Wafer loading and unloading apparatus and wafer testing machine

Abstract

The application relates to a wafer loading and unloading device and a wafer testing machine. The wafer loading and unloading device comprises a basket frame, a bearing member, a sensing mechanism and a detection mechanism. The basket frame is used for placing a wafer. The bearing member is arranged in a horizontal direction and is used for bearing the basket frame. The bearing member has a plurality of mounting holes arranged uniformly and in a vertical direction. A plurality of sensing mechanisms are mounted on the bearing member. Each sensing mechanism comprises a sensing member and a first sensor. The sensing member is mounted in a mounting hole and protrudes from the surface of the bearing member. Each first sensor is mounted below the bearing member and cooperates with the corresponding sensing member. When the basket frame is placed on the bearing member, one or more sensing members are pressed in the corresponding mounting hole and float, and the corresponding first sensor generates a trigger signal. The detection mechanism is electrically connected with each first sensor and is arranged to prompt that the basket frame is in a horizontal state after receiving the trigger signals of all the first sensors, otherwise, the basket frame is in a non-horizontal state.

Description

Technical Field

[0001] This utility model relates to the field of wafer testing technology, specifically to a wafer loading and unloading device and a wafer testing machine. Background Technology

[0002] Traditional manual wafer loading and unloading is not only inefficient, but also prone to wafer contamination due to improper operation, posing a risk of secondary contamination.

[0003] Existing automated wafer loading and unloading equipment mostly uses a wafer counting mechanism to calculate the number of wafers and determine whether the wafers are tilted or misplaced to avoid jamming caused by wafer misplacement. However, these devices are prone to misjudging wafer misplacement when the basket frame is not placed evenly, which can lead to equipment downtime and affect the smooth operation of loading and unloading. Utility Model Content

[0004] The first objective of this utility model is to provide a wafer loading and unloading device that solves the problem of misjudgment of wafer misalignment caused by uneven placement of the basket frame.

[0005] The second aspect of this utility model is to provide a wafer testing machine having the above-mentioned wafer loading and unloading equipment.

[0006] According to a first aspect of the present invention, a wafer loading and unloading device is provided, comprising: Basket frame, used to hold wafers; A support member, arranged horizontally, is used to support the basket frame, and the support member has a plurality of mounting holes evenly arranged vertically; Multiple sensing mechanisms are mounted on the carrier. Each sensing mechanism includes a sensing element and a first sensor. The sensing element is installed in the mounting hole and protrudes from the surface of the carrier. Each first sensor is installed below the carrier and cooperates with the corresponding sensing element. When the basket frame is placed on the carrier, one or more of the sensors are pressed into the corresponding mounting holes and float, causing the corresponding first sensor to generate a trigger signal; The detection mechanism is electrically connected to each of the first sensors and is configured to indicate that the basket frame is in a horizontal state after receiving trigger signals from all the first sensors; otherwise, it indicates that the basket frame is in a non-horizontal state.

[0007] Optionally, each of the sensing mechanisms further includes: A mounting platform is installed below the support member and has a limiting groove; the first sensor is installed at the bottom of the mounting platform, the sensing element passes through the mounting platform and can move down to the sensing area of ​​the first sensor when pressure is applied; An elastic element is installed in the limiting groove and sleeved on the outer periphery of the sensing element.

[0008] Optionally, the support member is square, and the basket frame is cuboid; Multiple of the aforementioned sensing mechanisms are distributed at the four corners of the carrier.

[0009] Optionally, the sidewall of the basket frame has mounting slots arranged vertically at intervals, each mounting slot being used to limit the position of one of the wafers, and the wafer loading and unloading equipment further includes: A frame, in which the load-bearing member is installed; A lifting mechanism, connected to the frame, is used to drive the support member and the basket frame to move vertically; A wafer counting mechanism, connected to the frame and located on one side of the support member, includes at least one second sensor for sequentially identifying each wafer as the basket frame moves vertically and generating an identification signal. The detection mechanism is electrically connected to the wafer counting mechanism and is used to acquire identification signals to calculate the number of wafers.

