Wafer carrying and clamping device with movable jaw anti-looseness

Abstract

The application discloses a wafer bearing clamping device with anti-loose movable clamping jaw, and aims at solving the problem of loose movable clamping jaw of the existing wafer bearing clamping device during high-speed rotation. The application mainly adjusts the installation angle of the mandrel on the shaft seat, so that the first driving plate and the second driving plate are located at the opposite side of the second limiting block and take the mandrel as the center. When the chuck bottom plate rotates at high speed, the centrifugal force acting on the first driving plate and the second driving plate is converted into a torque for driving the movable clamping jaw to rotate in the clamping direction, so that the effect of "the higher the rotation speed, the stronger the clamping force" is realized, that is, the application realizes internal mechanical inversion through structure improvement. Meanwhile, the angle direction of the guide groove is adjusted correspondingly, so that the action direction of the rotating driving wheel during the opening and closing of the movable chuck jaw is consistent with the original direction. In addition, the rotating driving wheel and the limiting part are designed in a split type, so that the machining and maintenance costs are reduced.

Description

Technical Field

[0001] This application relates to the field of wafer and chip manufacturing equipment technology, and in particular to a wafer carrier clamping device with a movable gripper to prevent loosening. Background Technology

[0002] In wafer manufacturing processes, single-wafer cleaning equipment is a key process component, and the stability and reliability of its carrier and clamping devices directly affect the cleaning effect and yield of the wafers. Especially with the increasing prevalence of third-generation semiconductor materials such as silicon carbide (SiC), the strong adhesion of particles on the wafer surface and the difficulty of cleaning place higher demands on the clamping force of the chuck. Existing technologies, such as the wafer carrier and clamping device disclosed in Chinese invention patent CN119008511B, utilize multiple clamping components to adapt to wafers of different sizes and employ a coordinated action of moving and stationary jaws to clamp and release the wafers, demonstrating a certain level of compatibility and automation.

[0003] However, in actual high-speed rotation cleaning processes, the device revealed the following technical problems:

[0004] First, under high-speed operation, the moving jaws can loosen due to centrifugal force, posing a risk of wafer displacement or even breakage. Specifically, in a stationary state, the moving jaws maintain the clamping state of the wafer using the tension of the elastic element and the attraction of the magnetic element; however, during high-speed rotation, components such as the first and second drive plates in the drive unit are subjected to outward centrifugal force. This force is transmitted to the moving jaws through the drive components, causing them to rotate outward around the shaft and open outward. As the rotational speed increases, the centrifugal force increases. When this force exceeds the clamping force, the moving jaws loosen, failing to effectively secure the wafer and seriously affecting process safety and stability.

[0005] Secondly, the rotating drive wheel in this device adopts a one-piece molded structure, which is beneficial for structural sealing and transmission stability, but the manufacturing cost is high. Moreover, the limiting part on it is prone to deformation or wear after frequent stress, requiring regular inspection or replacement. Since the limiting part and the rotating drive wheel are designed as a single unit, the entire unit must be replaced during maintenance, which is not only cumbersome but also increases the cost of using and maintaining the equipment.

[0006] Therefore, it is necessary to propose a new technical solution to address the aforementioned technical problems. Utility Model Content

[0007] This application provides a wafer carrier clamping device with a movable jaw to prevent loosening, which solves the problem that the movable jaw of the existing wafer carrier clamping device is prone to loosening under high-speed operation, thus failing to effectively fix the wafer.

[0008] To achieve the above objectives, this application provides the following technical solution:

[0009] This application provides a wafer carrier clamping device with a movable gripper for preventing loosening, including a connecting base plate connected to a process chamber of a cleaning equipment, a chuck base plate connected to the connecting base plate, and a plurality of clamping assemblies connected to the side of the chuck base plate away from the connecting base plate. Each clamping assembly includes a plurality of clamping portions evenly arranged along the circumference of the chuck base plate. Each clamping portion includes a movable gripper connected to the chuck base plate and a plurality of stationary grippers connected to the chuck base plate. The movable gripper includes a second support member rotatably connected to the chuck base plate and a second limiting block connected to the second support member. The connecting base plate is connected to a drive assembly for driving the second support member to rotate around a rotation axis. The drive assembly includes a motor connected to the connecting base plate, a rotary drive wheel rotatably connected to the output shaft of the motor via a first bearing, and a plurality of clamping blocks connected between the rotary drive wheel and the chuck base plate for using elastic force to prevent the second limiting block from loosening. The second limiting block is pressed against the sidewall of the wafer by a spring-loaded part, and multiple parts are connected between the rotary drive wheel and the chuck base plate to cooperate with the motor to overcome the spring force of the spring-loaded part and disengage the second limiting block from the wafer drive part. The chuck base plate is connected to the output shaft of the motor. The drive part includes two drive members, two first drive plates and a second drive plate. The two drive members are respectively connected to the moving jaws of two adjacent clamping assemblies. The second drive plate is connected to a guide rod, and the end of the guide rod is provided with a second bearing. The second bearing cooperates with the guide groove provided on the rotary drive wheel. The drive member includes a shaft seat connected to the first drive plate and a spindle connected to the shaft seat. The spindle is connected to a first connecting member on the moving jaw through a rotating shaft. The first connecting member is provided on the side of the second support member opposite to the second limiting block. The second limiting block is located on one side of the central axis of the rotating shaft, wherein:

[0010] One end of each of the two first drive plates is hinged to a drive component, and the other end of each of the two first drive plates is hinged to both ends of the second drive plate, thereby forming a linkage mechanism. The linkage mechanism is located on the opposite side of the second limiting block with the mandrel as the center. One end of the guide groove gradually extends from the center of the rotating drive wheel to the edge of the rotating drive wheel. The end of the guide groove near the center of the rotating drive wheel is the starting end, and the end near the edge of the rotating drive wheel is the ending end. The guide groove gradually shifts towards the direction of the mandrel from the starting end to the ending end. Under the action of centrifugal force, the wafer is gradually clamped by the second limiting block.

[0011] Furthermore, in the above technical solution, the length directions of the two first drive boards are parallel.

[0012] Furthermore, the guide groove is a straight groove or an arc-shaped groove.

[0013] Furthermore, the lower surface of the rotary drive wheel is detachably connected with multiple limiting parts, and the bottom surface of the limiting parts is provided with limiting holes for matching the output shaft of the cylinder.

[0014] Furthermore, the lower surface of the rotary drive wheel is provided with a plurality of mounting slots for mounting the limiting part; the limiting part includes a limiting block, the limiting block including a limiting connecting seat for fitting into the mounting slot and a limiting protrusion ring connected to the limiting connecting seat, the central groove of the limiting protrusion ring forming a limiting hole adapted to the output shaft of the cylinder; the limiting connecting seat and the mounting slot are fastened together by bolts.

[0015] Compared with the prior art, this application has at least the following beneficial effects:

[0016] 1. This application adjusts the mounting angle of the mandrel on the bearing seat, positioning the first and second drive plates opposite the second limiting block with the mandrel as the center. This transforms the centrifugal force acting on the first and second drive plates during high-speed rotation of the chuck base plate into a torque driving the moving jaws to rotate in the clamping direction. This completely solves the problem of centrifugal force causing the moving jaws to open in the prior art, achieving a stable effect of "the higher the rotational speed, the stronger the clamping force." Simultaneously, this application adjusts the angle and direction of the guide groove accordingly, ensuring that the direction of the rotating drive wheel's movement is consistent with the original direction when the moving jaws open and close. Therefore... This application achieves internal mechanical reversal through structural improvements without altering the external control logic. The motor still drives the chuck base plate to "work rotate" relative to the locked rotary drive wheel to open the gripper, ensuring compatibility with the original equipment control system and operating procedures without requiring software or operational changes. Furthermore, the wafer carrier clamping device with anti-loosening moving grippers provided in this application fundamentally eliminates the risk of wafer displacement, vibration, or breakage caused by loosening of the moving grippers during high-speed cleaning (such as brushing and rotary drying), directly improving the stability of the process and product yield.

