Transport roller and transport device

Abstract

The application relates to the photovoltaic technical field and provides a transmission roller and a transmission device. The transmission roller is applied to the transmission device, the transmission device is used for transmitting silicon wafers, and the transmission roller comprises a wheel body, a bearing surface of the wheel body is used for bearing the silicon wafers, and a ceramic fiber bundle is arranged on the bearing surface of the wheel body. Since the bearing surface of the wheel body of the transmission roller is provided with the ceramic fiber bundle, the ceramic fiber bundle is relatively soft and resistant to high temperature, therefore, when the transmission roller drives the silicon wafers to be subjected to high-temperature treatment, the area stress of the transmission roller can be increased, the pressure on the surface of the silicon wafers is reduced, and the risk of damage of the silicon wafers is reduced.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to transmission rollers and transmission devices. Background Technology

[0002] In the process of manufacturing solar silicon wafers, the wafers need to be transferred to a high-temperature furnace for high-temperature treatment.

[0003] In existing solutions, during the transfer of silicon wafers, the wafers are placed on two rows of transfer rollers. The transfer rollers carry the wafers into a high-temperature furnace for high-temperature processing. The area where the wafers contact the transfer rollers experiences significant force, making the wafers susceptible to damage. Utility Model Content

[0004] This application provides a transfer roller and a transfer device that can reduce damage to the edges of silicon wafers.

[0005] To achieve the above objectives, this application adopts the following technical solution:

[0006] In a first aspect, a transfer roller is provided, which is applied to a transfer device for transferring silicon wafers. The transfer roller includes: a wheel body, including a bearing surface for bearing silicon wafers; and a ceramic fiber bundle disposed on the bearing surface of the wheel body.

[0007] In conjunction with the first aspect, in some embodiments of the first aspect, the bearing surface of the wheel body is provided with a groove, and the ceramic fiber bundle is disposed in the groove.

[0008] In conjunction with the first aspect, in some embodiments of the first aspect, the depth of the groove is greater than or equal to 1 mm in the direction perpendicular to the bearing surface.

[0009] In conjunction with the first aspect, in some embodiments of the first aspect, the transfer roller further includes a first adhesive layer located on a bearing surface between adjacent grooves, wherein the ceramic fiber bundles are bonded to and in contact with the first adhesive layer.

[0010] In conjunction with the first aspect, in some embodiments of the first aspect, in a direction perpendicular to the bearing surface, the sum of the depth of the groove and the thickness of the first adhesive layer is the total thickness, which is greater than or equal to 1 mm.

[0011] In conjunction with the first aspect, in some embodiments of the first aspect, the bearing surface is a plane, and the transmission roller further includes a second adhesive layer located on the bearing surface, with ceramic fiber bundles disposed on the side of the second adhesive layer opposite to the bearing surface.

[0012] In conjunction with the first aspect, in some embodiments of the first aspect, the thickness of the thickest portion of the second adhesive layer is greater than or equal to 1 mm in the direction perpendicular to the bearing surface.

[0013] In conjunction with the first aspect, in some embodiments of the first aspect, the diameter of the ceramic fiber bundle is greater than or equal to 2 mm.

[0014] In conjunction with the first aspect, in some embodiments of the first aspect, the wheel body is characterized as a conical wheel body.

[0015] In a second aspect, a transmission device is provided for transmitting silicon wafers, the transmission device including the transmission rollers provided in the first aspect and any embodiment thereof.

[0016] Based on the transmission roller provided by this utility model, since the bearing surface of the transmission roller body is provided with ceramic fiber bundles, which are relatively soft and resistant to high temperature, the area of ​​the transmission roller can be increased when the transmission roller drives the silicon wafer to undergo high temperature treatment, thereby reducing the pressure on the surface of the silicon wafer and thus reducing the risk of silicon wafer damage. Attached Figure Description

[0017] Figure 1 A cross-sectional view of a transfer roller provided in this application;

[0018] Figure 2 A cross-sectional view of yet another type of transfer roller provided in this application;

[0019] Figure 3 A cross-sectional view of another type of transmission roller provided in this application.