[0010] Optionally, the multi-piece mechanism includes a plurality of second sensors, which are arranged horizontally at intervals along the width direction of the basket frame; The detection mechanism is configured to determine that the wafer is in a horizontal state when multiple second sensors simultaneously generate recognition signals.

[0011] Optionally, the wafer loading and unloading equipment further includes: A foolproof sensor is mounted on the carrier and located on one side of the basket frame to detect whether the wafer protrudes from the basket frame.

[0012] Optionally, the wafer loading and unloading equipment further includes: A gripper mechanism is used to grip the target wafer inside the basket frame and extract the target wafer from the basket frame; A cleaning mechanism is installed on the discharge side of the basket frame and includes a vacuum generator, a collection box, and a mounting plate. The bottom of the mounting plate is provided with multiple air holes. The vacuum generator is connected to each of the air holes and the collection box and is used to operate during the process of the target wafer being extracted from the basket frame, so that the air holes generate negative pressure, thereby sucking impurities on the surface of the target wafer into the collection box.

[0013] Optionally, the cleaning mechanism further includes: A drive mechanism, connected to the mounting plate, is used to drive the mounting plate to move up and down.

[0014] Optionally, the gripper mechanism includes: Material handling grippers; The first transfer mechanism is connected to the pick-up gripper and is used to drive the pick-up gripper to move vertically to the height of the target wafer; The second transfer mechanism, connected to the first transfer mechanism, is used to drive the first transfer mechanism and the pick-up gripper to move horizontally, so that the pick-up gripper can hold and extract the target wafer.

[0015] According to a second aspect of the present invention, a wafer testing machine is provided, including the wafer loading and unloading equipment.

[0016] The beneficial effects of this utility model are as follows: through the cooperation of the sensing mechanism and the detection mechanism, it is possible to accurately detect whether the basket frame is placed horizontally, thus avoiding the problem of misjudgment of wafer misalignment caused by the uneven placement of the basket frame.

[0017] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0018] Figure 1 This is a schematic structural diagram of a wafer loading and unloading device according to an embodiment of the present invention; Figure 2 This is a schematic structural diagram of the lifting mechanism of a wafer loading and unloading device according to an embodiment of the present invention; Figure 3 This is a first schematic cross-sectional view of the sensing mechanism of a wafer loading and unloading device according to an embodiment of the present invention; Figure 4 This is a second schematic cross-sectional view of the sensing mechanism of a wafer loading and unloading device according to an embodiment of the present invention; Figure 5 This is a schematic structural diagram of the gripper mechanism of a wafer loading and unloading device according to an embodiment of the present invention; Figure 6 This is a schematic structural diagram of the wafer loading and unloading device of this utility model, showing the multi-wafer mechanism. Figure 7 This is a schematic structural diagram of the cleaning mechanism of a wafer loading and unloading device according to an embodiment of the present invention; In the diagram: 1. Basket frame; 11. Mounting slot; 2. Supporting component; 21. Mounting hole; 22. Limiting component; 3. Sensing mechanism; 31. Sensing component; 32. First sensor; 33. Mounting platform; 331. Limiting slot; 332. Slide groove; 34. Elastic component; 35. Slide table; 4. Frame; 41. Barcode scanner; 5. Lifting mechanism; 51. Fixing plate; 52. Support frame; 53. First driving component; 54. Linear guide rail; 6. Counting mechanism; 61. First... 7. Two sensors; 8. Foolproof sensor; 9. Gripper mechanism; 10. Material gripper; 11. First transfer mechanism; 22. Support cantilever; 23. Third drive component; 24. Second transfer mechanism; 35. Support platform; 46. Fourth drive component; 57. Cleaning mechanism; 68. Vacuum generator; 79. Collection box; 80. Mounting plate; 91. Air hole; 92. Drive mechanism; 93. Mounting bracket; 94. Slide rail; 94. Second drive component. Detailed Implementation

[0019] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0022] Figure 1This is a schematic structural diagram of a wafer loading and unloading device according to an embodiment of the present invention. Figure 2 This is a schematic structural diagram of the lifting mechanism of a wafer loading and unloading device according to an embodiment of the present invention. Figure 3 This is a first schematic cross-sectional view of the sensing mechanism of a wafer loading and unloading device according to an embodiment of the present invention. Figure 4 This is a second schematic cross-sectional view of the sensing mechanism of a wafer loading and unloading device according to an embodiment of the present invention.

