A carrier for semiconductor packages

Abstract

The application provides a carrying device for semiconductor packaging, and belongs to the technical field of semiconductor packaging. The carrying device specifically comprises a jig bearing main plate, a positioning assembly, a wafer clamping part, a clamping driving unit, a detection part, a glue particle containing unit, a switching assembly and a connecting part. Through the processing scheme, the components that cooperate with each other can be arranged in the same jig, the one-time taking and placing of a large number of wafers, the glue particle feeding and the wafer detection can be realized in the same station, the corresponding jig does not need to be replaced, the operation time is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, and in particular relates to a material carrying device for semiconductor packaging. Background Technology

[0002] The semiconductor packaging process typically includes the following operations: placing the arranged wafers into a press, placing the black adhesive for molding the wafers into the press, and completing the molding of the wafers through the press; In traditional semiconductor packaging, the handling of wafers, such as picking up and placing empty wafers, injecting encapsulated granules, and removing encapsulated wafers, is mainly completed at different stations using different fixtures. Empty wafers need to be removed and placed into the press, and encapsulated wafers need to be quantitatively placed into the press. Removing empty wafers and encapsulating granules are generally done by different fixtures. During operation, fixtures need to be changed frequently, which is time-consuming, has a low degree of automation, and results in low efficiency of semiconductor packaging operations. Summary of the Invention

[0003] Therefore, in order to overcome the shortcomings of the prior art, this utility model provides a material handling device for semiconductor packaging that can complete the picking and placing of empty wafers and granules on a single fixture.

[0004] To achieve the above objectives, this utility model provides: A material handling device for semiconductor packaging, comprising: The fixture support main board has a positioning component on one side that precisely aligns the fixture support main board with the sheet stacker and press mold that have the sheet materials arranged outside. The fixture support main board has through holes. The sheet clamping part passes through the through hole and is fixed on the main board of the fixture. The clamping surface is located on one side of the main board of the fixture and is used to receive the sheet conveyed by the sheet stacking machine. A clamping drive unit is disposed on the other side of the main board of the fixture and above the sheet clamping part, and controls the opening and closing of the sheet clamping part to clamp the sheet. A granule receiving unit is disposed on one side of the sheet clamping part and receives granules from an external glue discharging mechanism. The granule receiving unit includes a material cylinder and a material cylinder slice. The switching component, located above the barrel slicer, is used to control the opening and closing of the granule receiving unit; The detection unit is located on one side of the sheet clamping unit, the positioning component, and the granule receiving unit, and is used to detect and transmit signals; The connecting part is used to connect to an external power source to provide power to the fixture carrying motherboard, clamping drive unit and switching components.

[0005] Preferably, the positioning component includes: A stop plate is provided on the side of the fixture that carries the main board; The positioning pin component is disposed on one side of the main board of the fixture, and is used to cooperate with the sheet stacker and the press mold to achieve precise alignment.

[0006] The limiting needle component is set on one side of the main board of the fixture to restrict the material from moving to both sides during material handling, thereby improving material handling accuracy.

[0007] Preferably, the sheet clamping part includes: The clamping mechanism is used to clamp the sheet material. The buffer limiting mechanism buffers the clamping of the clamping mechanism to prevent the material from sliding or being damaged in the clamping mechanism.

[0008] Preferably, the clamping mechanism includes: a miniature slide rail, a slider connecting plate, a support column, a tension spring, a finger hook, a finger hook crossbeam, and a connecting bracket. The miniature slide rail is mounted on the main support plate of the fixture. At least two slider connecting plates are connected to one miniature slide rail. The slider connecting plates are provided with pillars at both ends. A tension spring is provided between the two pillars on the same miniature slide rail. The slider connecting plate is fixedly connected to the clamping rod of the clamping drive unit. A connecting bracket, a finger hook beam and a finger hook are connected in sequence below the slider connecting plate.

[0009] Preferably, the switching component includes: The switching fastener is fixed on the main bearing plate of the fixture and connected to the sheet clamping part; The switching element provides a force for the horizontal movement of the barrel slices.

[0010] Preferably, each of the material cylinder, material clamping part, clamping drive unit, and detection part constitutes a set of mechanisms, and multiple sets of mechanisms are arranged in an array on the fixture carrier motherboard.

