A fixing device for semiconductor cleaning equipment

Abstract

The utility model relates to the technical field of semiconductor manufacturing, especially a fixing device for semiconductor cleaning equipment. Including base, the bottom of base is equipped with a plurality of support frame, a plurality of threaded sleeve seat are fixedly connected on the base, threaded sleeve seat is screw connected with the stand, the top fixedly connected with the rotating lever of stand, the middle fixedly sleeved with the ring plate of stand, the lower clamping seat is fixedly connected with the lower clamping seat around the ring plate below the stand, the screw rod is screw connected with the threaded connection of the screw rod on the ring plate around the stand, the upper clamping seat is rotatably connected with the upper clamping seat of the stand sliding connection, the screw rod top fixedly connected with the knob. The utility model provides a kind of fixing device, which can fix multiple semiconductor parts simultaneously, facilitate stacking storage and use, and has the function of convenient disassembly.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a fixing device for semiconductor cleaning equipment. Background Technology

[0002] Semiconductor devices undergo multiple cleaning processes during manufacturing to ensure their surface cleanliness meets process requirements. During cleaning, semiconductor components are typically placed on specialized clamping devices before being immersed in the cleaning equipment for further processing. These clamping devices must not only provide stable and reliable holding for the components, preventing displacement or damage from impacts in the cleaning solution, but also facilitate easy assembly, disassembly, and maintenance by operators to accommodate high-efficiency production cycles.

[0003] Currently, common semiconductor cleaning fixtures have certain limitations: Firstly, most devices can only fix single or a small number of parts, limiting the processing capacity of each cleaning operation and affecting overall cleaning efficiency. Secondly, the fixtures are often designed as a single unit, limiting the operating space when loading and unloading parts, which is not conducive to rapid placement and removal. Furthermore, when multiple fixtures are used simultaneously, their stacking stability is poor, they occupy a large amount of space, and are not convenient for rational layout within the cleaning equipment. Utility Model Content

[0004] This invention provides a fixing device that can simultaneously fix multiple semiconductor components, facilitate stacking, storage and use, and has convenient loading and unloading functions.

[0005] The technical solution adopted by this utility model is as follows: a fixing device for semiconductor cleaning equipment, including a base, a plurality of support frames at the bottom of the base, a plurality of threaded sleeves fixedly connected to the base, a column threadedly connected to the threaded sleeve, a rotating rod fixedly connected to the top of the column, an annular plate fixedly sleeved in the middle of the column, lower clamping seats fixedly connected to the bottom of the column below the annular plate, and threaded screws threadedly connected to the annular plate around the column, an upper clamping seat rotatably connected to the bottom of the screw and slidably connected to the column, and a knob fixedly connected to the top of the screw.

[0006] As a further improvement of this utility model, the base is provided with a number of mesh holes arranged in an array.

[0007] As a further improvement of this utility model, the number of support frames is four, which are distributed in a rectangular shape at the four corners of the bottom of the base, and the height of the support frame is greater than the height of the column.

[0008] As a further improvement of this utility model, the bottom end of the column has an external thread structure, and the inside of the threaded sleeve is provided with an internal thread groove that matches the external thread of the bottom end of the column. The bottom end of the column is detachably connected by the external thread and the internal thread groove of the threaded sleeve.

[0009] As a further improvement of this utility model, the top of the lower clamping seat away from the column and the bottom of the upper clamping seat away from the column are both provided with anti-slip clamping pads for clamping semiconductor wafers.

[0010] As a further improvement of this utility model, the bottom end of the screw is rotatably connected to the upper clamping seat through a bearing.

[0011] As a further improvement of this utility model, a slider is fixedly connected to the upper clamping seat near the column, and guide grooves for the slider to slide are provided around the column.

[0012] The beneficial effects of this utility model are as follows: By setting multiple independently adjustable upper and lower clamping seats, this utility model can stably clamp multiple semiconductor parts simultaneously, significantly improving the efficiency of a single cleaning operation; the column and base adopt a detachable threaded connection structure, allowing operators to conveniently load or remove parts from outside the device before installation, greatly improving operational convenience; the design of the support frame being taller than the column allows multiple fixing devices to be stacked stably, saving space inside the cleaning equipment and facilitating storage and transportation; combined with the array of mesh holes on the base, it effectively promotes the flow and drainage of cleaning fluid, thereby achieving efficient, stable, and convenient batch cleaning and fixing of semiconductor parts. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of a fixing device for a semiconductor cleaning equipment according to this utility model;

[0014] Figure 2 This is an exploded view of the structure of a fixing device for a semiconductor cleaning equipment according to this utility model;

[0015] Figure 3 This is a reference diagram showing the combined use of a fixing device for a semiconductor cleaning equipment according to this utility model;

[0016] Figure 4 This is a partial structural schematic diagram of a fixing device for a semiconductor cleaning equipment according to the present invention;

[0017] Figure 5 This is a partial structural cross-sectional view of a fixing device for a semiconductor cleaning equipment according to this utility model.

