Rotary automatic clamping device

CN224805433UActive Publication Date: 2026-09-25ULTRON SEMICON (SHANGHAI) CO LTD
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Patent Information

Application Number
CN202522479988.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-21
Publication Date
2026-09-25
Estimated Expiration
2035-11-21

AI Technical Summary

Technical Problem

采用手动机械夹具实现夹紧,需人工操作完成晶圆的固定与松开,不仅效率低下,且易因操作力度不均导致晶圆受力失衡,造成边缘崩裂或表面划伤;而采用气动或者电机驱动的夹紧机构,虽实现了自动化控制,但需配置额外的动力源及管路系统,导致装置结构复杂、成本升高,且在高速旋转工况下,动力传输部件易受离心力影响,存在密封失效、响应迟滞等问题,影响夹持稳定性

Benefits of technology

[0011]综上所述,本实用新型中通过多个限位件对晶圆进行限位,通过夹紧组件能够将晶圆压紧在限位件的凸环上,避免因离心力增大导致的晶圆偏移或甩出。其次,该夹紧组件无需额外配置动力源,通过托盘旋转产生的离心力即可驱动夹紧组件的摆动块向内摆动对晶圆进行压紧,防止晶圆甩出,而在托盘停止旋转后,摆动块通过自身重力和配重部的作用,能自动复位至竖立状态,减少外部控制环节,提升了操作便捷性与效率。再者,通过限位结构可控制摆动块的压头部下行行程,避免因离心力过大导致夹紧力超限,从而防止压头部对晶圆表面造成挤压损伤。

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Abstract

The utility model discloses a kind of rotary automatic clamping devices, including tray and multiple limit parts, and the edge of tray bottom surface is equipped with multiple clamping assemblies, clamping assembly includes fixed seat and swing block, and fixed seat is provided with mounting groove, and the middle part of swing block is hinged in mounting groove by pivot, and the weight of lower half of swing block is greater than the weight of upper half, and clamping assembly is also equipped with the limit structure for limiting swing amplitude of swing block. In this way, the wafer is positioned by multiple limit parts, and the wafer can be pressed on the convex ring of limit part by clamping assembly, to avoid the wafer from being thrown out due to the increase of centrifugal force. Through limit structure, the swing amplitude of swing block can be limited, to prevent the clamping force from exceeding the safety threshold, and then avoid the wafer from being squeezed and damaged by swing block.
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Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and specifically to a rotary automatic clamping device. Background Technology

[0002] In semiconductor wafer processing and inspection, wafers often need to be rotated. A clamping device is required to stably fix the wafer to ensure processing accuracy and operational safety. Existing technologies employ either manual mechanical clamping or automated driven clamping. Manual mechanical clamping requires manual operation to fix and release the wafer, which is not only inefficient but also prone to uneven force application, leading to edge chipping or surface scratches. While pneumatic or motor-driven clamping mechanisms offer automated control, they require additional power sources and piping systems, resulting in complex structures, increased costs, and, under high-speed rotation, the power transmission components are susceptible to centrifugal force, leading to sealing failures and response delays, affecting clamping stability. Utility Model Content

[0003] Based on this, and in view of the above-mentioned technical problems, the purpose of this utility model is to provide a rotary automatic clamping device.

[0004] The objective of this utility model can be achieved through the following technical solutions:

[0005] A rotary automatic clamping device includes a tray driven to rotate by a motor and multiple limiting members disposed on the edge of the upper surface of the tray. The multiple limiting members are distributed on a circle with the center of the tray as the center. Each limiting member has a raised ring on its outer peripheral surface. The top surface of all the raised rings forms a support surface for supporting a wafer. The diameter of the circle containing the limiting members is slightly larger than the diameter of the wafer. The bottom edge of the tray is provided with multiple clamping assemblies. Each clamping assembly includes a fixed base and a swing block. The fixed base is provided with a mounting groove. The middle part of the swing block is hinged in the mounting groove through a rotating shaft. The weight of the lower half of the swing block is greater than the weight of the upper half. The clamping assembly is also provided with a limiting structure for limiting the swing amplitude of the swing block.

