Probing device for image sensor packages

Abstract

The utility model discloses a top pin device for image sensor package relates to semiconductor packaging technical field, including top pin body, jacking mechanism, cover cap, top pin body includes a plurality of top pin and connecting portion, top pin is fixed on the upper end of connecting portion, jacking mechanism includes telescopic end of vertical direction movement, and the lower end of connecting portion is fixed on telescopic end, and the upper side of cover cap is equipped with a plurality of protruding holes, and top pin passes through protruding hole and is fixed, and the upper end of top pin is provided with needle tip plane part, and the upper side of needle tip plane part is plane, and the upper side opening of protruding hole is equipped with the accommodation groove around, and needle tip plane part can move to the accommodation groove, and the upper side of needle tip plane part is flush with the upper side of cover cap. The utility model provides a top pin device for image sensor package, solves the chip when sucking, and the chip can change position when being lifted by top pin, and the problem that the chip sucking of suction head is affected, the utility model discloses can make the chip be lifted more stable.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor packaging technology, and in particular to a pin device for image sensor packaging. Background Technology

[0002] Using a negative pressure suction head to pick up the chip is a crucial step in image sensor packaging. When using the negative pressure suction head to pick up the chip, a push pin is needed to lift the chip from below. In the prior art, such as the push pin device and semiconductor chip packaging equipment disclosed in Chinese Patent Application No. 202122021546.3, the specific structure of the push pin is described.

[0003] However, the existing ejector pins have a small tip area, which may puncture the chip carrier film on the underside of the chip when lifting it, causing chip damage. The small tip area can also cause unstable chip lifting, making it impossible for the negative pressure pick-up head to pick up the chip properly. Utility Model Content

[0004] To address the aforementioned technical problems, the ejector pin device for image sensor packaging provided by this utility model can make the chip more stable when it is ejected.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: The present invention provides a pin device for image sensor packaging, comprising a pin body, a lifting mechanism, and an outer cap; the pin body includes a plurality of pins and a connecting portion; the pins are fixed to the upper end of the connecting portion; the lifting mechanism includes a telescopic end that can move vertically; the lower end of the connecting portion is fixed to the telescopic end; the upper side of the outer cap has a plurality of protruding holes; the pins pass through the protruding holes and are fixed; the upper end of the pin is provided with a pin tip plane; the upper side of the pin tip plane is flat; a receiving groove is provided around the upper opening of the protruding hole; the pin tip plane can move into the receiving groove; when the pin tip plane is in the receiving groove, the upper side of the pin tip plane is flush with the upper side of the outer cap.

[0006] The ejector pin device for image sensor packaging provided by this utility model preferably further includes a spring; the telescopic end and the connecting part are connected by the spring; the telescopic direction of the spring is vertical.

[0007] The ejector pin device for image sensor packaging provided by this utility model preferably has the following features: the pin tip plane portion is cylindrical; the receiving groove is cylindrical; the cylindrical diameter of the receiving groove is the same as the cylindrical diameter of the pin tip plane portion; and the lower bottom edge of the cylindrical portion of the pin tip plane portion is provided with rounded corners.

[0008] The above technical solution has the following advantages or beneficial effects: This utility model discloses a ejector pin device for image sensor packaging, relating to the field of semiconductor packaging technology. It includes an ejector pin body, a lifting mechanism, and an outer cap. The ejector pin body includes a plurality of ejector pins and a connecting portion. The ejector pins are fixed to the upper end of the connecting portion. The lifting mechanism includes a telescopic end that can move vertically. The lower end of the connecting portion is fixed to the telescopic end. The upper side of the outer cap has a plurality of protruding holes. The ejector pins pass through the protruding holes and are fixed. The upper end of the ejector pin has a pin tip plane. The upper side of the pin tip plane is flat. A receiving groove is formed around the upper opening of the protruding hole. The pin tip plane can move into the receiving groove. When the pin tip plane is in the receiving groove, the upper side of the pin tip plane is flush with the upper side of the outer cap. This utility model provides an ejector pin device for image sensor packaging that solves the problem in the prior art where the chip may change position when lifted by the ejector pin during chip pick-up, affecting the pick-up of the chip by the pick-up head. This utility model allows for more stable chip lifting. Attached Figure Description

[0009] The present invention, its features, shape, and advantages will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings. Like reference numerals denote like parts throughout the drawings. The drawings are not intentionally drawn to scale; the focus is on illustrating the gist of the invention.

