Semiconductor device wafer fixing device

Abstract

The utility model provides a kind of semiconductor device wafer fixing device, it is related to semiconductor wafer technical field, including support platform, the inner wall of support platform is provided with driving motor, the output of driving motor is fixedly connected with screw rod, the top of support platform is fixedly connected with top cover, the top of top cover is equipped with the mouth of arrangement, the bottom of mouth of arrangement is provided with support structure.The utility model, by setting driving motor, for driving screw rod rotation, the outer surface of screw rod and the inner wall screw connection of moving cylinder, to mobilize moving cylinder up and down, the limiting rod of setting, prevent when screw rod transmission will moving cylinder drive rotation and lose the effect of moving cylinder up and down, the contact surface of setting rubber layer can increase with suction cylinder, to more easily make the effect of vacuum adsorption in suction cup, setting moving seat conveniently drives baffle to move, to be able to according to the diameter size of wafer adjustment baffle position to the edge of wafer is supported.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer technology, and in particular to a semiconductor device wafer fixing device. Background Technology

[0002] In existing technologies, such as the Chinese patent CN217881449U "A wafer fixing device for semiconductor testing," a disc is included. A clamping mechanism is uniformly mounted in a ring on the outer surface of the disc. The clamping mechanism includes a fixing block and a connecting rod, with the connecting rod fixedly connected to the inner surface of the fixing block. This invention, by incorporating a movable screw and a sliding disc, allows the movable screw sleeve to move on its surface when the movable screw sleeve moves. When the movable screw sleeve moves, the sliding disc moves inside the fixing sleeve, generating suction on the adsorption plate. This suction force can then adsorb the wafer, preventing it from being subjected to excessive suction. Furthermore, the device incorporates a torsion spring and rotating clamping rods. The torsion spring's own elasticity, along with multiple sets of rotating clamping rods, abuts against the wafer surface, preventing the wafer from shifting or deviating during testing, thus avoiding inaccurate detection.

[0003] Although the device achieves wafer edge positioning, the screw sleeve and sliding disk lack positioning components. When the lead screw is driven, it may cause the screw sleeve to rotate, thus losing the transmission effect. In addition, the rotating clamping rod will directly squeeze the wafer edge under the rebound of the torsion spring. The wafer is thin, and the larger the wafer diameter, the greater the rebound force, which may damage the wafer. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies. However, the screw sleeve and sliding disc in the invention lack positioning components. When the lead screw is driven, it may cause the screw sleeve to rotate, thus losing the transmission effect. In addition, the rotating clamping rod will directly squeeze the edge of the wafer under the rebound of the torsion spring. The wafer is thin and the larger the wafer diameter, the greater the rebound force, which may damage the wafer. This invention provides a semiconductor device wafer fixing device.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor device wafer fixing device, comprising a support platform, a drive motor disposed on the inner wall of the support platform, a lead screw fixedly connected to the output end of the drive motor, a top cover fixedly connected to the top of the support platform, a mounting opening provided on the top of the top cover, a support structure disposed at the bottom of the mounting opening, the support structure comprising a movable cylinder, two limiting rods disposed on the outer surface of the movable cylinder, an air suction cylinder disposed on the top of the movable cylinder, the top of the air suction cylinder being fixedly connected to the inner wall of the mounting opening, a suction cup fixedly connected to the top of the air suction cylinder, a rubber layer disposed at the bottom of the suction cup, and the bottom of the rubber layer being fixedly connected to the top of the movable cylinder.

[0006] In a preferred embodiment, the inner wall of the support platform is provided with a limiting groove, and the inner wall of the limiting groove and the inner wall of the limiting rod are slidably connected.

[0007] In a preferred embodiment, the outer surface of the top cover is provided with a sliding groove, and a positioning component is slidably connected to the inner wall of the sliding groove.

[0008] In a preferred embodiment, the positioning component includes a movable base, the outer surface of which is slidably connected to the inner wall of the sliding groove.

[0009] In a preferred embodiment, the outer surface of the movable base is threaded with positioning bolts, and a connecting plate is fixedly connected to one side of the movable base.

[0010] In a preferred embodiment, a baffle is fixedly connected to one side of the connecting plate, and an expansion groove is provided on the inner wall of the baffle, with a support member provided inside the expansion groove.

