Wafer etching cleaning equipment

Abstract

The utility model relates to a semiconductor technical field especially relates to a wafer etching cleaning equipment. Including inner groove, outer groove, liquid inlet pipe, reflux filter assembly, the reflux filter assembly includes first reflux pipeline, reflux pump, filter and second reflux pipeline. In this patent, etching liquid flows into the outer groove from the liquid outlet hole of liquid inlet pipe, then etching liquid will flow into the inner groove from the V-shaped overflow port of the upper inner groove, in order to etch the glass in the inner groove, and always utilize the reflux filter assembly in the etching process to flow back the etching liquid in the inner groove, and filter out the glass sand reactant produced in the etching process, then send the etching liquid into the liquid inlet pipe, realize filtration and reflux, can avoid the glass sand reactant accumulation in the inner groove groove bottom place contact glass and cause scratch, avoids the subsequent repair step, reduces the production investment cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer etching and cleaning device. Background Technology

[0002] In the semiconductor manufacturing industry, wet etching is a process in which a wafer is immersed in a chemical solution to etch away the thin film that needs to be removed from the wafer, converting it into a soluble compound that can then be removed. The equipment used for wet etching is called wet etching cleaning equipment.

[0003] Existing patent CN202222087981.0 provides a wet etching apparatus, including a circulation tank comprising an inner tank and an outer tank surrounding the inner tank, with the bottom wall of the outer tank being higher than the bottom wall of the inner tank; a circulation pipeline connecting the outer tank and the inner tank respectively, configured to circulate etching solution overflowing from the inner tank to the outer tank back to the inner tank, and one end of the circulation pipeline connected to the inner tank being connected to an inlet section extending to the bottom of the inner tank and along the bottom wall of the inner tank, with multiple outlet holes arranged on the inlet section. This invention can effectively avoid uneven etching of the wafer inside the tank, allowing for more uniform and complete wet etching of the wafer, thereby greatly improving the uniformity of the entire wafer and the stability of the process.

[0004] However, when using the above technology to etch wafer glass, glass sand reactants are continuously generated during the etching process. Since the glass sand reactants have a high density, they will continue to be generated and deposited at the bottom of the inner tank. In this case, they are easy to come into contact with the glass and cause scratches, which require subsequent repair. The operation is cumbersome and the cost is high. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a wafer etching and cleaning device that can avoid scratches caused by contact between glass sand reactants and glass.

[0006] To solve the above-mentioned technical problems, the technical solution of this utility model is: a wafer etching and cleaning device, the innovation of which lies in: including The inner tank has a liquid outlet at the center of its bottom. An outer tank is provided on the top periphery of the inner tank. The top of the outer tank wall is higher than the top of the inner tank wall, and a drain outlet is provided on the bottom of the outer tank. The liquid inlet pipe is horizontally arranged inside the outer tank, and the bottom of the liquid inlet pipe is also provided with multiple drain holes; The reflux filtration assembly includes a first reflux pipe, a reflux pump, a filter, and a second reflux pipe. The first reflux pipe connects the inner tank outlet to the reflux pump, and the reflux pump is connected to the inlet pipe via the filter and the second reflux pipe.

[0007] Furthermore, the upper edge of the inner tank is provided with multiple spaced V-shaped overflow ports for introducing the etching solution in the outer tank into the inner tank.

[0008] Furthermore, the bottom of the inner tank is tapered, which ensures that the glass sand reactants generated during etching do not accumulate at the bottom of the tank, and also facilitates cleaning by personnel.

[0009] Furthermore, a flow straightener is provided inside the inner tank to ensure a uniform flow field and prevent poor etching rate.

[0010] Furthermore, nitrogen bubble tubes are evenly laid on the rectifier plate to generate bubbles evenly inside the inner tank, thereby increasing circulation disturbance and promoting the reaction material to fall off the glass surface.

[0011] Furthermore, the inner and outer grooves are also equipped with attached heaters, thereby achieving an overall constant temperature effect.

[0012] Furthermore, the bottom of the outer tank is inclined, and the drain outlet is located near the lowest point of the bottom of the outer tank, thereby enabling the complete discharge of the etching solution from the outer tank.

[0013] Furthermore, a limiting block is fixed on the inner side of the outer tank wall, and a groove is provided on the top of the limiting block to accommodate the liquid inlet pipe, which facilitates the installation and positioning of the liquid inlet pipe.

