Wafer chuck

Abstract

The utility model relates to a wafer chuck which comprises a wafer carrier plate, a lifting driving part arranged on the wafer carrier plate, a floating disc arranged on the output end of the lifting driving part, at least two flexible compression joints and a plurality of floating pins arranged on the floating disc, the flexible compression joints are arranged above the wafer carrier plate and the floating pins, the bottom surface of the flexible compression joints is arranged opposite to the top surface of the wafer, the top surfaces of the wafer carrier plate and the floating pins are respectively arranged opposite to the bottom surface of the wafer, and the moving path of the top surface of the floating pin passes through the top surface of the wafer carrier plate. The utility model has the advantages of avoiding wafer warping deformation and ensuring clamping precision.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor manufacturing, and in particular to a wafer chuck. Background Technology

[0002] The key to AR waveguide testing lies in using machine vision systems to accurately simulate the position and movement of the human eye, evaluating the imaging quality and other key performance indicators of the waveguide sheet in an automated, objective, and quantitative manner, thereby ensuring the user experience of the final AR glasses. However, most current mainstream testing methods rely on manual or semi-automatic devices, and the wafer fixing methods are relatively outdated, typically using only simple slots and manual clamping blocks, making it difficult to achieve fully autonomous positioning. If only mechanical friction and edge restraint are relied upon, the wafer is prone to micro-displacement during dynamic testing. When different waveguide areas of the same wafer are tested multiple times, this displacement will cause error accumulation, seriously affecting the accuracy of the test results.

[0003] Due to the unique structure of AR waveguide wafers, both sides of the core waveguide region must be kept separate, with only the edge areas suitable for clamping. Mainstream non-contact clamping solutions, such as electrostatic disks or Bernoulli chucks, while not in contact with the wafer, are not ideal due to their high cost, heavy maintenance, and inability to meet the dynamic testing requirements of wafer rotation. Theoretically, using a vacuum chuck to only grip the edge areas, maintaining no contact in the center, is a feasible alternative. However, in practice, the hollow area of ​​the vacuum chuck will continuously evacuate due to leakage, creating a low-pressure area below the wafer. This pressure difference between the upper and lower surfaces of the wafer significantly exacerbates warping. This substantial deformation alters the optical path transmission characteristics within the waveguide structure, ultimately leading to inaccurate test results. Utility Model Content

[0004] The present invention aims to address the aforementioned shortcomings in the prior art by providing a wafer chuck that has the advantages of preventing wafer warping and ensuring clamping accuracy.

[0005] The above-mentioned objective of this utility model is achieved through the following technical solution: A wafer chuck includes a wafer carrier, a lifting drive disposed on the wafer carrier, a floating disk disposed at the output end of the lifting drive, and at least two flexible pressing portions and a plurality of floating pins disposed on the floating disk. The flexible pressing portions are arranged above the wafer carrier and the floating pins, with the bottom surface of the flexible pressing portions arranged opposite the top surface of the wafer. The top surfaces of the wafer carrier and the floating pins are respectively arranged opposite the bottom surface of the wafer. The movement path of the top surface of the floating pins passes through the top surface of the wafer carrier.

[0006] By adopting the above technical solution, during the loading stage, the lifting drive component moves the flexible pressing part and the floating pins upward until the top surface of the floating pins exceeds the top surface of the wafer carrier. This allows the wafers to be pre-placed on these floating pins manually or by a robotic arm. The design of multiple floating pins also provides more support points for wafer fixation. During the descent of the floating pins by the lifting drive component, the wafer is flexibly transferred to the surface of the wafer carrier. After this, the floating pins detach from the bottom surface of the wafer, while the flexible pressing part continues to press down until it touches the top surface of the wafer, completing the clamping. Conversely, the lifting drive component moves the floating pins downward... The flexible pressing part and the floating pin rise to facilitate wafer unloading. During this process, the flexible pressing part can flexibly adjust to the slight unevenness of the wafer surface, ensuring that the wafer is not damaged during pressing. Moreover, since the flexible pressing part only acts on the top surface of the wafer, it does not create a low-pressure area under the wafer like a vacuum chuck, thus avoiding wafer warping and deformation caused by air pressure difference. This provides a reliable, stable, and non-damaging fixing method for dynamic wafer inspection, which can significantly improve the accuracy and reliability of wafer inspection results.

[0007] The present invention is further configured such that: at least two strip-shaped support portions are protruding on the wafer carrier, the strip-shaped support portions and the flexible pressing portions are arranged in a one-to-one correspondence, and a clamping gap is formed between the strip-shaped support portions and the flexible pressing portions for the wafer edge to pass through.

