Labeling jig for avoiding foreign matter adsorption on wafer back surface

Abstract

The utility model provides a kind of label fixture for avoiding wafer back adsorption foreign matter, comprising: base consisting of first area and second area, cut adhesive tape with iron ring and pasted wafer is placed on the first area of base and is positioned and fixed by positioning peg, at this time, wafer is located on the support strip of the second area of base, by changing the shape and height formed by support strip, so that in the front of cut adhesive tape pastes identification label, wafer back cut adhesive tape does not directly contact desktop, so as to eliminate the possibility of wafer back adsorption suspended particle contaminant, so that wafer does not produce hidden crack or fragment when vacuum adsorption in subsequent process, finally improve product yield, reduce economic loss, substantially reduce the failure risk when device is applied.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a labeling fixture that prevents foreign matter from adsorbing onto the back of a wafer. Background Technology

[0002] Semiconductor manufacturing requires the construction of intricate electronic circuit structures on the surface of silicon wafers. As a crucial carrier for integrated circuits and other microelectronic components, the quality of wafer processing directly impacts the performance and reliability of the final product. With the market's increasing demands for miniaturization, high speed, and low power consumption in electronic devices, the precision and control requirements for each stage of wafer manufacturing are becoming increasingly stringent, especially for the quality of wafer dicing. During wafer processing, the wafer must always be in a highly clean production environment to avoid contamination; however, in practice, it is difficult to completely eliminate the suspension of fine powder or particulate matter in the air. These contaminants may adhere to the back of the wafer, leading to various subsequent process problems.

[0003] Specifically, such as Figure 1 As shown in diagram a, in the existing operating process, after the wafer 13 is thinned by grinding, it needs to be attached to a dicing tape 11 that provides mechanical support and protection. Then, the dicing tape 11 is fixed to an iron ring 12 to maintain a certain tension. Finally, an identification label 10 containing the product batch information is affixed to the front surface of the dicing tape 11 to facilitate material tracking and identification by personnel and automated machines. For example... Figure 1 As shown in b, during the process of affixing the identification label 10, the wafer 13 is typically placed temporarily on the workbench. During this process, the dicing tape 11 on the back of the wafer 13 directly contacts the workbench, potentially adsorbing suspended particulate contaminants. When the wafer with these contaminants enters subsequent processing steps, the back of the wafer needs to be fixed using vacuum adsorption. The adsorption pressure causes stress concentration on the wafer due to the adsorbed particles, leading to microcracks or even macroscopic breakage. These defects not only reduce product yield and result in significant economic losses but also greatly increase the failure risk of devices in subsequent applications, affecting overall production efficiency and product reliability.

[0004] Therefore, there is an urgent need for a labeling fixture that can effectively prevent foreign matter from adsorbing on the back of the wafer, so as to improve the process stability of labeling, increase product yield and reduce the risk of device failure in subsequent applications. Utility Model Content

[0005] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a labeling fixture that avoids foreign matter adsorbing on the back of the wafer, in order to solve the problem in the prior art that when affixing identification labels, suspended particulate contaminants may be adsorbed on the back of the wafer, which may cause micro-cracks or macro-fragmentation of the wafer during vacuum adsorption, resulting in a decrease in product yield.

[0006] To achieve the above and other related objectives, this utility model provides a labeling fixture to prevent foreign matter from adsorbing onto the back side of a wafer. The labeling fixture includes:

[0007] The base includes an annular first region and a second region, wherein the first region is located outside the second region and has multiple notches formed along the circumference of the first region, and a labeling window is also provided in the first region, the size of the labeling window being larger than the size of the label, and the size of the second region being equal to the size of the wafer.

[0008] A support strip is embedded within the second region to reduce the contact area between the base and the wafer.

[0009] Optionally, the number of the notches is at least two.

[0010] Optionally, the number of the notches is four, and the angle between adjacent notches is 90 degrees.

[0011] Optionally, a locating pin is provided on each side of one of the notches, and the locating pins are symmetrically distributed about the notch.

[0012] Optionally, the distance between the positioning pins is equal to the distance between the two latches of the iron ring.

[0013] Optionally, the labeling window is located in the middle of the positioning pin, and the size of the labeling window is at least 1.5 times the size of the label.

[0014] Optionally, the number of support bars is at least three and they are arranged in a centrally symmetrical manner. The length of the support bar is at least equal to two-thirds of the wafer radius, and the maximum length of the support bar is equal to the wafer radius.

[0015] Optionally, the shape of the support bars includes one of an X-shape, a trident shape, or a star shape.

[0016] Optionally, the height of the second region is lower than that of the first region.

[0017] Optionally, the second region has a plurality of circular holes, and the circular holes are arranged periodically in the second region.