[0018] As shown in the figure: 1. Base; 2. Support frame; 3. Threaded sleeve; 4. Column; 5. Rotating rod; 6. Ring plate; 7. Lower clamping seat; 8. Screw; 9. Upper clamping seat; 10. Knob; 11. Anti-slip clamping pad; 12. Bearing; 13. Slider. Detailed Implementation

[0019] The directional terms such as up, down, left, right, front, back, front, back, top, and bottom mentioned or possibly mentioned in this specification are defined relative to their structure and are relative concepts. Therefore, they may vary depending on their location and usage; thus, these or other directional terms should not be interpreted as restrictive terms.

[0020] The singular forms “a,” “the,” and “the” used in this specification are intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes one or more of the associated listed items, any or all possible combinations thereof.

[0021] To make the technical problems to be solved, the technical solutions, and the beneficial effects of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0022] This utility model provides the following: Figure 1-5 The shown is a fixing device for a semiconductor cleaning equipment, including a base 1. The bottom of the base 1 is provided with multiple support frames 2. Multiple threaded sleeves 3 are fixedly connected to the base 1. Columns 4 are threadedly connected to the threaded sleeves 3. Rotating rods 5 are fixedly connected to the top of the columns 4. An annular plate 6 is fixedly sleeved in the middle of the columns 4. Lower clamping seats 7 are fixedly connected to the columns 4 below the annular plate 6. Screws 8 are threadedly connected to the annular plate 6 around the columns 4. The bottom of the screws 8 is rotatably connected to an upper clamping seat 9 that is slidably connected to the columns 4. A knob 10 is fixedly connected to the top of the screws 8.

[0023] like Figure 1-3 As shown, the base 1 of this utility model has a number of mesh holes arranged in an array, which can ensure that the cleaning fluid can quickly penetrate the base 1 and fully contact the surface of the parts.

[0024] like Figure 1-3As shown, in this utility model, there are four support frames 2, which are distributed in a rectangular shape at the four corners of the bottom of the base 1. The height of the support frame 2 is greater than the height of the column 4, so that when multiple fixing devices need to be stacked, the base of the upper fixing device can be placed stably on the base 1 of the lower fixing device through the support frame 2 at its bottom, without interfering with the column 4 of the lower fixing device and the components on the column 4.

[0025] like Figure 2 As shown, the bottom end of the column 4 in this utility model has an external thread structure, and the threaded sleeve 3 has an internal thread groove that matches the external thread at the bottom end of the column 4. The bottom end of the column 4 is detachably connected by the external thread and the internal thread groove of the threaded sleeve 3. When the operator needs to load or unload semiconductor parts, he or she can rotate the rotating rod 5 at the top of the column 4 to unscrew the entire column 4, along with the annular plate 6, the lower clamping seat 7, the screw 8, the upper clamping seat 9 and other components on it, from the threaded sleeve 3 of the base.

[0026] like Figure 4 and Figure 5 As shown, in this utility model, the top of the lower clamping seat 7 away from the column 4 and the bottom of the upper clamping seat 9 away from the column 4 are both provided with anti-slip clamping pads 11 for clamping semiconductor wafers. The anti-slip clamping pads 11 are made of elastic and corrosion-resistant cleaning liquid materials, such as rubber or silicone.

[0027] like Figure 4 and Figure 5 As shown, in this utility model, the bottom end of the screw 8 is rotatably connected to the upper clamping seat 9 through the bearing 12. When the rotating knob 10 drives the screw 8 to rotate, since the screw 8 and the annular plate 6 are threadedly connected, the screw 8 will move axially. However, due to the setting of the bearing 12, the rotational movement of the screw 8 will not be transmitted to the upper clamping seat 9, but will only drive the upper clamping seat 9 to move vertically, ensuring that the upper clamping seat 9 can smoothly approach or move away from the lower clamping seat 7, thereby achieving reliable clamping and release of the parts.

