Chip wafer test handler

Abstract

The utility model relates to wafer testing equipment technical field, specifically disclose a chip wafer testing sorting machine, include: sorting machine body, the sorting machine body is provided with the placing table through the mounting panel, the placing table is fixedly arranged at the mounting panel top through a plurality of support rods, the placing table top is equipped with the placing groove, the placing table inside is equipped with the installation cavity, the installation cavity is connected with fixed assembly, the bottom of placing groove is equipped with the arc slot, the arc slot inside is equipped with the ejection mechanism, the utility model discloses the ejection mechanism that sets up, can move the moving plate through electric push rod drive and move upwards after testing, and then through connecting rod drive movable block and the rising of the jacking rod, make the rubber top block of connecting block top smoothly lift up wafer from the placing table bottom, effectively avoid the surface scratch or structural damage that traditional mode possibly caused from the side to push wafer, greatly promote the security and reliability of the slice operation.

Description

Technical Field

[0001] This utility model belongs to the technical field of wafer testing equipment, specifically relating to a chip wafer testing and sorting machine. Background Technology

[0002] Chip wafer testing and sorting machines (also known as probe stations) are key equipment in the back-end processes of semiconductor manufacturing. They perform electrical tests and sorting on each chip at the wafer level, thereby screening out qualified products before packaging. This is crucial for controlling costs and improving yield.

[0003] Existing wafer testing and sorting machines mainly consist of a wafer stage and a probe card. The working process is as follows: the wafer stage adsorbs and fixes the wafer through vacuum adsorption holes distributed on its surface, and then drives the wafer to move so that the chips on the wafer come into contact with the probes on the probe card in sequence. The testing machine applies test signals to the chips through the probe card and collects the response to complete the performance testing and sorting.

[0004] During testing, to ensure positioning accuracy and testing stability, the wafer must remain in close contact with the substrate surface. To resist acceleration and vibration during testing, the vacuum suction force is usually set relatively high, resulting in a very strong adhesion between the wafer and the substrate surface. After testing, wafer removal is mainly done manually or by a robotic arm. However, when the wafer is firmly held in place for the above reasons, the end effector of the robotic arm may encounter resistance when picking up the wafer. To solve this problem, operators or automated systems sometimes use an auxiliary method of applying a pushing force from the side of the wafer to break the vacuum seal or overcome the adhesion force. Applying a lateral pushing force may cause relative sliding friction between the wafer and the substrate surface, thereby scratching the thin film material on the back of the wafer or the fine structure on the front, resulting in chip scrap and affecting its use. Utility Model Content

[0005] The purpose of this invention is to provide a chip wafer testing and sorting machine to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution:

[0007] A chip wafer testing and sorting machine includes: a sorting machine body, a placement platform provided on the sorting machine body via a mounting plate, the placement platform being fixedly mounted on the top of the mounting plate by multiple support rods, a placement groove being provided on the top of the placement platform, a mounting cavity being provided inside the placement platform, a fixing component being connected to the mounting cavity, an arc-shaped groove being provided at the bottom of the placement groove, an ejection mechanism being provided inside the arc-shaped groove, and a heat dissipation component being provided on the inner sidewall of the placement groove;

[0008] The ejection mechanism includes a connecting block that is slidably disposed on the inner sidewall of the arc-shaped groove. A top block is fixedly disposed on the top of the connecting block. The top block is made of rubber and has an arc-shaped top. Two symmetrically arranged movable cavities are opened at the bottom of the connecting block, and a moving component is disposed in the movable cavity.

[0009] Preferably, the moving component includes a movable block slidably disposed inside the movable cavity, a top rod fixedly disposed on the top of the movable block, the top of the top rod penetrating the movable cavity and fixedly connected to the bottom of the connecting block, and a control component connected to the bottom of the movable block.

[0010] Preferably, the control component includes multiple connecting rods fixedly mounted on the movable block, the bottoms of the multiple connecting rods all penetrating the bottom of the placement platform and fixedly connected to the same movable plate, and two symmetrically arranged electric push rods fixedly mounted on the top of the mounting plate, the movable ends of the two electric push rods being fixedly connected to the bottom of the movable plate.

[0011] Preferably, the fixing component includes multiple sets of adsorption holes starting at the top of the mounting cavity, a vacuum pump is fixedly installed on the top of the mounting plate, an air extraction pipe is fixedly installed between the vacuum pump and the placement stage, and the air extraction pipe is connected to the mounting cavity through an air extraction hole.

[0012] Preferably, the heat dissipation assembly includes an air intake chamber located inside the placement platform, the air intake chamber being positioned directly below the mounting cavity, the air intake chamber having multiple air blowing channels, the air outlets of the air blowing channels being located on the inner side wall of the placement slot, and the air outlets of the air blowing channels being inclined downwards.