[0020] Figure label:

[0021] Transmission roller-10, wheel body-101, ceramic fiber bundle-102, silicon wafer-20, first adhesive layer-103, second adhesive layer-104. Detailed Implementation

[0022] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner to facilitate understanding.

[0023] Furthermore, to facilitate a clear description of the technical solutions of the embodiments of this utility model, the terms "first" and "second" are used in the embodiments of this utility model to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0024] It is understood that the term "embodiment" used throughout the specification means that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of the present invention. Therefore, the various embodiments throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. It is understood that in the various embodiments of the present invention, the sequence number of each process does not imply the order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present invention.

[0025] It is understood that in this utility model, "when," "if," and "if" all refer to the corresponding processing that will be carried out under certain objective circumstances, and are not limited to a specific time, nor do they require a judgment action to be performed, nor do they imply any other limitations.

[0026] It is understood that some optional features in the embodiments of this utility model can be implemented independently in certain scenarios without relying on other features, such as the current solution on which they are based, to solve the corresponding technical problems and achieve the corresponding effects. Alternatively, they can be combined with other features as needed in certain scenarios. Correspondingly, the device given in the embodiments of this utility model can also implement these features or functions, which will not be elaborated here.

[0027] In this utility model, unless otherwise specified, the same or similar parts between the various embodiments can be referred to each other. In the various embodiments and implementation methods of this utility model, unless otherwise specified or logically conflicting, the terminology and / or descriptions between different embodiments and between the implementation methods of different embodiments are consistent and can be mutually referenced. The technical features in different embodiments and between the implementation methods of different embodiments can be combined according to their inherent logical relationships to form new embodiments, implementation methods, implementation methods, or implementation approaches. The following embodiments of this utility model do not constitute a limitation on the scope of protection of this utility model.

[0028] During the fabrication of solar silicon wafer 20, the silicon wafer 20 needs to be transferred to a high-temperature furnace for high-temperature treatment.

[0029] For example, the high-temperature furnace can be a high-temperature annealing furnace or a sintering furnace. Of course, the high-temperature furnace can also be other furnaces with high temperatures. This utility model does not make any specific limitations in this regard.

[0030] In the existing scheme, during the transfer of silicon wafer 20, the silicon wafer 20 is placed on two rows of transfer rollers 10. The transfer rollers 10 drive the silicon wafer 20 into a high-temperature furnace for high-temperature treatment. The part of the silicon wafer 20 that contacts the transfer rollers 10 is subjected to greater force, which makes the silicon wafer 20 easily damaged.

[0031] To solve the above problems, this utility model provides a transmission roller 10, which is applied to a transmission device for transmitting silicon wafers 20, such as... Figure 1 As shown, the transmission roller 10 includes: a wheel body 101, including a bearing surface for bearing the silicon wafer 20; and a ceramic fiber bundle 102 disposed on the bearing surface of the wheel body.

[0032] Based on the transmission roller 10 provided by this utility model, since the bearing surface of the transmission roller 10 body 101 is provided with ceramic fiber bundles 102, the ceramic fiber bundles 102 are relatively soft and resistant to high temperature. Therefore, when the transmission roller 10 drives the silicon wafer 20 to undergo high temperature treatment, the area of ​​the transmission roller 10 can be increased to reduce the pressure on the surface of the silicon wafer 20, thereby reducing the risk of damage to the silicon wafer 20.

[0033] The transmission roller 10 can be made of ceramic, silicon nitride, or stainless steel. Of course, the transmission roller 10 can also be made of other materials, and this utility model does not impose any specific limitations on this.

[0034] The wheel body 101 of the transmission roller 10 can be a cylindrical wheel body, or the wheel body 101 of the transmission roller 10 can be a conical wheel body. This utility model does not impose specific limitations on this.

