Combined photovoltaic silicon wafer conveying box

Abstract

The utility model provides a combined photovoltaic silicon wafer transmission and carrying box belongs to silicon wafer transmission and carrying box technical field, including bottom plate, be located in the inner bolster and two side covers of bottom plate top, two side covers and bottom plate constitute box -like structure, the lower clamping groove of equal interval is located in the inner bolster top, the side clamping groove of equal interval is located in the side cover inboard wall, be located in the silicon wafer material taking subassembly of bottom plate inside, silicon wafer material taking subassembly includes: the cavity of being located in the bottom plate inside near the position of inner bolster just below, rotates in the lead screw of inner wall of cavity, pushes the table through the nut seat of screw fixed on the lead screw, the utility model discloses the direction of extrusion force is changed through the slope of pushing table and the contact place of top material board, and then makes the pushing table of horizontal movement push top material board vertical motion, and top material board can lift the silicon wafer in the lower clamping groove, and the adjacent silicon wafer is not in the same height, can directly take out the silicon wafer.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer carrier technology, specifically relating to a combined photovoltaic silicon wafer carrier. Background Technology

[0002] Photovoltaic silicon wafer transfer boxes are specialized equipment used in photovoltaic cell production lines for the carrying, sorting, inspection, and transfer of silicon wafers. They mainly undertake the functions of carrying, sorting, inspecting, and dimensional adaptation of silicon wafers.

[0003] Existing photovoltaic silicon wafer carrier boxes, after carrying silicon wafers, have small spacing between adjacent silicon wafers and are at the same height, making it difficult to easily remove the silicon wafers from the box. Moreover, the internal space of the carrier box is limited, requiring precise insertion before carrying silicon wafers, which increases the precision of the insertion operation.

[0004] Therefore, a combined photovoltaic silicon wafer carrier box is proposed. Summary of the Invention

[0005] This invention provides a combined photovoltaic silicon wafer carrier box, the purpose of which is to solve the problems mentioned above.

[0006] This utility model embodiment provides a combined photovoltaic silicon wafer transport box, including a base plate; an inner support platform and two side covers disposed on the top of the base plate, the two side covers and the base plate forming a box-shaped structure; a lower slot equally spaced on the top of the inner support platform; side slots equally spaced on the inner sidewalls of the side covers; and a silicon wafer picking assembly disposed inside the base plate. The silicon wafer picking assembly includes: a cavity disposed inside the base plate near the lower part of the inner support platform; a lead screw rotating on the inner sidewall of the cavity; a push platform fixed to a nut seat on the lead screw by screws; two inclined surfaces symmetrically disposed on the outer sidewalls of the push platform; a top material groove disposed at the bottom of the inner support platform and the top of the base plate near the lower slots; a top material plate inserted into the top material groove; a groove disposed at the center of the bottom of the top material plate; and two inclined surfaces symmetrically disposed on the outer sidewalls of the top material plate near the bottom of the groove.

[0007] Furthermore, a positioning block is provided at the center of one outer wall of the side cover, and several positioning holes are equally spaced at the top of the bottom plate near the position directly below the positioning block. A positioning pin passes through the center of the top of the positioning block, and one end of the positioning pin can be vertically inserted into the positioning hole.

[0008] Furthermore, a slider is provided at the bottom of the side cover, and a groove is provided at the top of the base plate near the outer side of the slider, and the slider and the groove are slidably connected.

[0009] Furthermore, the side slot has an L-shaped cross-section, and the inner wall of the side cover fits against the outer wall of the inner support platform.

[0010] Furthermore, one end of the lead screw extends out of the base plate, and a handwheel is provided at one end of the lead screw.

[0011] Furthermore, the first inclined plane and the second inclined plane are horizontal.

[0012] Furthermore, the top material groove and the lower clamping groove are connected, and the cross-section of the top material groove is smaller than the cross-section of the lower clamping groove.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. This utility model changes the direction of the extrusion force by using the inclined surface at the contact point between the push table and the top plate, thereby causing the horizontally moving push table to push the top plate to move vertically. The top plate can lift the silicon wafers in the lower slot, and adjacent silicon wafers are not at the same height, so the silicon wafers can be directly removed. As the push table moves, multiple silicon wafers in the transfer box can move in a wave-like manner, which makes it easier to remove the silicon wafers one by one.

[0015] 2. This utility model, through the separate design of the inner support platform and the side cover, allows the side cover to be far away from the inner support platform when the silicon wafer is inserted into the lower slot at the top of the inner support platform. This provides a large space for silicon wafer insertion, eliminating the need for precise alignment and facilitating efficient silicon wafer insertion. Furthermore, the combined box structure formed by the two side covers and the base plate facilitates the insertion and removal of silicon wafers and provides load-bearing protection for the silicon wafers, making silicon wafer transportation and processing easier.

