A preheating disc facilitating rapid positioning, picking and placing of chips
Patent Information
- Application Number
- CN202522633774.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-11
- Publication Date
- 2026-09-25
- Estimated Expiration
- 2035-12-11
AI Technical Summary
当前芯片逐个放置在测试仪器上,测试仪器上的加热装置将芯片加热到较高的设定检测温度,然后进行性能检测,其缺陷在于:每个芯片从常温加热至检测温度,加热时间长,需要几分钟,而性能检测时间只需不到1分钟,长周期加热使得每个芯片的检测周期大大增长,检测速度慢,而设备的检测成本很昂贵,长周期的加热会极大占用设备,使得单个芯片的检测成本大大提高
[0014]该一种便于芯片快速定位取放的预热盘独立设在检测装置前,将芯片批量预加热至检测温度,再通过机械手逐个将预热芯片放在检测设备上,检测设备只需加热几秒即可达到检测温度,相对于原先因此大大缩短了检测周期,其有益效果是:其一,设置预热盘,能够大大缩短检测设备的加热时间,实现芯片的快速检测,有效利用检测设备,降低芯片的检测成本;其二,该预热盘采用铝合金材质,易于加工,能够形成高精度的产品槽,且导热系数大、加热快、加热时间短,同时垂向定位通孔实现芯片和加热板的接触导热,进一步快速达到设定温度;其三,该预热盘采用垂向定位通孔和定位槽结构的产品槽,能够使芯片平衡放置在产品槽,便于其快速取放;其四,产品槽设置第一斜面导壁、第二斜面导壁,便于芯片快速取出和摆放,芯片位置精度高,同时设置避让凹槽能够减少芯片的摆放位置和芯片接触面积,避免定位槽损伤芯片;其五,XY轴识别点、Z轴识别点能够提供良好的参考坐标系,便于产品的快速高精度摆放。
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Figure CN224805403U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip testing, and in particular to a preheating plate that facilitates rapid chip positioning and placement. Background Technology
[0002] Chips are high-precision products, and each chip needs to undergo high-temperature performance testing before leaving the factory. Currently, chips are placed one by one on a testing instrument, where a heating device heats the chip to a high set testing temperature before performance testing. The drawback is that heating each chip from room temperature to the testing temperature takes a long time, several minutes, while the performance testing time is less than one minute. The long heating cycle greatly increases the testing cycle for each chip, resulting in slow testing speed. Meanwhile, the testing equipment is very expensive, and the long heating cycle greatly occupies the equipment, significantly increasing the testing cost per chip. Utility Model Content
[0003] To address one or more of the aforementioned problems, this invention provides a preheating tray that facilitates rapid chip positioning and placement.
[0004] According to one aspect of the present invention, a preheating tray for facilitating rapid chip positioning and placement includes: a material tray, a heating plate, multiple XY axis identification points, and multiple Z axis identification points. The material tray includes a rectangular tray made of aluminum alloy. The upper wall of the tray has multiple material slots arranged longitudinally at equal intervals. The lower wall of each material slot has multiple product slots arranged transversely at equal intervals. Each product slot has a vertical positioning through hole at one end and an open positioning slot at the other end. The positioning through hole mates with the plastic encapsulation body of the chip, and the positioning slot mates with the pins of the chip. The upper end of the positioning through hole wall has a first inclined guide wall with multiple clearance grooves. The upper end of the positioning slot wall has a second inclined guide wall. The plastic encapsulation body of the chip enters the positioning through hole along the first inclined guide wall and fits against the heating plate below for rapid preheating. The pins enter along the second inclined guide wall and fit horizontally against the lower wall of the positioning slot, so that the chip is gently, accurately and evenly placed in the product slot for quick material retrieval. The heating plate is attached to the lower wall of the material tray and is electrically connected to the circuit. Multiple XY axis recognition points are installed at the four corners of the disk; Multiple Z-axis recognition points are installed at the four corners of the disk, with each Z-axis recognition point close to an XY-axis recognition point.
[0005] In some implementations, the zinc plating on the disc surface is oxidized.
[0006] In some implementations, the disc body is made of AL6061; the heating plate is a copper conductor.
