Wafer carrier device

Abstract

The application provides a wafer bearing device, and relates to the technical field of wafer transmission.The wafer bearing device comprises a support, the support comprises a base and a floating part floatingly connected to the top end of the base, the top surface of the floating part is provided with a platform for bearing a wafer, a pressure sensor and a thimble are arranged below the platform, a convex part is arranged on the side wall of the base, the pressure sensor is arranged on the convex part, one end of the thimble is in contact with the sensing surface of the pressure sensor, and the other end of the thimble is in abutment with the bottom surface of the platform; and the pressure sensor is used for monitoring the pressure state of the thimble. By arranging the thimble and the pressure sensor below the platform, when the platform is tilted, the platform extrudes the thimble below the platform, the pressure sensor monitors that the thimble is in a pressure state, and outputs a pressure signal as an electric signal, so that the horizontal state of the platform can be monitored, and the operator can conveniently find and further process in time.

Description

Technical Field

[0001] This application relates to the field of wafer transport technology, and more specifically, to a wafer carrier device. Background Technology

[0002] A wafer is the substrate material used to manufacture semiconductor chips. It is typically cut from high-purity single-crystal silicon ingots and is in the form of a thin, circular sheet. After its surface is precisely polished, it undergoes hundreds of complex processes, including photolithography, etching, ion implantation, and thin film deposition, to stack integrated circuit patterns layer by layer on it. Finally, it is cut and packaged into individual chips.

[0003] Currently, during wafer transfer, the platform supporting the wafer may tilt due to mechanical vibration or human operation. The tilted platform may collide with the robotic arm that transfers the wafer, increasing the risk of wafer transfer. Utility Model Content

[0004] The purpose of this application is to provide a wafer carrier device to address the shortcomings of the prior art and solve the problem of not being able to detect platform tilting in a timely manner.

[0005] To achieve the above objectives, the technical solutions adopted in the embodiments of this application are as follows: In one aspect of this application, a wafer carrier device is provided, including a support member. The support member includes a base and a floating member that is buoyantly connected to the top of the base. A platform for carrying a wafer is placed on the top surface of the floating member. A pin and a pressure sensor are disposed below the platform. A protrusion is provided on the side wall of the base. The pressure sensor is disposed on the protrusion. One end of the pin contacts the sensing surface of the pressure sensor, and the other end abuts against the bottom surface of the platform. The pressure sensor is used to monitor the pressure state of the pin.

[0006] Optionally, the ejector pin is a spring ejector pin.

[0007] Optionally, multiple monitoring instruments are installed below the platform, and these instruments are used to output electrical signals characterizing the platform.

[0008] Optionally, at least part of the monitoring instrument includes a displacement sensor, which is disposed on the protrusion and is used to monitor the displacement of the platform relative to the displacement sensor.

[0009] Optionally, the base includes a base plate and a cylinder with a chamber. The cylinder is fixed to the base plate, and a floating component is floatingly connected to the cylinder. The chamber of the cylinder is connected to an air source through an air pipe.

[0010] Optionally, a pressure sensor is installed inside the trachea to monitor the pressure of the gas inside the trachea. Optionally, some monitoring instruments include ultrasonic sensors mounted on a base plate for measuring the distance between the platform and the base plate.

[0011] Optionally, three support members are provided, and the three support members are arranged in a triangle.

[0012] Optionally, at least some of the monitoring instruments are mounted on three support components.

[0013] Optionally, the wafer carrier also includes a processor that is connected to multiple monitoring instruments and is used to output the platform's attitude information based on electrical signals.

[0014] The beneficial effects of this application include: This application provides a wafer carrier device, including a support member and a platform for carrying wafers. The support member includes a base and a floating member buoyed to the top of the base. The platform is placed on the top surface of the floating member. A protrusion is provided on the side wall of the base, and a pressure sensor and a pin are provided on the protrusion. One end of the pin contacts the sensing surface of the pressure sensor, and the other end abuts against the bottom surface of the platform. By providing the pin and pressure sensor below the platform, when the platform tilts, the platform compresses the pin located below it. The pressure sensor detects that the pin is under pressure and outputs a pressure signal as an electrical signal. This not only monitors the horizontal state of the platform but also allows operators to promptly detect and take further action. Attached Figure Description

[0015] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0016] Figure 1 This is a schematic diagram of the overall structure of a wafer carrier device provided in an embodiment of this application; Figure 2 This is one of the structural schematic diagrams of a wafer carrier device provided in an embodiment of this application.

