Cartridge and roasting apparatus

Abstract

The application discloses a material box and a baking equipment, and relates to the technical field of semiconductor equipment. The material box comprises a guide shaft and a plurality of stacked bearing frames. The bearing frames are used for carrying chip substrates. Each of the bearing frames is provided with a mounting groove. The guide shaft is arranged in the mounting groove of each of the bearing frames, so that the guide shaft is movably connected with the bearing frames. The bearing frames are driven to rotate around the axis direction of the guide shaft relative to adjacent bearing frames, and / or the bearing frames are driven to slide along the extension direction of the mounting groove relative to adjacent bearing frames, so that the distance between the geometric centers of two adjacent chip substrates is increased. The material box can drive the bearing frames to rotate around the guide shaft and / or slide along the mounting groove, so that the contact area of the chip substrates with the external environment is increased, the uniformity of substrate heating and the heating rate are improved, and the cooling speed of the bearing frames after baking is accelerated.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a material box and baking equipment. Background Technology

[0002] With the rapid development of the semiconductor industry, in the manufacturing process of semiconductor devices, after the chip is mounted on the substrate, it needs to be fixed with adhesive. Then, it needs to be loaded into a cassette and enter the baking process to complete subsequent processing. Similarly, after the substrate is washed, it also needs to enter the baking process to remove moisture. However, the cassettes currently used in the baking process generally employ a fixed slot design to hold the substrate. This structure has the following drawbacks in practical applications: Firstly, during the baking process, the substrate in the slot inside the cassette exhibits uneven heating and a slow temperature rise rate. This not only directly affects the adhesion performance of the adhesive between the chip and the substrate, leading to insufficient adhesion strength and decreased stability, but also makes it difficult to completely dry the residual moisture in the substrate, potentially posing a threat to the performance and reliability of subsequent semiconductor devices. Secondly, after baking, the cooling rate of the cassette is too slow, significantly extending the process interval and severely restricting the improvement of overall production efficiency, failing to meet the high-efficiency manufacturing needs of the semiconductor industry. Utility Model Content

[0003] The purpose of this application is to provide a material box and baking equipment that enables the carrier to rotate around the guide shaft and / or slide along the mounting groove to increase the contact area between the chip substrate and the external environment, thereby improving the uniformity and heating rate of the substrate heating, while accelerating the cooling speed of the carrier after baking.

[0004] The embodiments of this application are implemented as follows: A first aspect of this application provides a material box, including a guide shaft and a plurality of stacked support frames. The support frames support chip substrates, each with a mounting groove. The guide shaft passes through the mounting grooves of the support frames, allowing it to be movably connected to them. Each support frame can be driven to rotate relative to adjacent support frames about the axis of the guide shaft, and / or can be driven to slide relative to adjacent support frames along the extension direction of the mounting groove, thereby increasing the distance between the geometric centers of two adjacent chip substrates. This material box allows the support frames to rotate about the guide shaft and / or slide along the mounting grooves, increasing the contact area between the chip substrate and the external environment, thereby improving the uniformity and heating rate of the substrate heating, while simultaneously accelerating the cooling rate of the support frames after baking.

[0005] As one possible implementation, it also includes a plurality of stacked connecting blocks, each of which is sleeved on the outside of the guide shaft, and each of the plurality of connecting blocks is slidably disposed in the mounting slots of the plurality of support frames.

[0006] As one possible implementation, the thickness of the connecting block is equal to the depth of the mounting groove along the axial direction of the guide shaft.

[0007] As one possible implementation, the length of the connecting block is less than the length of the mounting groove along the extending direction of the mounting groove.

[0008] As one possible implementation, the width of the connecting block matches the width of the mounting groove along the extension direction perpendicular to the mounting groove.

[0009] As one possible implementation, it also includes a base, the guide shaft is fixedly disposed on the base, and a plurality of the support frames are stacked on the base.

[0010] In one possible implementation, the orthographic projection of a plurality of the support frames along the axial direction of the guide shaft falls on the base, the guide shaft being located at the center of one side of the base along the extension direction of the mounting groove.

[0011] In one possible implementation, the support frame is provided with snap-fit ​​grooves on opposite sides, and the two opposite sides of the chip substrate are respectively installed in the two snap-fit ​​grooves.