[0007] In some implementations, the positioning through-hole is a rectangular through-hole that fits with the same diameter as the molding compound, and the positioning groove is a rectangular groove that fits with the gaps between multiple pins of the chip.
[0008] In some embodiments, a semi-circular hole is provided at the upper end of each of the four corners of the positioning through hole, and an inverted frustum-shaped clearance groove is provided at the upper end of each semi-circular hole. A rectangular clearance groove is provided on the front and rear walls and the side end walls of the positioning through hole.
[0009] In some embodiments, the right wall of the positioning through hole and the product groove is further provided with a third inclined guide wall; the upper ends of the first inclined guide wall and the upper ends of the second inclined guide wall are further provided with chamfers.
[0010] In some embodiments, the discharge trough is a transverse elongated oval trough, and the discharge trough and the vacuum suction and discharge unit of the pick-and-place module are spaced apart.
[0011] In some embodiments, the upper wall of the disc is provided with eight feeding slots at equal intervals in the longitudinal direction, and each feeding slot is provided with ten product slots at equal intervals in the transverse direction. Each product slot has a positioning through hole at the right end and a positioning slot at the left end.
[0012] In some embodiments, the upper wall of the heating plate is fixedly connected to the upper pin holes of the plate body by laterally spaced positioning pins; the plate body is provided with four lateral elongated upper connecting holes in the middle, and the upper end of the upper connecting holes is provided with a receiving groove that communicates with the outer material discharge groove. The threaded part is a cylindrical head screw, the nut is located in the receiving groove and the stud passes through the upper connecting hole to fix the threaded hole of the heating plate.
[0013] In some embodiments, four first mounting slots and a second mounting slot located outside the first mounting slots are symmetrically provided at both ends of the two transverse edges of the disk body; four XY axis identification points are installed in the first mounting slots and four Z axis identification points are installed in the second mounting slots.
[0014] This preheating tray, designed for rapid chip positioning and placement, is independently located in front of the testing device. It preheats chips in batches to the testing temperature, and then a robotic arm places each preheated chip onto the testing equipment. The testing equipment only needs to heat the chips for a few seconds to reach the testing temperature, significantly shortening the testing cycle compared to the previous method. Its advantages are: firstly, the preheating tray greatly reduces the heating time of the testing equipment, enabling rapid chip testing, effectively utilizing the testing equipment, and reducing chip testing costs; secondly, the preheating tray is made of aluminum alloy, which is easy to process, can form high-precision product slots, and has a high thermal conductivity, resulting in fast heating and short heating time. First, the short interval between the chips and the heating plate, along with the vertical positioning through-holes, allows for contact heat conduction between the chip and the heating plate, further accelerating the achievement of the set temperature. Second, the product slot with vertical positioning through-holes and positioning grooves ensures that the chip is placed evenly in the slot, facilitating rapid pick-up and drop-off. Third, the product slot features a first and second inclined guide wall, facilitating rapid chip removal and placement with high chip positioning accuracy. Additionally, the avoidance grooves reduce the chip placement area and contact area, preventing damage to the chip from the positioning groove. Fourth, the XY-axis and Z-axis recognition points provide a good reference coordinate system, facilitating rapid and high-precision placement of the product. Attached Figure Description
[0015] Figure 1 This is a three-dimensional schematic diagram of a preheating plate that facilitates rapid chip positioning and placement according to one embodiment of the present invention. Figure 2 for Figure 1 A partially enlarged schematic diagram of the material handling tray shown; Figure 3 for Figure 2 A partially enlarged schematic diagram of the product tank shown; Figure 4 for Figure 2 A top view of the product tank shown; Figure 5 for Figure 2 The diagram shows the front view of the preheating tray being unloaded. Material tray 1, tray body 10, first mounting groove 101, second mounting groove 102, first lower through hole 103, first lateral through hole 104, second lower through hole 105, second lateral through hole 106, material discharge groove 11, product groove 12, positioning through hole 120, positioning groove 121, first inclined guide wall 122, clearance groove 123, second inclined guide wall 124, third inclined guide wall 125, chamfer 126, semi-circular hole 127, upper pin hole 13, upper connecting hole 14, receiving groove 15; Heating plate 2; XY axis identification point 3; Z axis identification point 4; Chip 00, plastic package 001, pins 002; Pick-and-place module 01, vision inspection unit 010, vacuum suction and release unit 011, robotic arm 012. Detailed Implementation
[0016] The present invention will now be described in further detail with reference to the accompanying drawings. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to the directions in the accompanying drawings, while the terms "inner" and "outer" refer to the directions toward or away from the geometric center of a specific component, respectively.