[0017] Icons: 100-Wafer carrier; 110-Support; 111-Base; 1111-Base plate; 1112-Cylinder; 1112a-Cavity; 112-Floating component; 120-Platform; 130-Ejector pin; 140-Pressure sensor; 150-Protrusion; 160-Monitoring instrument; 161-Displacement sensor; 162-Ultrasonic sensor; 170-Air tube; 180-Air pressure sensor. Detailed Implementation Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, and the combined embodiments are still within the protection scope of this application.

[0018] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0019] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0020] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," not that the structure must be completely horizontal, but can be slightly tilted.

[0021] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0022] During wafer transport, a robotic arm is needed to place the wafer onto a platform or transfer a wafer from a platform to the next workstation. Mechanical vibrations or other factors can cause the platform carrying the wafer to tilt. Because there is no way to monitor whether the platform is level, the robotic arm continues transporting the wafer, potentially leading to a collision between the robotic arm and the platform. Therefore, this application provides a wafer carrier device capable of monitoring whether the platform is level. By monitoring this information, operators can detect platform tilting and take timely action to avoid the aforementioned problems.

[0023] like Figure 1 and Figure 2 As shown, in one aspect of this application embodiment, a wafer carrier device 100 is provided, including a support member 110. The support member 110 includes a base 111 and a floating member 112 that is floatingly connected to the top of the base 111. A platform 120 for carrying wafers is placed on the top surface of the floating member 112. A pin 130 and a pressure sensor 140 are disposed below the platform 120. A protrusion 150 is provided on the side wall of the base 111. The pressure sensor 140 is disposed on the protrusion 150. One end of the pin 130 contacts the sensing surface of the pressure sensor 140, and the other end abuts against the bottom surface of the platform 120. The pressure sensor 140 is used to monitor the pressure state of the pin 130. Specifically, the wafer carrier 100 includes a support member 110 and a platform 120. The support member 110 supports the platform 120, and the platform 120 carries the wafer. It should be noted that the wafer is placed in the middle or near the middle of the platform 120. The support member 110 includes a base 111 and a floating member 112. The floating member 112 is floatingly connected to the top of the base 111. The platform 120 is placed on the top surface of the floating member 112. That is, the platform 120 can rise or fall with the floating member 112, thereby achieving a rising or falling motion, and further causing the wafer placed on the platform 120 to rise or fall. A protrusion 150 is provided on the side wall of the base 111 to support a push pin 130 and a pressure sensor 140. The pressure sensor 140 is placed on the protrusion 150, and the push pin 130 is placed on the pressure sensor 140. Specifically, the needle seat of the ejector pin 130 contacts the sensing surface of the pressure sensor 140, and the needle tip of the ejector pin 130 abuts against the bottom surface of the platform 120. The pressure sensor 140 monitors whether the pressure exerted by the ejector pin 130 on the platform 120 is equal to a preset value.

[0024] When the platform 120 is in a horizontal position, the pressure value monitored by the pressure sensor 140 located at the bottom of the ejector pin 130 is equal to a preset value, such as the weight of the ejector pin 130. When the platform 120 tilts and presses against the ejector pin 130, the tip of the ejector pin 130 receives the pressure from the platform 120 and transmits the pressure to the needle seat. At this time, the pressure monitored by the pressure sensor 140 is greater than the preset value. Therefore, the pressure value monitored by the pressure sensor 140 is used to determine whether the platform 120 has tilted.

[0025] In some embodiments, two or more protrusions 150 are provided on the side wall of the base 111, the protrusions 150 surrounding the side wall of the base 111, and each protrusion 150 is provided with a pin 130 and a pressure sensor 140 for monitoring the tilt direction of the platform 120, for example, Figure 2As shown, if the pressure value detected by the pressure sensor 140 on the left increases, it indicates that the platform 120 is tilted to the left; conversely, if the pressure value detected by the pressure sensor 140 on the right increases, it indicates that the platform 120 is tilted to the right.

[0026] In some embodiments, the ejector pin 130 can be a spring ejector pin 130 or a solid ejector pin 130, and the specific type is not limited.

[0027] In some embodiments, the pressure sensor 140 may be a piezoresistive pressure sensor 140, a strain gauge pressure sensor 140, or a capacitive pressure sensor 140, and there is no specific limitation.

[0028] In some embodiments, platform 120 may be a marble platform 120, an alumina ceramic platform 120, or an aluminum nitride ceramic platform 120, and the specific type is not limited.

[0029] Optionally, such as Figure 2 As shown, ejector pin 130 is a spring ejector pin 130.

[0030] Specifically, the spring pin 130 can act as a buffer. When the platform 120 tilts and squeezes the spring pin 130, the spring's shock absorption and buffering effect can effectively reduce the scratches between the platform 120 and the pin 130.