[0023] Please see Figures 1 to 4 A preferred embodiment of this application shows a wafer loading and unloading device comprising a basket frame 1, a carrier 2, a sensing mechanism 3, and a detection mechanism. The basket frame 1 is used to place wafers. The carrier 2 is arranged horizontally to support the basket frame 1 and has a plurality of uniformly arranged vertically mounted holes 21. A plurality of sensing mechanisms 3 are mounted on the carrier 2. Each sensing mechanism 3 includes a sensing element 31 and a first sensor 32. The sensing element 31 is mounted within the mounting hole 21 and protrudes from the surface of the carrier 2. Each first sensor 32 is mounted below the carrier 2 and cooperates with the corresponding sensing element 31. When the basket frame 1 is placed on the carrier 2, one or more sensing elements 31 are pressed into the corresponding mounting hole 21 and float, causing the corresponding first sensor 32 to generate a trigger signal. The detection mechanism is electrically connected to each first sensor 32 and is configured to indicate that the basket frame 1 is in a horizontal state after receiving trigger signals from all first sensors 32; otherwise, it indicates that the basket frame 1 is in a non-horizontal state.

[0024] According to the solution of this utility model embodiment, by cooperating with the sensing mechanism 3 and the detection mechanism, it is possible to accurately detect whether the basket frame 1 is placed horizontally, thus avoiding the problem of misjudgment of wafer misalignment caused by the uneven placement of the basket frame 1.

[0025] It should be noted that only when all the first sensors 32 generate trigger signals can it be said that the bottom of the basket frame 1 is completely in contact with the top of the support member 2 and is in a horizontal state; if any one of the first sensors 32 does not generate a trigger signal, it means that part of the bottom of the basket frame 1 is not in contact with the support member 2 and the basket frame 1 is in a tilted state. The detection mechanism is connected to the external alarm system, which will trigger an alarm and remind the staff to come to the site and put the basket frame 1 back into a horizontal state.

[0026] The following detailed description uses specific examples: In some embodiments, see Figure 4Each sensing mechanism 3 also includes a mounting platform 33 and an elastic element 34. The mounting platform 33 is installed below the support member 2 and has a limiting groove 331. The first sensor 32 is installed at the bottom of the mounting platform 33. The sensing element 31 passes through the mounting platform 33 and can move down to the sensing area of ​​the first sensor 32 when pressed. The elastic element 34 is installed in the limiting groove 331 and sleeved on the outer periphery of the sensing element 31. It should be noted that after the basket frame 1 is placed horizontally on the support member 2, the bottom of the basket frame 1 will press down on the sensing element 31. During the descent of the sensing element 31, it will compress the elastic element 34 and move to the sensing area of ​​the first sensor 32, causing the first sensor 32 to generate a trigger signal. After the basket frame 1 leaves the support member 2, the elastic element 34 rebounds and the sensing element 31 protrudes from the surface of the support member 2 again. Here, the first sensor 32 is a slotted photoelectric sensor.

[0027] In some embodiments, see Figures 1 to 3 The support member 2 is square, and the basket frame 1 is cuboid. Multiple sensing mechanisms 3 are distributed at the four corners of the support member 2. The basket frame 1 is horizontal when all four sensing mechanisms 3 generate trigger signals. In some preferred embodiments, please refer to... Figure 4 The sensing mechanism 3 also includes a slide 35, on which the first sensor 32 is mounted. A groove 332, which mates with the slide 35, is provided on one side of the mounting platform 33. The slide 35 and the groove 332 are fixed together by screws, and the slide 35 can be adjusted vertically. It should be noted that during equipment installation, the position of the first sensor 32 is determined by adjusting the position between the slide 35 and the groove 332, ensuring that all first sensors 32 are triggered when the horizontal basket frame 1 is placed on the support member 2.

