Wafer cassette and semiconductor processing apparatus

Abstract

The application provides a wafer box and a semiconductor processing device, and relates to the technical field of wafer jigs. The wafer box comprises a box body, a blowing pipeline and a plurality of limiting supports. The inner wall of the box body is provided with a plurality of placement plates in the height direction, and wafer placement grooves are formed between adjacent placement plates. The blowing pipeline is arranged in the box body, and a plurality of first air holes are formed in the blowing pipeline. The plurality of limiting supports are connected to the box body or the blowing pipeline; a second air hole is formed in each limiting support, and each second air hole is in communication with the first air holes. The plurality of limiting supports and the plurality of placement plates are arranged in a staggered manner in the height direction. The wafer and the wafer box can be effectively prevented from being adhered, and the wafer can be conveniently picked up and transported.

Description

Technical Field

[0001] This utility model relates to the field of wafer fixture technology, and in particular to a wafer box and semiconductor processing equipment. Background Technology

[0002] In semiconductor packaging processes, wafer cassettes are typically used for storing and transporting wafers. Wafer cassettes require cleaning, and after cleaning, the surface of the support structure within the cassette is prone to developing rough, pitted surfaces. Subsequently, during subsequent wafer processing, reactive gases may enter the gap between the wafer and the support structure, forming a film. This film structure can easily adhere to the support structure at the wafer edges or surface, thus affecting wafer transport and pickup. Utility Model Content

[0003] The purpose of this invention is to provide a wafer cassette and semiconductor processing equipment that can effectively prevent wafers from sticking to the wafer cassette, and facilitate the picking and transportation of wafers.

[0004] In a first aspect, this utility model provides a wafer cassette, comprising: The box body; the inner wall of the box body is provided with multiple placement plates along the height direction, and a wafer placement groove is formed between adjacent placement plates; An air blowing pipe is provided inside the box, and a plurality of first air holes are provided on the air blowing pipe; Multiple limiting brackets are connected to the box body or the air blowing pipe; each limiting bracket is provided with a second air hole, and each second air hole communicates with the first air hole; The plurality of limiting brackets and the plurality of placement plates are staggered in the height direction.

[0005] In an optional embodiment, the limiting bracket is provided with mounting holes, and the air blowing pipe passes through each mounting hole of the limiting bracket in sequence to realize the connection between the limiting bracket and the air blowing pipe.

[0006] In an optional embodiment, the limiting bracket includes a first surface and a second surface disposed opposite to each other, and an outer peripheral surface connecting the first surface and the second surface; the first surface and the outer peripheral surface are respectively provided with a second air hole; the second air hole extends to the inner wall of the mounting hole to communicate with the first air hole on the air blowing pipe.

[0007] In an optional embodiment, a plurality of second air holes are provided at circumferential intervals on the outer peripheral surface.

[0008] In an optional embodiment, the bottom or top of the box is provided with a through hole, and the air blowing pipe extends to the through hole to connect with an external air source.

[0009] In an optional embodiment, the box body has a polygonal cross-section, and the air blowing pipe is located at the corner of the polygon.

[0010] In an optional embodiment, the box body includes a bottom plate, a top plate, and a side plate connected between the bottom plate and the top plate; the side plate is provided with a feed inlet.

[0011] In an optional embodiment, the box body includes a plurality of side panels connected in sequence, and each side panel is provided with the placement plate.

[0012] In an optional embodiment, the air blowing pipe is located at the corner formed by the connection of adjacent side plates.

[0013] Secondly, the present invention provides a semiconductor processing equipment, including a processing machine and a wafer cassette as described in any of the foregoing embodiments, wherein the wafer cassette is disposed on the processing machine.