[0031] When platform 120 tilts, it presses the needle tip of ejector pin 130. The needle tip presses the spring located in the needle seat. The elastic force generated by the spring presses the needle seat and is transmitted to the bottom of the needle seat. Pressure sensor 140 detects this pressure to determine that platform 120 has tilted.

[0032] Optionally, such as Figure 1 and Figure 2 As shown, multiple monitoring instruments 160 are arranged below the platform 120, and the multiple monitoring instruments 160 are used to output electrical signals characterizing the platform 120.

[0033] Multiple monitoring instruments 160 are installed below the platform 120. It should be noted that multiple monitoring instruments 160 refers to two or more monitoring instruments 160. The monitoring instruments 160 monitor the position status of the platform 120 and output the monitoring information in the form of electrical signals.

[0034] For example, monitoring instrument 160 is a laser rangefinder. The laser rangefinder emits a beam of light towards platform 120. After the beam hits platform 120, it is reflected back and received by the laser rangefinder again. The laser rangefinder calculates the distance by multiplying the round-trip time of the beam by the speed of light. When platform 120 is in a horizontal position, the distance measured between the laser rangefinder and platform 120 is the reference distance. The distance measured by the laser rangefinder is equal to the reference distance, indicating that platform 120 is in a horizontal state. When platform 120 is tilted, the distance measured by the laser rangefinder is greater than or less than the reference distance, indicating that platform 120 is tilted.

[0035] In some implementations, the monitoring instrument 160 may be an ultrasonic rangefinder, an infrared rangefinder, or a displacement sensor 161, and the specific type is not limited.

[0036] Optionally, such as Figure 1 and Figure 2 As shown, at least part of the monitoring instrument 160 includes a displacement sensor 161, which is disposed on the protrusion 150 and is used to monitor the displacement of the platform 120 relative to the displacement sensor 161.

[0037] Specifically, the multiple monitoring instruments 160 include at least a displacement sensor 161. A protrusion 150 for supporting the displacement sensor 161 is provided on the side wall of the base 111. The displacement sensor 161 measures the distance from the platform 120 to the displacement sensor 161 to determine whether the platform 120 is tilted.

[0038] When platform 120 tilts, the sensitive element of displacement sensor 161 senses the change in platform 120's movement, causing its parameters to change. The signal conditioning circuit processes the signal and outputs an electrical signal. The system reads the signal and calculates the displacement. For example, if displacement sensor 161 is a resistive displacement sensor, when platform 120 tilts, it causes the sliding contact to move on the resistive element, changing the resistance value. According to Ohm's law, under constant voltage, a change in resistance will cause a corresponding change in output current. By measuring the change in the output electrical signal, the displacement can be deduced. It should be noted that... Figure 2 The diagram is for illustrative purposes only. The specific installation can be done according to the specific situation of the resistive displacement sensor 161. Only the measurement principle is explained here.

[0039] In some embodiments, the displacement sensor 161 can be a photoelectric displacement sensor 161, an ultrasonic displacement sensor 161, or a capacitive displacement sensor 161, and there is no specific limitation. It should be noted that the measurement principles of different types of displacement sensors 161 are current technologies, and the specific installation position is installed according to the measurement principle of different sensors, which will not be elaborated here.

[0040] Optionally, such as Figure 2 As shown, the base 111 includes a base plate 1111 and a cylinder 1112 with a chamber 1112a. The cylinder 1112 is fixed to the base plate 1111, and the floating member 112 is floatingly connected to the cylinder 1112. The chamber 1112a of the cylinder 1112 is connected to an air source through an air pipe 170.

[0041] Specifically, the base 111 includes a base plate 1111 and a cylinder 1112. The cylinder 1112 has a chamber 1112a for containing gas. The cylinder 1112 is fixedly mounted on the base plate 1111. A floating component 112 is provided on the top of the cylinder 1112, and the floating component 112 is buoyantly connected to the cylinder 1112. The chamber 1112a is connected to an external air source through an air pipe 170. Gas is supplied by the air source to raise or lower the cylinder 1112, thereby raising or lowering the floating component 112 relative to the platform 120. It should be noted that... Figure 2 The diagram shows the connection between the trachea 170 and the chamber 1112a. The specific connection relationship is existing technology and will not be described in detail here.

[0042] In some embodiments, the cylinder 1112 is a pneumatic cylinder, and the floating component 112 is a flexible support pad. The platform 120 is raised or lowered by driving the flexible support pad through the pneumatic cylinder.

[0043] Optionally, such as Figure 2 As shown, a pressure sensor 180 is installed inside the trachea 170, which is used to monitor the pressure of the gas inside the trachea 170.