[0011] Preferably, the connection between the clamping drive unit and the sheet clamping part is provided with equal-height screws, which ensure that the clamping rod moves in the same plane.

[0012] Preferably, the detection unit includes a reflection sensor, an upper photoelectric sensor, and a lower photoelectric sensor. The reflection sensor is used to detect whether the clamping mechanism is clamping the material sheet, the upper photoelectric sensor is used to detect whether the positioning component is properly positioned, and the lower photoelectric sensor is used to detect whether there are rubber particles in the material cylinder.

[0013] Preferably, the connecting part is located at one end of the main board of the fixture, and the connecting part includes a terminal block, a power connector and a fixture stand plate, connecting the electrical components inside the device to the outside.

[0014] Preferably, the fixture upright plate is provided with a corrugated flexible conduit connector to facilitate the connection of external electrical wiring harnesses into the device. The fixture stand plate has a groove and corresponding holes in the middle for connecting to an external robotic arm.

[0015] Compared with the prior art, the advantages of this utility model are: The semiconductor packaging material handling device is equipped with a granule dispensing component, a die clamping part, and a detection part that work together in the same fixture. It can realize the one-time picking and placing of a large number of dies, granule dispensing, and die detection in the same station without changing the corresponding fixture, reducing operation time and improving production efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural schematic diagram of one side of an embodiment of the present utility model; Figure 2 This is a three-dimensional structural schematic diagram of another aspect of an embodiment of this utility model; Figure 3 This is a schematic diagram of the clamping mechanism of this utility model; Figure 4 This is a schematic diagram of the clamping drive unit of this utility model; Figure 5 This is a schematic diagram of the switching component of this utility model; Figure 6 This is a structural schematic diagram of the positioning pin component of this utility model; Figure 7 This is a structural schematic diagram of the limiting needle component of this utility model. Detailed Implementation

[0018] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0019] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] It should be noted that the following description covers various aspects of embodiments within the scope of protection of this invention. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using other structures and / or functionalities besides one or more of the aspects set forth herein.

[0021] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The drawings only show the components related to this application and are not drawn according to the actual number, shape and size of the components in the actual implementation. In the actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0022] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0023] Example 1: like Figure 1 and Figure 2As shown in the figure, this application provides a material handling device for semiconductor packaging, used for picking up and placing empty wafers and granules. The device includes a fixture support main board 1, a positioning component 200, a wafer clamping part 300, a clamping drive unit 400, a detection part 500, a granule receiving unit 600, a switching component 700, and a connecting part 800. One side of the fixture support main board 1 is provided with a positioning component 200 for precisely aligning the fixture support main board 1 with a wafer stacker that has wafers arranged externally. The positioning component 200 can also be precisely aligned with the press mold when placing wafers, so that the wafers fall into the working area.

[0024] The fixture support mainboard 1 is provided with a connection part 800 for connecting to an external power source to provide power to the clamping drive unit 400 and the switching assembly 700 on the fixture support mainboard 1. The connection part 800 includes a terminal block 20, a power connector 18, and a fixture stand plate 2. The terminal block 20 connects the electrical components inside the device to the outside. The fixture stand plate 2 is provided with a corrugated flexible hose connector 17 to facilitate the connection of external electrical wiring harnesses into the device. The fixture stand plate 2 has a groove and corresponding holes in the middle for connecting to an external robotic arm. The power connector 18 provides power to the clamping drive unit 400 and the switching assembly 700.

[0025] In some embodiments, the positioning component 200 includes a stop plate 8, a positioning pin component 9, and a limiting pin component 10. The stop plate is disposed on one side of the fixture carrying main board, and the positioning pin component 9 and the limiting pin component 10 are used to cooperate with the film sorting machine and the press to achieve precise alignment.

[0026] In this embodiment, photoelectric sensors 7a are provided on both sides of the positioning component 200 to detect whether the positioning component is properly positioned and whether the material sheet is placed correctly.

[0027] There are holes in the sheet material. Inside the press mold, there are corresponding needles inserted into the fixing holes on the sheet material. When the device puts the sheet material into the press, if the sheet material is not placed correctly, the needles on the press mold will push up the sheet material, thereby pulling up the pressing needle. The pressing needle blocks the light path of the photoelectric sensor 7a and sends out a corresponding signal to remind the sheet material to be rearranged.

