A TO-220 package triode fin glue bonding device

Abstract

The utility model relates to triode production technical field, especially a kind of TO-220 encapsulation triode fin glue injection laminating device, device is set laminating site on finished product discharge belt, and glue injection head is arranged above it;Through fin supply and feed mechanism, first, fin is pushed to the implementation quantitative glue injection of laminating site, then, triode is pushed to the laminating of laminating site by triode supply and feed mechanism, and subsequently, finished product discharge belt conveys laminating piece.The device compact structure, alignment stability, glue coating amount controllable, can reduce overflow or lack of glue and improve production efficiency and yield, suitable for the batch laminating production of TO-220 encapsulation triode.

Description

Technical Field

[0001] This utility model relates to the field of transistor manufacturing technology, and in particular to a device for applying adhesive to heat sinks of TO-220 packaged transistors. Background Technology

[0002] Before TO-220 packaged transistors are soldered onto the circuit board, a heatsink is typically attached to its back side to improve thermal conductivity and reliability. Current processes mostly involve manual dispensing, alignment, pressing, and transport of each transistor individually. This suffers from problems such as difficulty in consistently controlling the amount of adhesive applied, uneven coating leading to overflow or insufficient adhesive, rework due to alignment deviations, slow cycle times, and high reliance on manual labor. While some semi-automatic solutions introduce conveying or dispensing units, they still fall short in terms of orderly material supply, coordinated cycle times of sequential steps, and relative stability of the dispensing and bonding positions, making it difficult to balance yield and efficiency.

[0003] To this end, this application designs a glue injection and bonding device for TO-220 packaged transistors and heat sinks, realizing an integrated process of heat sink placement, quantitative glue injection, transistor bonding, and orderly delivery of finished products, while ensuring consistency in posture screening, alignment, and glue application. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, this utility model proposes a TO-220 packaged transistor heat sink adhesive bonding device.

[0005] A TO-220 packaged transistor heatsink dispensing and bonding device includes a finished product dispensing tape, a dispensing system bracket, and a dispensing head, characterized in that: The finished product discharge belt is provided with a bonding position, and the glue injection head is installed on the glue injection system bracket and located above the bonding position; the device is provided with a heat sink supply mechanism and a transistor supply mechanism. The heat sink feeding mechanism includes a heat sink loading vibratory plate, a heat sink conveying track, a heat sink blocking plate, and a heat sink loading push-pull motor, which is used to push the heat sink to the bonding position and inject a quantitative amount of glue under the glue injection head. The transistor feeding mechanism includes a transistor loading vibratory feeder, a transistor conveying track, a transistor blocking plate, and a transistor loading push-pull motor, which is used to push the transistor to the bonding position and bond it to the heat sink after glue injection. The finished product discharge belt is used to transport the bonded parts.

[0006] Furthermore, in order to better realize this utility model, the glue injection system bracket has a height or horizontal position adjustment structure to adjust the spacing and coverage of the glue injection head relative to the contact position.

[0007] Furthermore, in order to better realize this utility model, the glue injection system bracket is connected to the glue injection system conduit, the glue injection system conduit is connected to the heat dissipation silicone filling box through the pump, and the glue injection head has a back suction and anti-drip structure.

[0008] Furthermore, in order to better realize this utility model, guide rails are provided between the transistor loading vibratory feeder and the transistor conveying track, and between the heat sink loading vibratory feeder and the heat sink conveying track, for screening and correcting the front and back postures of the workpiece.

[0009] Furthermore, in order to better realize this utility model, the conveying speed of the finished product discharge belt is adjustable and matches the operating rhythm of the transistor loading push-pull motor and the heat sink loading push-pull motor.

[0010] Furthermore, in order to better realize this utility model, the dispensing head is a multi-point or strip-shaped dispensing structure to define the coating area and adapt to heat sinks of different specifications.

[0011] The beneficial effects of this utility model are as follows: The entire process—from heatsink mounting to quantitative glue application, transistor bonding, and finished product output—is completed sequentially at the same bonding position, reducing handling and secondary positioning errors and improving cycle time and yield. Through the glue application system's conduit and the pumping supply of the thermal silicone material box, along with the anti-drip structure of the glue head, stable control of the glue application amount and coverage area is achieved, significantly reducing the risk of overflow and insufficient glue. The adjustable glue application system bracket and the clogging plate, combined with a push-pull motor, enable orderly single-row advancement, adapting to multiple device specifications and supporting rapid changeovers, thus reducing production costs. Attached Figure Description

[0012] Figure 1 This is one of the three-dimensional structural schematic diagrams of the present utility model; Figure 2 This is the second three-dimensional structural schematic diagram of the present invention.