[0028] In some embodiments, see Figure 2 and Figure 4 The four corners of the support member 2 are also provided with multiple limiting members 22, which are used to limit and fix the basket frame 1.

[0029] In other embodiments, the shape of the carrier 2 is not limited, and the distribution of the multiple sensing mechanisms 3 on the carrier 2 is determined by the shape of the carrier 2.

[0030] In some embodiments, see Figure 3 The sidewall of the basket frame 1 has mounting slots 11 arranged vertically at intervals, each mounting slot 11 for positioning a wafer. See also... Figure 1 , 2The wafer loading and unloading equipment also includes a frame 4, a lifting mechanism 5, and a counting mechanism 6. The carrier 2 is installed inside the frame 4. The lifting mechanism 5 is connected to the frame 4 and is used to move the carrier 2 and the basket frame 1 vertically. The counting mechanism 6 is connected to the frame 4 and is located on one side of the carrier 2. The counting mechanism 6 includes at least one second sensor 61, which is used to sequentially identify each wafer as the basket frame 1 moves vertically and generate an identification signal. The detection mechanism is electrically connected to the counting mechanism 6 and is used to acquire the identification signal to calculate the number of wafers. It should be noted that initially, the carrier 2 is located below the counting mechanism 6. After the basket frame 1 is placed, the lifting mechanism 5 raises the carrier 2 and the basket frame 1. During the raising process, the second sensor 61 sequentially identifies the wafers in the basket frame 1 and the detection mechanism detects the number of wafers. Here, the second sensor 61 is a laser sensor.

[0031] In some preferred embodiments, the wafer counting mechanism 6 includes a plurality of second sensors 61, which are arranged horizontally at intervals along the width direction of the basket frame 1. The detection mechanism is configured to determine that the wafer is in a horizontal state when the plurality of second sensors 61 simultaneously generate identification signals. It should be noted that, since the plurality of second sensors 61 are arranged horizontally, when the wafer is in a horizontal state, the plurality of second sensors 61 can simultaneously detect the same wafer; however, when the wafer is in a tilted state, the plurality of second sensors 61 cannot simultaneously detect the same wafer, and in this case, it is determined that the wafer is in a non-horizontal misaligned placement state, and an alarm is triggered by the detection mechanism.

[0032] In some preferred embodiments, please refer to Figure 2 The lifting mechanism 5 includes a fixed plate 51, a support frame 52, and a first driving component 53. The fixed plate 51 is arranged vertically and is equipped with a linear guide rail 54. The support frame 52 is connected to the carrier 2 and can slide up and down along the linear guide rail 54. The first driving component 53 is mounted on the fixed plate 51 and is used to drive the support frame 52 to move the carrier 2 up and down. Here, the first driving component 53 is a servo motor mounted on the fixed plate 51 and a ball screw connected to the support frame 52. The cooperation of the servo motor and the ball screw drives the support frame 52 and the carrier 2 to move up and down precisely and smoothly.

[0033] Figure 6 This is a schematic structural diagram of the wafer loading and unloading device according to an embodiment of the present invention, showing the multi-wafer mechanism.

[0034] In some embodiments, see Figure 6The wafer loading and unloading equipment also includes a foolproof sensor 7, which is mounted on the carrier 2 and located on one side of the basket frame 1. This sensor detects whether the wafer protrudes from the basket frame 1. The foolproof sensor 7 is electrically connected to the detection mechanism, and when the sensor is triggered, the detection mechanism triggers an alarm signal. Here, the foolproof sensor 7 is a laser sensor.