[0014] The advantages of this utility model are: In this patent, the etching solution flows into the outer tank from the drain hole of the inlet pipe, and then flows into the inner tank from the V-shaped overflow port on the upper edge of the inner tank to etch the glass in the inner tank. During the etching process, the reflux filter component is used to reflux the etching solution in the inner tank and filter out the glass sand reactants generated during the etching process. The etching solution is then sent back to the inlet pipe to achieve filtration and reflux. This can prevent the glass sand reactants from accumulating at the bottom of the inner tank and contacting the glass, causing scratches, avoiding subsequent repair steps, and reducing production input costs.

[0015] 2. The bottom of the inner tank is tapered to ensure that the glass sand reactants generated during etching do not accumulate at the bottom of the tank, and also to facilitate cleaning by personnel.

[0016] 3. A flow rectifier is installed inside the inner tank to ensure a uniform flow field of the etching solution and prevent poor etching rate.

[0017] 4. Nitrogen bubble tubes are also evenly laid on the rectifier plate to generate bubbles evenly inside the inner tank, thereby increasing circulation disturbance and promoting the reaction material to fall off the glass surface.

[0018] 5. The inner and outer tanks are also equipped with attached heaters to achieve a constant temperature effect.

[0019] 6. The bottom of the outer tank is inclined, and the drain outlet is located at the lowest point of the bottom of the outer tank, so that the etching solution in the outer tank can be completely drained.

[0020] 7. A limiting block is also fixed on the inner side of the outer tank wall. The top of the limiting block has a groove that can just accommodate the placement of the liquid inlet pipe, which facilitates the installation and positioning of the liquid inlet pipe.

[0021] 8. A return pipe assembly is installed between the liquid outlet and the liquid inlet of the inner tank. It can be removed for easy maintenance and cleaning. Attached Figure Description

[0022] Figure 1 This is a top view of the present invention.

[0023] Figure 2 This is a side view of the present invention.

[0024] Figure 3 This is a cross-sectional view of the present invention. Detailed Implementation

[0025] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0026] like Figure 1-3 The wafer etching and cleaning equipment shown includes an inner tank 1, an outer tank 2, an inlet pipe 3, and a reflux filter assembly.

[0027] The inner tank 1 includes an upper rectangular tank section 14 and a lower conical tank section 15 connected together, forming an etching cavity between the upper rectangular tank section 14 and the lower conical tank section 15. An outlet 11 is opened in the center of the bottom of the lower conical tank section 15 to ensure that the glass sand reactants generated by etching will not accumulate at the bottom of the tank, and also to facilitate cleaning by personnel.

[0028] Multiple V-shaped overflow ports 12 are provided at intervals along the upper edge of the inner tank 1 to introduce the etching solution in the outer tank 2 into the inner tank 1.

[0029] A flow rectifier 13 is horizontally installed inside the inner tank 1 near the bottom of the tank to make the flow field uniform and prevent poor etching rate. The flow rectifier 13 is installed on the inner wall of the lower conical tank section 15 by four support columns 16.

[0030] The inner tank 1 is also equipped with multiple nitrogen bubbling tubes 5. The nitrogen bubbling tubes 5 are L-shaped, including vertical and horizontal sections. The vertical section of the nitrogen bubbling tube 5 is installed on the inner wall of the inner tank 1 through the mounting plate 4. The horizontal section of the nitrogen bubbling tube 5 is provided with an outlet and is laid horizontally and evenly at the bottom of the rectifier plate 13, so that uniform bubbles are generated inside the inner tank 1, thereby increasing the circulation disturbance and promoting the reaction material to fall off the glass surface.

[0031] Mounting plate 4 is fixed on the wall of inner tank 1, and a slot is provided on the side away from the inner tank wall for mounting the vertical section of nitrogen bubbling tube 5.

[0032] The outer tank 2 is located on the top periphery of the inner tank 1, with the top of its tank wall higher than the top of the inner tank 1. The bottom of the outer tank 2 is inclined and has a drain outlet 21, which is located near the lowest point of the bottom of the outer tank 2, thus enabling complete drainage of the etching solution from the outer tank 2. Attached heaters are also provided on the periphery of both the inner tank 1 and the outer tank 2 to achieve overall temperature control.

[0033] There are two inlet pipes 3, which are horizontally arranged on both sides inside the outer tank 2, and a limiting block 22 is provided on both sides of the length of the inlet pipe 3 on the inner wall of the outer tank 2.