[0028] like Figure 3 As shown, the fixture support main board 1 is provided with multiple through holes 111. The sheet clamping part 300 passes through the through holes 111 and is fixed on the fixture support main board 1. The clamping surface is located on one side of the fixture support main board 1 and is used to receive the sheet conveyed by the sheet stacking machine. The sheet clamping part 300 includes a clamping mechanism 5 and a buffer limiting mechanism 12.

[0029] The clamping mechanism 5 can be any type of mechanism that can open and close to clamp material pieces under external force. For example, by cooperating with the rotating component and the drive assembly, the head of the movable claw can be brought closer to or further away from the head of the fixed claw to achieve clamping action, which is suitable for confined spaces; by cooperating with the drive shaft and the guide block, the clamping parts of a pair of clamping pieces can be gradually opened outward to clamp the container; by cooperating with the drive mechanism and the chuck mechanism, the annular tooth structure of the first and second separating components can be used to move multiple claws along the guide groove to expand or shrink the clamping space.

[0030] like Figure 2 As shown, a reflection sensor 11 is provided on one side of the clamping mechanism 5 to detect whether the clamping mechanism 5 is clamping the material sheet.

[0031] In some embodiments, a granule receiving unit 600 is provided on one side of the clamping mechanism 5. The granule receiving unit 600 receives granules from an external dispensing mechanism. The granule receiving unit 600 includes a material cylinder 4 and a material cylinder slice 82. The material cylinders 4 are arranged in an array on the fixture support main board 1. Lower photoelectric sensors 7b are provided on both sides of the material cylinders 4. There are light-passing notches at corresponding positions of the light path of the lower photoelectric sensors 7b in the material cylinders 4 to allow the light path of the lower photoelectric sensors 7b to pass through. The lower photoelectric sensors 7b are used to check whether there are granules in the material cylinders 4.

[0032] like Figure 5 As shown, a switching assembly 700 is provided above the barrel slicer 82 to control the horizontal movement of the barrel slicer 82 and the opening and closing of the granule receiving unit 600. The switching assembly 700 includes a switching fixing member 83 and a switching member 81. The switching fixing member 83 is fixed on the fixture support plate and connected to the slicer clamping part. The switching member 81 provides a force for the horizontal movement of the barrel slicer 82, which in turn blocks the granules in the barrel 4. When multiple barrels 4 are provided on this device, the switching member 81 is located in the middle of each row of barrels 4, and the middle of the barrel slicer 82 is set on the switching member 81. The opening and closing of the switching member 81 drives the barrel slicer 82 to move and block the granules in the barrel 4. The switching member 81 can be a cylinder or a connecting rod, or other components that can provide driving force, and is not limited here.

[0033] like Figure 6 and 7 As shown: The tail of the limiting needle component 10 is the tip of the limiting needle 101, and the tail of the positioning needle component 9 is the clearance groove of the positioning needle 91.

[0034] The positioning pin component 9 consists of a positioning pin 91, a positioning pin bearing copper sleeve 92, a positioning pin compression spring 94, and a positioning pin retaining spring 95. The positioning pin bearing copper sleeve 92 has a through hole in its center. The positioning pin 91 passes through this hole on one side of the positioning pin bearing copper sleeve 92. The positioning pin compression spring 94 passes through the positioning pin 91 and is then held in place by the positioning pin retaining spring 95. Due to the compression and rebound of the positioning pin compression spring 94, the positioning pin 91 moves up and down within the positioning pin bearing copper sleeve 92 to perform its corresponding function.

[0035] The limiting needle component 10 consists of a limiting needle 101, a limiting needle bearing sleeve 102, a limiting needle compression spring 104, and a limiting needle retaining spring 105. The limiting needle bearing sleeve 102 has a through hole in its center. The limiting needle 101 passes through the hole on one side of the limiting needle bearing sleeve 102. The limiting needle compression spring 104 passes into the limiting needle 101 and is then held in place by the limiting needle retaining spring 105. Due to the compression and rebound of the limiting needle compression spring 104, the limiting needle 101 moves up and down within the limiting needle bearing sleeve 102 to perform its corresponding function.