[0017] 2. The limiting part on the rotary drive wheel in this application is a detachable split structure. Since the limiting part is a vulnerable part, the split design of this application facilitates maintenance and replacement, eliminating the need to replace the entire rotary drive wheel and reducing maintenance costs. In addition, the structure of the rotary drive wheel body is simplified, eliminating the need to process complex and precise limiting holes, thus reducing the overall processing difficulty and manufacturing cost. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. It should be understood that the specific shapes and structures shown in the drawings should not generally be regarded as limiting conditions for implementing this application. For example, based on the technical concepts disclosed in this application and the exemplary drawings, those skilled in the art are able to easily make conventional adjustments or further optimizations to the addition / reduction / classification, specific shapes, positional relationships, connection methods, and size ratios of certain units (components).

[0019] Figure 1 This is a schematic diagram of the clamping state of a wafer on a wafer carrier clamping device in one embodiment;

[0020] Figure 2 Is Figure 1 Based on this, a planar connection structure of a drive unit is illustrated;

[0021] Figure 3 This is a bottom view schematic diagram of a portion of the structure of the wafer carrier clamping device in one embodiment;

[0022] Figure 4 This is a three-dimensional structural diagram of the rotating drive wheel in one embodiment;

[0023] Figure 5 This is a schematic diagram of the overall structure of a rotating drive wheel with a limiting part installed in one embodiment;

[0024] Figure 6 This is a three-dimensional structural diagram of the limiting part in one embodiment;

[0025] Figure 7 This is a schematic diagram of the structure of the first driving board in one embodiment;

[0026] Figure 8 The background technology references a patent document containing a force analysis diagram of the drive unit under centrifugal force.

[0027] Figure 9 This is a force analysis diagram of the driving part of the wafer carrier clamping device of this application under the action of centrifugal force in one embodiment.

[0028] Explanation of reference numerals in the attached figures:

[0029] 1. Wafer; 2. Chuck base plate; 3. Moving jaw; 31. Second support; 32. Second limit block; 4. Stationary jaw; 5. First drive plate; 51. Shaft seat; 6. Second drive plate; 7. Guide rod; 8. Rotary drive wheel; 81. Guide groove; 82. Mounting groove; 9. Limit block; 91. Limit connecting seat; 92. Limiting protrusion ring; 93. Limiting hole; 10. Mandrel;

[0030] F, centrifugal force; z, axis of rotation. Detailed Implementation

[0031] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] In the description of this application: unless otherwise stated, "a plurality of" means two or more. The terms "first," "second," etc., in this application are intended to distinguish the objects referred to and do not have any special meaning in terms of technical connotation (e.g., they should not be construed as an emphasis on importance or order). Expressions such as "including," "comprising," and "having" also mean "not limited to" (certain units, components, materials, steps, etc.).

[0033] The terms used in this application, such as "upper," "lower," "left," "right," and "middle," are generally used to facilitate intuitive understanding by referring to the accompanying drawings, and are not absolute limitations on the positional relationships in the actual product. Changes in these relative positional relationships, without departing from the technical concept disclosed in this application, should also be considered within the scope of this application.

[0034] This application primarily addresses the problem of the moving gripper loosening due to centrifugal force during high-speed rotation in the wafer carrier clamping device disclosed in Chinese Invention Patent CN119008511B, and aims to improve upon this design. (See also...) Figure 8 , Figure 8 The diagram shows the force analysis of the current drive unit under centrifugal force. Regardless of whether the chuck base plate rotates clockwise or counterclockwise, the centrifugal force on the second drive plate and the first drive plate is outward (the direction of the centrifugal force is from the center of the chuck base plate to its edge). The linkage mechanism composed of the second drive plate and the first drive plate will rotate counterclockwise around the axis z of the moving jaw under the action of centrifugal force F, which will cause the moving jaw to loosen.

