A compact jet flow liquid cooling heat dissipation device

Abstract

The utility model belongs to the technical field of electronic device heat management, concretely relates to a compact jet flow type liquid cooling heat dissipation device. The heat dissipation device includes bottom plate, bottom plate sealing connection is installed on the substrate of chip, jet flow board is installed on the bottom plate, the cover plate is installed on the jet flow board, is equipped with cooling liquid inlet and cooling liquid outlet on the cover plate, is used for installing joint. Bottom plate is equipped with bottom plate cavity, jet flow board is equipped with jet flow recess, jet flow recess is equipped with jet flow hole and cooling liquid through -hole, and cooling liquid through -hole is linked with cooling liquid outlet and bottom plate cavity. Cooling liquid flows into jet flow recess and sprays to the chip surface to carry out heat exchange from cooling liquid inlet, then flows out through cooling liquid through -hole and cooling liquid outlet in proper order. Compared with prior art, the utility model discloses the device compact structure, and the overall integration degree is high, can realize efficient and even heat exchange in limited space, and simultaneously has good versatility, is applicable to the heat dissipation of various chips or other high heat flux density elements.

Description

Technical Field

[0001] This utility model relates to the field of thermal management technology for electronic devices, and in particular to a compact jet-type liquid cooling heat dissipation device, which is mainly used for heat dissipation of chips, and is also suitable for efficient cooling of other high heat flux density electronic components or microelectronic devices. Background Technology

[0002] As the integration and computing power of electronic chips continue to increase, the heat generated per unit area is increasing dramatically. Conventional natural convection or air cooling methods are no longer sufficient to meet the heat dissipation requirements of chips with high heat flux density. Therefore, liquid cooling technology has gradually become the mainstream thermal management solution. Among them, jet liquid cooling has attracted widespread attention because it can achieve high-speed impact of coolant on the heat exchange surface, thereby significantly enhancing the local heat exchange effect.

[0003] However, existing jet-type liquid cooling devices generally have some shortcomings. On the one hand, some devices have complex structures and numerous components, resulting in a large overall size, making them difficult to apply to compact electronic systems with limited installation space. On the other hand, unreasonable layout of the jet and return channels often leads to insufficient heat exchange in local areas and high flow resistance, limiting further improvement in heat dissipation efficiency. In addition, most existing designs lack adaptability and struggle to simultaneously meet the combined requirements of high-efficiency heat exchange and low pressure drop.

[0004] Therefore, there is an urgent need for a jet-type liquid cooling device that can achieve enhanced cooling of small-area, high-heat-flux-density devices within a limited space, and has advantages such as compact structure, excellent heat dissipation performance and strong adaptability. Utility Model Content

[0005] The purpose of this invention is to overcome the defects of the prior art by providing a compact jet-type liquid cooling heat dissipation device, which solves the problems of complex structure, large size and insufficient integration of the existing device. Furthermore, by optimizing the layout of the jet and return paths, the flow resistance is further reduced and the overall heat exchange efficiency is improved.

[0006] The objective of this utility model can be achieved through the following technical solutions:

[0007] The first objective of this utility model is to provide a compact jet-type liquid cooling heat dissipation device, which includes a base plate, a bottom plate, a jet plate, a cover plate, and a connector; the bottom plate is sealed to the base plate; the jet plate is sealed to the bottom plate; the cover plate is sealed to the jet plate; the connector is sealed to the cover plate; and the bottom plate has a bottom plate cavity.

[0008] Furthermore, the jet plate has a jet groove on the side facing the cover plate.

[0009] Furthermore, the jet groove is provided with a jet structure.

[0010] Furthermore, a chip is mounted on the substrate; the cavity in the base plate is used to accommodate the chip.

[0011] Furthermore, the chip is not limited to traditional integrated circuit chips, but can also be other electronic devices with similar structures and planar heat dissipation surfaces, including semiconductor devices, laser modules, graphics processors, central processing units or memory chips, etc., to meet the heat dissipation requirements of different high heat flux density electronic components or microelectronic devices.

[0012] Furthermore, the substrate is used to support and fix the chip, and can be a circuit board, a packaging carrier board, or other base structure with mechanical support and electrical connection functions. The substrate not only provides reliable mechanical support and electrical interconnection path for the chip, but can also be made of different materials, such as high thermal conductivity metal substrate, ceramic substrate, or high performance composite material substrate, depending on the packaging form and application scenario, to improve the overall thermal conductivity efficiency. The surface area of ​​the substrate forms a sealed interface with the base plate, which ensures the electrical performance of the chip while also accommodating the construction of liquid cooling channels.

[0013] Furthermore, the substrate may be provided with a number of substrate through holes. After the heat dissipation device is assembled, the substrate through holes can be used with fasteners such as screws or bolts to fix the heat dissipation device to the external mounting base or support frame, thereby ensuring the structural stability of the heat dissipation device during use.

[0014] Furthermore, the base plate is provided with a base plate cavity, which is used to accommodate the chip, so that the heat-generating surface of the chip can be directly exposed to the jet action area and flow channel of the coolant, so as to ensure that the coolant fully impacts and flows to exchange heat on the chip surface, thereby achieving efficient heat dissipation.

[0015] Preferably, the cavity of the base plate can be provided with a cavity ramp step structure below the corresponding coolant outlet. The cavity ramp step structure reduces the volume of the base plate cavity and the stagnant area at the bottom of the cavity by forming a ramp transition at the edge of the cavity. This ensures the reliability of the seal, makes the overall structure more compact, and facilitates the concentration and smooth flow of coolant in the outlet direction.

[0016] Furthermore, the cover plate is provided with at least one coolant inlet and at least one coolant outlet, the coolant inlet and coolant outlet being used to install the connector to realize the inflow and outflow of coolant.

[0017] Furthermore, common coolant inlet and outlet arrangements on the cover plate include: a one-inlet-one-outlet structure, suitable for conventional straight-through flow paths, with a simple structure and low resistance; and a one-inlet-two-outlet structure, where the coolant typically flows in through a central inlet and exits through two outlets after jetting, achieving a more uniform flow field distribution and more efficient heat exchange. The number and specific arrangement of the coolant inlets and outlets can be flexibly set according to the installation space and heat dissipation requirements of the object being cooled, thus ensuring both a compact structure and efficient flow and heat exchange performance.