[0035] When the wheel body 101 is a conical wheel body, the wheel body 101 can be a cone, that is, the wheel body 101 includes a cone base, a cone lateral surface, and a cone apex, and the cone lateral surface of the wheel body 101 is the bearing surface. Alternatively, the wheel body 101 can also be a frustum, that is, the wheel body 101 includes a cone base, a cone lateral surface, and a cone apex, the area of ​​the cone apex is smaller than the area of ​​the cone base, and the cone lateral surface of the wheel body 101 is the bearing surface.

[0036] The specific embodiments and accompanying drawings of this utility model will be described using the wheel body 101 as a frustum of a cylinder as an example. This will be explained in a unified manner here and will not be repeated later.

[0037] Along the axial direction of the wheel body 101, the wheel body 101 has a certain height, which can be between 10cm and 50cm. For example, the height of the wheel body 101 can be 10cm, 20cm, 30cm, 40cm, or 50cm. Of course, the height of the wheel body 101 can also have other values, and this utility model does not impose specific limitations on this. In this way, it can avoid the risk of the silicon wafer 20 slipping off the transfer roller 10 due to the wheel body 101 being too low, and it can also avoid the cost of the transfer roller 10 being increased due to the wheel body 101 being too high. Setting an appropriate height for the wheel body 101 can increase the stability of the transfer roller 10 in supporting the silicon wafer 20 and reduce the cost of the transfer roller 10.

[0038] It should be noted that when the wheel body 101 is a cylinder, the height of the wheel body 101 refers to the vertical distance between the upper and lower base surfaces; when the wheel body 101 is a cone, the height of the wheel body 101 refers to the vertical distance between the apex and the base of the cone; and when the wheel body 101 is a frustum, the height of the wheel body 101 refers to the vertical distance between the apex and the base of the cone.

[0039] The radius of the conical base of wheel 101 can be 5cm-10cm. For example, the radius of the conical base of wheel 101 can be 5cm, 6cm, 7cm, 8cm, 9cm, or 10cm. Of course, the radius of the conical base of wheel 101 can also have other values, and this utility model does not impose specific limitations on this. Thus, by setting the radius of the conical base of wheel 101 within a suitable range, it is possible to avoid the risk of damage to the transmission roller 10 if the radius is too small, resulting in insufficient strength, and also to avoid the risk of increased cost due to an excessively large radius. Setting a suitable radius for the conical base of wheel 101 can reduce the risk of damage to the transmission roller 10 and reduce its cost.

[0040] When the wheel body 101 is a frustum, the radius of its conical apex can be between 2cm and 7cm. For example, the radius of the conical apex of the wheel body 101 can be 2cm, 3cm, 4cm, 5cm, 6cm, or 7cm. Of course, the radius of the conical apex of the wheel body 101 can also have other values, and this utility model does not impose specific limitations on this. Thus, by setting the radius of the conical apex of the wheel body 101 within a suitable range, it is possible to avoid the risk of damage to the transmission roller 10 if the radius is too small, resulting in insufficient strength, and also to avoid the risk of increased cost due to an excessively large radius. Setting a suitable radius for the conical apex of the wheel body 101 can reduce the risk of damage to the transmission roller 10 and reduce its cost.

[0041] As one possible implementation method for placing the ceramic fiber bundle 102 on the bearing surface of the wheel body 101, such as... Figure 1 As shown, the bearing surface of the wheel body 101 is provided with a groove, and the ceramic fiber bundle 102 is disposed in the groove. In this way, the groove can limit the ceramic fiber bundle 102, prevent the ceramic fiber bundle 102 from falling off the bearing surface of the wheel body 101, and improve the firmness of the ceramic fiber bundle 102 on the bearing surface of the wheel body 101.

