Tea bar machine structure for improving refrigeration efficiency

Abstract

The utility model relates to the field of tea bar refrigeration, disclose a tea bar machine for improving refrigeration efficiency, including tea bar machine main part, tea bar machine main part from top to bottom are placed in department, heating part and bucket placing part, be equipped with the middle baffle between heating part and bucket placing part, be equipped with heating mechanism and place in heating part, and heating mechanism includes radiating fan, air inlet pipe, water tank and install refrigeration semiconductor on water tank, the back surface of placed department is equipped with backplate, is equipped with the opening on backplate and radiating fan heating part is embedded in the opening, and air inlet pipe export end sets up between refrigeration semiconductor and radiating fan, and the other end of air inlet pipe comes out from middle baffle and enters bucket placing part, to provide a kind of faster refrigeration tea bar machine structure that can effectively improve refrigeration efficiency.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration in tea bar machines, specifically to a tea bar machine for improving refrigeration efficiency. Background Technology

[0002] As people's living standards improve, more and more families have higher requirements for the quality of life. Tea bar machines with refrigeration function are a type of machine that integrates traditional water dispensers and refrigeration functions. In related technologies, semiconductor refrigeration can be used. This method utilizes the thermoelectric effect (i.e., Peltier effect) of semiconductor materials to achieve refrigeration. However, there are certain problems with using semiconductor refrigeration in tea bar machines, including poor heat dissipation efficiency. The hot end cooling fan of the semiconductor module is usually placed in a relatively closed chassis space. For example, Chinese patent document CN118912729A discloses a semiconductor module and control method for a tea bar machine, which includes a stainless steel water tank, a cold-side sensor, a semiconductor cooling chip, a hot-side heat sink, a foam pad, and a fan motor. The cold-side sensor is embedded in the wall of the stainless steel water tank, which is connected to the cold end of the semiconductor cooling chip. The hot end of the semiconductor cooling chip is connected to the hot-side heat sink, and the fan motor is located on the hot-side heat sink. The air intake required for heat dissipation mainly relies on the limited openings on the back panel of the device and the gaps generated during the assembly of the machine body. There is a lack of a specially designed, smooth air intake channel. This structure results in a serious lack of air intake and low heat dissipation efficiency. In some cases, some hot air is even drawn back into the cooling fan, forming a "hot air short circuit" phenomenon, which further aggravates the problem of poor heat dissipation and affects the cooling efficiency of the semiconductor module. Utility Model Content

[0003] The present invention aims to provide a tea bar machine for improving refrigeration efficiency, and to provide a tea bar machine structure that can effectively improve refrigeration efficiency and cool down faster.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a tea bar machine for improving cooling efficiency, comprising a tea bar machine body, the tea bar machine body comprising, from top to bottom, a placement part, a heating part, and a water bucket placement part, a partition plate between the heating part and the water bucket placement part, a heating mechanism placed in the heating part, the heating mechanism comprising a cooling fan, an air inlet pipe, a water tank, and a cooling semiconductor mounted on the water tank, a back plate on the back of the placement part, an opening on the back plate, the cooling fan and the heating part being embedded in the opening, the outlet end of the air inlet pipe being located between the cooling semiconductor and the cooling fan, and the other end of the air inlet pipe passing through the partition plate and entering the water bucket placement part.

[0005] The beneficial effects of this plan are: By setting a penetrating air intake duct in the middle partition, an independent and smooth air intake channel is set up, allowing air to flow from the water tank placement part into the heating part, supplying air to the cooling semiconductor to cool it down, and then the heat is discharged by the cooling fan. This avoids the limitations of the traditional structure that relies on the gaps in the body and the openings in the back panel for air intake, greatly improving the airflow and providing stable airflow conditions for heat dissipation at the hot end. The air intake and exhaust directions are clearly separated. The air intake duct introduces fresh air from the bottom (relatively cold area), and the hot air is discharged from the openings in the back panel. This avoids the phenomenon of hot air being sucked back in by the fan in the traditional structure, reduces the superposition effect of the hot end temperature, and thus improves the cooling efficiency of the semiconductor cooling chip.

[0006] The cooling fan is embedded in the opening on the back panel. When the fan is running, it can quickly blow the heat dissipated from the hot end to the outside of the machine, forming an efficient forced convection cooling path. Compared with natural convection cooling, it can significantly improve heat transfer efficiency and reduce heat retention inside the machine.