[0013] Preferably, a blower is fixedly installed on the top of the mounting plate, and an air inlet pipe is fixedly installed on the bottom of the blower and the placement platform. The air outlet of the air inlet pipe and the air inlet chamber are connected through the air inlet.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This invention, through its ejection mechanism, enables an electric push rod to drive a moving plate upward after testing. This, in turn, drives a connecting rod to raise a movable block and a push rod, allowing the rubber top block on the connecting block to smoothly lift the wafer from the bottom of the placement stage. This effectively avoids surface scratches or structural damage that can be caused by pushing the wafer from the side in traditional methods, greatly improving the safety and reliability of wafer retrieval operations. Simultaneously, the downward-sloping airflow channels evenly distribute the cooling airflow generated by the blower onto the wafer surface, achieving efficient heat dissipation during testing. This reduces the impact of high temperatures on the reliability of wafer pin soldering and effectively controls probe temperature rise, improving testing accuracy and equipment lifespan. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present utility model;

[0017] Figure 2 This is a schematic diagram of the connection structure between the mounting plate and the placement platform in this utility model;

[0018] Figure 3 This is a cross-sectional view of the placement platform in this utility model;

[0019] Figure 4 for Figure 3 Enlarged view of the structure at point A in the middle;

[0020] Figure 5 This is a schematic diagram of the structure of the fixing component and the heat dissipation component in this utility model;

[0021] In the diagram: 1. Sorter body; 2. Mounting plate; 3. Placement platform; 4. Mounting cavity; 5. Top block; 6. Connecting block; 7. Movable block; 8. Top rod; 9. Moving plate; 10. Connecting rod; 11. Electric push rod; 12. Adsorption hole; 13. Vacuum pump; 14. Air extraction pipe; 15. Air inlet chamber; 16. Air blowing channel; 17. Blower; 18. Air inlet pipe. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example 1:

[0024] Please see Figure 1 - Figure 5 As shown, a chip wafer testing and sorting machine includes: a sorting machine body 1, a placement platform 3 is provided on the sorting machine body 1 via a mounting plate 2, the placement platform 3 is fixedly mounted on the top of the mounting plate 2 by multiple support rods, a placement groove is provided on the top of the placement platform 3, a mounting cavity 4 is provided inside the placement platform 3, a fixing component is connected to the mounting cavity 4, an arc-shaped groove is provided at the bottom of the placement groove, an ejection mechanism is provided inside the arc-shaped groove, and a heat dissipation component is provided on the inner sidewall of the placement groove;

[0025] The ejection mechanism includes a connecting block 6 that is slidably disposed on the inner side wall of the arc-shaped groove. A top block 5 is fixedly disposed on the top of the connecting block 6. The top block 5 is made of rubber and has an arc-shaped top. Two symmetrically arranged movable cavities are opened at the bottom of the connecting block 6, and a moving component is disposed in the movable cavity.

[0026] The moving component includes a movable block 7 that is slidably disposed inside the movable cavity. A top rod 8 is fixedly disposed on the top of the movable block 7. The top of the top rod 8 passes through the movable cavity and is fixedly connected to the bottom of the connecting block 6. A control component is connected to the bottom of the movable block 7.

[0027] The control assembly includes multiple connecting rods 10 fixedly mounted on the movable block 7. The bottom of each connecting rod 10 passes through the bottom of the placement platform 3 and is fixedly connected to the same movable plate 9. Two symmetrically arranged electric push rods 11 are fixedly mounted on the top of the mounting plate 2. The movable ends of the two electric push rods 11 are fixedly connected to the bottom of the movable plate 9.

[0028] As can be seen from the above, the moving plate 9 is driven to move upward by the electric push rod 11, and then the movable block 7 is driven to slide in the movable cavity by the connecting rod 10. The movable block 7 pushes the connecting block 6 to move upward along the inner side wall of the arc groove by the push rod 8, so that the rubber top block 5 contacts the bottom of the wafer and lifts it up smoothly. The arc top surface design ensures uniform force during the lifting process, avoids wafer damage due to local stress, and the whole ejection process is stable and controllable, avoiding the problem of wafer scratches caused by taking the wafer from the side.

[0029] Example 2:

[0030] Specifically, regarding the aforementioned fixing components, the fixing components include multiple sets of adsorption holes 12 starting at the top of the mounting cavity 4, a vacuum pump 13 fixedly installed on the top of the mounting plate 2, an air extraction pipe 14 fixedly installed between the vacuum pump 13 and the placement stage 3, and the air extraction pipe 14 and the mounting cavity 4 are connected through air extraction holes.