[0018] Furthermore, the form of the connector can be selected according to the assembly space, fluid flow direction, and system integration requirements, including one or more of the following: straight-through connector, elbow connector, tee or multi-way connector; among them, the straight-through connector has a simple structure and low resistance, and is suitable for applications where the coolant enters and exits in a straight line; the elbow connector can achieve 90° or other angle turns, which is convenient for placement in applications with limited space or flow channel bends; the tee or multi-way connector can realize the diversion or convergence of coolant among multiple branches, which is suitable for multi-chip or multi-area coordinated cooling. The connector can also be equipped with a sealing ring, locking nut or reinforcing sleeve at the interface to further improve the sealing reliability and mechanical stability of the connection.

[0019] Furthermore, the connector is preferably connected to the coolant inlet and outlet using a detachable sealing method to facilitate assembly, maintenance, and replacement. The preferred connection method is a threaded connection, which allows for reliable locking within a limited installation space, ensuring a tight seal and pressure resistance at the interface, effectively preventing coolant leakage. Simultaneously, threaded connections offer high mechanical strength and vibration resistance, making them suitable for high flow rate or high pressure conditions. In addition, the connector can also be selected using snap-fit ​​connections, quick-connect connections, welded connections, or adhesive connections depending on specific application requirements. Quick-connect connections allow for rapid assembly and disassembly, suitable for frequent maintenance or replacement. Snap-fit ​​connections are suitable for medium- and low-pressure liquid cooling systems, balancing sealing performance and ease of use. Welded connections are suitable for long-term fixed installation, offering higher structural stability and permanent sealing. Adhesive connections are generally used in applications requiring high ease of assembly but low pressure resistance, suitable for temporary or auxiliary fixing. Through these various connection methods, the reliability of the coolant channel seal can be guaranteed while also considering installation convenience and maintenance flexibility in different application environments.

[0020] Preferably, the connector is a straight-through quick-connect connector, which has a compact overall structure and can realize the rapid assembly and disassembly of coolant pipelines in a limited space. The quick-connect connector has a built-in sealing ring, which can automatically press to form a reliable sealing interface during the insertion process, thereby effectively preventing coolant leakage. At the same time, the quick-connect connector has a release structure on the outside, which can be released by pressing or pulling, realizing quick disassembly without additional tools, facilitating maintenance and replacement.

[0021] Furthermore, the jet structure includes multiple jet holes, multiple slit structures, or a flexible combination of jet holes and slit structures to adapt to cooling requirements under different operating conditions. The arrangement of the jet holes and / or slit structures corresponds to the chip area or the chip and its surrounding area, thereby ensuring that high heat flux density areas can be directly cooled by the impact of the coolant. Through a reasonable combination of jet holes and slit structures, both localized enhanced heat transfer and overall cooling uniformity can be achieved, which helps to reduce the temperature gradient on the chip surface and improve thermal management performance.

[0022] Furthermore, the jet plate groove is provided with at least one coolant through-hole, which corresponds to the coolant outlet and communicates with the coolant outlet and the cavity of the base plate, thereby providing a smooth return path for the coolant after heat exchange. This design not only clearly separates the jet channel and the return channel, reducing flow interference and dead zones, but also effectively reduces the resistance loss of the liquid during flow, ensuring that the heat dissipation device can maintain a low pressure drop and stable heat exchange performance under high flow conditions.

[0023] Furthermore, the slit structure can be divided into several slit segments by partition strips. The slit segments within the same slit structure can be evenly or non-uniformly distributed to adapt to the cooling requirements of different areas. The slit segments within different slit structures can be aligned or staggered in the width direction, thereby achieving a flexible arrangement as a whole.

[0024] Furthermore, the jet orifice is typically circular in shape because circular orifices are a mature and precise technology in microfabrication, and the fluid maintains a relatively stable jet pattern when passing through a circular orifice, facilitating the formation of a concentrated and uniform impact flow field, thereby improving local heat transfer efficiency. Under specific application requirements, the jet orifice can also be designed as a parallelogram, triangle, or polygon, etc., to achieve different flow structures and heat transfer effects. The slit structure is typically a long parallelogram or rounded rectangle, characterized by its ability to form a sheet-like jet coverage area on the chip surface, suitable for scenarios where the chip is in a strip, rectangular, or large-area heat source distribution. The length, width, and spacing of the slit structure can be rationally designed according to specific application requirements, and the length and number of partition strips can be adjusted to achieve flexible adjustment of the slit segment distribution. This allows for optimization of local flow distribution, improves the flow distribution of coolant in different areas, and enhances the jet impact effect in high heat flux density areas while ensuring overall cooling uniformity, further effectively improving the heat transfer performance of the chip surface or other electronic device surfaces.

[0025] Furthermore, a nozzle structure is coaxially arranged around the outlet of the jet orifice and / or slit structure. When the nozzle structure is longitudinally cut along the flow direction of the coolant, its cross-sectional shape can be designed as an outward-expanding type, an inward-retracting type, or a straight cylinder type. The outward-expanding nozzle structure can form a diffusion flow field at the outlet, allowing the coolant to cover a larger area when it reaches the chip surface, which is beneficial to improving the heat transfer uniformity of a large area. The inward-retracting nozzle structure can shrink the flow stream, enhance the impact velocity and local turbulence intensity of the coolant, thereby strengthening the local heat transfer capacity of high heat flux density areas. The straight cylinder nozzle structure keeps the fluid channel straight, and the liquid stream maintains a stable state before the outlet, which facilitates the coolant to act directly on the chip surface, thereby achieving a relatively stable and uniform heat transfer effect.

[0026] Furthermore, the cross-sectional shape of the nozzle structure is not limited to a single form; it can also employ any combination of outward-expanding, inward-retracting, and straight-cylinder types. For example, a straight-cylinder section can be used first to maintain the impact intensity of the coolant, and then the coverage area can be expanded through an outward-expanding section; or an outward-expanding section can be used first for diffusion, followed by a straight-cylinder section to maintain flow stability; or a straight-cylinder section can be connected after an inward-retracting section to balance localized enhanced heat transfer with overall uniform cooling. Through diverse combination designs, the flow state of the coolant can be flexibly adjusted according to the heat dissipation requirements of different chip areas, thereby achieving comprehensive optimization that balances large-area uniform cooling with localized enhanced heat transfer.

[0027] Further, the total height of the nozzle structure is denoted as H, satisfying H≥0. When H>0:

[0028] The nozzle structure can be composed of at least one of the following forms: a straight section, an outward expansion section, and an inward contraction section; or it can adopt different combinations of the above forms.