[0013] In the picture, 1. Transistor conveyor track; 2. Heat sink conveyor track; 3. Transistor loading push-pull motor; 4. Heat sink loading push-pull motor; 5. Transistor blocking plate; 6. Heat sink blocking plate; 7. Finished product discharge belt; 8. Glue injection system bracket; 9. Glue injection system conduit; 10. Thermal silicone filling box; 11. Glue injection head; 12. Transistor loading vibratory feeder; 13. Heat sink loading vibratory feeder. Detailed Implementation

[0014] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0015] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0016] Figures 1-2 In one specific embodiment of this utility model, the embodiment includes a transistor loading vibratory feeder 12 and a heat sink loading vibratory feeder 13; the two vibratory feeders are respectively connected to the transistor conveying track 1 and the heat sink conveying track 2 via guide rails. The guide rails perform front and back screening and posture correction on the materials, so that the front of the transistors faces upward and the plane of the heat sink faces upward, and they are lined up in a single row at the ends of their respective tracks at the transistor blocking plate 5 and the heat sink blocking plate 6.

[0017] A transistor loading push-pull motor 3 is installed at the end of the transistor conveyor track 1, and a heat sink loading push-pull motor 4 is installed at the end of the heat sink conveyor track 2. Both motors cooperate with the corresponding blocking plates 5 and 6 to achieve stable ejection of single pieces. A finished product discharge belt 7 is installed in front, with a pre-set bonding position on the discharge belt 7 to support the bonding process and subsequent continuous conveying.

[0018] The dispensing system consists of a dispensing system bracket 8, a dispensing head 11, a dispensing system conduit 9, and a thermal silicone filling box 10. The dispensing system bracket 8 has a height and level adjustment mechanism to position the dispensing head 11 directly above the bonding area and define the coverage area. The dispensing system conduit 9 is connected to the thermal silicone filling box 10 via a pump to stably supply thermal silicone to the dispensing head 11. The dispensing head 11 is equipped with a back-suction anti-drip structure, which creates negative pressure when dispensing stops to prevent dripping and stringing.

[0019] The workflow is as follows: After startup, the vibratory feeder is activated, and materials enter their respective conveyor tracks 1 and 2 via the guide rails and queue at the blocking plates 5 and 6. First, the heat sink loading push-pull motor 4 operates, pushing a single heat sink to the bonding position of the finished product discharge belt 7; the dispensing head 11 applies adhesive to the heat sink according to the preset dosage and area; subsequently, the transistor loading push-pull motor 3 operates, pushing out a single transistor and pressing it onto the adhesive-coated heat sink to complete the bonding, forming a bonded part. The finished product discharge belt 7 continuously conveys the bonded part to the downstream curing or inspection station at a set speed. By adjusting the scale position of the dispensing system bracket 8, rapid changeover of different device and heat sink specifications can be achieved; by matching the speed of the discharge belt 7 with the rhythm of the push-pull motors 3 and 4, the bonding position is always located directly below the dispensing head 11, thereby ensuring adhesive consistency and bonding stability.

[0020] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solution of this utility model, as long as they do not depart from the spirit and scope of the technical solution of this utility model, should be covered within the scope of the claims of this utility model.

Claims

1. A TO-220 packaged transistor heat sink adhesive dispensing and bonding device, comprising a finished product discharge tape (7), an adhesive dispensing system bracket (8), and an adhesive dispensing head (11), characterized in that: The finished product discharge belt (7) is provided with a bonding position, and the glue injection head (11) is installed on the glue injection system bracket (8) and located above the bonding position; the device is provided with a heat sink feeding mechanism and a transistor feeding mechanism; The heat sink feeding mechanism includes a heat sink loading vibratory plate (13), a heat sink conveying track (2), a heat sink blocking plate (6), and a heat sink loading push-pull motor (4), which is used to push the heat sink to the bonding position and inject glue quantitatively under the glue injection head (11). The transistor feeding mechanism includes a transistor loading vibratory plate (12), a transistor conveying track (1), a transistor blocking plate (5), and a transistor loading push-pull motor (3), which is used to push the transistor to the bonding position and bond it with the heat sink after glue injection. The finished product discharge belt (7) is used to transport the bonding parts.

2. The TO-220 packaged transistor heat sink adhesive bonding device according to claim 1, characterized in that: The glue injection system bracket (8) has a height or horizontal position adjustment structure to adjust the spacing and coverage of the glue injection head (11) relative to the mating position.

3. The TO-220 packaged transistor heat sink adhesive bonding device according to claim 1, characterized in that: The glue injection system bracket (8) is connected to the glue injection system conduit (9), which is connected to the heat dissipation silicone filling box (10) via a pump. The glue injection head (11) has a back suction and anti-drip structure.

4. The TO-220 packaged transistor heat sink adhesive bonding device according to claim 1, characterized in that: Guide rails are provided between the transistor loading vibratory feeder (12) and the transistor conveying track (1), and between the heat sink loading vibratory feeder (13) and the heat sink conveying track (2), for screening and correcting the front and back postures of the workpieces.

5. The TO-220 packaged transistor heat sink adhesive bonding device according to claim 1, characterized in that: The conveying speed of the finished product discharge belt (7) is adjustable and matches the operating rhythm of the transistor loading push-pull motor (3) and the heat sink loading push-pull motor (4).

6. The TO-220 packaged transistor heat sink adhesive bonding device according to claim 1, characterized in that: The dispensing head (11) has a multi-point or strip-shaped dispensing structure to define the coating area and adapt to heat sinks of different specifications.

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