Semiconductor transport case

Abstract

The application discloses a semiconductor transport box body, and relates to the technical field of semiconductor production equipment.The side plate is arranged between the door plate and the back plate, and the side plate, the door plate and the back plate form a containing cavity.The containing cavity can contain the panel, so that the semiconductor transport box body can transport the panel.The side plate comprises a first side plate, a second side plate, a third side plate and a fourth side plate arranged in sequence.The fourth side plate is connected with the first side plate and the third side plate.The first side plate, the second side plate and the third side plate are integrally formed, that is, the first side plate, the second side plate and the third side plate are formed by bending a larger plate, so that the number of threaded holes on the first side plate, the second side plate and the third side plate is reduced, the first side plate, the second side plate and the third side plate can maintain higher flatness, the air tightness of the semiconductor transport box body is enhanced, and the structural strength of the semiconductor transport box body is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing equipment technology, and in particular to a semiconductor transport container. Background Technology

[0002] Currently, the manufacturing process of panels involves multiple steps, and each step requires different equipment. Therefore, panels need to be transferred between workstations and temporarily stored when necessary to coordinate with the production process.

[0003] In related technologies, sealed enclosures are typically used for storing and transporting panels. The sealed design of the enclosure effectively reduces the risk of panel contamination. The main structure of the enclosure is usually composed of four panels spliced ​​together. During splicing, corresponding threaded holes need to be machined on each panel, and the four panels are fixed together with bolts. However, machining too many threaded holes can easily cause panel deformation, which in turn reduces the airtightness of the entire enclosure. Utility Model Content

[0004] This application provides a semiconductor transport box that can solve the technical problem of reduced airtightness of the entire box.

[0005] In a first aspect, embodiments of this application provide a semiconductor transport container, which includes: Door panel; The back panel is positioned opposite the door panel; A peripheral side panel is located between the door panel and the back panel, and is connected to the door panel and the back panel to enclose and form a receiving cavity. The receiving cavity is used to receive the panel. The peripheral side panel includes a first side panel, a second side panel, a third side panel and a fourth side panel arranged in sequence. The first side panel and the third side panel are arranged opposite to each other, and the second side panel and the fourth side panel are arranged opposite to each other. The first side plate, the second side plate, and the third side plate are integrally formed, and the fourth side plate is connected to the first side plate and the third side plate.

[0006] In some embodiments, the first side panel has an outwardly folded first flange on the side away from the second side panel, and the third side panel has an outwardly folded second flange on the side away from the second side panel, and both the first flange and the second flange are connected to the fourth side panel.

[0007] In some embodiments, both the first flange and the second flange are welded to the fourth side plate.

[0008] In some embodiments, both the first flange and the second flange are provided with a plurality of first through holes, and the fourth side plate is provided with a plurality of second through holes; The semiconductor transport box also includes multiple connectors, one of which passes through a corresponding first through hole and second through hole to connect the fourth side plate to the first flange and the second flange.

[0009] In some embodiments, the semiconductor transport box further includes a bottom shell that covers the side of the fourth side plate facing away from the second side plate, and the connector is connected to the bottom shell.

[0010] In some embodiments, the semiconductor transport box further includes a connecting bracket located on the side of the second side plate facing away from the fourth side plate, and the connecting bracket is connected to the second side plate.

[0011] In some embodiments, the back panel is a transparent panel.

[0012] In some embodiments, the semiconductor transport box further includes a placement rack disposed within the receiving cavity, and the placement rack has multiple placement positions arranged sequentially along a direction perpendicular to the fourth side plate, the placement positions being used to place the panel.

[0013] In some embodiments, the placement rack includes: A fixing frame is disposed within the receiving cavity and adjacent to the back panel, and the fixing frame is connected to the peripheral side panel; Multiple sets of support shaft groups are arranged at intervals along a direction perpendicular to the fourth side plate, and each support shaft group includes at least two support shafts. At least two of the support shafts are arranged in a direction parallel to the fourth side panel, and one end of each support shaft is connected to the fixed frame, and the other end of each support shaft extends away from the back panel. The panel is placed above the two support shafts.