[0014] The wafer cassette and semiconductor processing equipment provided in this embodiment of the present invention have the following beneficial effects: The placement plate in the wafer cassette holds the wafers. Gas from the air blowing pipes can enter each limiting bracket and be blown out from the second air hole of the limiting bracket. The gas blown out from the second air hole can act on the wafer surface, which is beneficial for separating the wafer from the placement plate when picking up the wafer, preventing the wafer surface or edge from sticking to the wafer cassette, improving the wafer transportation efficiency, and protecting the wafer. Attached Figure Description

[0015] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of a wafer cassette for placing wafers, provided as an embodiment of the present invention. Figure 2 This is a schematic diagram of the wafer cassette for placing wafers, provided as an embodiment of the present invention. Figure 3 A schematic diagram of the disassembled structure of a wafer cassette provided in an embodiment of this utility model; Figure 4 A first-view structural schematic diagram of the limiting bracket for the wafer cassette provided in an embodiment of this utility model; Figure 5This is a second-view structural schematic diagram of the limiting bracket for the wafer cassette provided in an embodiment of the present invention.

[0017] Icons: 100-Wafer box; 110-Box body; 111-Base plate; 112-Top plate; 113-Side plate; 114-Placement plate; 115-Wafer placement slot; 116-Through hole; 117-Feed inlet; 120-Air blowing pipe; 121-First air hole; 130-Limiting bracket; 131-Second air hole; 132-Mounting hole; 133-First surface; 135-Outer peripheral surface; 200-Wafer. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0021] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0022] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0023] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0024] The following detailed description, in conjunction with the accompanying drawings, outlines some embodiments of the present invention. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0025] Please combine Figures 1 to 3 The wafer cassette 100 provided in this embodiment of the invention enables the storage and transportation of wafers 200. It also effectively prevents the wafers 200 from sticking to the wafer cassette 100, and can effectively separate the wafers 200 and the wafer cassette 100 when picking up the wafers 200, improving separation and transportation efficiency. Simultaneously, it also provides a certain degree of protection for the wafers 200.

[0026] The wafer cassette 100 includes a housing 110, an air blowing pipe 120, and multiple limiting brackets 130. Multiple placement plates 114 are provided along the height direction on the inner wall of the housing 110, forming wafer placement slots 115 between adjacent placement plates 114. Each wafer cassette 100 can store or transport multiple wafers 200. The air blowing pipe 120 is located inside the housing 110 and has multiple first air holes 121. The multiple limiting brackets 130 are connected to the housing 110 or the air blowing pipe 120. Each limiting bracket 130 has a second air hole 131, and each second air hole 131 communicates with a first air hole 121. Gas in the air blowing pipe 120 can enter each limiting bracket 130 and be blown out from the second air hole 131 of the limiting bracket 130. The gas blown out from the second vent 131 can act on the surface of the wafer 200, which is beneficial for picking up the wafer 200, facilitating the separation of the wafer 200 from the placement board 114, preventing the surface or edge of the wafer 200 from sticking to the wafer box 100, improving the transportation efficiency of the wafer 200, and protecting the wafer 200.

[0027] Optionally, multiple limiting brackets 130 and multiple placement plates 114 are staggered in the height direction. When gas is blown out of the second vent 131 of the limiting bracket 130, such as from the upper surface of the limiting bracket 130, the blown gas acts on the bottom surface of the wafer 200 located above the limiting bracket 130, thereby effectively separating the upper wafer 200 from the placement plate 114 and preventing them from sticking together and being difficult to pick up.

[0028] Furthermore, when the wafer 200 is blown up by the expelled gas, it separates from the placement board 114. To prevent the wafer 200 from being blown up too high, that is, to prevent the wafer 200 from displacing too much in the height direction under the action of air blowing, the limiting bracket 130 can limit the maximum displacement of the wafer 200 when it is blown up, and play a limiting role in the wafer 200, preventing the wafer 200 from falling due to excessive separation displacement and other situations that could damage the wafer 200.

[0029] Please combine Figure 4 and Figure 5 In this embodiment, the limiting bracket 130 has a pentagonal cross-section, which provides structural stability, a large contact surface, and reliable limiting. It also facilitates the design of the second air hole 131. Of course, in other embodiments, the cross-sectional shape of the limiting bracket 130 can be designed as other shapes, such as circular, triangular, quadrilateral, hexagonal, etc., and can also be adaptively designed according to the actual space inside the box 110. No specific limitations are made here.