[0011] In a preferred embodiment, the support includes a spring, one end of which is fixedly connected to the inner wall of the telescopic groove, the other end of which is fixedly connected to a support plate, and one side of the support plate is fixedly connected to an arc-shaped soft pad.

[0012] Compared with the prior art, the advantages and positive effects of this utility model are as follows: This invention features a drive motor to rotate a lead screw, with the outer surface of the lead screw threadedly connected to the inner wall of the moving cylinder, thereby causing the moving cylinder to move up and down. A limiting rod prevents the moving cylinder from rotating during lead screw transmission, thus preventing it from losing its up-and-down movement. A rubber layer increases the contact area with the suction cylinder, making it easier to achieve vacuum adsorption in the suction cup. A moving base facilitates the movement of a baffle, allowing the position of the baffle to be adjusted according to the wafer diameter to support the wafer edge. Positioning bolts are included to fix the position of the moving base. Attached Figure Description

[0013] Figure 1 A top perspective view of a semiconductor device wafer fixing device provided by this utility model.

[0014] Figure 2 A bottom-view perspective view of a semiconductor device wafer fixing device provided by this utility model.

[0015] Figure 3 A cross-sectional perspective view of a semiconductor device wafer fixing device provided by this utility model.

[0016] Figure 4 A three-dimensional structural view of a positioning component of a semiconductor device wafer fixing device provided by this utility model.

[0017] Legend: 1. Support platform; 2. Drive motor; 3. Lead screw; 4. Top cover; 5. Support structure; 6. Positioning assembly; 5. Support structure; 51. Moving cylinder; 52. Limiting rod; 53. Air extraction cylinder; 54. Suction cup; 55. Rubber layer; 6. Positioning component; 61. Movable seat; 62. Positioning bolt; 63. Connecting plate; 64. Baffle; 65. Support component; 65. Support component; 651. Spring; 652. Support plate; 653. Curved cushion. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0019] Example 1 like Figure 1-4As shown, this utility model provides a technical solution: a semiconductor device wafer fixing device, including a support platform 1, a drive motor 2 disposed on the inner wall of the support platform 1, a lead screw 3 fixedly connected to the output end of the drive motor 2, a top cover 4 fixedly connected to the top of the support platform 1, a mounting opening on the top of the top cover 4, a support structure 5 disposed at the bottom of the mounting opening, the support structure 5 including a movable cylinder 51, two limiting rods 52 disposed on the outer surface of the movable cylinder 51, an air extraction cylinder 53 disposed on the top of the movable cylinder 51, the top of the air extraction cylinder 53 being fixedly connected to the inner wall of the mounting opening, and a lead screw 3 fixedly connected to the top of the air extraction cylinder 53. The suction cup 54 has a rubber layer 55 at its bottom, and the bottom of the rubber layer 55 is fixedly connected to the top of the moving cylinder 51. The inner wall of the support platform 1 has a limiting groove, and the inner wall of the limiting groove is slidably connected to the inner wall of the limiting rod 52. The outer surface of the top cover 4 has a sliding groove, and the inner wall of the sliding groove is slidably connected to a positioning component 6. The positioning component 6 includes a moving seat 61, the outer surface of the moving seat 61 is slidably connected to the inner wall of the sliding groove, the outer surface of the moving seat 61 is threaded with a positioning bolt 62, a connecting plate 63 is fixedly connected to one side of the moving seat 61, and a baffle 64 is fixedly connected to one side of the connecting plate 63.

[0020] In this embodiment, a drive motor 2 is provided to drive the lead screw 3 to rotate. The outer surface of the lead screw 3 is threadedly connected to the inner wall of the moving cylinder 51, thereby adjusting the moving cylinder 51 to move up and down. A limiting rod 52 is provided to prevent the moving cylinder 51 from being rotated when the lead screw 3 is driven, thus losing the effect of moving the moving cylinder 51 up and down. A rubber layer 55 is provided to increase the contact surface with the vacuum cylinder 53, thereby making it easier to achieve the vacuum adsorption effect in the suction cup 54. A moving seat 61 is provided to facilitate the movement of the baffle 64, thereby allowing the position of the baffle 64 to be adjusted according to the diameter of the wafer to support the edge of the wafer. A positioning bolt 62 is provided to fix the position of the moving seat 61.