[0012] As one possible implementation, the support frame has a U-shaped or rectangular structure, and the mounting groove and one of the snap-fit ​​grooves are located on the same side of the support frame.

[0013] A second aspect of this application provides a baking apparatus, including the aforementioned material tray. This material tray enables a support frame to rotate about a guide shaft and / or slide along a mounting groove, thereby increasing the contact area between the chip substrate and the external environment, thus improving the uniformity and heating rate of the substrate, while simultaneously accelerating the cooling rate of the support frame after baking.

[0014] The beneficial effects of the embodiments of this application include: The material box includes a guide shaft and multiple stacked support frames. Each support frame carries a chip substrate and has a mounting slot. The guide shaft passes through these mounting slots, allowing it to be movably connected to the support frames. A support frame can be driven to rotate relative to adjacent support frames about the axis of the guide shaft, and / or can be driven to slide relative to adjacent support frames along the extension direction of the mounting slot, thereby increasing the distance between the geometric centers of two adjacent chip substrates. The material box provided in this application, by being movably connected to multiple support frames with mounting slots via the guide shaft, allows the support frames to rotate about the guide shaft and / or slide along the mounting slots, increasing the distance between the geometric centers of two adjacent chip substrates. This increases the contact area between the chip substrate and the external environment, thereby improving the uniformity and heating rate of the substrate heating, ensuring the adhesion between the chip and the substrate and the effective drying of moisture on the substrate. Simultaneously, it accelerates the heat dissipation and cooling rate of the support frames after baking, shortening the process interval and contributing to improved chip production efficiency. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the base, guide shaft, and connecting block provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the support frame provided in the embodiments of this application; Figure 3 This is one of the structural schematic diagrams of the material box provided in the embodiments of this application; Figure 4 This is a second schematic diagram of the structure of the material box provided in the embodiments of this application; Figure 5 This is the third schematic diagram of the material box provided in the embodiments of this application.

[0017] Icons: 100-material box; 10-guide shaft; 20-bearing frame; 21-mounting slot; 22-clamping slot; 30-connecting block; 40-base. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments. Similar reference numerals and letters in the following drawings indicate similar items. Once an item is defined in one drawing, it does not need to be further defined in other drawings.

[0019] The terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and should not be construed as limiting this application. The terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0020] Unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to connections within two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0021] Please refer to the reference. Figures 1 to 5 This application provides a material box 100, including a guide shaft 10 and a plurality of stacked support frames 20. The support frames 20 are used to support chip substrates. Each support frame 20 is provided with a mounting groove 21. The guide shaft 10 passes through the mounting grooves 21 of the support frames 20, so that the guide shaft 10 is movably connected to the support frames 20. The support frames 20 can be driven to rotate relative to adjacent support frames 20 about the axis of the guide shaft 10, and / or the support frames 20 can be driven to slide relative to adjacent support frames 20 along the extension direction of the mounting grooves 21, so as to increase the distance between the geometric centers of two adjacent chip substrates. This material box 100 enables the support frames 20 to rotate about the guide shaft 10 and / or slide along the mounting grooves 21, thereby increasing the contact area between the chip substrate and the external environment, thereby improving the uniformity and heating rate of the substrate heating, and at the same time accelerating the cooling rate of the support frames 20 after baking.

[0022] It should be noted that the material box 100 includes a guide shaft 10 and multiple stacked support frames 20. The guide shaft 10 can be a cylindrical metal rod, the diameter of which should be designed according to the size of the support frame 20, and the length should be able to cover the total height of all stacked support frames 20. The surface of the guide shaft 10 should be smooth to ensure low frictional resistance when the support frame 20 moves, and to avoid scratching the support frame 20. The support frame 20 can be a rectangular or circular frame structure. The support frame 20 is provided with a substrate limiting groove. The size of the substrate limiting groove matches the size of the chip substrate to prevent the chip substrate from shaking. Ventilation holes can be opened at the bottom of the substrate limiting groove, or the substrate limiting groove can be through the axial direction of the guide shaft 10 to enhance the heat exchange between the substrate and the environment.