[0014] In some embodiments, the placement rack further includes: Multiple side supports, at least one of the side supports is located on the side of the first side plate facing away from the third side plate, and at least another side support is located on the side of the third side plate facing away from the first side plate, the side supports extending in a direction perpendicular to the fourth side plate; Multiple support rods are arranged at intervals in a direction perpendicular to the fourth side plate, with the first end of each support rod connected to the side support member, and the second end of each support rod passing through the receiving cavity in a direction parallel to the fourth side plate, and the second end of each support rod connected to the support shaft.

[0015] The semiconductor transport box based on the embodiments of this application has at least the following beneficial effects: By placing the peripheral side plate between the door panel and the back panel, and forming a receiving cavity with the peripheral side plate, the semiconductor transport box can accommodate the panel, enabling the panel to be transported. The peripheral side plate includes a first side plate, a second side plate, a third side plate, and a fourth side plate arranged in sequence. The fourth side plate is connected to the first and third side plates. The first, second, and third side plates are integrally formed, that is, they are formed by bending a large piece of material. When assembling the semiconductor transport box, the connection steps between the first and second side plates and between the second and third side plates can be reduced, which can reduce workload and production costs. It can also reduce the number of threaded holes on the first, second, and third side plates, so that the first, second, and third side plates can maintain a high degree of flatness, thereby enhancing the airtightness of the semiconductor transport box and improving its structural strength. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural diagram of a semiconductor transport box provided in an embodiment of this application; Figure 2 A three-dimensional structural diagram of the peripheral side plate provided in an embodiment of this application; Figure 3 This is an exploded structural diagram of a semiconductor transport container provided in an embodiment of this application.

[0018] Explanation of reference numerals in the attached figures: 100. Semiconductor transport box; 101. Receiving cavity; 1. Door panel; 2. Back panel; 3. Peripheral side panel; 31. First side panel; 311. First flange; 32. Second side panel; 33. Third side panel; 331. Second flange; 34. Fourth side panel; 341. Second through hole; 301. First through hole; 4. Connector; 5. Bottom shell; 6. Connecting bracket; 7. Placement rack; 701. Placement position; 71. Fixing frame; 72. Support shaft; 73. Side support; 74. Support rod. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0020] In related technologies, sealed boxes are typically used to store and transport panels. The sealed design of the box can effectively reduce the risk of panel contamination. The main structure of the box is usually composed of four panels spliced ​​together. During splicing, corresponding threaded holes need to be machined on each panel, and the four panels are fixed with bolts.

[0021] However, machining too many threaded holes on the panel increases workload and production costs, and can easily cause panel deformation, which in turn reduces the airtightness of the entire semiconductor transport box 100. In addition, when assembling the semiconductor transport box 100, the screws need to be installed in a predetermined order, and there are strict requirements on the torque applied to the screws. If any link in the assembly process is wrong, it can easily reduce the airtightness of the semiconductor transport box 100, making the installation process of the semiconductor transport box 100 complicated.

[0022] To resolve the above technical issues, please refer to Figures 1 to 3 This application provides a semiconductor transport box 100, which includes a door panel 1, a back panel 2, and peripheral side panels 3. The door panel 1 and the back panel 2 are disposed opposite to each other, and the peripheral side panels 3 are located between the door panel 1 and the back panel 2. The peripheral side panels 3 are connected to the door panel 1 and the back panel 2 to form a receiving cavity 101. The receiving cavity 101 can be used to receive panels, so that the semiconductor transport box 100 can be used to transport panels. The peripheral side panels 3 include a first side panel 31, a second side panel 32, a third side panel 33, and a fourth side panel 34 arranged in sequence. The first side panel 31 and the third side panel 33 are disposed opposite to each other, and the second side panel 32 and the fourth side panel 34 are disposed opposite to each other. The first side panel 31, the second side panel 32, and the third side panel 33 are integrally formed, and the fourth side panel 34 is connected to the first side panel 31 and the third side panel 33.

[0023] Understandably, the door panel 1 is a component for opening and closing the receiving cavity 101. One side of the door panel 1 can be hinged to the peripheral side panel 3, allowing the door to rotate relative to the peripheral side panel 3. The door panel 1 can also be locked and unlocked with the peripheral side panel 3. When it is necessary to transfer the panel, the door panel 1 can be unlocked from the peripheral side panel 3 first, and then the door panel 1 can be rotated away from the peripheral side panel 3 to open the receiving cavity 101, so that the panel can be placed in the receiving cavity 101. Then, the door panel 1 can be rotated towards the peripheral side panel 3 and locked with the peripheral side panel 3, so that the door panel 1 can seal the receiving cavity 101 to prevent the panel from being contaminated. Finally, the semiconductor transport box 100 is transported to the transfer destination.