[0029] The height of the starting position of the outer expansion section or inner contraction section of the nozzle structure from the bottom end of the nozzle structure is denoted as h1, and the ratio of h1 to H is in the range of 0 to 1. This allows for flexible adjustment of the effective working section of the nozzle structure to adapt to different cooling requirements and fluid distribution characteristics.

[0030] The bottom of the nozzle structure maintains a distance h2 between itself and the chip surface, and h2>0. This ensures that there is an effective flow space between the coolant spray outlet and the chip heat exchange surface, thereby preventing the liquid jet from directly blocking or adhering to the chip surface and affecting the jet impact effect. It also forms a reasonable local flow channel to facilitate the ejection and return of the coolant.

[0031] The vertical wall of the straight section of the nozzle structure forms an angle α with the opening direction of the expanding or contracting section, which characterizes the degree of expansion or contraction of the nozzle structure, where α ≥ 0. When α = 0, the nozzle structure maintains a straight cylindrical shape; when α > 0, the nozzle structure can exhibit either an expanding or contracting section, achieving the effects of liquid jet diffusion coverage or concentrated contraction, respectively. By reasonably setting α, the coverage range, impact velocity, and impact flow rate of the coolant jet can be flexibly adjusted to adapt to different heat flux distributions and cooling requirements.

[0032] Furthermore, when the coolant inlet and outlet arrangement on the cover plate is a one-inlet-two-outlet structure, the nozzle structure can either spray vertically toward the chip surface to form a direct impact to enhance local heat transfer, or it can be set to spray obliquely at a certain angle to the chip surface to maintain the impact effect while promoting the liquid to spread along the surface and enhancing the lateral flow, thereby further improving the overall heat transfer performance.

[0033] Furthermore, the nozzle structures can be distributed independently of each other, or they can be connected into one unit without separation according to the processing technology and flow requirements, thereby ensuring ease of processing while taking into account diverse heat dissipation needs.

[0034] Furthermore, the jet holes can be arranged in a straight line or in a plug-in arrangement. By using different arrangement methods, the cooling requirements of different heat flux density areas on the chip surface can be better adapted while ensuring uniform fluid distribution.

[0035] Furthermore, the coolant through hole is coaxially surrounded by a flow guiding structure. The flow guiding structure can be set in the jet groove on the front of the jet plate, or it can be a through structure extending towards both sides of the cover plate and the bottom plate.

[0036] Preferably, when the flow-guiding structure extends only towards one side of the cover plate, its height is the same as the depth of the jet groove, thereby effectively fitting with the cover plate after assembly and ensuring the connectivity and sealing integrity of the coolant channel. Through the arrangement of the flow-guiding structure, spatial separation of the inflowing and returning coolant can be achieved within the heat dissipation device, avoiding mutual interference, ensuring the concentrated effect of the jet area and the smoothness of the return path, thereby improving the orderly flow of the coolant and the overall heat exchange performance.

[0037] Furthermore, the nozzle structure or flow guiding structure can be regarded as a pipe-like structure from the hollow core to the guide wall, which can be formed by processes such as micro-milling, etching, stamping, precision injection molding or metal additive manufacturing.

[0038] Furthermore, the shape, structure, and thickness of the base plate, jet plate, or cover plate can be flexibly designed according to the actual requirements of the heat dissipation device. Its shape can be adapted to the installation space, its structure can be adjusted according to the flow channel arrangement and heat dissipation path, and its thickness can be optimized according to the overall strength, heat dissipation performance, and processing conditions.

[0039] Furthermore, the jet groove and the cover plate together seal and define a flow divider cavity, which is used to guide and divide the coolant after it enters, so as to ensure that the coolant can be almost evenly distributed to multiple jet holes or slit structures.

[0040] Furthermore, the substrate, the bottom plate cavity, and the jet plate are jointly sealed to form a jet cavity. The coolant is directly applied to the surface of the electronic chip in the form of a high-speed jet through the jet holes or slit structure in the jet cavity to enhance heat exchange. The coolant after heat exchange is guided to the subsequent channel through the coolant through holes in the jet cavity to complete the efficient liquid cooling heat dissipation process.

[0041] Furthermore, the connection methods between the base plate and the substrate, between the jet plate and the base plate, and between the cover plate and the jet plate can be selected according to actual needs and processing technology, including threaded connection, welding connection, snap-fit ​​connection, riveting connection, or integral molding. Among these, threaded connection or welding connection is preferred; the threaded connection facilitates assembly and subsequent maintenance, and is suitable for occasions requiring frequent disassembly and maintenance; the welding connection can effectively improve the overall strength and sealing performance, and is suitable for long-term fixed installation or high-pressure, high-flow-rate conditions; the snap-fit ​​connection has a simple structure and quick assembly, and is suitable for medium and low-pressure liquid cooling systems and modular applications; the riveting connection has good structural stability and vibration resistance, and is often used for thin plates or lightweight designs; the integral molding method completes the overall structure directly in the manufacturing stage, with optimal sealing and strength, and is suitable for large-scale mass production. By selecting diverse connection methods, this heat dissipation device can balance reliability and ease of processing and maintenance in different application environments.

[0042] Furthermore, when the base plate and the substrate are installed using a threaded connection, the substrate has a plurality of threaded holes, and the base plate has a plurality of through holes. The threaded holes can be either threaded through holes or threaded blind holes, and the through holes are preferably unthreaded through holes. The first screw can pass through the through holes in the base plate and be screwed into the threaded holes in the substrate to achieve reliable fixing between the base plate and the substrate.

[0043] Furthermore, when the jet plate and the base plate are installed using a threaded connection, the base plate has a plurality of threaded holes, and the jet plate has a plurality of through holes. The threaded holes in the base plate can be either threaded through holes or threaded blind holes, and the through holes in the jet plate are preferably unthreaded through holes; the second screw can pass through the through holes in the jet plate and be screwed into the threaded holes in the base plate in sequence to achieve reliable fixing between the jet plate and the base plate.

[0044] Furthermore, when the cover plate and the jet plate are installed using a threaded connection, the jet plate has a plurality of threaded holes. The cover plate has a plurality of through holes. The threaded holes can be either threaded through holes or threaded blind holes, and the through holes are preferably unthreaded through holes. A third screw can pass through the through holes in the cover plate and be screwed into the threaded holes in the jet plate to achieve reliable fixing between the cover plate and the jet plate.