[0034] The top of the limiting block 22 is provided with a groove that can just accommodate the placement of the liquid inlet pipe 3, which facilitates the installation and positioning of the liquid inlet pipe 3. The bottom of the liquid inlet pipe 3 is also provided with multiple drainage holes, and the height of the two liquid inlet pipes 3 is lower than the V-shaped overflow port 12 of the inner tank 1.

[0035] There is also a conveying pipe 6 outside the outer tank 2. The conveying pipe 6 has two inlet sides and two outlet sides. The two outlet sides of the conveying pipe 6 pass through the tank wall of the outer tank 2 and are connected to two liquid inlet pipes 3 respectively. A storage tank is connected to one inlet side of the conveying pipe 6, so that the etching solution inside the storage tank is sent into the liquid inlet pipe 3 through the conveying pipe 6. A return pipe assembly is installed between the liquid outlet 11 of the inner tank and the liquid inlet pipe 3. It can be removed for easy maintenance and cleaning.

[0036] The reflux filtration assembly is also located outside the outer tank 2. The reflux filtration assembly includes a first reflux pipe, a reflux pump, a filter, and a second reflux pipe, which are sequentially arranged between the liquid outlet 11 of the inner tank and the liquid inlet pipe 3. In this embodiment, the filter is a glass frit filter.

[0037] The first reflux pipe is located below the inner tank 1, and the outlet 11 of the inner tank 1 is connected to the inlet of the reflux pump through the first reflux pipe. The outlet of the reflux pump is connected to the inlet of the filter through a connecting pipe. The outlet of the filter is connected to the other inlet side of the conveying pipe 6 through the second reflux pipe. Thus, the reflux pump can be used to send the etching solution and glass sand reactants inside the inner tank 1 into the filter through the first reflux pipe to filter out the glass sand reactants. The filtered etching solution is then fed into the inlet pipe 3 through the second reflux pipe and the conveying pipe 6, and flows into the outer tank 2 through the drain hole at the bottom of the inlet pipe 3.

[0038] The working principle of this patent: In this patent, the etching solution in the storage tank flows into the outer tank 2 through the drain hole of the inlet pipe 3. Then, the etching solution flows into the inner tank 1 from the V-shaped overflow port 12 on the upper edge of the inner tank 1 to etch the glass in the inner tank 1. During the etching process, the reflux filter assembly is used to reflux the etching solution in the inner tank 1 and filter out the glass sand reactants generated during the etching process. The etching solution is then sent back to the inlet pipe 3 to achieve filtration and reflux. This can prevent the glass sand reactants from accumulating at the bottom of the inner tank 1 and contacting the glass, causing scratches. This avoids subsequent repair steps and reduces production input costs.

[0039] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A wafer etching and cleaning device, characterized in that: include The inner tank has a liquid outlet at the center of its bottom. An outer tank is provided on the top periphery of the inner tank. The top of the outer tank wall is higher than the top of the inner tank wall, and a drain outlet is provided on the bottom of the outer tank. The liquid inlet pipe is horizontally arranged inside the outer tank, and the bottom of the liquid inlet pipe is also provided with multiple drain holes; The reflux filtration assembly includes a first reflux pipe, a reflux pump, a filter, and a second reflux pipe. The first reflux pipe connects the inner tank outlet to the reflux pump, and the reflux pump is connected to the inlet pipe via the filter and the second reflux pipe.

2. The wafer etching and cleaning equipment according to claim 1, characterized in that: The upper edge of the inner groove is provided with multiple spaced V-shaped overflow ports.

3. The wafer etching and cleaning equipment according to claim 1, characterized in that: The bottom of the inner groove is tapered.

4. The wafer etching and cleaning equipment according to claim 1, characterized in that: The inner tank is equipped with a flow rectifier plate.

5. The wafer etching and cleaning equipment according to claim 4, characterized in that: The rectifier plate is also evenly covered with multiple nitrogen bubbling tubes.

6. The wafer etching and cleaning equipment according to claim 1, characterized in that: The inner and outer grooves are also equipped with attached heaters.

7. The wafer etching and cleaning equipment according to claim 1, characterized in that: The bottom of the outer tank is inclined, and the drain outlet is located at the lowest point of the bottom of the outer tank.

8. The wafer etching and cleaning equipment according to claim 1, characterized in that: A limiting block is also fixed on the inner side of the outer tank wall, and a groove is provided on the top of the limiting block to accommodate the liquid inlet pipe.

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