[0028] like Figure 4 and Figure 5 As shown, in this utility model, the upper clamping seat 9 is fixedly connected to the side of the column 4 with a slider 13. The column 4 is provided with guide grooves around its perimeter for the slider 13 to slide. When the screw 8 drives the upper clamping seat 9 to move up and down, the upper clamping seat 9 slides in the guide groove of the column 4 through the slider 13. The guide groove plays a precise guiding and limiting role in the movement direction of the slider 13, preventing the upper clamping seat 9 from tilting or rotating during the movement, and ensuring that the upper clamping seat 9 can always be accurately aligned with the lower clamping seat 7, thereby ensuring the clamping accuracy and stability of the semiconductor parts.

[0029] Working Principle: In practical implementation, the column is first unscrewed from the threaded sleeve of the base. Then, the knobs on each column are rotated, causing the upper clamping seat to move upward via the screw, creating sufficient loading space between the upper and lower clamping seats. The operator can place the semiconductor wafers to be cleaned one by one onto the anti-slip clamping pad of the lower clamping seat, ensuring that the edge of the wafer is in full contact with the clamping surface of the lower clamping seat. After placement, the knobs are rotated in the opposite direction, pushing the screw to slide the upper clamping seat downward along the guide groove of the column until the anti-slip clamping pad at the bottom of the upper clamping seat is tightly pressed against the upper surface of the wafer. The elastic deformation and friction of the anti-slip clamping pad achieve stable clamping of the wafer. After all the wafers on all columns are clamped, the bottom end of the column is aligned with the threaded sleeve on the base by rotating the rod and tightened. The entire device can then be placed into the cleaning equipment for cleaning operations. During the cleaning process, the cleaning fluid flows freely through the array of mesh holes on the base, effectively acting on the wafer surface and all clamping gaps. After cleaning, the mesh structure accelerates the drying of residual cleaning fluid. When cleaning multiple batches of wafers simultaneously, multiple clamped devices can be stacked sequentially using the support frame at the bottom. The bottom of the support frame of the upper device rests precisely on the upper surface of the base of the lower device. The design of the support frame being taller than the column height prevents collisions between the columns and wafers of the upper and lower devices, achieving efficient space utilization. The same stacking method can be used for daily storage or transportation, reducing storage space requirements. To remove the wafer, simply unscrew the column from the base and loosen the knobs to move the upper clamping seat upwards. The entire operation requires no complex operations inside the device, significantly improving loading and unloading efficiency.

[0030] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A fixing device for a semiconductor cleaning equipment, comprising a base (1), characterized in that: The base (1) has multiple support frames (2) at its bottom. Multiple threaded sleeves (3) are fixedly connected to the base (1). A column (4) is threadedly connected to the threaded sleeve (3). A rotating rod (5) is fixedly connected to the top of the column (4). An annular plate (6) is fixedly fitted in the middle of the column (4). Lower clamping seats (7) are fixedly connected to the column (4) below the annular plate (6). Screws (8) threadedly connected to the annular plate (6) are threaded through the column (4) around the annular plate (6). An upper clamping seat (9) is rotatably connected to the bottom of the screw (8) and slidably connected to the column (4). A knob (10) is fixedly connected to the top of the screw (8).

2. The fixing device for a semiconductor cleaning equipment according to claim 1, characterized in that: The base (1) has several mesh holes arranged in an array.

3. The fixing device for a semiconductor cleaning equipment according to claim 1, characterized in that: The number of support frames (2) is four and they are arranged in a rectangular shape at the four corners of the bottom of the base (1). The height of the support frame (2) is greater than the height of the column (4).

4. The fixing device for a semiconductor cleaning equipment according to claim 1, characterized in that: The bottom end of the column (4) has an external thread structure, and the threaded sleeve (3) has an internal thread groove that matches the external thread at the bottom end of the column (4). The bottom end of the column (4) is detachably connected by the external thread and the internal thread groove of the threaded sleeve (3).

5. The fixing device for a semiconductor cleaning equipment according to claim 1, characterized in that: The lower clamping seat (7) at the top of the end away from the column (4) and the upper clamping seat (9) at the bottom of the end away from the column (4) are both provided with anti-slip clamping pads (11) for clamping semiconductor wafers.

6. The fixing device for a semiconductor cleaning equipment according to claim 1, characterized in that: The bottom end of the screw (8) is rotatably connected to the upper clamping seat (9) via a bearing (12).

7. The fixing device for a semiconductor cleaning equipment according to claim 1, characterized in that: The upper clamping seat (9) is fixedly connected to a slider (13) on the side near the column (4), and the column (4) is provided with guide grooves around its perimeter for the slider (13) to slide.

Images