[0042] In the direction perpendicular to the bearing surface, the depth h1 of the groove is greater than or equal to 1 mm. For example, the groove depth h1 can be 1 mm, 2 mm, or 3 mm. Of course, the groove depth h1 can also have other values, and this utility model does not impose specific limitations on this. Thus, setting the groove depth h1 within a suitable range can avoid the risk of the ceramic fiber bundle 102 detaching from the wheel body 101 due to insufficient constraint force caused by the groove depth h1 being too shallow, and also avoid the risk of damage to the silicon wafer 20 due to a smaller portion of the ceramic fiber bundle 102 protruding from the bearing surface and a smaller contact area between the transmission roller 10 and the ceramic fiber bundle 102 due to the groove depth being too deep. Setting a suitable groove depth h1 can enhance the firmness of the ceramic fiber bundle 102 on the wheel body 101 and reduce the risk of damage to the silicon wafer 20.

[0043] As another possible implementation, to place the ceramic fiber bundle 102 on the bearing surface of the wheel body 101, if the bearing surface of the wheel body 101 has a groove, such as... Figure 2 As shown, the transmission roller 10 also includes a first adhesive layer 103, which is located on the bearing surface between adjacent grooves. The ceramic fiber bundle 102 is bonded to the first adhesive layer 103. Thus, the first adhesive layer 103 can bond the ceramic fiber bundle 102 to the bearing surface of the wheel body 101, preventing the ceramic fiber bundle 102 from falling off the bearing surface of the wheel body 101, and further improving the firmness of the ceramic fiber bundle 102 on the bearing surface of the wheel body 101.

[0044] In the direction perpendicular to the bearing surface, the sum of the depth of the groove and the thickness of the first adhesive layer 103 is the total thickness h2, which is greater than or equal to 1 mm. For example, the total thickness h2 can be 1 mm, 2 mm, or 3 mm. Of course, the total thickness h2 can also have other values, and this utility model does not impose specific limitations on this. Thus, by setting the total thickness h2 within a suitable range, it is possible to avoid the risk of the ceramic fiber bundle 102 falling off the wheel body 101 due to insufficient constraint force between the groove and the first adhesive layer 103 if the total thickness h2 is too shallow. It is also possible to avoid the risk of damage to the silicon wafer 20 due to insufficient constraint force between the groove and the first adhesive layer 103 if the total thickness h2 is too deep. Setting an appropriate total thickness h2 for the groove and the first adhesive layer 103 can enhance the firmness of the ceramic fiber bundle 102 on the wheel body 101 and reduce the risk of damage to the silicon wafer 20.

[0045] The ratio of the groove depth to the thickness of the first adhesive layer 103 can be 0.5-1.5, for example, 0.5, 0.7, 1, 1.2, 1.5. Of course, the ratio can also be other values, and this utility model does not impose specific limitations on it. It can be understood that when the ratio is 1, the groove depth is the same as the thickness of the first adhesive layer 103; when the ratio is less than 1, the groove depth is less than the thickness of the first adhesive layer 103; and when the ratio is greater than 1, the groove depth is greater than the thickness of the first adhesive layer 103. Thus, by setting the ratio of the groove depth to the thickness of the first adhesive layer 103 within a suitable range, the risk of the ceramic fiber bundle 102 detaching from the wheel body 101 can be avoided if the groove depth is too small relative to the thickness of the first adhesive layer 103, resulting in insufficient constraint on the ceramic fiber bundle 102. Conversely, the risk of the ceramic fiber bundle 102 detaching from the wheel body 101 can be avoided if the groove depth is too large relative to the thickness of the first adhesive layer 103, resulting in low adhesion between the first adhesive layer 103 and the ceramic fiber bundle 102. Setting an appropriate ratio for the groove depth to the thickness of the first adhesive layer 103 can reduce the risk of the ceramic fiber bundle 102 detaching from the wheel body 101.

[0046] In some embodiments, in addition to providing a first adhesive layer 103 on the bearing surface between adjacent grooves, a third adhesive layer may also be provided in the groove. In this way, the third adhesive layer can bond the ceramic fiber bundle 102 to the groove, prevent the ceramic fiber bundle 102 from falling off the bearing surface of the wheel body 101, and further improve the firmness of the ceramic fiber bundle 102 on the bearing surface of the wheel body 101.