[0035] Figure 5 This is a schematic structural diagram of the gripper mechanism of a wafer loading and unloading device according to an embodiment of the present invention. Figure 7 This is a schematic structural diagram of the cleaning mechanism of a wafer loading and unloading device according to an embodiment of the present invention.

[0036] In some embodiments, see Figure 1 , 5 In addition to 7, the wafer loading and unloading equipment also includes a gripper mechanism 8 and a cleaning mechanism 9. The gripper mechanism 8 is used to hold the target wafer within the basket frame 1 and to remove the target wafer from the basket frame 1. See also... Figure 7 The cleaning mechanism 9 is installed on the discharge side of the basket frame 1 and includes a vacuum generator 91, a collection box 92, and a mounting plate 93. The bottom of the mounting plate 93 has multiple air holes 931. The vacuum generator 91 is connected to each air hole 931 and the collection box 92, and operates during the extraction of the target wafer from the basket frame 1 to generate negative pressure in the air holes 931, thereby drawing impurities from the surface of the target wafer into the collection box 92. The cleaning mechanism 9 is designed to clean the surface of the wafer before it enters subsequent processes, addressing the cleanliness issue during wafer transfer and reducing damage to the wafer during testing. Simultaneously, the negative pressure adsorption dust removal avoids direct contact with the wafer, preventing secondary damage.

[0037] In some embodiments, see Figure 5 The wafer loading and unloading equipment also includes a barcode scanner 41, which is mounted on the frame 4 and located on one side of the carrier 2. It is used to identify the information of the wafer when it is pulled out of the basket frame 1 and bind it to the background system for subsequent traceability.

[0038] In some embodiments, see Figure 7The cleaning mechanism 9 also includes a drive mechanism 94, which is connected to the mounting plate 93 and drives the mounting plate 93 to move up and down. In some preferred embodiments, the drive mechanism 94 includes a mounting frame 941, a slide rail 942, and a second drive member 943. The mounting frame 941 is located on the discharge side of the basket frame 1. The vacuum generator 91 and the collection box 92 are mounted on the mounting frame 941. The slide rail 942 is vertically mounted on the mounting frame 941. The second drive member 943 is mounted on the slide rail 942 and connected to the mounting plate 93, and drives the mounting plate 93 to slide up and down on the slide rail 942. Here, the second drive member 943 is a cylinder. By setting the drive mechanism 94, the mounting plate 93 can avoid interference with its stroke during the loading and unloading process of the wafer by the gripper mechanism 8.

[0039] In some embodiments, see Figure 2 , 5 6. The gripper mechanism 8 includes a pick-up gripper 81, a first transfer mechanism 82, and a second transfer mechanism 83. The first transfer mechanism 82 is connected to the pick-up gripper 81 and is used to move the pick-up gripper 81 vertically to the height of the target wafer. The second transfer mechanism 83 is connected to the first transfer mechanism 82 and is used to move the first transfer mechanism 82 and the pick-up gripper 81 horizontally, so that the pick-up gripper 81 clamps and extracts the target wafer.

[0040] In some preferred embodiments, please refer to Figure 5 The first transfer mechanism 82 includes a support cantilever 821 and a third drive member 822. The support cantilever 821 is connected to the material gripper 81, and the third drive member 822 is connected to the support cantilever 821 and is used to drive the support cantilever 821 to move the material gripper 81 vertically. The second transfer mechanism 83 includes a support platform 831 and a fourth drive member 832. The support platform 831 supports the first transfer mechanism 82, and the fourth drive member 832 is slidably connected to the support platform 831 and is used to drive the support platform 831 to move the first transfer mechanism 82 and the material gripper 81 horizontally. Here, the third drive member 822 is a cylinder mounted on the support platform 831, and the fourth drive member 832 is a linear motor module.

[0041] The present invention also provides a wafer testing machine, including wafer loading and unloading equipment. Details regarding the wafer loading and unloading equipment will not be provided here.