[0006] Using the above technical solution, since the lower half of the swing block is heavier than the upper half, when the tray is stationary, the swing block will stand upright due to the weight of the lower half. At this time, the top of the swing block maintains a distance from the wafer, providing ample space for wafer handling. When the motor drives the tray to rotate, the swing block, hinged to the fixed base, tilts inward under centrifugal force, its tail tilts outward and upward, and its top swings inward and downward, pressing the wafer against the protruding ring of the limiting component, preventing the wafer from being thrown out due to increased centrifugal force. Secondly, the limiting component has protruding rings on its circumference, and the top surfaces of all protruding rings form a supporting surface for the wafer, reducing the contact area and thus minimizing wafer contamination. Furthermore, as the tray rotation speed gradually increases, the clamping force of the swing block on the wafer increases accordingly. By adding a limiting structure to the clamping assembly, the swing amplitude of the swing block can be limited, preventing the clamping force from exceeding the safety threshold and thus avoiding damage to the wafer from being squeezed by the swing block.

[0007] In a specific embodiment of this utility model: the swing block is a PTFE swing block. Using this structure, the PTFE swing block material is lightweight and resistant to acid and alkali corrosion.

[0008] In a specific embodiment of this utility model: the limiting structure includes a counterweight extending outward from the tail of the swing block, and a stop portion located above the counterweight portion within the mounting groove. Thus, by blocking the counterweight portion with the stop portion, the inward swing amplitude of the swing block is limited, preventing excessive clamping force due to excessive centrifugal force, thereby preventing the top of the swing block from causing extrusion damage to the wafer surface.

[0009] In a specific embodiment of this utility model: the swing block, located above the stop portion, also has an outwardly protruding portion. Thus, the protruding portion cooperates with the stop portion to support and limit the swing block, preventing it from tilting excessively outward.

[0010] In a specific embodiment of this utility model: the top of the swing block has a pressure head that extends in the opposite direction to the counterweight.

[0011] In summary, this invention uses multiple limiting components to position the wafer, and the clamping assembly presses the wafer firmly onto the protruding rings of the limiting components, preventing wafer displacement or ejection due to increased centrifugal force. Secondly, this clamping assembly requires no additional power source; the centrifugal force generated by the tray's rotation drives the swing block of the clamping assembly to swing inward, pressing the wafer and preventing it from being ejected. After the tray stops rotating, the swing block automatically returns to an upright position due to its own weight and the counterweight, reducing external control steps and improving operational convenience and efficiency. Furthermore, the limiting structure controls the downward stroke of the pressure head of the swing block, preventing excessive clamping force due to excessive centrifugal force, thus preventing the pressure head from causing crushing damage to the wafer surface. Attached Figure Description

[0012] The present invention will be further described below with reference to the accompanying drawings.

[0013] Figure 1 This is a schematic diagram of the structure of a rotary automatic clamping device according to this utility model;

[0014] Figure 2 This is a schematic diagram of the clamping assembly of this utility model;

[0015] Figure 3 This is a cross-sectional view of the clamping assembly of this utility model. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0017] Please see Figure 1 As shown, this utility model is a rotary automatic clamping device, including a tray 10 driven to rotate by a motor, and multiple limiting members 11 disposed on the edge of the upper surface of the tray 10. The multiple limiting members 11 are distributed on a circle centered on the center of the tray 10. The diameter of the circle containing the limiting members 11 is slightly larger than the diameter of the wafer. Each limiting member 11 has a raised ring 12 on its outer circumferential surface, and the top surface of all the raised rings 12 forms a support surface for supporting the wafer. An external robotic arm places the wafer onto the raised rings of the limiting members on the tray. On the one hand, the limiting members can limit the wafer's position; on the other hand, the wafer is located on the support surface formed by the raised rings, which reduces the contact area of ​​the wafer, thereby reducing contamination.

[0018] Combination Figure 2 and Figure 3 As shown, in this embodiment, the bottom edge of the tray 10 is provided with multiple clamping assemblies 20. Each clamping assembly 20 includes a fixed base 21 and a swing block 22. A mounting groove 23 is provided on the fixed base 21. The middle of the swing block 22 is hinged within the mounting groove 23 via a pivot 24. The lower half of the swing block 22 has a greater weight than the upper half.