[0044] Specifically, a pressure sensor 180 is installed in the air pipe 170 connecting chamber 1112a to an external air source. The pressure sensor 180 monitors the gas pressure to determine whether platform 120 is tilted. For example, when platform 120 is in a horizontal position, it is raised by lifting cylinder 1112. At this time, the air pressure required to lift platform 120 is the reference air pressure. When platform 120 is tilted, the air pressure required to lift platform 120 is different from the reference air pressure. The pressure sensor 180 monitors the gas pressure to determine that platform 120 is tilted. Optionally, such as Figure 2 As shown, some monitoring instruments 160 include ultrasonic sensors 162, which are mounted on the base plate 1111 and used to measure the distance between the platform 120 and the base plate 1111.

[0045] Specifically, the ultrasonic sensor 162 measures the distance between the platform 120 and the base plate 1111 by emitting ultrasonic waves. The ultrasonic sensor 162 emits ultrasonic waves, calculates the time it takes for the ultrasonic wave to travel from the emission point to the reflection point after hitting the platform 120, and calculates the round-trip distance based on the speed of sound. The actual distance is half of this calculated distance. This distance is compared with a reference distance when the platform 120 is in a horizontal position to determine whether the platform 120 is tilted.

[0046] Optionally, such as Figure 1 As shown, there are three support members 110, which are arranged in a triangle.

[0047] Specifically, the platform 120 is supported by three support members 110, which are arranged in a triangle to ensure reliable positioning and support of the platform 120 and to ensure that each support member 110 is subjected to uniform force.

[0048] Optionally, such as Figure 1 As shown, at least some of the monitoring instruments 160 are respectively mounted on three support members 110.

[0049] Specifically, monitoring instruments 160 are installed on the three support components 110 to facilitate the determination of the tilt direction and degree of tilt of the platform 120.

[0050] Optionally, the wafer carrier 100 also includes a processor that is signal-connected to multiple monitoring instruments 160 and is used to output attitude information of the platform 120 based on electrical signals.

[0051] Specifically, the wafer carrier 100 is also equipped with a processor (not shown in the figure). The processor converts the electrical signals measured by multiple monitoring instruments 160 into digital signals, which are then displayed by a display instrument, making it convenient for operators to observe and process them in a timely manner.

[0052] In some embodiments, the wafer carrier 100 is also equipped with an alarm. The alarm is electrically connected to the processor. When the processor receives an abnormal signal, the alarm sounds an alarm, which makes it convenient for operators to promptly detect and handle any tilting of the platform 120.

[0053] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer carrier device, characterized in that, The device includes a support component, which includes a base and a floating component that is buoyantly connected to the top of the base. A platform for supporting a wafer is placed on the top surface of the floating component, and a pin and a pressure sensor are disposed below the platform. A protrusion is provided on the side wall of the base, and the pressure sensor is disposed on the protrusion. One end of the ejector pin is in contact with the sensing surface of the pressure sensor, and the other end abuts against the bottom surface of the platform. The pressure sensor is used to monitor the pressure state of the ejector pin.

2. The wafer carrier device as described in claim 1, characterized in that, The ejector pin is a spring ejector pin.

3. The wafer carrier device as described in claim 1, characterized in that, Multiple monitoring instruments are installed below the platform, and these instruments are used to output electrical signals characterizing the platform.

4. The wafer carrier device as described in claim 3, characterized in that, At least a portion of the monitoring instrument includes a displacement sensor disposed on the protrusion, the displacement sensor being used to monitor the displacement of the platform relative to the displacement sensor.

5. The wafer carrier device as described in any one of claims 3 to 4, characterized in that, The base includes a base plate and a cylinder with a chamber. The cylinder is fixed to the base plate, and the floating component is floatingly connected to the cylinder. The chamber of the cylinder is connected to an air source through an air pipe.

6. The wafer carrier device as described in claim 5, characterized in that, A pressure sensor is installed inside the trachea to monitor the pressure of the gas inside the trachea.

7. The wafer carrier device as described in claim 5, characterized in that, Some of the monitoring instruments include an ultrasonic sensor, which is mounted on the base plate and is used to measure the distance between the platform and the base plate.

8. The wafer carrier device as described in any one of claims 3 to 4, characterized in that, There are three support members, which are arranged in a triangle.

9. The wafer carrier device as described in claim 8, characterized in that, At least some of the monitoring instruments are respectively mounted on the three support members.

10. The wafer carrier device as described in claim 3, characterized in that, The wafer carrier device further includes a processor, which is connected to multiple monitoring instruments and is used to output the platform's attitude information based on the electrical signals.

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