[0045] Preferably, the through holes in the base plate, the jet plate, and the cover plate are countersunk through holes. These countersunk through holes allow the screw head to be flush with or slightly below the surface of the component after assembly, avoiding interference that might be caused by protruding screws, and also helping to improve the tight fit and aesthetic appearance of the overall structure.

[0046] Furthermore, the through holes in the base plate and the threaded holes in the substrate, the through holes in the jet plate and the threaded holes in the base plate, and the through holes in the cover plate and the threaded holes in the jet plate are all coaxially arranged and correspond in size and quantity. The specific number, position and size of the above holes can be adjusted according to the actual structural design and assembly requirements, so as to ensure assembly reliability while taking into account installation convenience.

[0047] Furthermore, the first screw, the second screw, and the third screw are only distinguished by their installation position or size; their structure and function are essentially the same, and they are all used to achieve a fixed connection between adjacent components. Specifically, the first screw is used to connect the base plate and the substrate, the second screw is used to connect the jet plate and the base plate, and the third screw is used to connect the cover plate and the jet plate.

[0048] Furthermore, when the base plate and the substrate, the jet plate and the base plate, or the cover plate and the jet plate are installed by means of snap-fit ​​connection, corresponding slots and latches need to be set on the edges of the interconnected components. The latches are inserted into the slots and fastened during assembly, and can then be disassembled by prying or unlocking.

[0049] Furthermore, when the base plate and the substrate, the jet plate and the base plate, or the cover plate and the jet plate are installed by riveting, aligned riveting holes need to be provided in the joint area of ​​the corresponding components. During assembly, rivets are inserted and deformed by pressing to achieve fixation.

[0050] Furthermore, when the base plate and the substrate, the jet plate and the base plate, or the cover plate and the jet plate are installed by welding, a welding area needs to be reserved at the corresponding contact interface, and the area is welded during the assembly process so that the two components form a fixed structure that is integrated as a whole.

[0051] Furthermore, when the base plate and the substrate, the jet plate and the base plate, or the cover plate and the jet plate are installed by means of threaded connection, snap-fit ​​connection or riveting connection, it is preferable to set a seal between the contact interfaces to prevent coolant leakage during the operation of the heat dissipation device; and to set a sealing groove on the corresponding component for positioning and accommodating the seal to ensure the installation stability and sealing effect of the seal.

[0052] Specifically, a first sealing element is provided between the base plate and the substrate, and a first sealing groove is provided on the side of the base plate facing the substrate to position and accommodate the first sealing element, thereby ensuring a reliable seal between the mating interface of the base plate and the substrate.

[0053] A second sealing element is provided between the jet plate and the base plate, and a second sealing groove is provided on the back of the jet plate and / or the front of the base plate to position and accommodate the second sealing element, thereby ensuring a reliable seal between the contact interface of the jet plate and the base plate.

[0054] A third sealing element is provided between the cover plate and the jet plate, and a third sealing groove is provided on the back of the cover plate and / or the front of the jet plate to position and accommodate the third sealing element, thereby ensuring a reliable seal between the mating interface of the cover plate and the jet plate.

[0055] A fourth seal is provided between the coolant through-hole and the coolant outlet with the flow guiding structure, and a sealing boss is provided at the upper end of the flow guiding structure facing the cover plate. The sealing boss is used to accurately position and place the fourth seal, thereby ensuring the spatial separation of the coolant inflow and outflow paths and improving the independence of the flow path and the integrity of the seal.

[0056] Furthermore, the first, second, third, and fourth sealing elements are preferably annular gaskets. These annular gaskets generate uniform circumferential sealing pressure after assembly and compression, effectively preventing coolant leakage under high pressure or high flow rate conditions. Depending on the spatial dimensions and stress conditions of the specific installation location, the cross-section of the annular gasket can be circular, rectangular, or other shapes to further improve the sealing fit and reliability. The first sealing element primarily ensures a seal between the chip carrier and the substrate. In practical applications, in addition to the first sealing element, it can be replaced by a sealing layer formed by various adhesives, such as sealants (e.g., silicone, anaerobic), structural adhesives (e.g., epoxy, acrylic), UV-curable adhesives, or polyurethane adhesives. These adhesives provide reliable sealing performance after curing and, to a certain extent, also serve a structural fixing function.

[0057] Preferably, the depth of the first sealing groove is less than the thickness of the first seal, the depth of the second sealing groove is less than the thickness of the second seal, the depth of the third sealing groove is less than the thickness of the third seal, and the step height of the sealing boss is less than the thickness of the fourth seal. By causing each seal to undergo a certain deformation after assembly, the tightness of the fit between adjacent components can be enhanced, thereby achieving a more reliable sealing effect and effectively preventing coolant leakage during operation.

[0058] Furthermore, when the base plate and the substrate, the jet plate and the base plate, or the cover plate and the jet plate are installed by welding, the weld itself can usually form an integral metallurgical bond, thereby ensuring a good sealing effect at the connection. In most cases, no additional sealing element or its receiving structure is required. However, in some application scenarios with higher sealing requirements or redundant protection, a sealing element and its corresponding receiving structure can be added near the welding interface to further improve the safety and reliability of the overall seal.

[0059] Furthermore, the materials of the first, second, third, and fourth seals can be selected from silicone rubber, fluorosilicone rubber, fluororubber, EPDM rubber, nitrile rubber, hydrogenated nitrile rubber, polyurethane rubber, polytetrafluoroethylene, polyimide, or flexible graphite, etc., which can provide good sealing performance in terms of high temperature resistance, corrosion resistance, pressure resistance, or aging resistance according to actual application requirements, thereby improving the sealing reliability and service life of the heat dissipation device under complex working conditions.

[0060] Furthermore, the materials of the base plate, jet plate, and cover plate can be selected according to the requirements of heat dissipation performance, mechanical strength, and processing technology. Preferred materials include metals and their alloys such as copper, aluminum, copper-aluminum alloys, aluminum alloys, stainless steel, titanium alloys, and magnesium alloys; ceramic materials such as alumina, aluminum nitride, silicon nitride, and silicon carbide can also be used; or non-metallic materials such as plastics, epoxy resins, and glass. Through reasonable material selection, a balance can be achieved between thermal conductivity, corrosion resistance, and weight control, thereby improving the overall performance and applicability of the heat dissipation device.

[0061] Furthermore, the coolant includes one or more of the following: water, ethylene glycol solution, ammonia, hydrocarbons, liquid nitrogen, fluorinated liquid, oil-based coolant, molten salt solution, or low-boiling-point organic working fluid, and can be mixed in proportion for use; the coolant can be used as a single-phase working fluid for heat exchange within the device, or as a two-phase working fluid that undergoes a liquid-gas phase change during heat exchange, to adapt to different heat dissipation requirements.