[0030] Optionally, the limiting bracket 130 is fixed to the inner wall of the housing 110. The limiting bracket 130 has mounting holes 132, and the air blowing pipe 120 passes through the mounting holes 132 of each limiting bracket 130 in sequence to connect the limiting bracket 130 and the air blowing pipe 120. In this way, the gas in the air blowing pipe 120 will be blown out from the second air hole 131 on each limiting bracket 130.

[0031] Optionally, the limiting bracket 130 includes a first surface 133 and a second surface disposed opposite to each other, and an outer peripheral surface 135 connecting the first surface 133 and the second surface. The first surface 133 and the outer peripheral surface 135 are each provided with a second air hole 131; the second air hole 131 extends to the inner wall of the mounting hole 132 to communicate with the first air hole 121 on the air blowing pipe 120. Here, the first surface 133 can be understood as the upper surface of the limiting bracket 130. It can be understood that the air blowing pipe 120 is provided with multiple first air holes 121, and each of the multiple first air holes 121 corresponds one-to-one with the second air hole 131 on the inner wall of the mounting hole 132 of each limiting bracket 130, ensuring that the gas in the air blowing pipe 120 can enter each limiting bracket 130 and be blown out from the first surface 133 and the outer peripheral surface 135 of the limiting bracket 130 respectively.

[0032] Optionally, a plurality of second air holes 131 are provided circumferentially spaced on the outer peripheral surface 135. These air holes can be blown out from the limiting bracket 130 in multiple directions to act on different surfaces of the wafer 200. It can be understood that the gas blown out from the first surface 133 of the limiting bracket 130 provides an upward force to the wafer 200, facilitating the separation of the wafer 200 from the placement plate 114 or the wafer 200 from the inner wall of the housing 110. When the wafer 200 is blown out, a gap appears between the wafer 200 and the placement plate 114. The gas blown out from the outer peripheral surface 135 of the limiting bracket 130 can better enter the gap between the wafer 200 and the placement plate 114, further increasing the separation angle, achieving better separation efficiency and effect, thereby improving the transfer efficiency of the wafer 200.

[0033] It should be noted that there may be one or more second vents 131 on the first surface 133. The distribution, number and shape of the second vents 131 on the entire limiting bracket 130 can be flexibly adjusted according to the actual situation, and no specific limitation is made here.

[0034] Optionally, the bottom or top of the housing 110 is provided with a through hole 116, and the air blowing pipe 120 extends to the through hole 116 to connect with an external air source. In this embodiment, the through hole 116 is located at the bottom of the housing 110. When the wafer cassette 100 is placed on the processing machine, the air blowing pipe 120 can be easily connected to the air vent of the processing machine, thereby introducing gas into the air blowing pipe 120. Of course, in some other embodiments, the through hole can also be provided at the top or side of the housing 110, and connected to an external air source through a pipeline; this is not specifically limited here.

[0035] Optionally, the cross-section of the housing 110 is polygonal, with the air blowing pipe 120 and the limiting bracket 130 located at the corners of the polygon. This improves space utilization, makes the structure more compact, and reduces the overall size and space occupied by the wafer housing 100.

[0036] Optionally, the housing 110 includes a base plate 111, a top plate 112, and a side plate 113 connected between the base plate 111 and the top plate 112. The side plate 113 is provided with a feed port 117. In this embodiment, the housing 110 has a polygonal cross-section with multiple corners. Furthermore, the housing 110 adopts a semi-open design to form the feed port 117, which has a larger cross-section, providing ample space for placing and removing the wafer 200 and facilitating operation.

[0037] Optionally, the housing 110 includes multiple side plates 113 connected in sequence, each side plate 113 being provided with a placement plate 114. This greatly improves the stability of wafer 200 placement, ensuring safe and reliable storage of the wafer 200. Optionally, air blowing pipes 120 are located at the corners formed by the connection of adjacent side plates 113. Multiple limiting brackets 130 are fixed to the side plates 113 and sleeved on the air blowing pipes 120, resulting in a compact, reliable, and stable structure. In this embodiment, multiple air blowing pipes 120 are provided, all designed perpendicular to the base plate 111. The multiple air blowing pipes 120 are respectively located at different corners to improve space utilization. The design of multiple air blowing pipes 120 facilitates air blowing to multiple parts of the wafer 200, improving air separation efficiency and thus enhancing the transmission efficiency of the wafer 200.