[0017] Figures 1 to 5 The diagram schematically illustrates a preheating tray for facilitating rapid chip positioning and placement according to one embodiment of the present invention. As shown, the preheating tray for facilitating rapid chip positioning and placement includes: a material placement tray 1, a heating plate 2, multiple XY axis identification points 3, and multiple Z axis identification points 4; The feeding tray 1 includes a rectangular tray 10 made of aluminum alloy. Further, the tray 10 is preferably made of AL6061 aluminum alloy, which has low density, is lightweight, and easy to process; it also has a high thermal conductivity, resulting in fast and short heating times. The surface of the tray 10 is treated with a zinc-plated oxide layer to prevent the chip from being electrically broken down. Multiple feeding slots 11 are longitudinally spaced at equal intervals along the middle of the upper wall of the tray 10. Multiple product slots 12 are transversely spaced at equal intervals along the middle of the lower wall of each feeding slot 11. Each product slot 12 has a vertical positioning through-hole 120 at one end and an open positioning slot 121 at the other end. The positioning through-hole 120 engages with the plastic encapsulation body 001 of the chip 00, and the positioning slot 121 engages with the pins 002 of the chip 00. The vertical positioning through-hole 120 allows the chip 00 to directly contact the heating plate for convenient and rapid heating, while the positioning slot 121 precisely supports the pins 001, keeping the chip balanced. Furthermore, the positioning through-hole 120 is preferably a rectangular through-hole that fits with the same diameter as the molding body 001, and the positioning groove 121 is preferably a rectangular groove that fits with the gaps of the multiple pins 002 of the chip 00. This setting reduces the chip placement position, avoids positional deviation during chip placement, maintains a good chip position, and facilitates quick pick-and-place. The upper end of the positioning through-hole 120 is provided with a first inclined guide wall 122 and its hole wall is provided with multiple avoidance grooves 123. The avoidance grooves can reduce the placement position and chip contact area of the chip 00, avoid the positioning groove 121 from damaging the chip 00, and at the same time, the placement tray 1 is lightweight. The upper end of the positioning groove 121 is provided with a second inclined guide wall 124; the first inclined guide wall 122 and the second inclined guide wall 124 facilitate the introduction of the chip 00.
[0018] The heating plate 2 is attached to the lower wall of the feeding tray 1 and is electrically connected to the circuit. Furthermore, it is positioned and connected to the tray body 10 by multiple locating pins and fixed to the tray body 10 by multiple threaded parts. Furthermore, the heating plate 2 is preferably a copper conductor, which has good thermal conductivity.
[0019] Multiple XY axis recognition points 3 are installed at the four corners of the disk body 10; Multiple Z-axis identification points 4 are installed at the four corners of the disk body 10. Each Z-axis identification point 4 is close to an XY-axis identification point 3, providing positioning reference points for the XY-axis and Z-axis, i.e., reference coordinate system. The visual inspection unit 010 of the pick-and-place module 01 scans and acquires the XY axis recognition point 3 and the Z axis recognition point 4 to obtain a reference coordinate system. The pick-and-place module 01 quickly moves to the target product slot 12 to place the chip. The plastic encapsulation body 001 of the chip 00 enters the positioning through hole 120 along the first inclined guide wall 122 and adheres to the heating plate 2 below for rapid preheating. The pins 002 enter along the second inclined guide wall 124 and horizontally adhere to the lower wall of the positioning groove 121, so that the chip 00 is gently, accurately and evenly placed in the product slot 12 for quick material retrieval.