[0023] The edge of the support frame 20 is provided with mounting grooves 21, and the guide shaft 10 passes through the mounting grooves 21 of multiple support frames 20 so that the guide shaft 10 is movably connected to multiple support frames 20. In the initial state, multiple support frames 20 are stacked in parallel on the base 40. After the baking process starts or is completed, the support frame 20 can be driven to rotate relative to the adjacent support frame 20 around the axis of the guide shaft 10, and / or the support frame 20 can be driven to slide relative to the adjacent support frame 20 along the extension direction of the mounting groove 21, so that the distance between the geometric centers of two adjacent chip substrates increases. The two adjacent chip substrates that were originally stacked in parallel are in a completely shielded state. After the support frame 20 is driven to move relative to the guide shaft 10, the distance between the two adjacent chip substrates increases significantly, so that the upper and lower surfaces of each chip substrate can contact the external environment (hot air during baking or cold air during cooling), thereby accelerating the heat exchange efficiency between the chip substrate and the external environment (uniform heating or rapid cooling).

[0024] In traditional fixed-stack substrate bins, the spacing between adjacent substrates is small. Furthermore, due to the parallel stacking of multiple substrates, airflow is difficult to enter the gap between adjacent substrates, resulting in difficulty in baking and curing the adhesive between the chip and the substrate during the baking process, and incomplete drying of moisture in the substrate. After baking, the substrate bin is difficult to cool down quickly. However, the substrate bin 100 provided in this application is movably connected to multiple carrier frames 20 with mounting grooves 21 via a guide shaft 10. This allows the carrier frames 20 to rotate around the guide shaft 10 and / or slide along the mounting grooves 21, thereby increasing the distance between the geometric centers of adjacent chip substrates. This increases the contact area between the chip substrate and the external environment, thereby improving the uniformity and heating rate of the substrate. This ensures the adhesion between the chip and the substrate and the moisture drying effect of the substrate. At the same time, it can also accelerate the heat dissipation and cooling speed of the carrier frames 20 after baking, shorten the process interval time, and help improve the chip production efficiency.

[0025] As one possible implementation method, such as Figures 1 to 5As shown, the material box 100 also includes a plurality of stacked connecting blocks 30, all of which are sleeved on the outside of the guide shaft 10, and the plurality of connecting blocks 30 are slidably disposed in the mounting grooves 21 of the plurality of support frames 20.

[0026] It should be noted that the material box 100 also includes a plurality of stacked connecting blocks 30. The central area of ​​the connecting block 30 has a connecting hole so that the connecting block 30 is sleeved on the outside of the guide shaft 10 through the connecting hole. The diameter of the connecting hole should match the diameter of the guide shaft 10 to ensure that the connecting block 30 can rotate smoothly relative to the guide shaft 10, thereby changing the distance between the geometric centers of two adjacent chip substrates. In addition, the plurality of connecting blocks 30 are slidably disposed in the mounting grooves 21 of the plurality of carriers 20. The size of the connecting block 30 should match the size of the mounting groove 21 to ensure that the connecting block 30 can slide smoothly relative to the mounting groove 21, thereby changing the distance between the geometric centers of two adjacent chip substrates. Since the connecting block 30 is also sleeved on the guide shaft 10, the connecting block 30 can slide smoothly relative to the mounting groove 21. In fact, the support frame 20 slides along the extension direction of the mounting groove 21. By adding the connecting block 30 between the guide shaft 10 and the mounting groove 21, not only can the guide shaft 10 be prevented from directly contacting the support frame 20, but the connecting block 30 can also provide precise guidance for the sliding of the support frame 20.

[0027] As one possible implementation method, such as Figures 1 to 5 As shown, along the axial direction of the guide shaft 10, the thickness of the connecting block 30 is equal to the depth of the mounting groove 21.

[0028] It should be noted that the thickness of the connecting block 30 along the axial direction of the guide shaft 10 is equal to the depth of the mounting groove 21. The depth of the mounting groove 21 refers to the distance between the upper and lower surfaces of the support frame 20. The two are completely equal, which ensures that the connecting block 30 will not protrude or sink after being embedded in the mounting groove 21. In other words, the upper and lower surfaces of the connecting block 30 are flush with the upper and lower surfaces of the support frame 20 into which it is embedded, so as to avoid axial gap between the connecting block 30 and the mounting groove 21. In this way, the support frame 20 will not move along the axial direction of the guide shaft 10 when it moves, which would cause the axial distance between two adjacent support frames 20 to change, thereby affecting the heating uniformity of the chip substrate. At the same time, it also facilitates the assembly between components.