[0047] The thickness of the third adhesive layer is less than or equal to 0.5 mm in the direction perpendicular to the groove wall. For example, the thickness of the third adhesive layer can be 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, or 0.5 mm. Of course, the thickness of the third adhesive layer can also have other values, and this utility model does not impose specific limitations on this. Thus, by setting the thickness of the third adhesive layer within a suitable range, it can avoid the risk of the ceramic fiber bundle 102 detaching from the wheel body 101 due to insufficient constraint force caused by an excessively thick third adhesive layer and a shallow actual groove depth, as well as the risk of the ceramic fiber bundle 102 detaching from the wheel body 101 due to insufficient adhesion caused by an excessively thin third adhesive layer. Setting a suitable thickness for the third adhesive layer can enhance the firmness of the ceramic fiber bundle 102 on the wheel body 101.

[0048] As another possible implementation, the ceramic fiber bundle 102 is placed on the bearing surface of the wheel body 101, such as... Figure 3As shown, the bearing surface is planar, and the transmission roller 10 also includes a second adhesive layer 104 located on the bearing surface. The ceramic fiber bundle 102 is disposed on the side of the second adhesive layer 104 facing away from the bearing surface. Thus, by bonding the ceramic fiber bundle 102 to the bearing surface through the second adhesive layer 104, the firmness of the ceramic fiber bundle 102 on the wheel body 101 can be enhanced. Furthermore, since the bearing surface is planar, the wheel body 101 with a planar bearing surface is easier to process, thereby reducing the complexity of manufacturing the wheel body 101.

[0049] Since the second adhesive layer 104 needs to be bonded to the ceramic fiber bundle 102, the ceramic fiber bundle 102 needs to be placed on the second adhesive layer 104 before it cures to ensure good adhesion between the ceramic fiber bundle 102 and the second adhesive layer 104. Because the second adhesive layer 104 is not yet cured when the ceramic fiber bundle 102 is bonded to it, and because the second adhesive layer 104 has a certain degree of fluidity, after the ceramic fiber bundle 102 is placed on the second adhesive layer 104, as... Figure 3 As shown, when the second adhesive layer 104 is subjected to force and deforms, a groove will be formed in the second adhesive layer 104. The second adhesive layer 104 is located in the groove, resulting in uneven thickness of the second adhesive layer 104. It can be understood that the thickest part of the second adhesive layer 104 refers to the part of the second adhesive layer 104 that is tangent to the adjacent ceramic fiber bundle 102.

[0050] In the direction perpendicular to the bearing surface, the thickness h3 of the thickest part of the second adhesive layer 104 is greater than or equal to 1 mm. For example, the thickness h3 can be 1 mm, 2 mm, or 3 mm. Of course, the thickness h3 can also have other values, and this utility model does not impose specific limitations on this. In this way, by setting the thickness h3 of the thickest part of the second adhesive layer 104 within a suitable range, it is possible to avoid the risk of the ceramic fiber bundle 102 falling off the wheel body 101 due to insufficient adhesion of the second adhesive layer 104 to the ceramic fiber bundle 102 if the thickness h3 of the thickest part of the second adhesive layer 104 is too thin, and also to avoid the increased cost of the transmission roller 10 due to excessive thickness h3 of the thickest part of the second adhesive layer 104. Setting a suitable thickness h3 for the thickest part of the second adhesive layer 104 can enhance the firmness of the ceramic fiber bundle 102 on the wheel body 101 and reduce the cost of the transmission roller 10.

[0051] The first adhesive layer 103, the second adhesive layer 104, or the third adhesive layer can be made of at least one of epoxy resin high-temperature adhesive, polyimide adhesive, organosilicon high-temperature adhesive, phenolic resin adhesive, silicate-based inorganic adhesive, or two-component high-temperature resistant organosilicon adhesive. Of course, the first adhesive layer 103, the second adhesive layer 104, or the third adhesive layer can also be made of other materials, and this utility model does not impose specific limitations on them.