[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures particularly pointed out in the description and the drawings. Attached Figure Description

[0017] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0019] Figure 2 This is a half-sectional schematic diagram of an embodiment of the present utility model;

[0020] Figure 3 This is an embodiment of the present utility model. Figure 2 Enlarged diagram of point A in the diagram;

[0021] Figure 4 This is a schematic diagram of the push platform structure according to an embodiment of the present utility model;

[0022] Figure 5 This is a schematic diagram of the top plate structure according to an embodiment of the present utility model;

[0023] Figure 6 This is a schematic diagram of the inner support structure according to an embodiment of the present utility model;

[0024] Figure 7 This is a schematic diagram of the base plate structure of an embodiment of the present utility model;

[0025] Figure 8 This is a schematic diagram of the side cover structure according to an embodiment of the present utility model;

[0026] Reference numerals: 1. Base plate; 2. Inner support platform; 3. Side cover; 4. Lower slot; 5. Side slot; 6. Silicon wafer picking assembly; 61. Cavity; 62. Lead screw; 63. Pushing platform; 64. Inclined surface one; 65. Top material groove; 66. Top material plate; 67. Groove; 68. Inclined surface two; 7. Positioning block; 8. Positioning hole; 9. Positioning pin; 10. Slider; 11. Slide groove. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] Example 1

[0029] Reference Figure 1-6 This utility model embodiment proposes a combined photovoltaic silicon wafer transfer box, including a base plate 1. An inner support platform 2 is provided at the top center of the base plate 1, and two side covers 3 are symmetrically arranged on the top of the base plate 1 near the outer side of the inner support platform 2. The top of the inner support platform 2 has several lower slots 4 at equal intervals, which can be used to insert photovoltaic silicon wafers. The inner side wall of the side cover 3 has a side slot 5 with an L-shaped cross-section. The inner side wall of the side cover 3 fits against the outer side wall of the inner support platform 2. The L-shaped side slot 5 can support the bottom of the inserted silicon wafer, ensuring the stability of the silicon wafer placed inside the transfer box.

[0030] A cavity 61 for the silicon wafer feeding assembly 6 is formed inside the base plate 1, directly below the inner support platform 2. A lead screw 62 is rotatably connected to the inner wall of the cavity 61. One end of the lead screw 62 extends out of the base plate 1, and a handwheel is provided at one end of the lead screw 62. The handwheel can be used to rotate the lead screw 62, thereby driving the push platform 63 to move linearly and reciprocally within the cavity 61. The nut seat on the lead screw 62 is fixedly connected to the push platform 63 by screws. Two inclined surfaces 64 are symmetrically formed on the outer wall of the push platform 63. A top material groove 65 is formed at the bottom of the inner support platform 2 and the top of the base plate 1, directly below the lower retaining groove 4. The top material groove 65 is connected to the lower retaining groove 4, and the cross-section of the top material groove 65 is... The cross-section is smaller than that of the lower slot 4. The interconnected structure allows the top plate 66 to enter the lower slot 4, thereby lifting the silicon wafer inserted into the lower slot 4 and preventing the silicon wafer from falling into the top groove 65. The top plate 66 is matched inside the top groove 65. A groove 67 is opened at the center of the bottom of the top plate 66. Two inclined surfaces 68 are symmetrically opened at the top of the inside of the groove 67. Inclined surfaces 64 and 68 are horizontal. Through the horizontal inclined surfaces 64 and 68, when the push stage 63 moves horizontally, the push stage 63 pushes the top plate 66 to move vertically. The top plate 66 lifts the silicon wafer, making the adjacent silicon wafers misaligned, which makes it easier to remove the silicon wafer.

[0031] To facilitate the convenient removal of adjacent silicon wafers from the transfer box, in this embodiment, the lead screw 62 is rotated within the cavity 61, and the push platform 63 moves linearly along the lead screw 62. As the push platform 63 moves, the inclined surface 64 on the push platform 63 contacts the inclined surface 68 on the top plate 66. The lower slot 4 and the top slot 65 vertically guide and limit the top plate 66. Utilizing the change in pressure when the inclined surfaces contact, the horizontally moving push platform 63 pushes the top plate 66 vertically. After the top of the top plate 66 enters the lower slot 4, it contacts the silicon wafer. The top plate 66 lifts the silicon wafer in the lower slot 4. At this time, the silicon wafer is not at the same height as the adjacent silicon wafer, and the silicon wafer can be directly removed. As the push platform 63 continues to move, multiple silicon wafers in the transfer box can move in a wave-like manner, thereby removing the silicon wafers one by one.

[0032] After the pusher 63 and the top plate 66 are separated, the top plate 66 falls back to its original position under its own gravity, making it easier for the next ejection operation.