[0010] Figure 1 This is a schematic diagram of the overall structure of the ejector pin device for image sensor packaging provided in Embodiment 1 of this utility model when the ejector pin body lifts the chip.

[0011] Figure 2 This is a schematic diagram of the overall structure of the ejector pin device for image sensor packaging provided in Embodiment 1 of this utility model in the ejector pin body retracted state.

[0012] Figure 3 This is a cross-sectional structural schematic diagram of the ejector pin device for image sensor packaging provided in Embodiment 1 of this utility model. Detailed Implementation

[0013] The technical solutions of the present utility model will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, and not all of them. Therefore, the detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to illustrate selected embodiments of the present utility model. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without inventive effort are within the protection scope of the present utility model.

[0014] Example 1: The ejector pin device for image sensor packaging provided in Embodiment 1 of this utility model, such as Figures 1 to 3 As shown, the device includes a pin body 1, a lifting mechanism 2, and an outer cap 3. The pin body 1 includes several pins 11 and a connecting part 12. The pins 11 are fixed to the upper end of the connecting part 12. The lifting mechanism 2 includes a telescopic end 21 that can move vertically. The lower end of the connecting part 12 is fixed to the telescopic end 21. The upper side of the outer cap 3 has several protrusion holes 31. The pins 11 pass through the protrusion holes 31 and are fixed. The upper end of the pin 11 is provided with a pin tip flat part 13. The upper side of the pin tip flat part 13 is flat. A receiving groove 32 is provided around the upper opening of the protrusion hole 31. The pin tip flat part 13 can move into the receiving groove 32. When the pin tip flat part 13 is in the receiving groove 32, the upper side of the pin tip flat part 13 is flush with the upper side of the outer cap 3.

[0015] The ejector pin device for image sensor packaging provided in Embodiment 1 of this utility model has two states during operation: an initial chip placement state and a chip lifting state. In the initial chip placement state, the telescopic end 21 of the lifting mechanism 2 is in the initial retracted position, and the connecting part 12 and the ejector pin 11 are simultaneously in the retracted state. At this time, the pin tip plane 13 at the upper end of the ejector pin 11 is completely embedded in the receiving groove 32 of the outer cover 3, and the upper side surface of the pin tip plane 13 is flush with the upper side surface of the outer cover 3. In this state, the upper side surface of the outer cover 3 can be completely... The adhesive carrier film beneath the image sensor chip is fully bonded. When the chip is being lifted, the negative pressure suction head moves directly above the target image sensor chip. Upon receiving a device command, the lifting mechanism 2 extends its telescopic end 21 vertically upwards, driving all the ejector pins 11 to rise synchronously via the connecting part 12. The ejector pins 11 move vertically along the extension hole 31 of the outer cap 3, which guides them and prevents deviation. The pin tip flat portion 13 gradually detaches from the receiving groove 32 and continues upwards, lifting the chip close to the negative pressure suction head. Compared to existing ejector pins, this embodiment allows the pin tip flat portion 13, with a larger contact area, to contact and lift the chip, preventing the pin tip from puncturing the chip carrier film and damaging the chip. It also avoids chip tilting caused by relative sliding between the pin tip and the chip, ensuring the negative pressure suction head accurately aligns with the chip center, thereby reducing the failure rate of the suction.

[0016] The ejector pin device for image sensor packaging provided in Embodiment 1 of this utility model solves the problem in the prior art that when a chip is picked up by the ejector pin, the chip may change position, affecting the pick-up of the chip by the pick-up head; this utility model can make the chip more stable when it is picked up.