[0008] By adopting the above technical solution, compared with the multi-point support of the floating pin, the flexible pressing part support can distribute the load, reduce the risk of wafer warping caused by local stress, reserve space for the robotic arm to load between two adjacent strip support parts, and the notch design can also avoid the interference of the full ring support structure on the movement path of the robotic arm fork.

[0009] The present invention is further configured such that the projections of the strip-shaped support portion and the flexible pressing portion on the horizontal plane overlap and form an arc shape.

[0010] By adopting the above technical solution, the arc-shaped projection overlap design can better fit the edge contour of the wafer, making the contact between the flexible pressing part and the strip support part and the edge of the wafer more uniform. This helps to distribute the pressure evenly on the edge of the wafer during the clamping process, avoiding cracks or damage to the edge of the wafer due to excessive local pressure.

[0011] The present invention is further configured such that a feeding gap is reserved between two adjacent floating pins.

[0012] By adopting the above technical solution, the reserved loading gap provides sufficient space for the loading operation of the robotic arm, enabling the robotic arm to place the wafers in the appropriate position more flexibly and smoothly. This avoids collisions between the robotic arm and the floating pin during operation, reducing the risk of damage to the wafers and equipment.

[0013] The present invention is further configured such that the at least two strip-shaped support portions, the at least two flexible pressing portions, and the multiple floating pins are uniformly distributed relative to the circumference of the wafer.

[0014] By adopting the above technical solution, the circumferentially uniformly distributed design can make the support force and pressure on the wafer on the chuck more balanced.

[0015] The present invention is further configured such that: at least two lifting drive components are provided and are evenly distributed along the circumference of the floating disk.

[0016] By adopting the above technical solution, a more stable and balanced driving force can be provided for the floating disk, which can ensure that the floating disk remains stable during the rising and falling process and avoid tilting or shaking. This is conducive to ensuring accurate clamping and positioning of wafers and preventing wafer position deviation from affecting the accuracy of subsequent processing or inspection.

[0017] The present invention is further configured such that a floating joint is provided between the output end of the lifting drive component and the floating disk.

[0018] By adopting the above technical solution, the floating joint can effectively compensate for possible installation errors and positional deviations between the lifting drive component and the floating plate, so that the driving force of the lifting drive component can be transmitted to the floating plate more smoothly. Even if there is some inaccuracy in the installation process, the floating joint can be fine-tuned to avoid stress concentration and component damage caused by rigid connection. At the same time, the floating joint can also buffer the impact force generated during the lifting process to a certain extent, reduce the vibration impact on the equipment, and further improve the stability and reliability of the floating plate movement.

[0019] The present invention is further configured such that: at least two sets of lifting guide columns are provided on the floating disk, the lifting guide columns are slidably inserted on the wafer carrier disk through linear bearings, each set of lifting guide columns is provided with a pressure plate, and the flexible pressing part is provided on the bottom surface of the pressure plate.

[0020] By adopting the above technical solution, the cooperation between the lifting guide column and the linear bearing can provide precise guidance for the lifting and lowering movement of the floating disk, ensuring that the floating disk moves in a straight line in the vertical direction, and further improving the stability and accuracy of the floating disk's movement.

[0021] The present invention is further configured to include a rotation drive, wherein the wafer carrier is disposed at the output end of the rotation drive.

[0022] By adopting the above technical solution, the rotary drive can drive the wafer carrier to rotate, so that the wafer placed on the wafer carrier can perform circumferential motion according to actual needs. This rotation function provides more operational possibilities for wafers in processing, inspection and other processes. For example, it can achieve uniform processing of different positions of the wafer and avoid affecting the overall quality of the wafer due to uneven local processing.

[0023] The present invention is further configured to include a slip ring connector, wherein the fixed end and the rotating end of the slip ring connector are respectively disposed on the rotary drive and the wafer carrier, and the output end of the slip ring connector is connected to the input end of the lifting drive.

[0024] By adopting the above technical solution, the slip ring connector can achieve a stable electrical connection between the rotating part and the stationary part during the process of the rotating drive component driving the wafer carrier to rotate. This allows the lifting drive component to continuously and stably obtain power supply and control signals, and ensures that the lifting drive component can work normally even when the wafer carrier is rotating.