[0033] Example 2

[0034] Reference Figure 1 , Figure 7 and Figure 8This utility model embodiment also proposes a combined photovoltaic silicon wafer carrier box, including a base plate 1, an inner support platform 2 is provided at the top center of the base plate 1, and two side covers 3 are symmetrically arranged at the top of the base plate 1 near the outer side of the inner support platform 2. The top of the inner support platform 2 is provided with several lower slots 4 at equal intervals, which can be used to insert photovoltaic silicon wafers. The inner sidewall of the side cover 3 is provided with side slots 5. The two side covers 3, the inner support platform 2 and the base plate 1 are fitted together to form a box structure for carrying photovoltaic silicon wafers.

[0035] A positioning block 7 is provided at the center of one side outer wall of the side cover 3. Several positioning holes 8 are equally spaced at the top of the bottom plate 1, directly below the positioning block 7. A positioning pin 9 passes through the center of the top of the positioning block 7. The bottom end of the positioning pin 9 can be inserted into one of the positioning holes 8. Slider blocks 10 are symmetrically arranged at the bottom of the side cover 3. A sliding groove 11 is provided at the top of the bottom plate 1, near the outer side of the slider 10. The slider 10 and the sliding groove 11 are slidably connected.

[0036] In order to facilitate the quick and efficient insertion of silicon wafers into the transfer box, in this embodiment, by sliding the slider 10 in the slide groove 11, the two side covers 3 are moved in opposite directions along the base plate 1, and the inner support platform 2 between the two side covers 3 is exposed. At this time, the distance between the two side covers 3 is much greater than the width of the silicon wafer. Multiple silicon wafers are inserted vertically into the lower slot 4 at the top of the inner support platform 2 in sequence. Under the limitation of the lower slot 4, the silicon wafers are supported by the inner support platform 2.

[0037] Then, the two side covers 3 are pushed to move towards each other. As the side covers 3 move, the side slots 5 on the side covers 3 are fitted onto the outside of the silicon wafer. As the side covers 3 move, the side covers 3 push the silicon wafer horizontally and linearly in the lower slots 4 on the inner support platform 2 until the two side covers 3 push the silicon wafer to the position directly above the inner support platform 2. At this time, the positioning pin 9 is inserted into the positioning hole 8 at the corresponding position after passing through the positioning block 7 to fix the position of the side covers 3. The two side covers 3 and the base plate 1 form a box structure. The box structure carries and protects the silicon wafer, which facilitates the transfer and processing of the silicon wafer.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A combined photovoltaic silicon wafer transfer box, characterized in that: Including the base plate (1); An inner support platform (2) and two side covers (3) are provided on the top of the base plate (1), and the two side covers (3) and the base plate (1) form a box-shaped structure; Lower slots (4) are equally spaced on the top of the inner support platform (2); Side slots (5) are equally spaced on the inner sidewall of the side cover (3); A silicon wafer feeding assembly (6) is located inside the base plate (1); The silicon wafer feeding assembly (6) includes: A cavity (61) is formed inside the base plate (1) near the inner support platform (2) directly below it; A lead screw (62) that rotates on the inner wall of the cavity (61); The push platform (63) is fixed to the nut seat on the lead screw (62) by screws; Two inclined surfaces (64) are symmetrically opened on the outer side wall of the push platform (63); A top material groove (65) is opened at the bottom of the inner support platform (2) and directly below the lower slot (4) at the top of the base plate (1); A top plate (66) inserted inside the top groove (65); A groove (67) is formed at the center of the bottom of the top plate (66); A symmetrical inclined surface (68) is formed on the outer side wall of the top plate (66) near the bottom of the groove (67).

2. The combined photovoltaic silicon wafer transfer box according to claim 1, characterized in that: A positioning block (7) is provided at the center of one side outer wall of the side cover (3). Several positioning holes (8) are equally spaced at the top of the bottom plate (1) near the position directly below the positioning block (7). A positioning pin (9) passes through the center of the top of the positioning block (7). One end of the positioning pin (9) can be vertically inserted into the positioning hole (8).

3. The combined photovoltaic silicon wafer transfer box according to claim 1, characterized in that: The bottom of the side cover (3) is provided with a slider (10), and the top of the base plate (1) is provided with a groove (11) near the outer side of the slider (10). The slider (10) and the groove (11) are slidably connected.

4. The combined photovoltaic silicon wafer transfer box according to claim 1, characterized in that: The side slot (5) has an L-shaped cross-section, and the inner wall of the side cover (3) is in contact with the outer wall of the inner support (2).

5. A combined photovoltaic silicon wafer transfer box according to claim 1, characterized in that: One end of the lead screw (62) extends out of the base plate (1), and a handwheel is provided at one end of the lead screw (62).

6. A combined photovoltaic silicon wafer transfer box according to claim 1, characterized in that: The inclined plane one (64) and the inclined plane two (68) are horizontal.

7. A combined photovoltaic silicon wafer transfer box according to claim 1, characterized in that: The top material groove (65) and the lower card groove (4) are connected, and the cross-section of the top material groove (65) is smaller than the cross-section of the lower card groove (4).

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