[0052] Ceramic fiber bundle 102 is a ribbon-shaped high-temperature resistant fiber bundle woven from ceramic fiber yarns. Ceramic fiber bundle 102 has good temperature resistance, with a long-term temperature resistance typically ranging from 650℃ to 1050℃, and a short-term peak temperature resistance that can even reach 1260℃.

[0053] The diameter h4 of the ceramic fiber bundle 102 is greater than or equal to 2 mm. For example, the diameter h4 of the ceramic fiber bundle 102 can be 2 mm, 3 mm, 4 mm, 5 mm, 6 mm, or 7 mm. Of course, the diameter h4 of the ceramic fiber bundle 102 can also have other values, and this utility model does not impose specific limitations on this. Thus, by setting the diameter h4 of the ceramic fiber bundle 102 within a suitable range, it is possible to avoid the increased risk of damage to the silicon wafer 20 due to an excessively small diameter h4, or the increased cost of the transmission roller 10 due to an excessively large diameter h4. Setting a suitable diameter h4 for the ceramic fiber bundle 102 can reduce the risk of damage to the silicon wafer 20 and reduce the cost of the transmission roller 10.

[0054] The distance between adjacent ceramic fiber bundles 102 can be 0.5mm-1.5mm. For example, the distance between adjacent ceramic fiber bundles 102 can be 0.5mm, 0.7mm, 1mm, 1.2mm, or 1.5mm. Of course, the distance between adjacent ceramic fiber bundles 102 can also be other values, and this utility model does not impose specific limitations on this. By setting the distance between adjacent ceramic fiber bundles 102 within a suitable range, it is possible to avoid the risk of damage to the silicon wafer 20 due to excessively large distances between adjacent ceramic fiber bundles 102, resulting in a lower winding density. It is also possible to avoid the cost of the transmission roller 10 due to excessively close distances between adjacent ceramic fiber bundles 102, resulting in a higher winding density. Setting an appropriate spacing between adjacent ceramic fiber bundles 102 can reduce the risk of damage to the silicon wafer 20 and reduce the cost of the transmission roller 10.

[0055] The winding direction of the ceramic fiber bundle 102 on the wheel body 101 can be parallel to the conical bottom surface of the wheel body 101, that is, the ceramic fiber bundle 102 is wound parallel to the wheel body 101; or, the winding direction of the ceramic fiber bundle 102 on the wheel body 101 can be intersected with the conical bottom surface of the wheel body 101, that is, the ceramic fiber bundle 102 is wound spirally on the wheel body 101. This utility model does not impose specific limitations on this.

[0056] Understandably, when the winding direction of the ceramic fiber bundle 102 on the wheel body 101 is parallel to the conical bottom surface of the wheel body 101, the extending direction of the groove on the bearing surface of the wheel body 101 or the groove of the second adhesive layer 104 is parallel to the conical bottom surface of the wheel body 101, that is, the groove on the bearing surface of the wheel body 101 or the groove of the second adhesive layer 104 is wound parallel to the wheel body 101. When the winding direction of the ceramic fiber bundle 102 on the wheel body 101 intersects the conical bottom surface of the wheel body 101, the extending direction of each groove on the bearing surface of the wheel body 101 or the groove of the second adhesive layer 104 intersects the conical bottom surface of the wheel body 101, that is, the groove on the bearing surface of the wheel body 101 or the groove of the second adhesive layer 104 is spirally wound on the wheel body 101.

[0057] The silicon wafer 20 can be a silicon substrate without any film layers; or, the silicon wafer 20 includes a silicon substrate and various film layers disposed on the silicon substrate, such as a tunneling oxide layer, a doped layer, a passivation layer, etc.; or, the silicon wafer 20 includes a silicon substrate, various film layers disposed on the silicon substrate, and electrodes. Of course, the silicon wafer 20 can also have other structures, and this utility model does not impose specific limitations on them.