[0017] As a preferred embodiment, this embodiment also includes a spring 4; the telescopic end 21 and the connecting part 12 are connected by the spring 4; the telescopic direction of the spring 4 is vertical. The spring 4 is compressed between the upper end of the telescopic end 21 and the lower end of the connecting part 12, and the spring 4 applies a downward elastic force to the connecting part 12, causing the connecting part 12 and the ejector pin 11 to sink synchronously. The needle tip plane 13 is pulled by the ejector pin 11 to abut against the bottom of the receiving groove 32, thereby ensuring that the upper side of the needle tip plane 13 is flush with the upper side of the outer cap 3. In the prior art, the ejector pin does not require a spring because it can be completely inside the extension hole, and the upper end has a certain deviation margin within the extension hole. However, in this embodiment, to ensure that the upper side of the pin tip plane 13 is flush with the upper side of the outer cap 3, if there is no spring 4, the lifting mechanism 2 needs to have a more precise vertical stroke margin. Otherwise, the ejector pin 11 may collide with the bottom of the receiving groove 32 and deform due to the vertical downward movement of the pin tip plane 13. Because the spring 4 is provided, the extension and contraction of the spring 4 allows the lifting mechanism 2 to travel downward by a margin within the deformation range of the spring 4, thereby reducing the precision requirements of the lifting mechanism 2 and saving costs.

[0018] As a preferred embodiment, in this case, the needle tip plane portion 13 is cylindrical; the receiving groove 32 is cylindrical; the cylindrical diameter of the receiving groove 32 is the same as the cylindrical diameter of the needle tip plane portion 13; and the lower bottom edge of the cylindrical portion 13 is rounded. The rounded edge of the lower bottom edge prevents the right-angled edge from getting stuck at the upper opening of the receiving groove 32 when the device wobbles. The smooth transition of the rounded edge allows the ejector pin 11 to smoothly embed into the receiving groove 32 even with slight wobbling, thereby ensuring stable operation of the device.

[0019] In summary, this utility model discloses a ejector pin device for image sensor packaging, relating to the field of semiconductor packaging technology. It includes an ejector pin body, a lifting mechanism, and an outer cap. The ejector pin body comprises a plurality of ejector pins and a connecting portion. The ejector pins are fixed to the upper end of the connecting portion. The lifting mechanism includes a telescopic end that can move vertically. The lower end of the connecting portion is fixed to the telescopic end. The upper side of the outer cap has a plurality of protruding holes. The ejector pins pass through the protruding holes and are fixed. The upper end of the ejector pin has a pin tip plane. The upper side of the pin tip plane is flat. A receiving groove is formed around the upper opening of the protruding hole. The pin tip plane can move into the receiving groove. When the pin tip plane is in the receiving groove, the upper side of the pin tip plane is flush with the upper side of the outer cap. The ejector pin device for image sensor packaging provided by this utility model solves the problem in the prior art where the chip may change position when lifted by the ejector pin during chip pick-up, affecting the pick-up of the chip by the pick-up head. This utility model allows for more stable chip lifting.

[0020] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the contents of the present utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A ejector pin device for image sensor packaging, characterized in that, Includes the ejector pin body, lifting mechanism, and outer cap; The ejector pin body includes a plurality of ejector pins and a connecting part; the ejector pins are fixed to the upper end of the connecting part. The lifting mechanism includes a telescopic end that can move vertically; the lower end of the connecting part is fixed to the telescopic end; The upper side of the outer cap has several protruding holes; the ejector pin passes through the protruding holes for fixation; The upper end of the ejector pin is provided with a needle tip plane portion; the upper side surface of the needle tip plane portion is a plane; A receiving groove is provided around the upper opening of the protrusion hole; the needle tip plane can be moved into the receiving groove; when the needle tip plane is in the receiving groove, the upper side of the needle tip plane is flush with the upper side of the outer cap.

2. The ejector pin device for image sensor packaging as described in claim 1, characterized in that, It also includes a spring; the telescopic end and the connecting part are connected by the spring; the spring telescopic direction is vertical.

3. The ejector pin device for image sensor packaging as described in claim 1, characterized in that, The needle tip plane is cylindrical; the receiving groove is cylindrical; the cylindrical diameter of the receiving groove is the same as the cylindrical diameter of the needle tip plane; the bottom edge of the cylindrical bottom surface of the needle tip plane is rounded.

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