[0020] This preheating tray, designed for rapid chip positioning and placement, is independently positioned in front of the testing device. It preheats chips in batches to the testing temperature. The preheating tray can be stopped or kept warm. A robotic arm then places each preheated chip onto the testing equipment. The testing equipment only needs to heat the chips for a few seconds to reach the testing temperature, significantly shortening the testing cycle compared to previous methods. Its advantages are: firstly, the preheating tray greatly reduces the heating time of the testing equipment, enabling rapid chip testing, effectively utilizing the equipment, and reducing testing costs; secondly, the preheating tray is made of aluminum alloy, which is easy to process, can form high-precision product slots, and has a high thermal conductivity, resulting in fast heating and short heating time. The preheating plate uses a vertical positioning through-hole 120 to achieve contact heat conduction between the chip and the heating plate 2, thereby quickly reaching the set temperature. Thirdly, the product slot 12, with its vertical positioning through-hole 120 and positioning groove 121 structure, allows the chip to be placed evenly in the product slot 12, facilitating rapid pick-up and drop-off. Fourthly, the product slot 12 is equipped with a first inclined guide wall 122 and a second inclined guide wall 124, facilitating rapid removal and placement of the chip 00 with high positioning accuracy. Simultaneously, the avoidance groove reduces the placement position and contact area of the chip 00, preventing damage to the chip 00 from the positioning groove 121. Fifthly, the XY axis identification point 3 and Z axis identification point 4 provide a good reference coordinate system, facilitating rapid and high-precision placement of the product.
[0021] Furthermore, each of the four upper corners of the positioning through-hole 120 is provided with a semi-circular hole 127, and each semi-circular hole 127 is provided with an inverted frustum-shaped clearance groove 123 at its upper end. The front and rear walls and the side end walls of the positioning through-hole 120 are all provided with a vertically extending rectangular clearance groove 123. The beneficial effect is that this setting further reduces the contact area between the chip and the product slot 12, thus protecting the chip.
[0022] Preferably, the right wall of the hole where the positioning through hole 120 intersects with the product groove 12 is further provided with a third inclined guide wall 125; the upper ends of the first inclined guide wall 122 and the second inclined guide wall 124 are further provided with chamfers 126. Its beneficial effects are: Furthermore, the feeding groove 11 is a transverse elongated oval groove, and the feeding groove 11 and the vacuum suction and discharge unit 011 of the pick-and-place module 01 are spaced apart. The beneficial effect is that this setting facilitates the quick removal and placement of the chip 00, and the chip 00 has high positioning accuracy.
[0023] Furthermore, the upper wall of the disk body 10 is provided with eight feeding slots 11 at equal intervals along the longitudinal direction. Each feeding slot 11 is provided with ten product slots 12 at equal intervals along the transverse direction. Each product slot 12 has a positioning through hole 120 on its right end and a positioning slot 121 on its left end. The beneficial effect is that this arrangement can realize the preheating of chips 00 in large quantities.
[0024] Furthermore, the lower wall of the disc body 10 is provided with a number of blind holes 13 at equal intervals in the middle and with through holes 13 at the four corners. The upper wall of the heating plate 2 is fixedly connected to the upper holes 13 by positioning pins at equal intervals in the middle. The disc body 10 has four horizontally elongated upper connecting holes 14 in the middle. The upper end of the upper connecting holes 14 has a receiving groove 15 that communicates with the outer material discharge groove 11. The threaded part is a cylindrical head screw, with the nut located in the receiving groove 15 and the stud passing through the threaded hole of the upper connecting hole 14 to fix and connect the heating plate 2. Its advantages are: this setting facilitates quick and high-precision installation, while the overall size of the equipment is compact.
[0025] Furthermore, the two transverse edges of the disc body 10 are symmetrically provided with four first mounting grooves 101 and a second mounting groove 102 located outside the first mounting grooves 101; The first mounting groove 101 has a first lower through hole 103 at its center on the lower groove wall, and a first lateral through hole 104 on its lower wall. The second mounting groove 102 has a second lower through hole 105 at its center on the lower groove wall, and a second lateral through hole 106 on its lower wall. Four XY axis identification points 3 are installed in the first mounting slot 101, and four Z axis identification points 4 are installed in the second mounting slot 102. The advantage of this arrangement is that it facilitates installation.
[0026] Furthermore, the identification point is the Mark reference point, and the visual inspection unit 010 is a CCD camera or a CMOS camera. The pick-and-place module 01 is a vacuum plate or vacuum nozzle mounted on the robotic arm 012.
[0027] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.