[0024] Optionally, the first side plate 31, the second side plate 32, and the third side plate 33 are formed by bending a large piece of sheet metal. When assembling the semiconductor transport box 100, the connection steps between the first side plate 31 and the second side plate 32, as well as the connection steps between the second side plate 32 and the third side plate 33, can be reduced, thereby reducing workload and production costs. Furthermore, the number of threaded holes on the first side plate 31, the second side plate 32, and the third side plate 33 can be reduced, allowing the first side plate 31, the second side plate 32, and the third side plate 33 to maintain a high degree of flatness, thereby enhancing the airtightness of the semiconductor transport box 100 and improving the structural strength of the semiconductor transport box 100.

[0025] Please see Figure 2 In some embodiments, the first side plate 31 has an outwardly turned first flange 311 on the side away from the second side plate 32, and the third side plate 33 has an outwardly turned second flange 331 on the side away from the second side plate 32. Both the first flange 311 and the second flange 331 are connected to the fourth side plate 34.

[0026] Optionally, the first flange 311 and the second flange 331 are bent in a direction away from each other. Both the first flange 311 and the second flange 331 extend in a direction parallel to the fourth side plate 34. When assembling the semiconductor transport box 100, the first side plate 31 is connected to the fourth side plate 34 through the first flange 311, and the third side plate 33 is connected to the fourth side plate 34 through the second flange 331. This makes it easy to connect the first side plate 31 and the third side plate 33 to the opposite sides of the fourth side plate 34, and increases the contact area between the first side plate 31 and the fourth side plate 34, as well as the contact area between the third side plate 33 and the fourth side plate 34, thereby increasing the airtightness of the receiving cavity 101.

[0027] In some embodiments, both the first flange 311 and the second flange 331 are welded to the fourth side plate 34.

[0028] Optionally, the projection of the first flange 311 onto the first plane falls within the projection of the fourth side plate 34 onto the first plane. The first plane is perpendicular to a first direction, which is perpendicular to the fourth side plate 34. The projection of the second flange 331 onto the first plane also falls within the projection of the fourth side plate 34 onto the first plane. The first flange 311 can contact the surface of the fourth side plate 34, and a first welding area can be formed between the fourth side plate 34 and the first flange 311. Solder can be filled into the first welding area so that the fourth side plate 34 can be welded to the first flange 311. Similarly, the second flange 331 can also contact the surface of the fourth side plate 34, and a second welding area can be formed between the second flange 331 and the fourth side plate 34. Solder can be filled into the second welding area so that the fourth side plate 34 can be welded to the second flange 331.

[0029] Please see Figure 1 and Figure 2 In some embodiments, the first flange 311 and the second flange 331 are provided with a plurality of first through holes 301, the fourth side plate 34 is provided with a plurality of second through holes 341, and the semiconductor transport box 100 also includes a plurality of connectors 4, one connector 4 passing through a corresponding first through hole 301 and a second through hole 341 to connect the fourth side plate 34 with the first flange 311 and the second flange 331.

[0030] Optionally, the opposite sides of the fourth side plate 34 are provided with a plurality of second through holes 341. A portion of the plurality of second through holes 341 is arranged opposite to the first flange 311, and another portion of the plurality of second through holes 341 is arranged opposite to the second flange 331. A first through hole 301 is arranged opposite to a second through hole 341. The connector 4 can be a screw, bolt, etc. The connector 4 passes through a corresponding first through hole 301 and second through hole 341 to connect the fourth side plate 34 with the first flange 311 and the second flange 331, so that the first side plate 31 and the third side plate 33 can be stably connected with the fourth side plate 34, and the assembly is also very convenient.

[0031] Please see Figure 1 and Figure 3 In some embodiments, the semiconductor transport box 100 further includes a bottom shell 5, which covers the side of the fourth side plate 34 facing away from the second side plate 32, and the connector 4 is connected to the bottom shell 5.

[0032] Optionally, the fourth side plate 34 is the bottom plate of the semiconductor transport box 100. The bottom shell 5 is located on the side of the fourth side plate 34 facing away from the second side plate 32. The bottom shell 5 is provided with a support member. The connector 4 passes through the first through hole 301 and the second through hole 341 and can also be connected to the support member, so that the bottom shell 5 can be installed under the fourth side plate 34. Thus, the bottom shell 5 can protect the fourth side plate 34 and prevent the fourth side plate 34 from being impacted during the transfer of the panel.

