cleaning tank 01, meaning that the jetting device 05 and the hot pressing generating device 04 are located on the same side. It should be noted that the gas ejected by the jetting device 05 can be diffused, so that when the cleaning liquid mist rises, the jetting device 05 ejects gas from the support unit 021 toward one side of the wafer cleaning tank 01, preventing the cleaning liquid mist from spreading upward.

[0054] Meanwhile, since the hot pressure generating device 04 generates hot pressure, the hot airflow generated by the jet device 05, combined with the hot pressure generating device 04, makes it easier to prevent the cleaning fluid mist from rising.

[0055] In this embodiment, an air jet device 05 is provided on the side of the support portion 021 facing the wafer cleaning tank 01, which can further prevent the cleaning liquid mist from rising, thereby avoiding damage to the wafer 03 by the cleaning liquid droplets.

[0056] In another embodiment of this application, reference is made to Figure 4 , Figure 4 A schematic diagram of the arrangement of a hot press generating device and an air jet nozzle provided in an embodiment of this application; the trough-type cleaning machine includes a hot press generating device 04, and the air jet device 05 includes multiple air jet nozzles 051;

[0057] Multiple jet nozzles 051 surround the thermo-pressurizing device 04.

[0058] Specifically, a hot pressure generating device 04 is provided on the side of the support part 021 facing the wafer cleaning tank 01. At this time, the hot pressure generating device 04 can be located in the central area of ​​the support part 021, so that the air pressure on the side of the support part 021 facing the wafer cleaning tank 01 increases, so as to form a central high temperature hot zone between the wafer cleaning tank 01 and the clamping device 02. At this time, the mist in the central high temperature hot zone will diffuse to the edge cold zone, suppressing the rise of cleaning fluid mist.

[0059] The jet device 05 includes multiple jet nozzles 051. At this time, the jet nozzles 051 surround the heat pressure generating device 04, blowing the hot airflow from the central high-temperature hot zone to the edge cold zone, further suppressing the rise of cleaning fluid mist.

[0060] In this embodiment, the hot pressing generating device 04 is located in the middle, and multiple jet nozzles 051 surround the hot pressing generating device 04, which allows the cleaning fluid mist to be discharged to the outer cold area, thereby preventing the cleaning fluid mist from rising and thus preventing the cleaning fluid droplets from damaging the wafer 03.

[0061] In another embodiment of this application, reference is made to Figure 5 , Figure 5 A schematic diagram of another arrangement of hot pressure generating device and jet nozzle provided in an embodiment of this application; the trough cleaning machine includes multiple hot pressure generating devices 04, and the jet device 05 includes multiple jet nozzles 051;

[0062] The jet nozzle 051 and the thermo-pressurizing device 04 are arranged in an alternating array.

[0063] Specifically, a plurality of hot-pressing generating devices 04 are provided on the side of the support portion 021 facing the wafer cleaning tank 01. At this time, the jetting device 05 is provided with a plurality of jet nozzles 051. The plurality of jet nozzles 051 and the plurality of hot-pressing generating devices 04 are arranged in an alternating array. For example, in a first direction, the jet nozzles 051 and the hot-pressing generating devices 04 are arranged alternately; in a second direction, the jet nozzles 051 and the hot-pressing generating devices 04 are arranged alternately. Both the first and second directions are parallel to the plane of the support portion 021, and the first and second directions are perpendicular to each other. It should be noted that the arrangement of the jet nozzles 051 and the hot-pressing generating devices 04 is not specifically limited and can be configured according to specific needs. For example, in the first direction, the jet nozzles 051 can be arranged sequentially, and in the second direction, the jet nozzles 051 and the hot-pressing generating devices 04 can be arranged alternately. Both the first and second directions are parallel to the plane of the support portion 021, and the first and second directions are perpendicular to each other. Alternatively, in the first direction, the hot pressing generating devices 04 are arranged in sequence, and in the second direction, the jet nozzles 051 and the hot pressing generating devices 04 are arranged alternately. Both the first and second directions are parallel to the plane where the bearing part 021 is located, and the first and second directions are set perpendicular to each other.

[0064] In this embodiment, the jet nozzle 051 and the hot pressure generating device 04 are arranged in an alternating array, which allows the hot pressure generated by the hot pressure generating device 04 to be evenly dispersed by the jet nozzle 051, thereby preventing the cleaning liquid mist from rising.

[0065] In another embodiment of this application, the hot pressing generating device 04 includes an infrared lamp.

[0066] Specifically, the thermopressurizing device 04 can be an infrared lamp. When the infrared lamp is powered on, its internal filament or other light-emitting elements are heated to a certain temperature, thereby emitting infrared radiation. Infrared radiation is an electromagnetic wave with a thermal effect. When the environment receives infrared radiation, its molecules vibrate and rotate, intensifying molecular motion and increasing the internal energy of the environment, thus raising the temperature and generating thermopressurization.