[0029] As one possible implementation method, such as Figures 1 to 5 As shown, along the extension direction of the mounting groove 21, the length of the connecting block 30 is less than the length of the mounting groove 21.

[0030] It should be noted that the length of the connecting block 30 is less than the length of the mounting groove 21 along its extension direction. The extension direction of the mounting groove 21 is perpendicular to the axis of the guide shaft 10. The shorter length of the connecting block 30 ensures that the carrier 20 can slide freely relative to the connecting block 30. The difference between the length of the connecting block 30 and the length of the mounting groove 21 should be designed according to the adjustment requirements of the distance between the geometric centers of two adjacent chip substrates to ensure sufficient contact between the chip substrate and the external environment. For large-sized chip substrates, the carrier 20 can slide to its maximum spacing to increase the contact area between the chip substrate and the external environment and avoid overlapping and obstruction of the chip substrates. For small-sized chip substrates, the carrier 20 can slide to its minimum spacing to reduce the space occupied. By adjusting the sliding distance of the carrier 20 (using the length difference between the mounting groove 21 and the connecting block 30), it can be adapted to chip substrates of different sizes.

[0031] As one possible implementation method, such as Figures 1 to 5 As shown, along the extension direction perpendicular to the mounting groove 21, the width of the connecting block 30 matches the width of the mounting groove 21.

[0032] It should be noted that the width of the connecting block 30 matches the width of the mounting groove 21 along the extension direction perpendicular to the mounting groove 21. The extension direction of the mounting groove 21, the axial direction of the guide shaft 10, and the extension direction perpendicular to the mounting groove 21 are all mutually perpendicular. The extension direction of the mounting groove 21 can be the length direction of the support frame 20, the axial direction of the guide shaft 10 can be the height direction of the support frame 20, and the extension direction perpendicular to the mounting groove 21 can be the width direction of the support frame 20, together forming a three-dimensional rectangular coordinate system. Matching the width of the connecting block 30 with the width of the mounting groove 21, such that the width of the connecting block 30 is slightly smaller than the width of the mounting groove 21, avoids movement jamming caused by interference fit and eliminates lateral offset caused by excessive clearance.

[0033] As one possible implementation method, such as Figures 1 to 5 As shown, the material box 100 also includes a base 40, a guide shaft 10 is fixedly disposed on the base 40, and multiple support frames 20 are stacked on the base 40.

[0034] It should be noted that the material box 100 also includes a base 40, which is a rectangular or circular plate-like structure or a frame structure. The shape of the base 40 should match the shape of the support frame 20. The base 40 is provided with positioning holes, and the guide shaft 10 passes through the positioning holes so that the guide shaft 10 is fixedly set on the base 40. After the guide shaft 10 and the base 40 are assembled, multiple support frames 20 are stacked on the base 40, while ensuring that the guide shaft 10 passes through the mounting slots 21 of multiple support frames 20. The base 40 serves as the overall support frame of the material box 100, realizing the precise positioning of the guide shaft 10 and the stable stacking of the support frames 20, while strengthening the structural integrity of the material box 100.

[0035] In other embodiments, the guide shaft 10 may be designed as an adjustable height structure. For example, the end of the guide shaft 10 that is connected to the base 40 is provided with a first thread, and the positioning hole of the base 40 is also provided with a second thread that matches the first thread of the guide shaft 10. By adjusting the depth to which the guide shaft 10 is screwed into the positioning hole, the height of the guide shaft 10 (i.e. the length of the guide shaft 10 protruding from the base 40 along its axial direction) can be adjusted to accommodate the stacking requirements of different numbers of carriers 20.

[0036] As one possible implementation method, such as Figures 1 to 5 As shown, the orthographic projection of multiple support frames 20 along the axial direction of the guide shaft 10 falls on the base 40, and the guide shaft 10 is located at the center of one side of the base 40 along the extension direction of the mounting groove 21.

[0037] It should be noted that, along the axial direction of the guide shaft 10, the orthographic projections of multiple support frames 20 fall on the base 40. In the initial state, the orthographic projections of multiple support frames 20 are all highly coincident with the base 40, so that the base 40 can be used as a reference for assembly and maintenance. Along the extension direction of the mounting groove 21, the guide shaft 10 is located at the center of one side of the base 40 to ensure that there is sufficient space on both sides of the guide shaft 10 when the support frame 20 slides. When the support frame 20 slides along the extension direction of the mounting groove 21, the multiple support frames 20 can be adjusted to be symmetrically distributed in space, which can optimize the utilization of space and facilitate the operator to apply force evenly from the side.