[0007] Preferably, as an improvement, the cooling semiconductor includes a cold end and a hot end, with the cold end fixedly disposed on the side wall of the water tank and a foam pad provided between the cold end and the hot end.

[0008] The beneficial effects are as follows: the cold end is directly fixed to the side wall of the water tank, which enables the cold end to quickly exchange heat with the water, thereby achieving a rapid drop in water temperature and shortening the cooling response time. By setting a foam pad between the cold end and the hot end of the cooling semiconductor, the reverse conduction of heat can be effectively blocked, preventing the heat from the hot end from being transferred to the cold end, ensuring a stable temperature difference between the cold and hot ends of the semiconductor module, thereby improving the cooling efficiency.

[0009] Preferably, as an improvement, the hot end face is arranged with several rows of heat dissipation fins, and the adjacent rows of heat dissipation fins are staggered in height.

[0010] The beneficial effects are: adjacent rows of heat dissipation fins are staggered in the height direction, and the heat dissipation fins are used to expand the heat dissipation area at the hot end and enhance air turbulence.

[0011] Preferably, as an improvement, foam is provided at the connection between the cooling fan and the backplate.

[0012] The beneficial effects are: the foam is used to fill the gap between the cooling fan and the backplate, achieving sealing, shock absorption and sound insulation.

[0013] Preferably, as an improvement, a temperature sensor is embedded in the inner wall of the water tank.

[0014] The beneficial effects are as follows: a temperature sensor is embedded in the inner wall of the water tank, which can monitor water temperature changes in real time. The control module can automatically adjust the working state of the cooling semiconductor according to the temperature signal, realize intelligent start and stop control, and facilitate water temperature control.

[0015] Preferably, as an improvement, the water tank is made of food-grade PP plastic.

[0016] Preferably, as an improvement, ventilation holes are provided on the back of the bucket placement section. Attached Figure Description

[0017] Figure 1 This is an embodiment of the present utility model; Figure 2 This is a side view of the hot end of the present invention.

[0018] The reference numerals in the accompanying drawings include: placement part 1, heating part 2, water tank placement part 3, middle partition 4, cooling fan 5, cooling semiconductor 6, back plate 7, air inlet pipe 8, heat dissipation fins 9, foam 10, water tank 11. Detailed Implementation

[0019] The following detailed description is provided through specific implementation methods and examples: The preferred embodiments of this utility model are basically as shown in the appendix. Figure 1-2 As shown, Figure 1 The tea bar machine shown is for improving cooling efficiency. It includes a tea bar machine body. The tea bar machine body consists of a placement part 1, a heating part 2 and a water bucket placement part 3 from top to bottom. A partition 4 is provided between the heating part 2 and the water bucket placement part 3. A heating mechanism is placed in the heating part 2. The heating mechanism includes a cooling fan 5, an air inlet pipe 8, a water tank 11 and a cooling semiconductor 6 installed on the water tank 11. A back plate 7 is provided on the back of the placement part 1. The back plate 7 has an opening and the cooling fan 5 and the heating part 2 are embedded in the opening. The outlet end of the air inlet pipe 8 is located between the cooling semiconductor 6 and the cooling fan 5. The other end of the air inlet pipe 8 passes through the partition 4 and enters the water bucket placement part 3. A ventilation hole is opened on the back of the water bucket placement part 3.

[0020] By setting a penetrating air inlet pipe 8 on the partition plate 4, an independent and smooth air inlet channel is set up, allowing air to flow from the water tank placement part 3 into the heating part 2 and supply air to the cooling semiconductor 6. The heat is then discharged by the cooling fan 5. This avoids the limitation of relying on the gaps in the body and the openings in the back panel 7 for air intake in the traditional structure, greatly improving the airflow and providing stable airflow conditions for heat dissipation at the hot end. The air intake and exhaust directions are clearly separated. The air inlet pipe 8 introduces fresh air from the bottom (relatively cold area), and the hot air is discharged from the openings in the back panel 7. This avoids the phenomenon of hot air being sucked back in by the fan in the traditional structure, reduces the superposition effect of the hot end temperature, and thus improves the cooling efficiency of the semiconductor cooling chip.