[0038] This utility model embodiment also provides a semiconductor processing apparatus, including a processing machine and a wafer cassette 100 as described in any of the foregoing embodiments, the wafer cassette 100 being disposed on the processing machine. The air blowing pipe 120 in the wafer cassette 100 can be connected to the air vent of the processing machine, thereby facilitating the introduction of an air source.

[0039] In summary, the wafer cassette 100 and semiconductor processing equipment provided in this embodiment of the present invention have the following beneficial effects, including: The placement plate 114 in the wafer cassette 100 is used to hold the wafer 200. Gas from the air blowing pipe 120 can enter each limiting bracket 130 and be blown out from the second air hole 131 on the first surface 133 and the outer peripheral surface 135 of the limiting bracket 130. The gas blown out from the second air hole 131 can act on the surface of the wafer 200, which is beneficial for the separation of the wafer 200 from the placement plate 114 when picking up the wafer 200, avoiding the surface or edge of the wafer 200 from sticking to the wafer cassette 100, improving the transport efficiency of the wafer 200, and protecting the wafer 200. The air blowing pipe 120 and the limiting bracket 130 are designed at the corners of the cassette 110, which helps to improve space utilization and make the structure more compact. Multiple air blowing pipes 120 are distributed in different corners, which can blow air to different parts of the wafer 200, improving separation efficiency and separation effect.

[0040] The semiconductor processing equipment provided in this embodiment of the present invention includes the wafer cassette 100 described above, which can effectively prevent the wafer 200 from sticking to the wafer cassette 100 and improve the transmission efficiency of the wafer 200.

[0041] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. Any modifications, equivalent substitutions, improvements, etc., should be included within the protection scope of this utility model.

Claims

1. A wafer cassette, characterized in that, include: Box body; The inner wall of the box is provided with multiple placement plates along the height direction, and a wafer placement groove is formed between adjacent placement plates; An air blowing pipe is provided inside the box, and a plurality of first air holes are provided on the air blowing pipe; Multiple limiting brackets are connected to the box body or the air blowing pipe; each limiting bracket is provided with a second air hole, and each second air hole communicates with the first air hole; The plurality of limiting brackets and the plurality of placement plates are staggered in the height direction.

2. The wafer cassette according to claim 1, characterized in that, The limiting bracket is provided with mounting holes, and the air blowing pipe passes through each mounting hole of the limiting bracket in sequence to realize the connection between the limiting bracket and the air blowing pipe.

3. The wafer cassette according to claim 2, characterized in that, The limiting bracket includes a first surface and a second surface disposed opposite to each other, and an outer peripheral surface connecting the first surface and the second surface; the first surface and the outer peripheral surface are respectively provided with the second air hole; the second air hole extends to the inner wall of the mounting hole to communicate with the first air hole on the air blowing pipe.

4. The wafer cassette according to claim 3, characterized in that, The outer peripheral surface is provided with a plurality of second air holes spaced circumferentially.

5. The wafer cassette according to claim 1, characterized in that, The box body has a through hole at the bottom or top, and the air blowing pipe extends to the through hole to connect with an external air source.

6. The wafer cassette according to any one of claims 1 to 5, characterized in that, The box body has a polygonal cross-section, and the air blowing pipe is located at the corner of the polygon.

7. The wafer cassette according to claim 6, characterized in that, The box body includes a bottom plate, a top plate, and a side plate connected between the bottom plate and the top plate; the side plate is provided with a feed inlet.

8. The wafer cassette according to claim 7, characterized in that, The box body includes multiple side panels connected in sequence, and each side panel is provided with the placement plate.

9. The wafer cassette according to claim 7, characterized in that, The air blowing pipe is located at the corner formed by the connection of adjacent side plates.

10. A semiconductor processing apparatus, characterized in that, It includes a processing machine and a wafer cassette as described in any one of claims 1 to 9, wherein the wafer cassette is disposed on the processing machine.

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