[0062] Furthermore, the liquid cooling heat dissipation device can be used in conjunction with an external control system. The external control system may include components such as pumps, valves, sensors, and controllers, which are used to monitor and adjust the operating parameters such as the flow rate, pressure, and temperature of the coolant in real time, thereby realizing intelligent management of the heat dissipation process, which helps to improve the overall heat exchange efficiency, maintain the stability of device operation, and extend the life of the chip, thus adapting to complex and ever-changing working scenarios and usage requirements.

[0063] The second objective of this invention is to provide a method for operating a compact jet-type liquid cooling heat dissipation device, the method comprising the following steps:

[0064] The coolant enters the distribution chamber through the connector, where it is guided and distributed before entering the jet structure of the jet plate and then entering the jet chamber through the jet structure for heat exchange.

[0065] After heat exchange, the coolant passes through the jet plate and is finally discharged through the connector, thus completing the efficient liquid cooling process.

[0066] Furthermore, the working method includes the following steps:

[0067] The coolant enters the distribution chamber through the coolant inlet via the connector. After being guided and distributed here, it enters each jet hole and / or slit structure, and then impacts the heat-generating surface of the chip at high speed through the nozzle structure before entering the jet chamber.

[0068] After heat exchange, the coolant passes through a coolant through-hole connected to the jet cavity and is guided to the coolant outlet by the flow guiding structure on the coolant through-hole, and finally discharged through the connector, thus completing the efficient liquid cooling heat dissipation process.

[0069] This invention provides a compact jet-type liquid cooling device, primarily used for chip heat dissipation, but also suitable for efficient cooling of other high heat flux density electronic components or microelectronic devices. The device includes a base plate, a jet plate, a cover plate, and a connector. The base plate is sealed to a substrate on which the chip is mounted. The jet plate is mounted on the base plate, and the cover plate is mounted on the jet plate. The cover plate has at least one coolant inlet and at least one coolant outlet, and is used to mount the connector. The base plate has a cavity for accommodating the chip, and the jet plate has a jet groove. The jet groove contains a jet hole located above the chip and a coolant through-hole communicating with the coolant outlet. The coolant through-hole also communicates with the base plate cavity to ensure that the coolant can flow out smoothly after heat exchange on the chip surface. The coolant flows into the jet groove through the coolant inlet and is then sprayed at high speed onto the chip surface for heat exchange, subsequently flowing out of the cooling device through the coolant through-hole and the coolant outlet. Compared with the prior art, the device of this utility model has a compact structure and high overall integration. The coolant directly impacts the chip surface through the jet hole and quickly removes heat, which can achieve efficient and uniform heat exchange in a limited space. At the same time, it has good versatility and is suitable for heat dissipation of various chips or other high heat flux density components.

[0070] Compared with the prior art, the present invention has the following beneficial effects:

[0071] 1) This technical solution provides a compact jet-type liquid cooling heat dissipation device, which assembles components such as a base plate, bottom plate, jet plate, and cover plate in a layered and compact stacking manner. Depending on the connection method, sealing components can be used to achieve a stable and reliable seal, thereby forming a complete coolant flow channel. This heat dissipation device not only has a compact and reasonable overall layout, but also offers high flexibility and adaptability during assembly, effectively improving the integration of the heat dissipation device and making it suitable for applications with strict space requirements.

[0072] 2) This technical solution provides a compact jet-type liquid cooling heat dissipation device. Its flow-guiding structure effectively separates the incoming coolant from the cooled liquid after heat exchange, preventing interference and thus avoiding the impact of secondary mixing on heat exchange efficiency. After entering the distribution chamber, the coolant is ejected through jet holes or slit structures equipped with nozzles. By adjusting the height and shape of the nozzle structure, the diffusion range, impact intensity, and interaction distance with the chip surface of the jet stream can be flexibly changed, thereby creating stronger turbulence and disturbance in the high heat flux density area of ​​the chip, significantly improving local heat exchange capacity. After heat exchange, the coolant is smoothly discharged through side-mounted coolant passages, effectively reducing flow resistance during the return process. This ensures efficient heat exchange while maintaining a low pressure drop, further improving the stability and reliability of the device operation.

[0073] 3) The compact jet-type liquid cooling heat dissipation device provided by this technical solution has strong versatility. The shape, structure and thickness of each component can be flexibly designed according to actual needs, so as to adapt to chips of different sizes and packaging forms or other high heat flux density electronic components.

[0074] 4) This technical solution provides a compact jet-type liquid cooling device. Through a rational fluid channel layout, the device integrates liquid inlet, jet, and return flow, effectively simplifying the overall complexity and resulting in excellent structural compactness. It is suitable for high heat flux density electronic devices with limited installation space. The coolant enters through the central inlet and directly impacts the chip area at high speed through jet holes or slit structures, then rapidly exits along the internal return channel, forming a clear and efficient flow path, significantly reducing pressure drop and improving heat exchange efficiency. Compared with existing technologies, this invention can achieve enhanced cooling of small-area, high heat flux density devices within a limited space, possessing advantages such as compact structure, excellent heat dissipation performance, and strong adaptability.

[0075] 5) This technical solution provides a compact jet-type liquid cooling heat dissipation device. This device adopts a layered modular structure of a substrate, base plate, jet plate, and cover plate, eliminating the complex separation of the cavity and confluence channel in traditional devices. This forms a simple flow channel of flow distribution cavity-jet cavity-confluence cavity, making the overall structure more compact and the flow path shorter, thereby effectively reducing flow resistance. In the heat dissipation unit, this device not only includes jet holes but also introduces a slit structure and a combination of the two. With diverse arrangement methods, it can be flexibly designed for different chip sizes and heat flux density distributions. Simultaneously, a nozzle structure is added around the jet holes. The nozzle can take various forms, allowing for control of the jet's diffusion range and turbulence intensity, achieving both enhanced cooling of hot spots and uniform overall heat dissipation. Furthermore, a flow guiding structure is installed around the coolant passages, reducing backflow resistance and effectively separating the inflowing and outflowing coolant, further improving heat exchange performance. This device achieves higher heat exchange efficiency and more uniform temperature distribution within the same space, with lower pressure drop and better energy efficiency; at the same time, due to its modular and sealed optimized design, it has stronger adaptability and reliability, and can be used for chips of different types and power consumption levels. Attached Figure Description

[0076] Figure 1 This is a schematic diagram of the overall structure of the compact jet-type liquid cooling heat dissipation device according to Embodiment 1 of this utility model;

[0077] Figure 2 for Figure 1 An exploded view of the compact jet-type liquid cooling device shown.