[0021] The cooling fan 5 is embedded in the opening of the back plate 7. When the fan is running, it can quickly blow the heat dissipated by the hot end to the outside of the machine, forming an efficient forced convection cooling path. Compared with natural convection cooling, it can significantly improve the heat transfer efficiency and reduce the heat retention inside the machine.

[0022] To ensure a simple and reliable structure, the preferred embodiment of this invention comprises a cooling semiconductor 6 with a cold end and a hot end. The cold end is fixedly disposed on the side wall of the water tank 11, and a foam pad is provided between the cold end and the hot end. The cold end is directly fixed to the side wall of the water tank 11, enabling rapid heat exchange between the cold end and the water, resulting in a rapid drop in water temperature and a shorter cooling response time. By providing a foam pad between the cold and hot ends of the cooling semiconductor 6, reverse heat conduction is effectively blocked, preventing heat transfer from the hot end to the cold end, ensuring a stable temperature difference between the cold and hot ends of the semiconductor module, thereby improving cooling efficiency. To ensure reliable cooling performance, the preferred embodiment of this invention is as follows: Figure 2 As shown, several rows of heat dissipation fins 9 are arranged on the hot end face. The adjacent rows of heat dissipation fins 9 are staggered in height and arranged in a staggered manner in the height direction. The heat dissipation fins are used to expand the heat dissipation area of ​​the hot end and enhance air turbulence.

[0023] To ensure a simple and reliable structure, the preferred embodiment of this invention includes foam 10 at the connection between the cooling fan 5 and the back plate 7. The foam 10 fills the gap between the cooling fan 5 and the back plate 7, achieving sealing, shock absorption, and sound insulation. To further ensure a simple and reliable structure, the preferred embodiment of this invention includes a temperature sensor embedded in the inner wall of the water tank 11. This temperature sensor can monitor water temperature changes in real time, and the control module can automatically adjust the operating state of the cooling semiconductor 6 based on the temperature signal, achieving intelligent start-stop control for precise water temperature control. The water tank 11 is made of food-grade PP plastic, and EPS foam is provided on the outside of the water tank 11 for heat insulation.

[0024] The above descriptions are merely embodiments of this utility model. Commonly known technical solutions and / or characteristics are not described in detail here. It should be noted that those skilled in the art can make various modifications and improvements without departing from the technical solution of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A tea bar machine for improving refrigeration efficiency, comprising a tea bar machine body, wherein the tea bar machine body comprises, from top to bottom, a placement part (1), a heating part (2), and a water bucket placement part (3), wherein a partition plate (4) is provided between the heating part (2) and the water bucket placement part (3), and a heating mechanism is provided in the heating part (2), characterized in that: The heating mechanism includes a cooling fan (5), an air inlet pipe (8), a water tank (11), and a cooling semiconductor (6) installed on the water tank (11). The back of the placement part (1) is provided with a back plate (7), and the back plate (7) is provided with an opening and the heating part (2) of the cooling fan (5) is embedded in the opening. The outlet end of the air inlet pipe (8) is located between the cooling semiconductor (6) and the cooling fan (5), and the other end of the air inlet pipe (8) passes through the middle partition (4) and enters the water tank placement part (3).

2. The tea bar machine for improving refrigeration efficiency according to claim 1, characterized in that: The refrigeration semiconductor (6) includes a cold end and a hot end. The cold end is fixedly disposed on the side wall of the water tank (11), and a foam pad is provided between the cold end and the hot end.

3. The tea bar machine for improving refrigeration efficiency according to claim 2, characterized in that: Several rows of heat dissipation fins (9) are arranged on the hot end face, and the adjacent rows of heat dissipation fins (9) are staggered in height.

4. The tea bar machine for improving refrigeration efficiency according to claim 1, characterized in that: Foam (10) is provided at the connection between the cooling fan (5) and the back plate (7).

5. The tea bar machine for improving refrigeration efficiency according to claim 1, characterized in that: A temperature sensor is embedded in the inner wall of the water tank (11).

6. The tea bar machine for improving refrigeration efficiency according to claim 1, characterized in that: The water tank (11) is made of food-grade PP plastic.

7. The tea bar machine for improving refrigeration efficiency according to claim 1, characterized in that: The back of the bucket placement section (3) has ventilation holes.

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