[0038] As one possible implementation method, such as Figures 1 to 5 As shown, the support frame 20 has slots 22 on opposite sides, and the two opposite sides of the chip substrate are respectively installed in the two slots 22.

[0039] It should be noted that the support frame 20 has snap-fit ​​grooves 22 on its opposite sides. The snap-fit ​​grooves 22 are U-shaped or stepped grooves opened on the opposite sides of the support frame 20. Their cross-sectional dimensions must match the thickness and side shape of the chip substrate. The support frame 20 and the snap-fit ​​grooves 22 are integrally formed. The snap-fit ​​grooves 22 can be coated with polytetrafluoroethylene to reduce the frictional resistance when the chip substrate is inserted into or removed from the snap-fit ​​grooves 22. During installation, the chip substrate is inserted into the snap-fit ​​grooves 22 on the opposite sides of the support frame 20 in a horizontal direction. The positioning is achieved by the lateral constraint of the groove wall. The insertion depth is based on the "center of the chip substrate coincides with the center of the support frame 20". The chip substrate is stably supported by the precise groove positioning, while also taking into account the convenience of installation and the need for substrate protection.

[0040] As one possible implementation method, such as Figures 1 to 5 As shown, the support frame 20 has a U-shaped or rectangular structure, and the mounting groove 21 and one of the snap-fit ​​grooves 22 are located on the same side of the support frame 20.

[0041] It should be noted that the carrier frame 20 has a U-shaped or rectangular structure and is integrally injection molded or metal bent. The snap-fit ​​groove 22 extends along the inner side of the side. The mounting groove 21 and one of the snap-fit ​​grooves 22 are located on the same side of the carrier frame 20. This allows the operator to adjust the carrier frame 20 and load and unload the chip substrate on the same operating surface (i.e., the horizontal plane) without frequently changing the operating direction, thus improving the efficiency of human-machine interaction.

[0042] This application also provides a baking apparatus, including the aforementioned ingredient container 100. Since the structure and beneficial effects of the ingredient container 100 have been described in detail in the foregoing embodiments, they will not be repeated here.

[0043] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

[0044] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this application will not describe the various possible combinations separately.

Claims

1. A material box, characterized in that, The device includes a guide shaft and multiple stacked carriers for supporting chip substrates. Each carrier has a mounting groove. The guide shaft passes through the mounting grooves of the carriers to movably connect with them. Each carrier can be driven to rotate relative to adjacent carriers about the axis of the guide shaft, and / or can be driven to slide relative to adjacent carriers along the extension direction of the mounting groove to increase the distance between the geometric centers of two adjacent chip substrates.

2. The material box according to claim 1, characterized in that, It also includes multiple stacked connecting blocks, each of which is sleeved on the outside of the guide shaft, and each of the multiple connecting blocks is slidably disposed in the mounting slots of the multiple support frames.

3. The material box according to claim 2, characterized in that, Along the axial direction of the guide shaft, the thickness of the connecting block is equal to the depth of the mounting groove.

4. The material box according to claim 2, characterized in that, Along the extending direction of the mounting groove, the length of the connecting block is less than the length of the mounting groove.

5. The material box according to claim 2, characterized in that, Along the extension direction perpendicular to the mounting groove, the width of the connecting block matches the width of the mounting groove.

6. The material box according to claim 1, characterized in that, It also includes a base, the guide shaft is fixedly mounted on the base, and multiple support frames are stacked on the base.

7. The material box according to claim 6, characterized in that, The orthographic projection of the plurality of the support frames along the axial direction of the guide shaft falls on the base, the guide shaft being located at the center of one side of the base along the extension direction of the mounting groove.

8. The material box according to claim 1, characterized in that, The support frame has snap-fit ​​slots on its opposite sides, and the chip substrate is installed in the two snap-fit ​​slots on its opposite sides.

9. The material box according to claim 8, characterized in that, The support frame has a U-shaped or rectangular structure, and the mounting groove and one of the snap-fit ​​grooves are located on the same side of the support frame.

10. A baking apparatus, characterized in that, Includes the material box as described in any one of claims 1 to 9.

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