[0025] In summary, the beneficial technical effects of this utility model are as follows: This wafer chuck, through its unique structural design, achieves reliable clamping and stable driving of wafers. In terms of clamping, the cooperation between the flexible pressing part and the strip-shaped support part not only avoids wafer warping and deformation but also ensures clamping accuracy, providing a stable foundation for dynamic wafer inspection. The multiple floating pins not only facilitate loading but also increase the support points for wafer fixation, improving clamping stability. In terms of driving, the reasonable distribution of the lifting drive components and the application of the floating joint ensure the smooth movement of the floating disk and the effective transmission of driving force. The rotation drive component and the sliding... The ring connector allows the wafer to rotate as needed, ensuring the normal operation of the lifting drive during rotation. This innovative design enables the wafer chuck of this invention to effectively solve the problems existing in the prior art, improve the accuracy and reliability of wafer inspection, and reduce the risk of errors and damage caused by clamping and driving issues. At the same time, its structural design also considers the convenience and flexibility in actual operation, such as reserving a loading gap and avoiding interference with the movement path of the robotic arm, providing a more efficient and stable solution for wafer processing and inspection, with significant economic benefits and market application prospects. Attached Figure Description

[0026] Figure 1 This is a three-dimensional structural diagram of the wafer chuck of this utility model.

[0027] Figure 2This is a schematic diagram of the main structure of the wafer chuck of this utility model.

[0028] In the figure, 1 is the rotary drive component; 2 is the slip ring connector; 3 is the wafer carrier; 4 is the strip support; 5 is the lifting drive component; 51 is the floating joint; 6 is the floating disk; 7 is the flexible pressing part; 8 is the floating pin; 9 is the lifting guide column; 91 is the linear bearing; and 10 is the pressure plate. Detailed Implementation

[0029] To make the technical means, creative features, objectives and effects of this utility model clearer and easier to understand, the present utility model will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0030] Reference Figure 1 This utility model discloses a wafer chuck, comprising a rotary drive 1, a slip ring connector 2, a wafer carrier 3 disposed at the output end of the rotary drive 1, two strip-shaped support portions 4 disposed on the top surface of the wafer carrier 3, two lifting drive components 5 disposed at the bottom of the wafer carrier 3, a floating disk 6 disposed at the output end of the lifting drive component 5, and two flexible pressing portions 7 and two pairs of floating pins 8 disposed on the floating disk 6. The two strip-shaped support portions 4, the two flexible pressing portions 7, and the two pairs of floating pins 8 are uniformly distributed circumferentially relative to the wafer, and the two lifting drive components 5 are uniformly distributed circumferentially along the floating disk 6.

[0031] Reference Figure 2 The rotary drive 1 is configured as a torque motor (external rotor), the slip ring connector 2 is configured as a pneumatic slip ring, and the lifting drive 5 is configured as a cylinder. The fixed end and rotating end of the slip ring connector 2 are respectively located on the rotary drive 1 and the wafer carrier 3, and the output end of the slip ring connector 2 is connected to the input end of the lifting drive 5. The slip ring connector 2 enables a stable electrical connection between the rotating part and the stationary part during the rotation of the wafer carrier 3 driven by the rotary drive 1. This allows the lifting drive 5 to continuously and stably receive power supply and control signals, ensuring normal operation of the lifting drive 5 even when the wafer carrier 3 is rotating.

[0032] The rotary drive 1 enables the wafer carrier 3 to rotate, allowing the wafer placed on the wafer carrier 3 to move in a circular motion according to actual needs. This rotation function provides more operational possibilities for the wafer during processing and inspection. For example, it can achieve uniform processing of different positions on the wafer, avoiding the impact of uneven processing on the overall quality of the wafer. The slip ring connector 2 can achieve a stable electrical connection between the rotating part and the stationary part while the rotary drive 1 drives the wafer carrier 3 to rotate. This allows the lifting drive 5 to continuously and stably receive power supply and control signals, ensuring the normal operation of the lifting drive 5 even when the wafer carrier 3 is rotating.

[0033] The flexible pressing part 7 is arranged above the wafer carrier 3 and the floating pin 8. The strip support part 4 and the flexible pressing part 7 are arranged in a one-to-one correspondence. The projections of the strip support part 4 and the flexible pressing part 7 on the horizontal plane overlap and form an arc shape. A clamping gap is formed between the strip support part 4 and the flexible pressing part 7 for the wafer edge to pass through. The bottom surface of the flexible pressing part 7 is arranged opposite to the top surface of the wafer, and the top surfaces of the strip support part 4 and the floating pin 8 are arranged opposite to the bottom surface of the wafer, respectively. The moving path of the top surface of the floating pin 8 passes through the top surface of the strip support part 4, and a loading gap is reserved between two adjacent floating pins 8.