[0035] To address the aforementioned technical problems, this application provides a wafer carrier clamping device with a movable gripper to prevent loosening. The difference between the structure of the wafer carrier clamping device provided in this application and that described in Chinese Invention Patent CN119008511B lies in the following: This application adjusts the mounting angle of the mandrel on the bearing seat, so that the first drive plate and the second drive plate are located on the opposite side of the second limiting block with the mandrel as the center. When the chuck base plate rotates at high speed, the centrifugal force acting on the first drive plate and the second drive plate is converted into a torque that drives the movable gripper to rotate in the clamping direction, achieving the purpose of greater clamping force with higher rotation speed. At the same time, in order to make the action of the movable gripper rotating and opening consistent with the action in patent CN119008511B, this application adapts and adjusts the angle direction of the guide groove in the rotary drive wheel. In addition, this application changes the rotary drive wheel and the limiting part to a separate design, reducing processing and maintenance costs.

[0036] The structure of the wafer carrier clamping device provided in this application will be specifically described below with reference to specific embodiments.

[0037] This application provides a wafer carrier clamping device with a movable gripper to prevent loosening, including a connecting base plate connected to the process chamber of a cleaning equipment, a chuck base plate connected to the connecting base plate, and multiple clamping components connected to the side of the chuck base plate away from the connecting base plate. See also Figure 1 The clamping assembly includes multiple clamping parts evenly arranged along the circumference of the chuck base plate 2. Each clamping part includes a movable jaw 3 connected to the chuck base plate 2 and multiple stationary jaws 4 connected to the chuck base plate 2. The movable jaw 3 includes a second support member 31 rotatably connected to the chuck base plate 2 and a second limiting block 32 connected to the second support member 31. The base plate is connected to a drive assembly for driving the second support member 31 to rotate around the axis. The second limiting block 32 is located on one side of the central axis of the axis. The drive assembly is used to drive the second limiting block 32 to rotate around the axis and abut against the side wall of the wafer 1 to achieve clamping of the wafer 1.

[0038] The drive assembly includes a motor connected to the connecting base plate, a rotary drive wheel 8 rotatably connected to the output shaft of the motor via a first bearing, a plurality of elastic parts connected between the rotary drive wheel 8 and the chuck base plate 2 for pressing the second limiting block 32 against the side wall of the wafer 1 by elastic force, and a plurality of drive parts connected between the rotary drive wheel 8 and the chuck base plate 2 for cooperating with the motor to overcome the elastic force of the elastic parts and disengage the second limiting block 32 from the wafer 1. The chuck base plate 2 is connected to the output shaft of the motor.

[0039] See Figure 2The drive unit includes two drive components, two first drive plates 5 and a second drive plate 6. The two drive components are respectively connected to the movable jaws 3 of two adjacent clamping assemblies. The second drive plate 6 is connected to a guide rod 7. The end of the guide rod 7 is provided with a second bearing. The second bearing cooperates with the guide groove 82 provided on the rotating drive wheel 8. The drive component includes a bearing seat 51 connected to the first drive plate 5 and a spindle 10 connected to the bearing seat 51. The spindle 10 is connected to the first connecting member on the movable jaw 3 through a rotating shaft. The first connecting member is provided on the side of the second support member 31 away from the second limiting block 32. Wherein: one end of each of the two first drive plates 5 is hinged to a drive member, and the other end of each of the two first drive plates 5 is hinged to both ends of the second drive plate 6, thereby forming a linkage mechanism. This linkage mechanism is located on the opposite side of the second limiting block 32 with the spindle 10 as the center. At the same time, one end of the guide groove 81 gradually extends from the center of the rotating drive wheel 8 to the edge of the rotating drive wheel 8. The end of the guide groove 81 near the center of the rotating drive wheel 8 is the starting end, and the end near the edge of the rotating drive wheel 8 is the ending end. The guide groove 81 gradually shifts towards the direction of the spindle 10 from the starting end to the ending end.

[0040] See Figure 9 The diagram shows the force analysis of the drive unit under centrifugal force. Regardless of whether the chuck base plate rotates clockwise or counterclockwise, the linkage mechanism consisting of the second drive plate and the first drive plate will rotate clockwise around the rotating axis z of the moving jaw under the action of centrifugal force, causing the moving jaw to clamp inward, so that the higher the speed, the greater the clamping force.