[0067] In this embodiment, infrared lamps generate infrared rays, raising the ambient temperature between the wafer cleaning tank 01 and the carrier plate to form a hot-pressing zone, which can prevent the cleaning fluid mist from rising.

[0068] In another embodiment of this application, reference is made to Figure 6 , Figure 6 This is a schematic diagram of the structure of an exhaust device provided in an embodiment of this application; see reference. Figure 7 , Figure 7 This is a cross-sectional structural diagram of a trough-type cleaning machine provided in an embodiment of this application; the trough-type cleaning machine also includes:

[0069] The exhaust device 06 is located on the side of the wafer cleaning tank 01 away from the bottom surface and is sleeved with the wafer cleaning tank 01 to exhaust the gas inside the wafer cleaning tank 01.

[0070] Specifically, the exhaust device 06 is located on the side of the wafer cleaning tank 01 away from the bottom surface and is sleeved with the wafer cleaning tank 01. At this time, the cleaning liquid mist generated in the wafer cleaning tank 01 will be discharged from the exhaust device 06, which prevents the cleaning liquid mist from condensing into water droplets on the clamping device 02.

[0071] In one embodiment, while the hot pressing device 04 suppresses the rise of the cleaning fluid mist, the exhaust device 06 discharges the cleaning fluid mist, which can further prevent the cleaning fluid mist from condensing into water droplets on the clamping device 02.

[0072] In another embodiment, while the hot pressure generating device 04 suppresses the rise of the cleaning fluid mist, the jetting device 05 blows the hot air carrying the cleaning fluid mist toward the exhaust device 06, and the exhaust device 06 discharges the cleaning fluid mist, which can further prevent the cleaning fluid mist from condensing into water droplets on the clamping device 02.

[0073] In this embodiment, the exhaust device 06 can discharge the cleaning fluid mist in a timely manner, reducing the chance of contact between the cleaning fluid mist and the surface of the clamping device 02, and reducing the occurrence of condensation.

[0074] In another embodiment of this application, such as Figure 6 , Figure 7 As shown, the exhaust device 06 includes a housing 061 and at least one exhaust port 062 disposed on the housing 061, the exhaust port 062 being located on the side wall of the housing 061.

[0075] Specifically, the exhaust device 06 includes a housing 061, which can be sleeved with the wafer cleaning tank 01. The sidewall of the housing 061 includes at least one exhaust port 062. In this case, the sidewall of the wafer cleaning tank 01 is located below the sidewall of the exhaust device 06 in the vertical direction. The shape of the exhaust port 062 is not specifically limited; it can be a strip-shaped exhaust port 062 or a dot-shaped exhaust port 062, etc.

[0076] As the cleaning fluid mist rises in the wafer cleaning tank 01, it can be directly discharged from the exhaust port 062 of the exhaust device 06, reducing the possibility of the cleaning fluid mist rising.

[0077] In this embodiment, since the jetting device 05 jets air towards the edge area, and an exhaust port 062 is provided on the side wall of the exhaust device 06, it is easier to discharge the mist from the cleaning device.

[0078] In another embodiment of this application, the exhaust device 06 includes two exhaust ports 062, which are arranged opposite to each other.

[0079] Specifically, the side wall of the housing 061 of the exhaust device 06 includes two exhaust ports 062, located on opposite sides of the housing 061. The exhaust ports 062 can be elongated, creating a slit-jet-like effect that more effectively guides the rising airflow of the mist. This allows the exhaust airflow to form a flat jet area at an angle to the rising direction of the mist, thereby improving mist capture efficiency. Furthermore, the elongated exhaust ports 062 cover a larger area, achieving more efficient and comprehensive mist collection and discharge, resulting in more uniform exhaust.

[0080] In this embodiment, two exhaust ports 062 are arranged opposite each other, which can create a stronger negative pressure area in the area where the fog rises. Compared with a single exhaust port 062, the oppositely arranged exhaust ports 062 can more effectively attract fog to flow towards them, thereby improving the ability to capture and expel fog, and enabling the fog in the space to be discharged more evenly and quickly.

[0081] In another embodiment of this application, the tank-type cleaning machine further includes:

[0082] An air extraction device (not shown in the figure) is located on one side of the exhaust device 06 and is used to extract the gas discharged by the exhaust device 06.

[0083] Specifically, an air extraction device is also provided on one side of the exhaust device 06. It should be noted that when the hot pressure generating device 04 and the jetting device 05 are provided on the side of the bearing part 021 facing the wafer cleaning tank 01, the cleaning liquid mist will flow with the hot air flow to the edge cold area of ​​the wafer cleaning tank 01, and then be discharged directly from the exhaust port 062 of the exhaust device 06.

[0084] At this point, an air extraction device is installed on one side of the exhaust device 06. This air extraction device can further extract the cleaning fluid mist discharged from the exhaust port 062, avoiding pollution of the external environment by the cleaning fluid mist, and improving the efficiency of cleaning fluid mist discharge.