[0078] Figure 3 This is a schematic diagram of the substrate structure in Embodiment 1 of this utility model;

[0079] Figure 4 This is a schematic diagram of the front structure of the base plate in Embodiment 1 of this utility model;

[0080] Figure 5 This is a schematic diagram of the back structure of the base plate in Embodiment 1 of this utility model;

[0081] Figure 6 This is a schematic diagram of the front structure of the guide plate in Embodiment 1 of this utility model;

[0082] Figure 7 This is a schematic diagram of the back structure of the guide plate in Embodiment 1 of this utility model;

[0083] Figure 8 This is a schematic diagram of three cross-sectional shapes of the nozzle structure in this utility model: outward expansion type, inward contraction type, and straight cylinder type;

[0084] Figure 9 This is a schematic diagram showing the jet holes arranged in a row in this utility model;

[0085] Figure 10 This is a schematic diagram of the jet hole arrangement in this utility model;

[0086] Figure 11 This is a schematic diagram of the slit structure in this utility model;

[0087] Figure 12 This is a schematic diagram of the front structure of the cover plate in Embodiment 1 of this utility model;

[0088] Figure 13 This is a schematic diagram of the back structure of the cover plate in Embodiment 1 of this utility model;

[0089] Figure 14 This is a schematic diagram of the flow path of the coolant in Embodiment 1 of this utility model;

[0090] Figure 15 This is a schematic diagram of the flow path of the coolant in Embodiment 2 of this utility model;

[0091] Figure label:

[0092] 1-Substrate; 11-Chip; 12-Substrate threaded hole; 13-Substrate through hole;

[0093] 2-Base plate; 21-Base plate cavity; 22-Base plate through hole; 23-Base plate threaded hole; 24-First sealing groove; 25-Second sealing groove; 26-Cavity inclined step structure;

[0094] 3-Jet plate; 31-Jet groove; 311-Jet hole; 3111-Nozzle structure; 312-Coolant through hole; 3121-Guide structure; 3122-Sealing boss; 313-Slit structure; 3131-Partition strip; 3132-Slit section; 32-Jet plate threaded hole; 33-Jet plate through hole; 34-Third sealing groove;

[0095] 4-Cover plate; 41-Coolant inlet; 42-Coolant outlet; 43-Cover plate through hole;

[0096] 5-Connector;

[0097] 61-First seal; 62-Second seal; 63-Third seal; 64-Fourth seal;

[0098] 71 - First screw; 72 - Second screw; 71 - Third screw;

[0099] 81-Flow splitter cavity; 82-Jet cavity;

[0100] H - Total height of the nozzle structure; h1 - Height of the starting position of the outer or inner section of the nozzle structure from the bottom of the nozzle structure; h2 - Distance between the bottom of the nozzle structure and the chip surface; α - Angle between the vertical wall of the straight section of the nozzle structure and the opening of the outer or inner section. Detailed Implementation

[0101] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. Component models, material names, connection structures, and other features not explicitly described in this technical solution are considered common technical features disclosed in the prior art.

[0102] In this utility model, unless otherwise specified, the relative positions, depths, heights, thicknesses, lengths, and widths of the components shown in the accompanying drawings are merely illustrative, used to express the relative fit and spatial correspondence between the parts. Those skilled in the art can scale the figures proportionally according to actual needs without affecting the substantive content of this utility model.

[0103] For ease of description, the front and back sides of several components are defined as follows: the side of the substrate on which the chip is mounted is defined as the front side of the substrate, and the opposite side is its back side; the side of the base plate facing the jet plate is defined as the front side of the base plate, and the opposite side is its back side; the side of the jet plate facing the cover plate is defined as the front side of the jet plate, and the opposite side is its back side; the side of the cover plate facing the jet plate is defined as the back side of the cover plate, and the opposite side is its front side.

[0104] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection achieved by screw fastening, welding, or cooperation with a seal; they can also refer to a direct or indirect connection between components, or an interaction relationship achieved through other elements; they can be a fixed connection, a detachable connection, or an integral part; they can be a mechanical connection or an electrical connection; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction relationship between two components; "upper," "lower," "left," "right," etc., are only used to indicate relative positional relationships, and the relative positional relationship may change when the absolute position of the described object changes. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0105] It should be noted that in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations, nor should they be construed as limiting their quantity, order, priority, or importance. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0106] The present invention will be further described in detail below with reference to specific embodiments.

[0107] Example 1

[0108] like Figures 1-2 As shown, this embodiment provides a compact jet-type liquid cooling heat dissipation device, such as... Figure 1 and Figure 2 As shown, the assembly includes a substrate 1, a base plate 2, a jetting plate 3, a cover plate 4, and a connector 5. The base plate 2 is sealed and mounted on the substrate 1 by a first screw 71, and a first sealing element 61 is provided between the base plate 2 and the substrate 1. The jetting plate 3 is sealed and mounted on the base plate 2 by a second screw 72, and a second sealing element 62 is provided between the jetting plate 3 and the base plate 2. The cover plate 4 is sealed and mounted on the jetting plate 3 by a third screw 73, and a third sealing element 63 and a fourth sealing element 64 are provided between the cover plate 4 and the jetting plate 3. The connector 5 is preferably a straight-through quick-connect connector and is sealed and mounted on the cover plate 4.

[0109] like Figure 3 As shown, the substrate 1 has multiple substrate through holes 13, and a chip 11 is mounted on the surface of the substrate 1. Multiple substrate threaded holes 12 are provided around the chip 11. The substrate through holes 13 can be used with fasteners such as screws and bolts to fix the heat dissipation device as a whole to an external mounting base or support frame, thereby ensuring the stability of the heat dissipation device during operation.

[0110] like Figure 4 and Figure 5 As shown, the base plate 2 is provided with a base plate cavity 21, a base plate through hole 22 and a base plate threaded hole 23; the back of the base plate 2 is provided with a first sealing groove 24 for positioning and accommodating the first sealing element 61; the front of the base plate 2 is provided with a second sealing groove 25 for positioning and accommodating the second sealing element 62.