[0036] The limit pin bearing copper sleeve 102 and the positioning pin bearing copper sleeve 92 are the same part, which improves the part interchangeability and reduces costs.

[0037] In some embodiments, both the positioning pin component 9 and the limiting pin component 10 are mounted on the fixture support main board 1 via bearing copper sleeves and secured by stop plates. During prolonged operation, the device will experience wear. This wear occurs internally within the positioning pin component 9 and the limiting pin component 10, rather than at the connection point with the fixture support main board 1. Therefore, after wear occurs, only the corresponding positioning pin component 9 and limiting pin component 10 need to be replaced; there is no need to replace the fixture support main board 1, significantly reducing costs.

[0038] During operation, the robotic arm rotates, driving the fixture carrying the main board 1 to the material handling position of the sheet-laying machine platform. During this process, the tail tip of the limiting tip 101 in the limiting needle component 10 is inserted into both ends of the sheet on the sheet-laying machine platform. The tail tip of the limiting tip 101 restricts both ends of the sheet, reducing lateral slippage and improving the accuracy of sheet handling. The tail tip of the limiting tip 101 also plays a guiding role. The feeding needle on the sheet-laying machine platform is inserted into the clearance groove at the end of the positioning needle 91 in the positioning needle component 9. The clearance groove annular surface of the positioning needle 91 is used to press the sheet. The positioning component 200 is used to detect whether the positioned sheet is correctly placed, improving sheet handling accuracy and efficiency.

[0039] During material feeding, the device is positioned above the press mold and then slowly descends to the material feeding position of the press mold. During this time, the tip of the limit needle 101 in the limit needle component 10 is inserted into the press mold, and the clearance groove at the tail of the positioning needle 91 in the positioning needle component 9 covers the feeding needle of the press mold. The material sheet has been placed to the material feeding position of the press mold.

[0040] The positioning pin component 9 can be independently mounted on the fixture carrier main board 1 for use with the sheet machine and press mold to achieve precise alignment. Alternatively, it can be mounted together with the limiting pin component 10 on the fixture carrier main board 1 to provide even more precise alignment.

[0041] In this embodiment, when the clamping mechanism 5 clamps the sheet, the clamping mechanism 5 is located on one side of the sheet. The clamping mechanism 5 includes: a miniature slide rail 51, a slider connecting plate 52, a support column 54, a tension spring 53, a hook 55, a hook beam 56, and a connecting bracket 57. The miniature slide rail 51 is mounted on the fixture bearing main plate 1. At least two slider connecting plates 52 are connected to one miniature slide rail 51. The slider connecting plate 52 can be mounted on the miniature slide rail 51 through its own groove. Support columns 54 are provided at both ends of the slider connecting plate 52. A tension spring 53 is provided between the two support columns 54 on the same miniature slide rail 51. The tension of the tension spring 53 in the clamping mechanism 5 is evenly distributed, so that the clamping mechanism 5 runs relatively smoothly. The connecting bracket 57, the hook beam 56, and the hook 55 are connected in sequence below the slider connecting plate 52.

[0042] In the clamping mechanism 5, buffer limiting mechanisms 12 are provided on both sides of the finger hook beam 56. These mechanisms are used to adjust and support the tension and tension distance of the spring 53 of the buffer clamping mechanism 5 itself. This facilitates the adjustment of the parallelism of the finger hook beam 56 set on the same slider connecting plate 52, ensuring that the relative gap between the finger hooks 55 clamping the material pieces is consistent. This buffers the clamping of the clamping mechanism 5, preventing the material pieces from sliding in the clamping mechanism 5 due to one side being tight and the other side being loose, thus improving the accuracy of picking up and putting down materials.

[0043] The preferred material for the finger hook 55 is PEEK, rather than metal finger hooks. This avoids the potential adverse effects of metal finger hooks on some precision sheets. In addition, PEEK material has excellent properties such as high temperature resistance and wear resistance, which extends the service life of the finger hook 55 and reduces costs.