[0033] Please see Figure 1 and Figure 3 In some embodiments, the semiconductor transport box 100 further includes a connecting bracket 6, which is located on the side of the second side plate 32 facing away from the fourth side plate 34, and is connected to the second side plate 32.

[0034] Optionally, the second side plate 32 is the top plate of the semiconductor transport box 100, and the connecting bracket 6 is located on the side of the second side plate 32 facing away from the fourth side plate 34. The connecting bracket 6 is connected to the second side plate 32 and can be connected to external lifting equipment, so that the semiconductor transport box 100 can be transferred by lifting equipment, thereby further improving the transfer efficiency.

[0035] In some embodiments, the back panel 2 is a transparent panel, or optionally, the back panel 2 is tempered glass, so that the contents of the receiving cavity 101 can be directly observed from the back panel 2.

[0036] Please see Figure 3 In some embodiments, the semiconductor transport box 100 further includes a placement rack 7 disposed within the receiving cavity 101, and the placement rack 7 has a plurality of placement positions 701 arranged sequentially along a direction perpendicular to the fourth side plate 34, the placement positions 701 being used to place panels.

[0037] Optionally, the placement rack 7 is installed in the receiving cavity 101. The placement rack 7 has multiple placement positions 701, each of which can be used to store a panel. The multiple placement positions 701 are arranged sequentially along a direction perpendicular to the fourth side plate 34, so that multiple panels can be placed sequentially in the receiving cavity 101 along a direction perpendicular to the fourth side plate 34, thereby enabling multiple panels to be transferred at one time and improving the efficiency of panel transfer.

[0038] Please see Figure 3 In some embodiments, the placement rack 7 includes a fixed frame 71 and multiple sets of support shafts. The fixed frame 71 is disposed in the receiving cavity 101 and adjacent to the back panel 2, and the fixed frame 71 is connected to the peripheral side panel 3. The multiple sets of support shafts are arranged sequentially at intervals along a direction perpendicular to the fourth side panel 34. Each support shaft set includes at least two support shafts 72, which are arranged along a direction parallel to the fourth side panel 34. One end of each support shaft 72 is connected to the fixed frame 71, and the other end of each support shaft 72 extends away from the back panel 2. The area above the two support shafts 72 is used to place a panel.

[0039] Optionally, the fixing frame 71 is a square frame, and the outer contour shape of the fixing frame 71 is the same as the inner contour shape of the receiving cavity 101. The fixing frame 71 can be connected to the inner wall surface of the peripheral side plate 3, so that the fixing frame 71 can be fixed in the receiving cavity 101. In this embodiment, the fixing frame 71 has multiple fixing rods, which extend in a direction perpendicular to the fourth side plate 34, and the multiple fixing rods are arranged at intervals in a direction parallel to the fourth side plate 34.

[0040] Multiple sets of support shafts are arranged sequentially at intervals along a direction perpendicular to the fourth side plate 34, and each set of support shafts includes at least two support shafts 72. One end of each support shaft 72 is connected to two fixing rods, and the other end of each support shaft 72 extends away from the back plate 2. A placement position 701 can be formed above the two support shafts 72, and the panel can be placed above the two support shafts 72, thereby stably supporting multiple panels in the receiving cavity 101.

[0041] In some embodiments, each set of support shafts may include three support shafts 72, which are arranged sequentially at intervals along a direction parallel to the fourth side plate 34. One end of each of the three support shafts 72 is connected to a three fixing rod, and the other end of each support shaft 72 extends away from the back plate 2. A placement position 701 can be formed above the three support shafts 72 for placing the panel, so that the panel is placed more stably.

[0042] Please see Figure 3 In some embodiments, the placement rack 7 further includes a plurality of side supports 73 and a plurality of support rods 74. At least one side support 73 is located on the side of the first side plate 31 facing away from the third side plate 33, and at least another side support 73 is located on the side of the third side plate 33 facing away from the first side plate 31. The side supports 73 extend in a direction perpendicular to the fourth side plate 34. The plurality of support rods 74 are arranged sequentially at intervals in a direction perpendicular to the fourth side plate 34. The first end of the support rod 74 is connected to the side support 73, and the second end of the support rod 74 passes through the receiving cavity 101 in a direction parallel to the fourth side plate 34. The second end of the support rod 74 is connected to the support shaft 72.