[0021] Example 2 like Figure 4 As shown, the inner wall of the baffle 64 is provided with a telescopic groove, and a support member 65 is provided inside the telescopic groove. The support member 65 includes a spring 651. One end of the spring 651 is fixedly connected to the inner wall of the telescopic groove, and the other end of the spring 651 is fixedly connected to a support plate 652. An arc-shaped soft pad 653 is fixedly connected to one side of the support plate 652.

[0022] In this embodiment, the telescopic groove is provided to accommodate the extension and retraction of the spring 651, and the support plate 652 also slides on its inner wall, so that the inner side of the baffle 64 can provide buffered support for the wafer edge to prevent damage to the wafer. The arc-shaped soft pad 653 further increases the buffering and protection effect of the inner side of the baffle 64.

[0023] Working principle: like Figure 1-4As shown, in actual use, the bottom of the wafer is first brought into contact with the suction cup 54 by the suction cup 54. Then, the drive motor 2 is started, which drives the lead screw 3 to rotate. Since the lead screw 3 is threadedly connected to the inner wall of the moving cylinder 51 and the limiting rod 52 slides in the limiting groove on the inner wall of the support platform 1, the moving cylinder 51 will move downward in the vertical direction. The lower rubber layer 55 creates a negative pressure in the suction cylinder 53 and the suction cup 54, thereby stably adsorbing the wafer. Then, according to the diameter of the wafer, the sliding seat 61 is slid to move the baffle 64 to the edge of the wafer. The positioning bolt 62 is tightened to fix the moving seat 61. At this time, the support plate 652 is pressed against the edge of the wafer under the elastic action of the spring 651, and the arc-shaped soft pad 653 is in direct contact with the wafer, which can not only provide auxiliary support for the wafer, but also avoid damage to the wafer caused by rigid contact.

[0024] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A semiconductor device wafer fixing device, comprising a support stage (1), characterized in that: The inner wall of the support platform (1) is provided with a drive motor (2), and the output end of the drive motor (2) is fixedly connected with a lead screw (3). The top of the support platform (1) is fixedly connected with a top cover (4). The top of the top cover (4) is provided with a placement opening. The bottom of the placement opening is provided with a support structure (5). The support structure (5) includes a moving cylinder (51). The outer surface of the moving cylinder (51) is provided with two limiting rods (52). The top of the moving cylinder (51) is provided with an air suction cylinder (53). The top of the air suction cylinder (53) is fixedly connected to the inner wall of the placement opening. The top of the air suction cylinder (53) is fixedly connected with a suction cup (54). The bottom of the suction cup (54) is provided with a rubber layer (55). The bottom of the rubber layer (55) is fixedly connected to the top of the moving cylinder (51).

2. The semiconductor device wafer fixing device according to claim 1, characterized in that: The inner wall of the support platform (1) is provided with a limiting groove, and the inner wall of the limiting groove and the inner wall of the limiting rod (52) are slidably connected.

3. The semiconductor device wafer fixing device according to claim 1, characterized in that: The outer surface of the top cover (4) is provided with a sliding groove, and the inner wall of the sliding groove is slidably connected with a positioning component (6).

4. A semiconductor device wafer fixing device according to claim 3, characterized in that: The positioning component (6) includes a movable seat (61), the outer surface of which is slidably connected to the inner wall of the sliding groove.

5. A semiconductor device wafer fixing device according to claim 4, characterized in that: The outer surface of the movable seat (61) is threaded with a positioning bolt (62), and a connecting plate (63) is fixedly connected to one side of the movable seat (61).

6. The semiconductor device wafer fixing device according to claim 5, characterized in that: A baffle (64) is fixedly connected to one side of the connecting plate (63). The inner wall of the baffle (64) is provided with a telescopic groove, and a support member (65) is provided inside the telescopic groove.

7. A semiconductor device wafer fixing device according to claim 6, characterized in that: The support member (65) includes a spring (651), one end of which is fixedly connected to the inner wall of the telescopic groove, and the other end of which is fixedly connected to a support plate (652). An arc-shaped soft pad (653) is fixedly connected to one side of the support plate (652).

Images