[0018] As described above, the labeling fixture of this utility model, which avoids the adsorption of foreign matter on the back of the wafer, has the following beneficial effects: by setting a base to support the iron ring and the dicing tape with the wafer attached, the dicing tape does not need to directly contact the table when affixing the identification label to the front of the dicing tape, eliminating the possibility of suspended particulate contaminants adsorbed on the back of the wafer. This prevents the wafer from developing microcracks or breaking during vacuum adsorption in subsequent processes, ultimately improving product yield, reducing economic losses, and significantly reducing the failure risk during device application. Attached Figure Description

[0019] Figure 1 The diagram shows a cross-sectional structure and a top view of a wafer fixed on a cutting tape in the prior art.

[0020] Figure 2 The diagram shows a structural schematic of a labeling fixture for preventing foreign matter from adsorbing onto the back of a wafer, according to this invention.

[0021] Figure 3 This is a schematic diagram of another labeling fixture of the present invention to avoid foreign matter adsorbing on the back of a wafer.

[0022] Component designation explanation

[0023] 10. Label; 11. Cutting tape; 12. Iron ring; 121. Bayonet; 13. Wafer; 14. Base; 141. First area; 142. Second area; 143. Notch; 15. Positioning pin; 16. Support strip; 17. Round hole; 18. Labeling window. Detailed Implementation

[0024] The following specific embodiments illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification.

[0025] Please see Figures 1 to 3It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and are not intended to limit the scope of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to size, without affecting the effectiveness and purpose of this invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, terms such as "above," "on top of," "on the upper surface of," and "on the surface" are used to describe the spatial relationship between one device or feature as shown in the figures and other devices or features, solely for clarity of description and not to limit the scope of this invention. Changes or adjustments to these relative relationships, without substantially altering the technical content, should also be considered within the scope of this invention.

[0026] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] In this utility model, unless otherwise explicitly specified, terms such as "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Furthermore, the use of terms such as "first," "second," and "third" to define components is merely for the purpose of distinguishing these components. Unless otherwise stated, these terms have no special meaning and therefore should not be construed as limiting the scope of protection of this utility model.

[0028] Please see Figure 2 An embodiment of a labeling fixture for preventing foreign matter from adsorbing on the back side of a wafer, provided in this utility model application, includes:

[0029] The base 14 includes an annular first region 141 and a second region. The first region 141 is located outside the second region and has a plurality of notches 143 formed along the circumference of the first region 141. A labeling window 18 is also provided in the first region 141. The size of the labeling window 18 is larger than the size of the label 10. The size of the second region 142 is equal to the size of the wafer 13.

[0030] Support bar 16, which is embedded in the second region 142, to reduce the contact area between the base 14 and the wafer 13.

[0031] Specifically, this embodiment does not limit the shape of the base 14, as long as the iron ring 12 can be fixed on the base 14. It can be as follows: Figure 2 The ring shape can also be other shapes.

[0032] As an example, the number of gaps 143 is at least two.

[0033] Specifically, in this embodiment, the base 14 includes an annular first region 141 and a second region 142. The first region 141 is located outside the second region 142. A plurality of notches 143 are formed along the circumference of the first region 141 of the base 14. The number of notches 143 is at least two, so as to facilitate personnel to pick up and place the iron ring 12 when performing the labeling 10 operation.

[0034] Preferably, such as Figure 2 As shown, there are four notches 143, located in the four directions of the base 14: top, bottom, left, and right. For example, the one above the base 14 is named the first notch 143, the one below the base 14 is named the second notch 143, the one on the left side of the base 14 is named the third notch 143, and the one on the right side of the base 14 is named the fourth notch 143. The above examples are used for detailed description in this application. The four notches 143 are the same in shape and size, and the angle between adjacent notches 143 is 90 degrees. That is, the angle between the first notch 143 and the third and fourth notches 143 is 90 degrees, and the angle between the second notch 143 and the third and fourth notches 143 is 90 degrees. The four notches 143 facilitate the handling and placement of the iron ring 12 when labeling 10. Of course, the position and size parameters of the notches 143 are not overly restricted here, and can be selected according to actual needs.

[0035] As an example, a positioning pin 15 is provided on each side of one of the notches 143, and the positioning pins 15 are symmetrically distributed about the notch 143.

[0036] Specifically, such as Figure 2As shown, in this embodiment, two positioning pins 15 are also provided on the base 14. The two positioning pins 15 are located on both sides of the second notch 143 and are symmetrically distributed about the second notch 143. The distance between the positioning pins 15 is equal to the distance between the two latches 121 of the iron ring 12, so as to ensure that the position of the iron ring 12 is fixed and facing the same direction each time it is placed on the base 14. Of course, in other embodiments, the positioning pins 15 can also be located at other notch 143 positions, as long as the distance between the positioning pins 15 is equal to the distance between the two latches 121 of the iron ring 12. There is no excessive limitation here, and the specific selection can be made according to actual needs.

[0037] As an example, the labeling window 18 is located in the middle of the positioning pin 15, and the size of the labeling window 18 is at least 1.5 times the size of the label 10.