[0058] The silicon substrate can be monocrystalline silicon, polycrystalline silicon, or amorphous silicon, and this invention does not impose any specific restrictions on it.

[0059] This utility model also provides a transmission device, which includes the aforementioned transmission rollers 10. For example, the transmission device includes multiple sets of transmission rollers 10, each set of transmission rollers 10 including two transmission rollers 10 arranged opposite each other. The silicon wafer 20 can be placed on the set of transmission rollers 10, and the transmission rollers 10 drive the silicon wafer into a high-temperature furnace for high-temperature processing.

[0060] Furthermore, in addition to the aforementioned transmission roller 10, the transmission device may also include other components. For example, the transmission device may also include a support member connected to the transmission roller 10, which can support and fix the transmission roller 10 to prevent displacement.

[0061] For example, the support member can be a support frame, a hanging rail, etc., and this utility model does not impose specific limitations on it.

[0062] The transmission device may also include a drive unit connected to the transmission roller 10. The drive unit can provide rotational power to the transmission roller 10, driving the transmission roller 10 to rotate, so that the transmission roller 10 drives the silicon wafer 20 to move.

[0063] For example, the driving component can be a motor, etc., and this utility model does not impose specific limitations on it.

[0064] Of course, the transmission device may also include other components, and this utility model does not impose specific limitations on this.

[0065] Although the present invention has been described herein in conjunction with various embodiments, those skilled in the art will understand and implement other variations of the disclosed embodiments by reviewing the accompanying drawings, the disclosure, and the appended claims in carrying out the claimed invention. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality. While different dependent claims may recite certain measures, this does not mean that these measures cannot be combined to produce a good effect.

[0066] Although the present invention has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of the present invention. Accordingly, this specification and drawings are merely exemplary descriptions of the present invention as defined by the appended claims, and are considered to cover any and all modifications, variations, combinations, or equivalents within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and modifications of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and modifications.

Claims

1. A transmission roller, characterized in that, The transfer roller is used in a transfer device for transferring silicon wafers, and the transfer roller includes: A wheel body, including a bearing surface for supporting a silicon wafer; Ceramic fiber bundles are disposed on the bearing surface of the wheel body.

2. The transmission roller according to claim 1, characterized in that, The bearing surface of the wheel body is provided with a groove, and the ceramic fiber bundle is disposed in the groove.

3. The transmission roller according to claim 2, characterized in that, In a direction perpendicular to the bearing surface, the depth of the groove is greater than or equal to 1 mm.

4. The transmission roller according to claim 2, characterized in that, The transmission roller also includes a first adhesive layer located on the bearing surface between adjacent grooves, and the ceramic fiber bundle is bonded to and in contact with the first adhesive layer.

5. The transmission roller according to claim 4, characterized in that, In a direction perpendicular to the bearing surface, the sum of the depth of the groove and the thickness of the first adhesive layer is the total thickness, which is greater than or equal to 1 mm.

6. The transmission roller according to claim 1, characterized in that, The bearing surface is a plane, and the transmission roller further includes a second adhesive layer located on the bearing surface. The ceramic fiber bundle is disposed on the side of the second adhesive layer opposite to the bearing surface.

7. The transmission roller according to claim 6, characterized in that, In a direction perpendicular to the bearing surface, the thickness of the thickest part of the second adhesive layer is greater than or equal to 1 mm.

8. The transmission roller according to claim 1, characterized in that, The diameter of the ceramic fiber bundle is greater than or equal to 2 mm.

9. The transmission roller according to any one of claims 1-8, characterized in that, The wheel is a conical wheel.

10. A transmission device, characterized in that, The transmission device is used to transmit silicon wafers, and the transmission device includes the transmission rollers as described in any one of claims 1-9.

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