[0044] like Figure 4 As shown, in some embodiments, the clamping drive unit 6 is disposed on the other side of the fixture bearing main plate 1 and above the clamping mechanism 5, controlling the opening and closing of the clamping mechanism 5 to clamp the material sheet. A height-equalizing screw 15 is provided at the fixed connection between the slider connecting plate 52 and the clamping rod 62 of the clamping drive unit 6. The clamping drive component 61 of the clamping drive unit 6 drives the clamping rod 62 to move horizontally against the height-equalizing screw 15, thereby causing the clamping mechanism 5 to open and close to clamp the material sheet. The clamping drive component 61 can be a cylinder or a connecting rod, or other components that can provide driving force; no limitation is made here.

[0045] The clamping rod 62 has a long slot to accommodate adjustments made to the distance between the hooks 55 in the clamping mechanism 5 when machining errors accumulate or when the theoretical material differs from the actual production conditions. The equalizing screw 15 can move within the long slot, improving the device's fault tolerance. The clamping rod 62 also has a groove at the mounting point of the equalizing screw 15, creating a gap between the head of the screw 15 and the clamping rod 62. This reduces wear, ensures smooth operation, extends the lifespan of the parts, and improves the stability of the device's operation.

[0046] When it is necessary to receive glue particles, the switching element 81 moves the barrel slice 82 to no longer block the barrel 4. The glue discharge mechanism operates, and the discharge mechanism pushes all the glue particles into the barrel 4. The light path of the lower photoelectric sensor 7b on both sides of the barrel 4 is blocked, and the lower photoelectric sensor 7b sends a signal that there is material in the barrel 4. The control switching element 81 moves the barrel slice 82 to block the glue particles in the barrel 4.

[0047] When it is necessary to add granules, the switching component 81 opens, causing the material cylinder slicer 82 to move and no longer block the granules. The granules fall from the material cylinder 4 into the press mold. The light path of the photoelectric sensor 7b on both sides of the material cylinder 4 is unobstructed. The photoelectric sensor 7b detects that all the granules in the material cylinder 4 have fallen into the press mold and sends a corresponding signal.

[0048] like Figure 2 As shown, the running trajectory of the barrel slicer 82 is provided with a slicer limiting block 13, which is used to limit and support the barrel slicer 82 to prevent it from getting stuck due to deformation caused by its own weight and the weight of the granules, ensuring that the barrel slicer runs on a fixed trajectory and improving the stability of the device operation.

[0049] In some embodiments, the main board 1 of the fixture is provided with a plurality of columns 14 for mounting the fixture cover plate 3, which can serve to seal and prevent dust and for aesthetic purposes.

[0050] When the material handling device used for semiconductor packaging is in operation, the robot arm moves the device from the standby position to above the stacking platform of the stacking machine, driving the clamping drive 61 to move so that the clamping rod 62 abuts against the equal-height screw 15, thereby driving the clamping mechanism 5 to open.

[0051] The robotic arm operates, causing the device to slowly descend to the material handling position of the sheet handling platform. During this process, the positioning component 200 is inserted at both ends of the sheet on the sheet handling platform. The feeding needle on the sheet handling platform is inserted into the positioning component 200 to press the sheet. The photoelectric sensor 7a detects that it is normal. Then, the clamping drive component 61 is driven to move, causing the clamping mechanism 5 to close under the tension of the tension spring 53 and the traction of the clamping rod 62 in its own mechanism, thus clamping the whole mold sheet on the sheet handling platform.

[0052] The robotic arm moves the device upwards slowly, and the reflection sensor 11 detects that the clamping mechanism 5 has correctly gripped the material pieces. The robotic arm then moves the device from above the sheet-laying platform of the sheet-laying machine to above the external glue-discharging mechanism, and then slowly descends onto the glue-discharging mechanism platform. The switching component 81 moves the material cylinder slice 82 to no longer obstruct the material cylinder 4. The glue-discharging mechanism operates, and the glue-discharging mechanism pushes all the glue particles into the material cylinder 4 of the integrated device. The light paths of the lower photoelectric sensors 7b on both sides of the material cylinder 4 are blocked, and the lower photoelectric sensors 7b emit a signal indicating that there is material in the material cylinder 4. Then, the switching component 81 moves the material cylinder slice 82 into the material cylinder 4 to block the glue particles, and the glue-discharging mechanism operates, retracting the glue-discharging mechanism push rod.