[0038] like Figure 2 As shown, a labeling window 18 is also provided in the first region 141 of the base 14. The size of the labeling window 18 is larger than the size of the label 10. The labeling window 18 can restrict the position of manual labeling, ensuring that the position of the operator is fixed each time the label 10 is applied, thereby improving the efficiency of labeling 10. Furthermore, the fixed position of the label 10 also facilitates accurate scanning of the label 10 in subsequent processes by using a fixed scanning position, further improving the recognition efficiency of the label 10. Specifically, the size of the labeling window 18 is at least 1.5 times the size of the label 10, thus providing sufficient space for the operator to work while ensuring accurate labeling position. It should be noted that this embodiment does not limit the specific number and location of the labeling windows 18, and can be customized according to process requirements.

[0039] As an example, the number of support bars 16 is at least 3 and they are arranged in a centrally symmetrical manner. The length of the support bar 16 is at least equal to two-thirds of the radius of the wafer 13, and the length of the support bar 16 is at most equal to the radius of the wafer 13.

[0040] Specifically, in this embodiment, a plurality of support strips 16 are embedded in the second region 142 of the base 14. The number of support strips 16 is at least three and they are arranged symmetrically at the center. The height of each support strip 16 is the same as the height of the first region 141 of the base 14. The length of each support strip 16 is at least two-thirds of the radius of the wafer 13, and at most equal to the radius of the wafer 13. This allows the support strips 16 to support the back side of the wafer 13 when the iron ring 12 is placed on the first region 141 of the base 14. Optionally, the shape of the support strips 16 includes one of an X-shape, a trident shape, or a star shape, such as... Figure 2 As shown, in this embodiment, the support strips 16 are arranged in an X-shape, meaning that most of the second region 142 is hollow, which can significantly reduce the contact area between the wafer 13 and the base 14 and reduce the risk of foreign objects adsorbing on the back of the wafer 13.

[0041] As an example, the height of the second region 142 is lower than that of the first region 141.

[0042] Specifically, such as Figure 3 As shown, in another embodiment of this application, the height of the second region 142 of the base 14 can be set lower than the height of the first region 141. In this case, when the iron ring 12 is placed on the first region 141 of the base 14, since the iron ring 12 can provide a certain tension to the cutting tape 11, the back side of the wafer 13 can be completely kept out of contact with the second region 142, further reducing the risk of foreign matter adsorbing on the back side of the wafer 13. However, in actual operation, the operator may accidentally touch the front side of the wafer 13, causing the back side of the wafer 13 to be exposed to foreign matter. Without support, severe cracking or breakage can occur. Therefore, multiple circular holes 17 are provided in the second region 142, and the multiple circular holes 17 are arranged in a periodic pattern. This allows the support platform 16 between the multiple circular holes 17 to provide support for the wafer 13 even if it falls due to accidental contact by the operator, reducing the risk of cracking or breakage. In addition, the periodic arrangement of the circular holes 17 can also significantly reduce the contact area between the wafer 13 and the base 14, reducing the risk of foreign objects adsorbing on the back of the wafer 13.

[0043] In summary, this invention provides a labeling fixture that prevents foreign matter from adsorbing onto the back of a wafer. By using a base to support the iron ring and the dicing tape with the wafer attached, the dicing tape does not directly contact the worktable when affixing identification labels to the front of the tape. This eliminates the possibility of suspended particulate contaminants adsorbing onto the back of the wafer, preventing microcracks or breakage during subsequent vacuum adsorption processes. Ultimately, this improves product yield, reduces economic losses, and significantly lowers the risk of device failure. Therefore, this invention effectively overcomes the various shortcomings of existing technologies and has high industrial applicability.

[0044] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A labeling fixture for preventing foreign matter from adsorbing onto the back side of a wafer, characterized in that, The labeling fixture includes: The base includes an annular first region and a second region, wherein the first region is located outside the second region and has multiple notches formed along the circumference of the first region, and a labeling window is also provided in the first region, the size of which is larger than the size of the label, and the size of the second region is equal to the size of the wafer. A support strip is embedded within the second region to reduce the contact area between the base and the wafer.

2. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 1, characterized in that: The number of gaps is at least two.

3. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 2, characterized in that: The number of gaps is 4, and the angle between adjacent gaps is 90 degrees.

4. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 1, characterized in that: A locating pin is provided on each side of one of the notches, and the locating pins are symmetrically distributed about the notch.

5. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 4, characterized in that: The distance between the positioning pins is equal to the distance between the two notches of the iron ring.

6. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 4, characterized in that: The labeling window is located in the middle of the positioning pin, and the size of the labeling window is at least 1.5 times the size of the label.

7. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 1, characterized in that: The number of support bars is at least three and they are arranged in a centrally symmetrical manner. The length of each support bar is at least two-thirds of the wafer radius and at most equal to the wafer radius.

8. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 7, characterized in that: The shape of the support bars includes one of the following: X-shape, trident shape, or star shape.

9. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 1, characterized in that: The height of the second region is lower than that of the first region.

10. The labeling fixture for avoiding foreign matter adsorption on the back side of a wafer according to claim 9, characterized in that: The second region has multiple circular holes, and the circular holes are arranged periodically within the second region.

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