[0041] Therefore, this application adjusts the mounting angle of the mandrel on the bearing seat so that the first drive plate and the second drive plate are located on the opposite side of the second limiting block with the mandrel as the center. This achieves a specific arrangement direction adjustment of the linkage mechanism formed by the first drive plate and the second drive plate, so that the centrifugal force acting on the first drive plate and the second drive plate during high-speed rotation is converted into a torque that drives the moving gripper to rotate in the clamping direction through this specific structure. This completely solves the problem of the moving gripper opening due to centrifugal force in the prior art, and achieves the stable effect of "the higher the speed, the stronger the clamping force".

[0042] Secondly, this application sets the extension direction of the guide groove 81 to gradually shift towards the direction of the mandrel, so that the wafer is gradually clamped by the second limiting block under the action of centrifugal force. The adaptive adjustment of the guide groove direction makes the gripper open when the rotary drive wheel rotates clockwise relative to the base plate of the wafer bearing clamping device. This is consistent with the action in patent CN119008511B. That is, this application achieves internal mechanical reversal through structural improvement without changing the external control logic. The motor still opens the gripper by driving the chuck base plate to "work rotate" relative to the locked rotary drive wheel, ensuring compatibility with the original equipment control system and operation process, without the need to change the software or operating procedures. Furthermore, the matching guide groove direction makes the force flow of the drive unit smooth during the opening of the gripper, and the action is more reliable and stable.

[0043] As can be seen, this application achieves an inherent mechanical reversal through structural improvements, but the direction of the rotating drive wheel's movement remains consistent with the original when the moving jaws open and close, without altering the external control logic, thus ensuring compatibility with the existing equipment control system and operating procedures. Furthermore, this application fundamentally eliminates the risk of wafer displacement, vibration, or breakage caused by loose jaws during high-speed cleaning (such as brushing and rotary drying), directly improving the stability of the process and the yield of the product.

[0044] In one specific embodiment, such as Figure 2 The length directions of the two first drive boards 5 are parallel.

[0045] In one specific embodiment, the guide groove 81 formed on the rotary drive wheel 8 is a straight groove or an arc groove. Different groove shapes can meet the requirements of the opening and closing speed and acceleration of the moving gripper under different working conditions. Among them, straight grooves are easy to process, while arc grooves can achieve smoother speed changes. In other embodiments, the guide groove can also be an irregularly shaped groove composed of multiple line segments, which can be specially optimized for the opening and closing motion curve of the moving gripper.

[0046] In a preferred embodiment of this application, see [link to application]. Figure 4 , 5 The lower surface of the rotary drive wheel 8 is detachably connected to multiple limiting parts, and the bottom surface of each limiting part has limiting holes 93 for matching the output shaft of the cylinder. Specifically, the lower surface of the rotary drive wheel 8 has multiple mounting grooves 82 for mounting the limiting parts. See also Figure 6 The limiting part includes a limiting block 9, which includes a limiting connecting seat 91 for fitting into the mounting groove 82 and a limiting protrusion 92 connected to the limiting connecting seat 91. The central groove of the limiting protrusion 92 forms a limiting hole 93 that fits into the output shaft of the cylinder. The limiting connecting seat 91 and the mounting groove 82 are fastened together by bolts.

[0047] The integrated design of the rotary drive wheel and the limiting component eliminates the need to replace the entire rotary drive wheel when replacing the easily worn limiting component, significantly reducing maintenance costs and time. Furthermore, the simplified structure of the rotary drive wheel eliminates the need for machining complex and precise limiting holes, reducing overall machining difficulty and manufacturing costs. The limiting component can be manufactured using more wear-resistant or easier-to-machine materials. Moreover, the bolted connection between the limiting block and the rotary drive wheel ensures the stability of the limiting component during operation, preventing loosening due to vibration or other reasons and guaranteeing the reliability of the locking function.

[0048] In summary, this application, through ingenious structural improvements, transforms the centrifugal force under high-speed operating conditions into the clamping force of the moving jaws, fundamentally solving the problem of loosening of the moving jaws. Simultaneously, the accompanying guide groove design ensures that the external operating logic remains unchanged. Therefore, this application provides a wafer carrier clamping device that maintains stable clamping force under high-speed rotation conditions and has a structure that is easier to manufacture and maintain, thereby improving the reliability, safety, and economy of cleaning equipment.