[0085] In another embodiment of this application, the wafer cleaning tank 01 further includes:

[0086] A cover plate (not shown in the figure) is used to open or close the wafer cleaning tank 01 on the side of the wafer cleaning tank 01 facing the clamping device 02.

[0087] Specifically, a cover plate is provided on one side of the wafer cleaning tank 01. When the clamping device 02 moves to the upper side of the wafer cleaning tank 01, the cover plate can open or close the wafer cleaning tank 01. It should be noted that during the wafer 03 cleaning process, it is necessary to prevent external impurities, dust and other contaminants from entering the wafer cleaning tank 01. The cover plate can play an isolation role, preventing airborne particles from falling into the wafer cleaning solution, thereby ensuring the cleanliness of the cleaning environment and avoiding secondary contamination of the wafer 03.

[0088] Furthermore, the wafer cleaning solution in the wafer cleaning tank 01 typically contains volatile chemicals. The cover plate can reduce the evaporation of the wafer cleaning solution, which can reduce the waste of the wafer cleaning solution and save costs on the one hand, and reduce the chemical substances of the wafer cleaning solution that evaporate into the air, thus reducing the impact on the working environment and the health of operators.

[0089] In this embodiment, the cover plate can open and close automatically, and setting the cover plate can improve the cleanliness of wafer cleaning.

[0090] It should be noted that the tank cleaning machine may also include a clamping device 02 cleaning tank. After the first batch of wafers 03 is cleaned, the clamping device 02 can be placed into the clamping device 02 cleaning tank for cleaning. It should be noted that the cleaning clamping assembly can further prevent wafer cleaning fluid from remaining on the clamping device 02.

[0091] In addition, after removing wafer 03 from wafer cleaning tank 01, it needs to be placed in a water tank and a drying tank for further processing. The water tank helps remove impurities from the surface of wafer 03. The drying tank removes any residual moisture from the surface of wafer 03 after cleaning, ensuring that wafer 03 is dry. Heating and ventilation are used to accelerate moisture evaporation, preventing residual moisture from causing water stains or oxidation on the surface of wafer 03.

[0092] By using the tank-type cleaning machine described in this application, the condensation of wafer cleaning fluid mist on the clamping device 02 is avoided, further preventing damage to the wafer 03 by the cleaning fluid when clamping the wafer 03, and ensuring the performance of the wafer 03.

[0093] In the description of this specification, references to terms such as "some embodiments," "another embodiment," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0094] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0095] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A tank-type cleaning machine, characterized in that, include: A wafer cleaning tank is used to hold wafer cleaning solution; A clamping device is located on one side of the wafer cleaning tank. The clamping device includes a support part and a gripping part connected to each other. The gripping part is used to clamp the wafer, and the support part is used to move the wafer so that the wafer is positioned opposite to the wafer cleaning tank. A hot-pressing device is located on the side of the support portion facing the wafer cleaning tank, and is used to generate hot pressure.

2. The tank-type cleaning machine according to claim 1, characterized in that, The tank-type cleaning machine also includes: An air jet device is located on the side of the support unit facing the wafer cleaning tank, and is used to jet air onto one side of the wafer cleaning tank.

3. The tank-type cleaning machine according to claim 2, characterized in that, The trough-type cleaning machine includes a thermostatic generating device, and the jetting device includes multiple jet nozzles. The plurality of jet nozzles surround the thermo-pressure generating device.

4. The tank-type cleaning machine according to claim 2, characterized in that, The trough-type cleaning machine includes multiple heat-generating devices, and the jetting device includes multiple jet nozzles; The jet nozzles and the thermostatic generating device are arranged in an alternating array.

5. The tank-type cleaning machine according to claim 1, characterized in that, The hot-pressing device includes an infrared lamp.

6. The tank-type cleaning machine according to claim 1, characterized in that, The tank-type cleaning machine also includes: An exhaust device is located on the side of the wafer cleaning tank away from the bottom surface and is sleeved with the wafer cleaning tank to exhaust the gas inside the wafer cleaning tank.

7. The tank-type cleaning machine according to claim 6, characterized in that, The exhaust device includes a housing and at least one exhaust port disposed on the housing, the exhaust port being located on the side wall of the housing.

8. The tank-type cleaning machine according to claim 7, characterized in that, The exhaust device includes two exhaust ports, which are arranged opposite to each other.

9. The tank-type cleaning machine according to claim 6, characterized in that, The tank-type cleaning machine also includes: An extraction device is located on one side of the exhaust device and is used to extract the gas discharged by the exhaust device.

10. The tank-type cleaning machine according to claim 1, characterized in that, The wafer cleaning tank also includes: A cover plate is used to open or close the wafer cleaning tank on the side of the wafer cleaning tank facing the clamping device.

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