[0053] The robotic arm moves the device upwards and then moves it above the press mold. It then slowly descends to the material handling position of the press mold. When the descent ends, the tip of the limiting needle 101 in the positioning component 200 is inserted into the press mold, and the clearance groove of the positioning needle 91 covers the material handling needle of the press mold. The clamping drive component 61 and the switching component 81 are both vented and opened, and the material sheet and granules are put into the material handling position of the press mold.

[0054] Before encapsulation, the robotic arm slowly raises the device, during which the reflection sensor 11 detects that all the sheets on the clamping mechanisms 5 have been lowered and sends a corresponding signal. The clamping drive unit 61 and the switching unit 81 are both vented and closed. Then, the robotic arm moves the device out of the press. After the press closes and the sheet is encapsulated, the press opens, and the robotic arm moves the device back into the press. The clamping mechanisms 5 open, and the device descends to the material removal position. The clamping mechanisms 5 close to hold the formed sheet, and the robotic arm moves the device out of the press and to the subsequent equipment for processing. After the formed sheet on this device is removed by the subsequent equipment, the robotic arm moves the device to the standby position, awaiting the next process cycle.

[0055] Example 2: This application provides a material handling device for semiconductor packaging, used for picking up and placing empty wafers and granules. The device includes a fixture support main board 1, a positioning component 200, a wafer clamping part 300, a clamping drive unit 400, a detection part 500, a granule receiving unit 600, a switching component 700, and a connecting part 800. One side of the fixture support main board 1 is provided with a positioning component 200 that precisely aligns the fixture support main board 1 with a wafer stacker that has wafers arranged externally. The positioning component 200 can also precisely align with the die of the wafer feeding press, so that the wafer falls into the working area.

[0056] The main board 1 of the fixture is provided with a connecting part 800 for connecting the device to the outside and providing power to the device.

[0057] In some embodiments, the positioning component 200 is inserted into an external device for positioning, and a clearance space is also provided when the device and the external device are connected. Upper photoelectric sensors 7a are provided on both sides of the positioning component 200 to detect whether the material sheet is correctly positioned.

[0058] The fixture support main board 1 is provided with multiple through holes 111. The sheet clamping part 300 passes through the through holes 111 and is fixed on the fixture support main board 1. The clamping surface is located on one side of the fixture support main board 1 and is used to receive the sheet conveyed by the sheet stacking machine. The sheet clamping part 300 includes a clamping mechanism 5 and a buffer limiting mechanism 12.

[0059] In some embodiments, the clamping drive unit 6 is disposed on the fixture support main board 1, and the clamping drive unit 6 controls the opening and closing of the clamping mechanism 5 to clamp the material sheet. A reflection sensor 11 is disposed on one side of the clamping mechanism 5 to detect whether the clamping mechanism is clamping the material sheet.

[0060] The clamping mechanism 5 includes a granule receiving unit 600 on one side. This unit receives granules from an external discharging mechanism. The granule receiving unit 600 includes a barrel 4 and a barrel slicer 82. Lower photoelectric sensors 7b are located on both sides of the barrel 4, and the barrel 4 has corresponding light-transmitting notches for the photoelectric sensors 7b to pass through, used to check for the presence of granules inside the barrel 4. The barrel slicer 82 moves to block and release the granules in the barrel 4. A switching component 81 is located above the barrel slicer 82 to control its horizontal movement and the opening and closing of the granule receiving unit 600.

[0061] In some embodiments, each sheet clamping part 300, clamping drive unit 400, detection part 500, granule receiving unit 600, and switching component 700 constitutes a set of mechanisms, and multiple sets of mechanisms are arrayed on the fixture carrier motherboard 1.

[0062] like Figure 1 As described above, a height-equalizing screw 15 can be provided at the connection between the slider connecting plate 52 and the clamping rod 62. During operation, the clamping drive 61 opens and the clamping rod 62 abuts against the height-equalizing screw 15, thereby driving the clamping mechanism 5 to open.

[0063] The clamping rod 62 has a long slot to accommodate adjustments made to the distance between the hooks 55 in the clamping mechanism 5 when machining errors accumulate or when the theoretical material differs from the actual production conditions. The equalizing screw 15 can move within the long slot, improving the device's fault tolerance. The clamping rod 62 also has a groove at the mounting point of the equalizing screw 15, creating a gap between the head of the screw 15 and the clamping rod 62. This reduces wear, ensures smooth operation, extends the lifespan of the parts, and improves the stability of the device's operation.