[0111] The base plate cavity 21 is provided corresponding to the chip 11 and its surrounding area to accommodate the chip 11. A cavity inclined step structure 26 is further provided on the corresponding outlet side edge of the base plate cavity 21. The cavity inclined step structure 26 reduces the stagnant area at the bottom of the base plate cavity 21 through the inclined transition and guides the coolant to flow more smoothly to the outlet. The first sealing groove 24 and the second sealing groove 25 are both opened around the edge of the base plate cavity 21. The depth of the first sealing groove 24 is slightly less than the thickness of the first sealing member 61, and the depth of the second sealing groove 25 is slightly less than the thickness of the second sealing member 62, so as to ensure that a reliable seal can be formed between the substrate 1 and the base plate 2 and between the jet plate 3 and the base plate 2 after the components are assembled.

[0112] The bottom plate through hole 22 is a countersunk through hole without threads and is arranged coaxially with the base plate threaded hole 12. Its number and size correspond to the base plate threaded hole 12, so that the first screw 71 can pass smoothly through the bottom plate through hole 22 and be screwed into the base plate threaded hole 12, thereby realizing the fastening connection between the bottom plate 2 and the base plate 1.

[0113] like Figure 6 and Figure 7 As shown, the front of the jet plate 3 is provided with a jet groove 31 and a third sealing groove 34; the jet groove 31 is provided with a plurality of jet holes 311 and coolant through holes 312. The jet plate 3 is also provided with a plurality of jet plate threaded holes 32 and jet plate through holes 33.

[0114] A nozzle structure 3111 is coaxially arranged on the side of the jet hole 311 facing the base plate 2; a guide structure 3121 is coaxially arranged on the side of the coolant passage 312 facing the cover plate 4, and the height of the guide structure 3121 is equal to the depth of the jet groove 31. The nozzle structure 3111 is composed of at least one of a straight section, an outwardly expanding section, and an inwardly contracting section. Specifically, such as... Figure 8As shown, the cross-sectional shape of the nozzle structure 3111 can be outwardly expanding, inwardly contracting, or cylindrical. The outwardly expanding type includes a cylindrical section and an outwardly expanding section connected to the cylindrical section; the inwardly contracting type includes a cylindrical section and an inwardly contracting section connected to the cylindrical section; and the cylindrical type includes a cylindrical section. The ratio of the height h1 of the starting position of the outwardly expanding or inwardly contracting section of the nozzle structure from the bottom end of the nozzle structure 3111 to the total height H of the nozzle structure 3111 ranges from 0 to 1. The distance h2 from the bottom end of the nozzle structure 3111 to the surface of the chip 11 is greater than 0. The angle α between the vertical wall of the cylindrical section of the nozzle structure 3111 and the opening direction of the outwardly expanding or inwardly contracting section is greater than or equal to 0. When α > 0, it exhibits an outwardly expanding or inwardly contracting section; when α = 0, it maintains a cylindrical shape. In this embodiment, the jet hole 311 is circular, and the nozzle structure 3111 maintains a cylindrical shape, which is a typical cylindrical type.

[0115] The jet plate through hole 33 is a countersunk hole without threads and is arranged coaxially with the threaded hole 23 of the base plate. Its number and size correspond to the threaded hole 23 of the base plate, so that the second screw 72 can pass smoothly through the jet plate through hole 33 and be screwed into the threaded hole 23 of the base plate, thereby realizing the fast connection between the jet plate 3 and the base plate 2.

[0116] The third sealing groove 34 is formed around the edge of the jet groove 31 to position and accommodate the third seal 63. The depth of the third sealing groove 34 is slightly less than the thickness of the third seal 63. A sealing boss 3122 is provided at the upper end of the flow guiding structure 3121 for installing the fourth seal 64, and the step height of the sealing boss 3122 is slightly less than the thickness of the fourth seal 64. Through the cooperation of the third seal 63 and the fourth seal 64, a reliable seal can be formed between the jet plate 3 and the cover plate 4.

[0117] like Figure 9 and Figure 10 As shown, the jet holes 311 can be arranged in either a straight line or a staggered arrangement. Specifically, a straight line arrangement means that the jet holes 311 are arranged sequentially along a straight line. This arrangement has a simple structure, is easy to manufacture, and allows for a regular coolant flow path, resulting in a relatively uniform cooling distribution on the chip surface. It is suitable for areas with relatively uniform heat flux density. A staggered arrangement means that adjacent rows of jet holes 311 are staggered. This method can increase the coolant coverage area and enhance the local turbulence effect, thereby helping to improve the heat transfer capacity of high heat flux density areas of the chip. However, its manufacturing complexity is relatively higher. In this embodiment, the jet holes 311 are arranged in a staggered arrangement.

[0118] Besides using only the jet orifice 311 as the jet structure, one can also use only the slit structure 313, or both the jet orifice 311 and the slit structure 313 as the jet structure. For example... Figure 11As shown, the slit structure 313 is divided into several slit segments 3132 along its length by a partition strip 3131. The slit segments 3132 on the same slit structure 313 can be evenly distributed (e.g., ...). Figure 11 The first slit structure 313 from top to bottom can also be non-uniformly distributed (e.g., Figure 11 (As shown in the second slit structure 313 from top to bottom). Furthermore, the slit segments 3132 on different slit structures 313 can be either aligned with each other or staggered in the width direction.

[0119] like Figure 12 and Figure 13 As shown, the cover plate 4 is provided with a coolant inlet 41, a coolant outlet 42, and multiple cover plate through holes 43. The coolant inlet 41 and coolant outlet 42 are used to install the connector 5 to realize the inflow and outflow of coolant; the number, size, and distribution of the coolant outlets 42 correspond to and are connected with the coolant through holes 312 on the jet plate 3, thereby forming a coolant return path; the cover plate through holes 43 are unthreaded countersunk through holes and are coaxially arranged with the jet plate threaded holes 32. Their number and size match the jet plate threaded holes 32, so that the third screw 73 can pass smoothly through the cover plate through holes 43 and be screwed into the jet plate threaded holes 32, thereby realizing the fastening connection between the cover plate 4 and the jet plate 3.

[0120] like Figure 14 As shown, solid arrows indicate the inflow path of the coolant, and dashed arrows indicate the return path after heat exchange. The jet groove 31 and the cover plate 4 together seal and define the flow distribution cavity 81; the base plate 1, the bottom plate cavity 21 and the jet plate 3 together seal and define the jet cavity 82.