[0049] The technical features of the above embodiments can be combined in any way (as long as there is no contradiction in the combination of these technical features). For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described; these embodiments not explicitly written should also be considered to be within the scope of this specification.

[0050] The present application has been described in a relatively specific and detailed manner above through general descriptions and specific embodiments. It should be understood that, based on the technical concept of the present application, several conventional adjustments or further innovations can be made to these specific embodiments; however, as long as they do not depart from the technical concept of the present application, the technical solutions obtained by these conventional adjustments or further innovations also fall within the protection scope of the claims of the present application.

Claims

1. A wafer carrier clamping device with a movable jaw for preventing loosening, comprising a connecting base plate connected to a process chamber of a cleaning equipment, a chuck base plate connected to the connecting base plate, and a plurality of clamping assemblies connected to the side of the chuck base plate away from the connecting base plate. Each clamping assembly includes a plurality of clamping portions evenly arranged along the circumference of the chuck base plate. Each clamping portion includes a movable jaw connected to the chuck base plate and a plurality of stationary jaws connected to the chuck base plate. The movable jaw includes a second support member rotatably connected to the chuck base plate and a second limiting block connected to the second support member. The connecting base plate is connected to a drive assembly for driving the second support member to rotate around a rotation axis. The drive assembly includes a motor connected to the connecting base plate, a rotary drive wheel rotatably connected to the output shaft of the motor via a first bearing, and a plurality of wheels connected between the rotary drive wheel and the chuck base plate for using elastic force to abut against the second limiting block. The drive unit comprises a spring-loaded part that is tightly attached to the sidewall of the wafer and a plurality of parts connected between the rotary drive wheel and the chuck base plate, which are used to cooperate with the motor to overcome the spring force of the spring-loaded part and disengage the second limiting block from the wafer. The chuck base plate is connected to the output shaft of the motor. The drive unit includes two drive members, two first drive plates and a second drive plate. The two drive members are respectively connected to the moving jaws of two adjacent clamping assemblies. The second drive plate is connected to a guide rod, and the end of the guide rod is provided with a second bearing. The second bearing cooperates with a guide groove provided on the rotary drive wheel. The drive member includes a shaft seat connected to the first drive plate and a spindle connected to the shaft seat. The spindle is connected to a first connecting member on the moving jaw through a rotating shaft. The first connecting member is provided on the side of the second support member opposite to the second limiting block. The second limiting block is located on one side of the central axis of the rotating shaft. One end of each of the two first drive plates is hinged to a drive component, and the other end of each of the two first drive plates is hinged to both ends of the second drive plate, thereby forming a linkage mechanism. The linkage mechanism is located on the opposite side of the second limiting block with the spindle as the center. One end of the guide groove gradually extends from the center near the center of the rotating drive wheel to the edge near the edge of the rotating drive wheel. The end of the guide groove near the center of the rotating drive wheel is the starting end, and the end near the edge of the rotating drive wheel is the ending end. The guide groove gradually shifts towards the direction of the mandrel from the starting end to the ending end. Under the action of centrifugal force, the wafer is gradually clamped by the second limiting block.

2. The wafer carrier clamping device with movable gripper for preventing loosening according to claim 1, characterized in that, The length directions of the two first drive boards are parallel.

3. The wafer carrier clamping device with movable gripper for preventing loosening according to claim 1, characterized in that, The guide groove is a straight groove or an arc groove.

4. The wafer carrier clamping device with movable gripper for preventing loosening according to claim 1, characterized in that, The lower surface of the rotary drive wheel is detachably connected to multiple limiting parts, and the bottom surface of the limiting parts is provided with limiting holes for matching the output shaft of the cylinder.

5. The wafer carrier clamping device with movable gripper for preventing loosening according to claim 4, characterized in that, The lower surface of the rotary drive wheel is provided with a plurality of mounting slots for mounting the limiting part; The limiting part includes a limiting block, which includes a limiting connecting seat for fitting into the mounting groove and a limiting protrusion ring connected to the limiting connecting seat. The central groove of the limiting protrusion ring forms a limiting hole that fits into the output shaft of the cylinder. The limiting connector and the mounting groove are fastened together by bolts.

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