Claims
1. A preheating tray for easy and rapid chip positioning and placement, characterized in that, Includes: a material tray (1), a heating plate (2), multiple XY axis identification points (3) and multiple Z axis identification points (4); The feeding tray (1) includes a rectangular tray (10) made of aluminum alloy. Multiple feeding slots (11) are longitudinally spaced at equal intervals along the middle of the upper wall of the tray (10). Multiple product slots (12) are transversely spaced at equal intervals along the middle of the lower wall of each feeding slot (11). Each product slot (12) has a vertical positioning through-hole (120) at one end and an upper open positioning slot (121) at the other end. The positioning through-hole (120) cooperates with the plastic encapsulation body (001) of the chip (00), and the positioning slot (121) cooperates with the pins (002) of the chip (00). The positioning through-hole (120)... The upper end of the wall is provided with a first inclined guide wall (122) and its hole wall is provided with multiple clearance grooves (123). The upper end of the positioning groove (121) is provided with a second inclined guide wall (124). The plastic encapsulation body (001) of the chip (00) enters the positioning through hole (120) along the first inclined guide wall (122) and adheres to the heating plate (2) below, which facilitates rapid preheating. The pin (002) enters along the second inclined guide wall (124) and horizontally adheres to the lower wall of the positioning groove (121), so that the chip (00) is gently, accurately and evenly placed in the product slot (12), which facilitates rapid material removal. The heating plate (2) is attached to the lower wall of the material tray (1) and is electrically connected to the circuit; Multiple XY axis identification points (3) are installed at the four corners of the disk body (10); Multiple Z-axis identification points (4) are installed at the four corners of the disk body (10), and each Z-axis identification point (4) is close to an XY-axis identification point (3) to provide positioning reference points for the XY-axis and Z-axis.
2. The preheating plate according to claim 1, characterized in that, The surface of the disc (10) is treated with an oxidized zinc plating layer.
3. The preheating tray according to claim 2, characterized in that, The plate (10) is made of AL6061; the heating plate (2) is made of copper conductor.
4. The preheating plate according to claim 1, characterized in that, The positioning through hole (120) is a rectangular through hole that fits the same diameter as the molding body (001), and the positioning groove (121) is a rectangular groove that fits the gap between the multiple pins (002) of the chip (00).
5. The preheating plate according to claim 4, characterized in that, The positioning through hole (120) has a semi-circular hole (127) at the upper end of each of its four corners, and each semi-circular hole (127) has an inverted frustum-shaped clearance groove (123) at the upper end. The front and rear walls and the side walls of the positioning through hole (120) are each provided with a rectangular clearance groove (123) that runs vertically through the hole.
6. The preheating plate according to claim 5, characterized in that, The right wall of the positioning through hole (120) and the product groove (12) is also provided with a third inclined guide wall (125); the upper end of the first inclined guide wall (122) and the upper end of the second inclined guide wall (124) are also provided with a chamfer (126).
7. The preheating plate according to claim 1, characterized in that, The discharge trough (11) is a transverse elongated oval trough, and the discharge trough (11) and the vacuum suction and discharge unit (011) of the pick-and-place module (01) are spaced apart.
8. The preheating tray according to claim 7, characterized in that, The upper wall of the disc (10) is provided with eight feeding slots (11) at equal intervals in the longitudinal direction. Each feeding slot (11) is provided with ten product slots (12) at equal intervals in the transverse direction. Each product slot (12) has a positioning through hole (120) on the right end and a positioning slot (121) on the left end.
9. The preheating plate according to claim 1, characterized in that, The upper wall of the heating plate (2) is fixedly connected to the upper pin hole (13) of the disc body (10) by the horizontally spaced positioning pins; the disc body (10) is provided with four horizontally elongated upper connecting holes (14) in the middle, and the upper end of the upper connecting hole (14) is provided with a receiving groove (15) that communicates with the outer material feeding groove (11). The threaded part is a cylindrical head screw, the nut is located in the receiving groove (15) and the stud passes through the upper connecting hole (14) to fix the threaded hole of the heating plate (2).
10. The preheating plate according to claim 1, characterized in that, The disk body (10) has four first mounting slots (101) symmetrically arranged at both ends of its two transverse edges, and a second mounting slot (102) located outside the first mounting slots (101); the four XY axis identification points (3) are installed in the first mounting slots (101), and the four Z axis identification points (4) are installed in the second mounting slots (102).