[0043] In this embodiment, there are four side support members 73. Two side support members 73 are located on the side of the first side plate 31 facing away from the third side plate 33, and two side support members 73 are located on the side of the third side plate 33 facing away from the first side plate 31. Each side support member 73 extends in a direction perpendicular to the fourth side plate 34. Both the first side plate 31 and the third side plate 33 have multiple through holes, which are arranged sequentially at intervals in a direction perpendicular to the fourth side plate 34.

[0044] Each side support 73 is connected to multiple support rods 74. The multiple support rods 74 are arranged in sequence at intervals along a direction perpendicular to the fourth side plate 34. The first end of the support rod 74 is connected to the side support 73, and the support rod 74 passes through the through hole. The second end of the support rod 74 is located in the receiving cavity 101 and is connected to the support shaft 72. Thus, the support rod 74 can support the support shaft 72, so that the support shaft 72 can support the panel more stably and prevent the panel from shaking in the receiving cavity 101.

[0045] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0046] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A semiconductor transport box, characterized in that, include: Door panel; The back panel is positioned opposite the door panel; A peripheral side panel is located between the door panel and the back panel, and is connected to the door panel and the back panel to enclose and form a receiving cavity. The receiving cavity is used to receive the panel. The peripheral side panel includes a first side panel, a second side panel, a third side panel and a fourth side panel arranged in sequence. The first side panel and the third side panel are arranged opposite to each other, and the second side panel and the fourth side panel are arranged opposite to each other. The first side plate, the second side plate, and the third side plate are integrally formed, and the fourth side plate is connected to the first side plate and the third side plate.

2. The semiconductor transport box according to claim 1, characterized in that, The first side panel has an outwardly turned first flange on the side away from the second side panel, and the third side panel has an outwardly turned second flange on the side away from the second side panel. Both the first flange and the second flange are connected to the fourth side panel.

3. The semiconductor transport box according to claim 2, characterized in that, Both the first flange and the second flange are welded to the fourth side plate.

4. The semiconductor transport box according to claim 2, characterized in that, Both the first flange and the second flange are provided with multiple first through holes, and the fourth side plate is provided with multiple second through holes; The semiconductor transport box also includes multiple connectors, one of which passes through a corresponding first through hole and second through hole to connect the fourth side plate to the first flange and the second flange.

5. The semiconductor transport box according to claim 4, characterized in that, The semiconductor transport box also includes a bottom shell, which covers the side of the fourth side plate facing away from the second side plate, and the connector is connected to the bottom shell.

6. The semiconductor transport box according to claim 1, characterized in that, The semiconductor transport box also includes a connecting bracket, which is located on the side of the second side plate facing away from the fourth side plate, and the connecting bracket is connected to the second side plate.

7. The semiconductor transport box according to claim 1, characterized in that, The back panel is a transparent panel.

8. The semiconductor transport box according to claim 1, characterized in that, The semiconductor transport box also includes a placement rack, which is disposed within the receiving cavity and has multiple placement positions arranged sequentially along a direction perpendicular to the fourth side plate. The placement positions are used to place the panel.

9. The semiconductor transport box according to claim 8, characterized in that, The placement rack includes: A fixing frame is disposed within the receiving cavity and adjacent to the back panel, and the fixing frame is connected to the peripheral side panel; Multiple sets of support shaft groups are arranged at intervals along a direction perpendicular to the fourth side plate, and each support shaft group includes at least two support shafts. At least two of the support shafts are arranged in a direction parallel to the fourth side panel, and one end of each support shaft is connected to the fixed frame, and the other end of each support shaft extends away from the back panel. The panel is placed above the two support shafts.

10. The semiconductor transport box according to claim 9, characterized in that, The placement rack also includes: Multiple side supports, at least one of the side supports is located on the side of the first side plate facing away from the third side plate, and at least another side support is located on the side of the third side plate facing away from the first side plate, the side supports extending in a direction perpendicular to the fourth side plate; Multiple support rods are arranged at intervals in a direction perpendicular to the fourth side plate, with the first end of each support rod connected to the side support member, and the second end of each support rod passing through the receiving cavity in a direction parallel to the fourth side plate, and the second end of each support rod connected to the support shaft.

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