[0121] The complete flow process of the coolant in this heat dissipation device is as follows: The coolant enters the distribution chamber 81 through the coolant inlet 41 via connector 5. After being guided and distributed here, it enters each jet hole 311 and impacts the heating surface of the chip 11 at high speed through the nozzle structure 3111 before entering the jet chamber 82. After heat exchange, the coolant then passes through the coolant through hole 312, which is connected to the jet chamber 82, and is guided to the coolant outlet 42 by the guide structure 3121 on the coolant through hole 312. Finally, it is discharged through connector 5, thus completing the efficient liquid cooling process. The design of the above flow path ensures that the coolant fully impacts the heating area and is quickly discharged, taking into account both heat exchange efficiency and flow stability.

[0122] Example 2

[0123] Example 2 has a basically the same overall structure as Example 1, with the only difference being the arrangement of the coolant inlet and outlet. Specifically, Example 2 has one coolant inlet 41 and two coolant outlets 42, with coolant outlets 42 located on the left and right sides of the coolant inlet 41, and the two coolant outlets 42 are symmetrically distributed on the cover plate 4. This results in a change in the coolant flow path compared to Example 1, such as... Figure 15 As shown. Except for the differences mentioned above, the rest of the structure is the same as in Example 1, and will not be described again here.

[0124] Compared with Example 1, Example 2 provides coolant outlets 42 on both sides of the coolant inlet 41, making the coolant flow path more symmetrical and balanced, further reducing the coolant backflow resistance, and is suitable for chip heat dissipation needs with larger heat exchange area or higher heat flux density.

[0125] It should be understood that the above description is merely a preferred embodiment of the present utility model, intended to illustrate the technical solution of the present utility model, and does not constitute a limitation on its protection scope. For those skilled in the art, various changes or equivalent substitutions can be made to its structural form, dimensional parameters, and processing methods without departing from the core concept and principle of the present utility model, and all such changes or equivalent substitutions should be covered within the protection scope of the present utility model.

[0126] The above description of the embodiments is provided to enable those skilled in the art to understand and use the utility model. It will be apparent to those skilled in the art that various modifications can be easily made to these embodiments, and the general principles described herein can be applied to other embodiments without inventive effort. Therefore, the present utility model is not limited to the above embodiments, and any improvements and modifications made by those skilled in the art based on the disclosure of the present utility model without departing from its scope should be within the protection scope of the present utility model.

Claims

1. A compact jet-type liquid cooling heat dissipation device, characterized in that, The compact jet-type liquid cooling heat dissipation device includes a base plate (1), a bottom plate (2), a jet plate (3), a cover plate (4), and a connector (5). The base plate (2) is sealed to the base plate (1); The jet plate (3) is sealed and connected to the base plate (2); The cover plate (4) is sealed to the jet plate (3); The connector (5) is sealed to the cover plate (4); The bottom plate (2) is provided with a bottom plate cavity (21); The jet plate (3) has a jet groove (31) on the side facing the cover plate (4); A flow divider cavity (81) is formed between the jet groove (31) and the cover plate (4). A jet cavity (82) is formed between the substrate (1), the bottom plate cavity (21), and the jet plate (3). The jet groove (31) is provided with a jet structure.

2. The compact jet-type liquid cooling heat dissipation device according to claim 1, characterized in that, A chip (11) is mounted on the substrate (1). The base plate cavity (21) is used to accommodate the chip (11).

3. A compact jet-type liquid cooling heat dissipation device according to claim 2, characterized in that, The jet structure includes a plurality of jet holes (311), a plurality of slit structures (313), or a combination of jet holes (311) and slit structures (313); The jet hole (311) and / or slit structure (313) correspond to the area where the chip (11) is located, or to the chip (11) and its surrounding area.

4. A compact jet-type liquid cooling heat dissipation device according to claim 3, characterized in that, The slit structure (313) is divided into several slit segments (3132) by a partition strip (3131); The slit segments (3132) are uniformly or non-uniformly distributed within the same slit structure (313); The slit segments (3132) within different slit structures (313) are either aligned or staggered in the width direction of the slit structure (313).

5. A compact jet-type liquid cooling heat dissipation device according to claim 3, characterized in that, The jet hole (311) and / or slit structure (313) are coaxially arranged around the nozzle structure (3111) on the side facing the base plate (2). When the nozzle structure (3111) is longitudinally cut along the flow direction of the coolant, its cross-sectional shape is either outwardly expanding, inwardly contracting, or cylindrical.

6. A compact jet-type liquid cooling heat dissipation device according to claim 5, characterized in that, The total height H of the nozzle structure (3111) is ≥ 0; When H > 0: the nozzle structure (3111) is composed of at least one of the following: a straight section, an outward expansion section, and an inward contraction section; The starting position of the outward expansion section or the inward contraction section is at a height of h1 from the bottom of the nozzle structure (3111), and the ratio of h1 to H is in the range of 0 ~ 1; The distance between the bottom end of the nozzle structure (3111) and the surface of the chip (11) is denoted as h2, and h2 > 0, which is used to ensure that the coolant injection channel outlet and the heat exchange surface maintain an effective gap. The angle between the vertical wall of the straight section of the nozzle structure (3111) and the opening of the outward expansion section or the inward contraction section is α. The α is used to characterize the degree of outward expansion or inward contraction of the nozzle structure (3111), and satisfies α ≥ 0.

7. A compact jet-type liquid cooling heat dissipation device according to claim 3, characterized in that, The jet holes (311) are arranged in a straight line or in a plug-in arrangement within the jet groove (31).

8. A compact jet-type liquid cooling heat dissipation device according to claim 1, characterized in that, The cover plate (4) has at least one coolant inlet (41) and at least one coolant outlet (42). The coolant inlet (41) and coolant outlet (42) are respectively used to install the connector (5) to realize the inflow and outflow of coolant.

9. A compact jet-type liquid cooling heat dissipation device according to claim 8, characterized in that, The jet groove (31) is provided with at least one coolant through hole (312). The coolant through hole (312) corresponds to the coolant outlet (42) and is connected to the coolant outlet (42) and the bottom plate cavity (21).

10. A compact jet-type liquid cooling heat dissipation device according to claim 9, characterized in that, The coolant through hole (312) is coaxially surrounded by a flow guiding structure (3121). The flow guiding structure (3121) is a structure that extends toward the cover plate (4) or extends toward both sides of the cover plate (4) and the bottom plate (2); When the coolant through hole (312) is provided with a flow guide structure (3121) only on the side facing the cover plate (4), the height of the flow guide structure (3121) is the same as the depth of the jet groove (31).

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