[0042] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0043] The above embodiments only illustrate several implementation methods of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A wafer loading and unloading device, characterized in that, include: Basket frame, used to hold wafers; A support member, arranged horizontally, is used to support the basket frame, and the support member has a plurality of mounting holes evenly arranged vertically; Multiple sensing mechanisms are mounted on the carrier. Each sensing mechanism includes a sensing element and a first sensor. The sensing element is installed in the mounting hole and protrudes from the surface of the carrier. Each first sensor is installed below the carrier and cooperates with the corresponding sensing element. When the basket frame is placed on the carrier, one or more of the sensors are pressed into the corresponding mounting holes and float, causing the corresponding first sensor to generate a trigger signal; The detection mechanism is electrically connected to each of the first sensors and is configured to indicate that the basket frame is in a horizontal state after receiving trigger signals from all the first sensors; otherwise, it indicates that the basket frame is in a non-horizontal state.

2. The wafer loading and unloading equipment according to claim 1, characterized in that, Each of the aforementioned sensing mechanisms also includes: A mounting platform is installed below the support member and has a limiting groove; the first sensor is installed at the bottom of the mounting platform, the sensing element passes through the mounting platform and can move down to the sensing area of ​​the first sensor when pressure is applied; An elastic element is installed in the limiting groove and sleeved on the outer periphery of the sensing element.

3. The wafer loading and unloading equipment according to claim 2, characterized in that, The supporting component is square, and the basket frame is cuboid. Multiple of the aforementioned sensing mechanisms are distributed at the four corners of the carrier.

4. The wafer loading and unloading equipment according to any one of claims 1-3, characterized in that, The sidewall of the basket frame has mounting slots arranged vertically at intervals, each mounting slot being used to limit the position of one of the wafers. The wafer loading and unloading equipment further includes: A frame, in which the load-bearing member is installed; A lifting mechanism, connected to the frame, is used to drive the support member and the basket frame to move vertically; A wafer counting mechanism, connected to the frame and located on one side of the support member, includes at least one second sensor for sequentially identifying each wafer as the basket frame moves vertically and generating an identification signal. The detection mechanism is electrically connected to the wafer counting mechanism and is used to acquire identification signals to calculate the number of wafers.

5. The wafer loading and unloading equipment according to claim 4, characterized in that, The multi-piece mechanism includes a plurality of second sensors, which are arranged horizontally at intervals along the width direction of the basket frame; The detection mechanism is configured to determine that the wafer is in a horizontal state when multiple second sensors simultaneously generate recognition signals.

6. The wafer loading and unloading equipment according to any one of claims 1-3, characterized in that, Also includes: A foolproof sensor is mounted on the carrier and located on one side of the basket frame to detect whether the wafer protrudes from the basket frame.

7. The wafer loading and unloading equipment according to any one of claims 1-3, characterized in that, Also includes: A gripper mechanism is used to grip the target wafer inside the basket frame and extract the target wafer from the basket frame; A cleaning mechanism is installed on the discharge side of the basket frame and includes a vacuum generator, a collection box, and a mounting plate. The bottom of the mounting plate is provided with multiple air holes. The vacuum generator is connected to each of the air holes and the collection box and is used to operate during the process of the target wafer being extracted from the basket frame, so that the air holes generate negative pressure, thereby sucking impurities on the surface of the target wafer into the collection box.

8. The wafer loading and unloading equipment according to claim 7, characterized in that, The cleaning facility also includes: A drive mechanism, connected to the mounting plate, is used to drive the mounting plate to move up and down.

9. The wafer loading and unloading equipment according to claim 7, characterized in that, The gripper mechanism includes: Material handling grippers; The first transfer mechanism is connected to the pick-up gripper and is used to drive the pick-up gripper to move vertically to the height of the target wafer; The second transfer mechanism, connected to the first transfer mechanism, is used to drive the first transfer mechanism and the pick-up gripper to move horizontally, so that the pick-up gripper can hold and extract the target wafer.

10. A wafer testing machine, characterized in that, Includes the wafer loading and unloading equipment as described in any one of claims 1-9.

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