[0064] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application.

Claims

1. A material handling device for semiconductor packaging, characterized in that, include: The fixture support main board has a positioning component on one side that precisely aligns the fixture support main board with the sheet stacker and press mold that have the sheet materials arranged outside. The fixture support main board has through holes. The sheet clamping part passes through the through hole and is fixed on the main board of the fixture. The clamping surface is located on one side of the main board of the fixture and is used to receive the sheet conveyed by the sheet stacking machine. A clamping drive unit is disposed on the other side of the main board of the fixture and above the sheet clamping part, and controls the opening and closing of the sheet clamping part to clamp the sheet. A granule receiving unit is disposed on one side of the sheet clamping part and receives granules from an external glue discharging mechanism. The granule receiving unit includes a material cylinder and a material cylinder slice. The switching component, located above the barrel slicer, is used to control the opening and closing of the granule receiving unit; The detection unit is located on one side of the sheet clamping unit, the positioning component, and the granule receiving unit, and is used to detect and transmit signals; The connecting part is used to connect to an external power source to provide power to the fixture carrying motherboard, clamping drive unit and switching components.

2. The material handling device for semiconductor packaging according to claim 1, characterized in that, The positioning component includes: A stop plate is provided on the side of the fixture that carries the main board; The positioning pin component is disposed on one side of the main board of the fixture, and is used to cooperate with the sheet stacker and the press mold to achieve precise alignment; The limiting needle component is disposed on one side of the main board of the fixture and is used to restrict the material sheet from moving to both sides during material handling, thereby improving the accuracy of material handling.

3. The material handling device for semiconductor packaging according to claim 1, characterized in that, The sheet clamping part includes: The clamping mechanism is used to clamp the sheet material. The buffer limiting mechanism buffers the clamping of the clamping mechanism to prevent the material from sliding or being damaged in the clamping mechanism.

4. The material handling device for semiconductor packaging according to claim 3, characterized in that, The clamping mechanism includes: a miniature slide rail, a slider connecting plate, a support column, a tension spring, a finger hook, a finger hook crossbeam, and a connecting bracket. The miniature slide rail is mounted on the main support plate of the fixture. At least two slider connecting plates are connected to one miniature slide rail. The slider connecting plates are provided with pillars at both ends. A tension spring is provided between the two pillars on the same miniature slide rail. The slider connecting plate is fixedly connected to the clamping rod of the clamping drive unit. A connecting bracket, a finger hook beam and a finger hook are connected in sequence below the slider connecting plate.

5. The material handling device for semiconductor packaging according to claim 1, characterized in that, The switching component includes: The switching fastener is fixed on the main support plate of the fixture and connected to the sheet clamping part; The switching element provides a force for the horizontal movement of the barrel slices.

6. The material handling device for semiconductor packaging according to claim 1, characterized in that, Each of the sheet clamping part, clamping drive unit, detection part, granule receiving unit and switching component constitutes a set of mechanisms, and multiple sets of mechanisms are arranged in an array on the fixture carrier motherboard.

7. The material handling device for semiconductor packaging according to claim 6, characterized in that, The connection between the clamping drive unit and the material clamping part is provided with equal-height screws, which ensure that the clamping rod moves in the same plane.

8. The material handling device for semiconductor packaging according to claim 1, characterized in that, The detection unit includes a reflection sensor, an upper photoelectric sensor, and a lower photoelectric sensor. The reflection sensor is used to detect whether the clamping mechanism is clamping the material sheet, the upper photoelectric sensor is used to detect whether the positioning component is properly positioned, and the lower photoelectric sensor is used to detect whether there are granules in the material cylinder.

9. The material handling device for semiconductor packaging according to claim 1, characterized in that, The connecting part is located at one end of the main board of the fixture, and the connecting part includes a terminal block, a power connector and a fixture stand plate, connecting the electrical components inside the device to the outside.

10. The material handling device for semiconductor packaging according to claim 9, characterized in that, The fixture's upright plate is equipped with a corrugated flexible hose connector, facilitating the connection of external electrical wiring harnesses into the device. The fixture stand plate has a groove and corresponding holes in the middle for connecting to an external robotic arm.

Images