[0031] As can be seen from the above, by operating the vacuum pump 13, the air in the mounting cavity 4 is extracted through the air extraction pipe 14, creating a negative pressure in the mounting cavity 4. Through multiple sets of evenly distributed adsorption holes 12, a uniform adsorption force is generated on the wafer placed in the placement slot, ensuring that the wafer remains stable and fixed during the test, effectively avoiding displacement and vibration during the test, and ensuring the test accuracy.

[0032] Example 3:

[0033] Specifically, regarding the aforementioned heat dissipation assembly, the heat dissipation assembly includes an air inlet chamber 15 opened inside the placement platform 3. The air inlet chamber 15 is located directly below the mounting cavity 4. Multiple air blowing channels 16 are opened on the air inlet chamber 15. The air outlet of the air blowing channel 16 is located on the inner side wall of the placement slot. The air outlet of the air blowing channel 16 is inclined downward.

[0034] A blower 17 is fixedly installed on the top of the mounting plate 2. An air inlet pipe 18 is fixedly installed on the bottom of the blower 17 and the placement platform 3. The air outlet of the air inlet pipe 18 and the air inlet chamber 15 are connected through the air inlet.

[0035] As can be seen from the above, the cooling airflow is delivered to the air inlet chamber 15 through the air inlet pipe 18 by the blower 17, and then blown evenly onto the wafer surface through multiple downward-sloping air outlets 16. The downward-sloping design allows the airflow to form convection along the wafer surface, which not only removes a large amount of heat generated during the test and reduces the impact of high temperature on the reliability of wafer pin soldering, but also the airflow plays an auxiliary role in heat dissipation of the probe area, controlling the rise of probe temperature, improving test accuracy and equipment lifespan.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A chip wafer testing and sorting machine, characterized in that, include: The sorting machine body (1) is provided with a placement platform (3) by means of a mounting plate (2). The placement platform (3) is fixedly mounted on the top of the mounting plate (2) by means of multiple support rods. The top of the placement platform (3) is provided with a placement groove. The placement platform (3) is provided with an installation cavity (4). The installation cavity (4) is connected to a fixing component. The bottom of the placement groove is provided with an arc-shaped groove. The arc-shaped groove is provided with an ejection mechanism. The inner sidewall of the placement groove is provided with a heat dissipation component. The ejection mechanism includes a connecting block (6) that is slidably disposed on the inner side wall of the arc-shaped groove. A top block (5) is fixedly disposed on the top of the connecting block (6). The top block (5) is made of rubber and has an arc-shaped top. Two symmetrically arranged movable cavities are opened at the bottom of the connecting block (6). A moving component is disposed in the movable cavity.

2. The chip wafer testing and sorting machine according to claim 1, characterized in that: The moving component includes a movable block (7) that is slidably disposed inside the movable cavity. A top rod (8) is fixedly disposed on the top of the movable block (7). The top of the top rod (8) passes through the movable cavity and is fixedly connected to the bottom of the connecting block (6). A control component is connected to the bottom of the movable block (7).

3. A chip wafer testing and sorting machine according to claim 2, characterized in that: The control component includes multiple connecting rods (10) fixedly installed on the movable block (7). The bottom of each of the multiple connecting rods (10) passes through the bottom of the placement platform (3) and is fixedly connected to the same movable plate (9). The top of the mounting plate (2) is fixedly provided with two symmetrically arranged electric push rods (11). The ends of the movable rods of the two electric push rods (11) are fixedly connected to the bottom of the movable plate (9).

4. A chip wafer testing and sorting machine according to claim 1, characterized in that: The fixing assembly includes multiple sets of adsorption holes (12) starting at the top of the mounting cavity (4), a vacuum pump (13) is fixedly installed on the top of the mounting plate (2), an air extraction pipe (14) is fixedly installed between the vacuum pump (13) and the placement platform (3), and the air extraction pipe (14) and the mounting cavity (4) are connected through an air extraction hole.

5. A chip wafer testing and sorting machine according to claim 1, characterized in that: The heat dissipation assembly includes an air inlet chamber (15) inside the placement platform (3). The air inlet chamber (15) is located directly below the mounting cavity (4). The air inlet chamber (15) has multiple air blowing channels (16). The air outlet of the air blowing channel (16) is located on the inner side wall of the placement slot. The air outlet of the air blowing channel (16) is inclined downward.

6. A chip wafer testing and sorting machine according to claim 5, characterized in that: A blower (17) is fixedly installed on the top of the mounting plate (2), and an air inlet pipe (18) is fixedly installed on the bottom of the blower (17) and the placement platform (3). The air outlet of the air inlet pipe (18) and the air inlet chamber (15) are connected through the air inlet.

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