[0019] Thus, the middle part of the swing block 22 is hinged to the mounting base via the pivot 24. When the tray is stationary, because the weight of the lower half of the swing block is greater than that of the upper half, the swing block 21 is in an upright position. The top of this swing block maintains a distance from the wafer, providing ample space for wafer handling operations. This facilitates the stable placement of the wafer on the support surface formed by multiple convex rings, or the removal of the wafer from the support surface. When the tray 10 is rotated by a motor, the swing block 22 tilts inward under centrifugal force, while the tail tilts outward and upward, and the top swings inward and downward accordingly. When the tray rotation speed exceeds 140 r / min, the pressure head 221 contacts the wafer surface and applies pressure, pressing the wafer against the support surface. This prevents the wafer from being thrown out due to its increasing centrifugal force. Furthermore, this clamping assembly does not require an additional power source; it relies solely on the centrifugal force generated by the tray rotation to drive the swing block 22 to press the wafer, preventing it from being thrown out. When the tray stops rotating and the centrifugal force disappears, the swing block returns to an upright position under its own gravity. This reduces external control steps and improves ease of operation and efficiency.

[0020] In this embodiment, the oscillating block is a PTFE oscillating block. This structure makes the PTFE oscillating block material lightweight and resistant to acid and alkali corrosion.

[0021] In this embodiment, the clamping assembly 20 is also provided with a limiting structure to restrict the swing amplitude of the swing block 22. As the tray rotation speed gradually increases, the clamping force of the swing block on the wafer will increase accordingly. Thus, by adding a limiting structure to the clamping assembly, the swing amplitude of the swing block can be limited, preventing the clamping force from exceeding the safety threshold, thereby avoiding damage to the wafer caused by the swing block.

[0022] The limiting structure includes a counterweight 222 extending outward from the tail of the swing block 22, and a stop 231 located above the counterweight 222 within the mounting groove 23. The top of the swing block 22 has a pressure head 221 extending in the opposite direction to the counterweight 222. Thus, by blocking the counterweight with the stop, the inward tilt angle of the swing block is limited, thereby controlling the downward stroke of the pressure head and preventing damage to the wafer surface due to excessive clamping force. A protrusion 223 protrudes outward from the center of the swing block 22, above the stop 231. The protrusion 223 cooperates with the stop 231 to support and limit the swing block, preventing it from tilting excessively outward.

[0023] In summary, this invention uses multiple limiting components to position the wafer, and the clamping assembly presses the wafer firmly onto the protruding rings of the limiting components, preventing wafer displacement or ejection due to increased centrifugal force. Secondly, this clamping assembly requires no additional power source; the centrifugal force generated by the tray's rotation drives the swing block of the clamping assembly to swing inward, pressing the wafer and preventing it from being ejected. After the tray stops rotating, the swing block automatically returns to an upright position due to its own weight and the counterweight, reducing external control steps and improving operational convenience and efficiency. Furthermore, the limiting structure controls the downward stroke of the pressure head of the swing block, preventing excessive clamping force due to excessive centrifugal force, thus preventing the pressure head from causing crushing damage to the wafer surface.

[0024] The above description provides a detailed account of one embodiment of the present invention. However, this description is merely a preferred embodiment and should not be construed as limiting the scope of the present invention. All equivalent variations and improvements made within the scope of the claims of the present invention should still fall within the patent coverage of the present invention.

Claims

1. A rotary automatic clamping device, comprising a tray driven to rotate by a motor, and a plurality of limiting members disposed on the edge of the upper surface of the tray, the plurality of limiting members being distributed on a circle centered on the center of the tray, wherein each limiting member has a raised ring on its outer peripheral surface, the top surface of all the raised rings forming a support surface for supporting a wafer, and the diameter of the circle containing the limiting members is slightly larger than the diameter of the wafer, characterized in that, The bottom edge of the tray is provided with multiple clamping components. Each clamping component includes a fixed base and a swing block. The fixed base is provided with a mounting groove. The middle part of the swing block is hinged in the mounting groove via a pivot. The weight of the lower half of the swing block is greater than the weight of the upper half. The clamping component is also provided with a limiting structure for limiting the swing amplitude of the swing block.

2. The rotary automatic clamping device according to claim 1, characterized in that, The swing block is made of PTFE.

3. The rotary automatic clamping device according to claim 2, characterized in that, The limiting structure includes an outwardly extending counterweight portion located at the tail of the swing block, and a stop portion located above the counterweight portion within the mounting groove.

4. The rotary automatic clamping device according to claim 3, characterized in that, The swing block, located above the stop, also has an outwardly protruding portion.

5. The rotary automatic clamping device according to claim 3, characterized in that, The top of the swing block has a pressure head that extends in the opposite direction to the counterweight.