[0034] Compared to the multi-point support of the floating pin 8, the flexible pressing part 7 can distribute the load, reducing the risk of wafer warping caused by local stress. Space can be reserved between adjacent strip support parts 4 for the robotic arm's loading operation, and the notch design avoids interference from the full-ring support structure on the robotic arm's fork's movement path. The arc-shaped projection overlap design better conforms to the wafer's edge contour, making the contact between the flexible pressing part 7 and the strip support part 4 and the wafer edge more uniform. This helps to evenly distribute pressure on the wafer edge during clamping, preventing cracks or damage caused by excessive local pressure. The reserved loading gap provides ample space for the robotic arm's loading operation, allowing it to place the wafer more flexibly and smoothly into the appropriate position. This avoids collisions between the robotic arm and the floating pin 8 during operation, reducing the risk of damage to the wafer and equipment.

[0035] A floating connector 51 is provided between the output end of the lifting drive 5 and the floating disk 6. Two sets of lifting guide columns 9 are provided on the floating disk 6. The lifting guide columns 9 slide through the wafer carrier 3 via linear bearings 91. Each set of lifting guide columns 9 is provided with a pressure plate 10, and a flexible pressing part 7 is provided on the bottom surface of the pressure plate 10.

[0036] The floating joint 51 effectively compensates for potential installation errors and positional deviations between the lifting drive component 5 and the floating disk 6, allowing the driving force of the lifting drive component 5 to be transmitted more smoothly to the floating disk 6. Even if there is some inaccuracy during installation, the floating joint 51 can be fine-tuned to avoid stress concentration and component damage caused by rigid connections. Simultaneously, the floating joint 51 can also buffer the impact force generated during lifting to a certain extent, reducing the vibration impact on the equipment and further improving the stability and reliability of the floating disk 6's movement. The cooperation between the lifting guide column 9 and the linear bearing 91 provides precise guidance for the lifting movement of the floating disk 6, ensuring that the floating disk 6 moves linearly in the vertical direction, further improving the smoothness and accuracy of the floating disk 6's movement.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A wafer chuck, characterized in that: The device includes a wafer carrier (3), a lifting drive (5) disposed on the wafer carrier (3), a floating disk (6) disposed at the output end of the lifting drive (5), and at least two flexible pressing parts (7) and a plurality of floating pins (8) disposed on the floating disk (6). The flexible pressing parts (7) are arranged above the wafer carrier (3) and the floating pins (8). The bottom surface of the flexible pressing parts (7) is arranged relative to the top surface of the wafer. The top surfaces of the wafer carrier (3) and the floating pins (8) are arranged relative to the bottom surface of the wafer. The moving path of the top surface of the floating pins (8) passes through the top surface of the wafer carrier (3).

2. A wafer chuck according to claim 1, characterized in that: At least two strip-shaped support portions (4) are provided on the wafer carrier disk (3). The strip-shaped support portions (4) and the flexible pressing portions (7) are arranged in a one-to-one correspondence. A clamping gap is formed between the strip-shaped support portions (4) and the flexible pressing portions (7) for the wafer edge to pass through.

3. A wafer chuck according to claim 2, characterized in that: The projections of the strip support (4) and the flexible pressing part (7) on the horizontal plane overlap and form an arc shape.

4. A wafer chuck according to claim 3, characterized in that: A feeding gap is reserved between two adjacent floating pins (8).

5. A wafer chuck according to claim 4, characterized in that: The at least two strip-shaped support portions (4), at least two flexible pressing portions (7), and multiple floating pins (8) are uniformly distributed relative to the circumference of the wafer.

6. A wafer chuck according to claim 1, characterized in that: The lifting drive component (5) is provided in at least two parts and is evenly distributed along the circumference of the floating disk (6).

7. A wafer chuck according to claim 6, characterized in that: A floating joint (51) is provided between the output end of the lifting drive (5) and the floating disk (6).

8. A wafer chuck according to claim 1, characterized in that: At least two sets of lifting guide columns (9) are provided on the floating disk (6). The lifting guide columns (9) are slidably inserted on the wafer carrier disk (3) through linear bearings (91). Each set of lifting guide columns (9) is provided with a pressure plate (10). The flexible pressing part (7) is provided on the bottom surface of the pressure plate (10).

9. A wafer chuck according to claim 1, characterized in that: It also includes a rotation drive (1), and the wafer carrier (3) is disposed at the output end of the rotation drive (1).

10. A wafer chuck according to claim 9, characterized in that: It also includes a slip ring connector (2), the fixed end and the rotating end of which are respectively disposed on the rotating drive (1) and the wafer carrier (3), and the output end of the slip ring connector (2) is connected to the input end of the lifting drive (5).

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